JP2669388B2 - Tape carrier type semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier type semiconductor device, and more particularly to a mounting structure of an integrated circuit (LSI) used in electronic equipment such as an information processing device.

[0002]

2. Description of the Related Art In recent years, the degree of integration of integrated circuits used in information processing devices and the like has been increasing, and along with this, LSI packages have also become DIP (Dual Inlin).
e Package), QFP (Quad Flat)
Package), PGA (Pin Grid Arr)
The densification is progressing to ay). Moreover, in order to further increase the density, TC for connecting the LSI to the insulating film
P (Tape Carrier Package) is also used.

For example, as shown in FIG.
The lead 26 attached to the No. 5 is connected to the OLB (Outer Lead Bo) on the circuit board 23 by the pressure pad 22.
nding) to the pad 24 by pressure contact and lead 26 to the OLB.
It is electrically connected to the pad 24. The pressure pad 22 is integrated with the heat conduction plate 21, and the IC chip 2
The heat generated from 5 is exhausted to the outside from the heat conduction plate 21. About this mounting technology, US Patent
No. See 4658331.

[0004]

In the conventional integrated circuit mounting structure described above, in the case of a PGA which is a high-density package, input / output (I / O) pins are provided on the back surface of the PGA substrate, and these input / output (I / O) pins are provided. The PGA is mounted on the wiring board by soldering the pins onto the wiring board.

However, when the soldering or the like of the input / output pins is inspected after mounting, the mounting portion for soldering or the like is hidden by the PGA and cannot be seen. Can not be inspected.

Further, when a lead attached to an IC chip is pressed against an OLB pad on a circuit board with a pressure pad to be electrically connected, the OLB pad on the circuit board is electrically connected to the lead by pressing. Because of the connection, the reliability of the connection is low, which causes the reliability of the semiconductor device to be greatly impaired.

Therefore, an object of the present invention is to solve the above-mentioned problems, to enable the appearance of a soldered state after mounting to be inspected by an appearance inspection, to improve the reliability of connection, and to improve the reliability of a semiconductor device. It is an object of the present invention to provide a tape carrier type semiconductor device which can be manufactured.

[0008]

A tape carrier type semiconductor device according to the present invention is a tape carrier type semiconductor device in which an integrated circuit is electrically connected to an insulating film provided with an arbitrary wiring. Suctions the solder that is electrically connected to the other end of the wiring that is electrically connected to the input / output terminals of the circuit and is placed at the corresponding position on the wiring board.
Is electrically connected to the through-hole you fill the corresponding position of one end of the integrated circuit is connected to input and output to the other end of the wiring which is electrically connected to the terminals electrically and the wiring substrate Te A lead connecting member is provided on the insulating film.

In another tape carrier type semiconductor device according to the present invention, in addition to the above configuration, one end is electrically connected to the other end of a wiring electrically connected to an input / output terminal of the integrated circuit. A pad member for wire bonding, which is electrically connected via a wire to a pad for wire bonding arranged at a corresponding position on the wiring board, is provided on the insulating film.

In another tape carrier type semiconductor device according to the present invention, in addition to the above-described structure, one end is electrically connected to the other end of a wiring electrically connected to an input / output terminal of the integrated circuit. A wiring connection pad member that is electrically connected via a wiring to a wiring connection pad disposed at a corresponding position on the wiring board is provided on the insulating film.

[0011] Still another tape carrier type semiconductor device according to the present invention is a tape carrier type semiconductor device in which an integrated circuit is electrically connected to an insulating film provided with arbitrary wiring, and one end of the tape carrier type semiconductor device is provided with the integrated circuit. Suction and filling of solder that is electrically connected to the other end of the wiring that is electrically connected to the output terminal and that is arranged at the corresponding position on the wiring board
And a through hole you, one end of the wire bonding which is disposed electrically to the other end of the wiring connected are electrically connected and the corresponding position on the wiring board to the input and output terminals of the integrated circuit A pad member for wire bonding electrically connected to the pad via a wire is provided on the insulating film.

Still another tape carrier type semiconductor device according to the present invention is a tape carrier type semiconductor device in which an integrated circuit is electrically connected to an insulating film provided with arbitrary wiring, and one end of the integrated circuit is provided at one end. and a through hole you <br/> filled wicking electrically connected to the connected to the other end of the wiring electrically and solder disposed in corresponding positions on the wiring board to the input-output terminal, one end Is electrically connected to the other end of the wiring electrically connected to the input / output terminal of the integrated circuit, and connected to a wiring connection pad disposed at a corresponding position on the wiring board via a wiring. And a wiring connection pad member electrically connected to the insulating film.

[0013]

[Function] A through hole is provided in the insulating film carrier,
The insulating film carrier and the wiring board are electrically and mechanically connected by sucking up the solder supplied to the pad on the wiring board into the through hole.

As a result, the process of connecting the insulating film carrier and the wiring board can be simplified, the semiconductor device can be easily manufactured, and the cost can be reduced.

Further, since it becomes possible to confirm the state of the solder sucked into the through hole by the visual inspection, the inspection of the soldered state after mounting becomes easy. Furthermore, since the connection between the insulating film carrier and the wiring board is made using solder, the reliability of the semiconductor device is improved.

Furthermore, by installing leads, bonding pads, or soldering pads to the outer leads on the insulating film carrier, respectively,
It is also possible to arbitrarily increase the number of connection points between the LSI and the wiring board, and an LSI having more connection points
Can also be handled.

[0017]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the present invention.
FIG. 2 is a partial sectional view of an embodiment of the present invention. In these figures, a tape carrier type semiconductor device according to an embodiment of the present invention is constructed by connecting an insulating film carrier 1 and an LSI 5 mechanically and electrically.

On the insulating film carrier 1 having a thickness of about 100 μm, outer leads 4 having a width of 40 μm made of a conductor such as Cu
a and 4b are wired. A hole larger than the outer shape of the LSI 5 is provided at the center of the insulating film carrier 1 so that the LSI 5 can be mounted.

The LSI 5 is set in this hole, and the input / output terminal of the LSI 5 and the inner lead 3 are connected to the ILB (Inner).
The insulating film carrier 1 and the LSI 5 are mechanically and electrically connected to each other by connecting at the lead bonding section 7. The inner lead 3 and the outer lead 4a,
4b is for electrically connecting the LSI 5 to a wiring board (not shown).

One end of the outer lead 4a is the inner lead 3
And an OLB part 2 is provided at the other end. The outer lead 4b has one end connected to the inner lead 3 and the other end connected to the lead 6.

The OLB portion 2 comprises a through hole 2a penetrating the insulating film carrier 1 and a metallized portion 2b metallized on the wall surface of the through hole 2a with the same conductor as the outer lead 4a. The shape of the through-hole 2a is not limited to a circle or a square, and the cross-sectional shape is not limited to a rectangle or a trapezoid. However, the size of the opening facing the wiring board is preferably about 100 μmφ.

FIG. 3 is an enlarged sectional view of the OLB section 2 of FIG. 1, and FIG. 4 is a view showing a process of connecting the OLB section 2 of FIG. FIG. 4A shows the solder 9 on the pad 10 of the wiring board 8.
FIG. 4B is a view showing a state in which the OLB portion 2 of the insulating film carrier 1 is overlaid on the solder 9 on the pads 10 of the wiring board 8, and FIG. FIG. 4 is a diagram showing a state in which solder 9 on a pad 10 of a substrate 8 is filled in an OLB portion 2 of an insulating film carrier 1.

A method of filling the through holes 2a of the OLB portion 2 with solder will be described with reference to FIGS. 3 and 4.

OL formed on the insulating film carrier 1
A metallized portion 2b is formed on the side wall of the through hole 2a of the B portion 2 by metallizing so that the solder 9 is easily wetted. In addition, the metallized portion 2b is a through hole 2.
Not only a, but also around the through holes 2a on the front surface and the back surface of the insulating film carrier 1, the contact area of the solder 9 becomes larger.

By filling the through hole 2a with the solder 9, the wiring board 8 and the OLB portion 2 on the insulating film carrier 1 are electrically and mechanically connected. Solder 9
Are eutectic solder consisting of Sn63% and Pb37%, high temperature solder consisting of Sn5% and Pb95%, and Au2.
A high temperature solder or the like composed of 0% and Sn80% is used.

When the insulating film carrier 1 is connected to the wiring board 8, the solder 9 is first supplied onto the pads 10 of the wiring board 8 [see FIG. 4 (a)]. Here, the pad 10 is connected to the inner layer pattern formed in the wiring board 8 and further wired so as to be connected to the outside.

The insulating film carrier 1 is superposed on the wiring board 8 so that the OLB portion 2 of the insulating film carrier 1 is on the pad 10 of the wiring board 8 [see FIG. 4 (b)]. Thereafter, the insulating film carrier 1 and the entire wiring board 8 are heated to 200 ° C. to 250 ° C. to melt the solder 9. As a result, the solder 9 is sucked into the through hole 2a of the OLB portion 2 (see FIG. 4C).

Since the metallized portion 2b is formed on the side wall of the through hole 2a so that the solder 9 is easily wetted,
The solder 9 is very easy to suck up in the through hole 2a. Further, since the metallized portion 2b is connected to the wiring (outer lead 4a) on the insulating film carrier 1, it can be electrically connected to the LSI 5.

As described above, in this embodiment, the insulating film carrier 1 and the wiring board 8 can be connected by a simple method, and the filling state of the solder 9 in the through hole 2a can be confirmed by the visual inspection. Therefore, the inspection method is simplified.

FIG. 5 is a partial sectional view showing a connection state between an insulating film carrier and a wiring board according to one embodiment of the present invention. In the figure, the leads 6 connected to the outer leads 4b of the insulating film carrier 1 are connected to the pads 11 positioned on the wiring board 8 by soldering.

In this case, the solder 9 to be filled in the through-hole 2a is supplied to the pad 11 on the wiring board 8 in advance, and when the solder 9 is filled in the through-hole 2a, the lead 6 is connected to the wiring board 8 at the same time. It should be soldered to the upper pad 11. In addition to this method, the through hole 2a
It is also possible to fill the inside with the solder 9 and then solder the leads 6 to the pads 11 on the wiring substrate 8 with hot air or a soldering iron.

FIG. 6 is a partial sectional view showing a connection state between an insulating film carrier and a wiring board according to another embodiment of the present invention. In the figure, an insulating film carrier 1 according to another embodiment of the present invention is provided with a bonding pad 12 for wire bonding, which is connected to an outer lead 4b. The bonding pad 12 and the pad positioned on the wiring board 8 are provided. 14 are connected by a wire 13.

According to this method, the outer leads 4b on the insulating film carrier 1 and the pads 14 on the wiring board 8 are arbitrarily connected by the wires 13 without connecting the leads 6 on the insulating film carrier 1. It becomes possible.

FIG. 7 is a partial sectional view showing a connection state between an insulating film carrier and a wiring board according to another embodiment of the present invention. In the figure, an insulating film carrier 1 according to another embodiment of the present invention is provided with a soldering pad 15 connected to an outer lead 4b. The soldering pad 15 and the pad positioned on the wiring board 8 are provided. 19
And are connected by a wiring 17 (covered wire). In this case, the wiring 17 is connected and fixed to the soldering pad 15 and the pad 19 on the wiring board 8 by solders 16 and 18, respectively.

In this way, the insulating film carrier 1 is provided with the through holes 2a, and the solder 9 supplied to the pads 11 on the wiring board 8 is sucked up into the through holes 2a, whereby the insulating film carrier 1 and the wiring board 8 are sewn. By electrically and mechanically connecting the insulating film carrier 1 and the wiring board 8, the connecting process between the insulating film carrier 1 and the wiring board 8 can be simplified, and the manufacturing can be facilitated, so that the cost can be reduced.

Further, since it is possible to confirm the sucked state of the solder 9 into the through hole 2a by the visual inspection,
Inspection of the soldering state after mounting becomes easy. Further, since the insulating film carrier 1 and the wiring board 8 are connected using the solder 9, the reliability of the semiconductor device can be improved.

Further, the leads 6 and the bonding pads 1 are attached to the outer leads 4b on the insulating film carrier 1.
2, or by setting the soldering pads 15 so as to be connected to each other, it is possible to arbitrarily increase the number of connection points between the LSI 5 and the wiring board 8, and it is possible to correspond to an LSI having more connection points. Becomes

Therefore, the soldering state after mounting can be inspected by the visual inspection, and the reliability of the connection can be improved and the reliability of the semiconductor device can be improved.

[0040]

As described above, according to the present invention, in a tape carrier type semiconductor device in which an integrated circuit is electrically connected to an insulating film provided with an arbitrary wiring, one end is connected to an input / output terminal of the integrated circuit. A through hole electrically connected to the other end of the wiring on the insulating film electrically connected is filled with solder disposed at a corresponding position on the wiring board, and one end of the input / output terminal of the integrated circuit is provided. By electrically connecting the lead connection member electrically connected to the other end of the wiring on the insulating film electrically connected to the corresponding position on the wiring board, the soldering state after mounting can be seen. Inspection can be performed by inspection, and there is an effect that the reliability of the connection can be increased and the reliability of the device can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of one embodiment of the present invention.

FIG. 3 is an enlarged cross-sectional view of an OLB portion of FIG.

4A is a view showing the supply of solder onto the pads of the wiring board of FIG. 3; FIG. 4B is a state in which the OLB portion of the insulating film carrier is overlaid on the solder on the pads of the wiring board of FIG. 3; 3C is a diagram showing a state in which the solder on the pad of the wiring board of FIG. 3 is filled in the OLB portion of the insulating film carrier.

FIG. 5 is a partial cross-sectional view showing a connection state between an insulating film carrier and a wiring board according to one embodiment of the present invention.

FIG. 6 is a partial sectional view showing a connection state between an insulating film carrier and a wiring board according to another embodiment of the present invention.

FIG. 7 is a partial cross-sectional view showing a connection state between an insulating film carrier and a wiring board according to another embodiment of the present invention.

FIG. 8 is a sectional view of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating film carrier 2 OLB part 2a Through hole 2b Metallized part 3 Inner lead 4a, 4b Outer lead 5 LSI 6 Lead 7 ILB part 8 Wiring board 9 Solder 10, 11, 14, 14, 19 Pad 12 Bonding pad 13 Wire 15 Solder pad 16, 18 Solder 17 Wiring

Claims (5)

(57) [Claims] 1. A tape carrier type semiconductor device in which an integrated circuit is electrically connected to an insulating film provided with an arbitrary wiring, wherein one end of a wiring electrically connected to an input / output terminal of the integrated circuit. A through hole electrically connected to the other end and sucked and filled with solder disposed at a corresponding position on the wiring board; and one end electrically connected to an input / output terminal of the integrated circuit. A tape carrier type semiconductor device comprising, on the insulating film, a lead connection member electrically connected to the other end of the wiring to be connected and electrically connected to a corresponding position on the wiring board. . 2. A wire bonding pad having one end electrically connected to the other end of a wiring electrically connected to an input / output terminal of the integrated circuit and arranged at a corresponding position on the wiring board. 2. The tape carrier semiconductor device according to claim 1, further comprising a pad member for wire bonding, which is electrically connected to the wire via a wire, on the insulating film. 3. A wiring connection, one end of which is electrically connected to the other end of a wiring electrically connected to an input / output terminal of the integrated circuit, and which is disposed at a corresponding position on the wiring board. 3. The tape carrier semiconductor device according to claim 1, further comprising a wiring connection pad member electrically connected to the pad via a wiring, on the insulating film. 4. A tape carrier type semiconductor device in which an integrated circuit is electrically connected to an insulating film provided with an arbitrary wiring, wherein one end of the wiring is electrically connected to an input / output terminal of the integrated circuit. A through hole electrically connected to the other end and sucked and filled with solder disposed at a corresponding position on the wiring board; and one end electrically connected to an input / output terminal of the integrated circuit. A wire bonding pad member electrically connected to the other end of the connected wiring and electrically connected via a wire to a wire bonding pad disposed at a corresponding position on the wiring board. A tape carrier type semiconductor device, which is provided on the insulating film. 5. A tape carrier type semiconductor device in which an integrated circuit is electrically connected to an insulating film provided with an arbitrary wiring, wherein one end of the wiring is electrically connected to an input / output terminal of the integrated circuit. A through hole electrically connected to the other end and sucked and filled with solder disposed at a corresponding position on the wiring board; and one end electrically connected to an input / output terminal of the integrated circuit. Wiring connection pad electrically connected to the other end of the wiring to be connected and electrically connected via a wiring to a wiring connection pad disposed at a corresponding position on the wiring board A tape carrier type semiconductor device having a member on the insulating film.