JPH08252687A - Cream solder and method for supplying solder - Google Patents
Cream solder and method for supplying solderInfo
- Publication number
- JPH08252687A JPH08252687A JP7083291A JP8329195A JPH08252687A JP H08252687 A JPH08252687 A JP H08252687A JP 7083291 A JP7083291 A JP 7083291A JP 8329195 A JP8329195 A JP 8329195A JP H08252687 A JPH08252687 A JP H08252687A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- cream
- solder supply
- supplying
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はクリームはんだ及びはん
だ供給方法に関し、フラツクスとはんだ粒子とをそれぞ
れ所定の割合で混練することにより形成されるクリーム
はんだ及びスクリーン印刷法によるはんだ供給方法に適
用して好適なものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder and a solder supplying method, and is applied to a cream solder formed by kneading a flux and a solder particle at a predetermined ratio and a solder supplying method by a screen printing method. It is suitable.
【０００２】[0002]
【従来の技術】従来、例えば表面実装型の電子部品（以
下、表面実装型電子部品と呼ぶ）は以下の手順により基
板上に実装されている。すなわち、まず基板（及び当該
表面実装型電子部品）の各電極上にはんだを供給する。
続いて表面実装型電子部品の各電極がそれぞれ基板の対
応する各電極とはんだを介して接触するように当該表面
実装型電子部品を基板上に位置決めし、マウントした
後、基板の電極及び実装型電子部品の電極間のはんだを
リフローする。これにより基板の電極と表面実装型電子
部品の対応する各電極とをそれぞれ電気的及び物理的に
接合させることができ、かくしてこの表面実装電子部品
を基板上に所定状態に実装することができる。2. Description of the Related Art Conventionally, for example, surface mount type electronic parts (hereinafter referred to as surface mount type electronic parts) are mounted on a substrate by the following procedure. That is, first, solder is supplied onto each electrode of the substrate (and the surface-mounted electronic component).
Subsequently, the surface mount type electronic component is positioned and mounted on the substrate so that each electrode of the surface mount type electronic component comes into contact with each corresponding electrode of the substrate via solder, and then the electrode and the mount type of the substrate are mounted. Reflow solder between electrodes of electronic parts. As a result, the electrodes of the substrate and the corresponding electrodes of the surface-mounted electronic component can be electrically and physically bonded to each other, and thus the surface-mounted electronic component can be mounted on the substrate in a predetermined state.
【０００３】ところでこのような実装作業に必要なはん
だを基板の対応する電極上に供給するはんだ供給方法と
しては、従来から種々の方法が提案され、実現されてい
る。スクリーン印刷法はこのようなはんだ供給方法の１
つであり、基板の各電極にそれぞれ対応させて貫通孔が
穿設された薄肉のマスクを当該基板上に位置合わせして
載上し、当該マスク上に供給されるクリームはんだをマ
スクの各貫通孔を通して基板の各電極上に転写するよう
にして行われる。By the way, as a solder supply method for supplying the solder necessary for such mounting work onto the corresponding electrodes of the substrate, various methods have been proposed and realized. The screen printing method is one of such solder supply methods.
The thin-walled mask, which has through-holes corresponding to the electrodes of the board, is aligned and placed on the board, and the cream solder supplied on the mask is passed through the mask. It is performed so as to be transferred onto each electrode of the substrate through the holes.
【０００４】この場合このようなスクリーン印刷法に使
用されるクリームはんだは、はんだ粒子とフラツクスと
を所定の割合で混練することにより形成されており、従
来ではこのはんだ粒子として粒径30〜50〔μm 〕程度の
ものが選択的に使用されていた。In this case, the cream solder used in such a screen printing method is formed by kneading the solder particles and the flux at a predetermined ratio, and conventionally, the solder particles have a particle diameter of 30 to 50 [. μm] was selectively used.
【０００５】[0005]
【発明が解決しようとする課題】ところが、近年、表面
実装型電子部品の小型化、フアインピツチ化、高密度実
装化に伴つて、基板の電極及び電極間ピツチも微細化し
てきている。However, in recent years, with the miniaturization, fine pitch, and high-density mounting of surface mount electronic components, the electrodes of the substrate and the pitch between the electrodes have been miniaturized.
【０００６】このため例えばリードピツチが0.5 〔mm〕
以下になるような超小型部品を基板上に実装する際に必
要な微小なはんだを一定の膜厚を確保しながら基板の電
極上にスクリーン印刷法で供給しようとする場合、マス
クに形成される微小な貫通孔の口径に対して粒径30〜50
〔μm 〕のはんだ粒子は大き過ぎるためにマスクの各貫
通孔内に均一にはんだ粒子を供給し難く、この結果クリ
ームはんだを基板の電極上に確実には転写させ難いこと
によりマスクのこれら貫通孔に目詰まり等を発生させ易
い問題があつた。Therefore, for example, the lead pitch is 0.5 [mm].
It is formed on a mask when it is attempted to supply the minute solder necessary for mounting the following ultra-small components on the substrate by the screen printing method while securing a certain film thickness on the electrodes of the substrate. Particle size 30 to 50 with respect to the diameter of minute through holes
Since the solder particles of [μm] are too large, it is difficult to supply the solder particles uniformly into each through hole of the mask. As a result, it is difficult to reliably transfer the cream solder onto the electrodes of the substrate. However, there is a problem that it is easy to cause clogging.
【０００７】本発明は以上の点を考慮してなされたもの
で、微小量のはんだを一定の膜厚を確保して供給するこ
とのできるクリームはんだ及びはんだ供給方法を提案し
ようとするものである。The present invention has been made in consideration of the above points, and it is an object of the present invention to propose a cream solder and a solder supply method capable of supplying a minute amount of solder while securing a constant film thickness. .
【０００８】[0008]
【課題を解決するための手段】かかる課題を解決するた
め本発明においては、粒径が15〜20〔μm 〕以下のはん
だ粒子だけを用いてクリームはんだを形成するようにし
た。またはんだ供給対象物のはんだ供給位置に対応させ
て貫通孔が設けられたマスクの当該貫通孔を通して、は
んだ供給対象物のはんだ供給位置上にフラツクスと粒径
が15〜20〔μm 〕以下のはんだ粒子とをそれぞれ所定の
割合で混練することにより形成されたクリームはんだを
供給するようにした。In order to solve the above problems, in the present invention, the cream solder is formed by using only the solder particles having a particle size of 15 to 20 [μm] or less. Also, through the through holes of the mask provided with through holes corresponding to the solder supply position of the solder supply target, the flux and the grain size of 15-20 [μm] or less on the solder supply position of the solder supply target The cream solder formed by kneading the particles with each other at a predetermined ratio was supplied.
【０００９】[0009]
【作用】このクリームはんだは、はんだ粒子が小さい
分、微小な口径の孔を通して転写性良くはんだ供給対象
物のはんだ供給位置に供給することができる。従つてマ
スクの貫通孔の口径が微小な場合にも転写性良くこのク
リームはんだをはんだ供給対象物のはんだ供給位置上に
転写することができる。This cream solder can be supplied to the solder supply position of the solder supply target object with good transferability through the holes having a minute diameter because the solder particles are small. Therefore, even when the through hole of the mask has a small diameter, this cream solder can be transferred onto the solder supply position of the solder supply target with good transferability.
【００１０】[0010]
【実施例】以下図面について、本発明の一実施例を詳述
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.
【００１１】図１において、１は全体としてクリームは
んだを示し、フラツクス２と、粒径が15〜20〔μm 〕以
下のはんだ粒子３とを所定の割合で混練することにより
形成されている。In FIG. 1, reference numeral 1 denotes a cream solder as a whole, which is formed by kneading a flux 2 and a solder particle 3 having a particle diameter of 15 to 20 [μm] or less at a predetermined ratio.
【００１２】この実施例の場合、フラツクス２として
は、固形分50〜80〔％〕のものが使用されており、クリ
ームはんだ１全体の9.0 〜11.0〔％〕程度の重量構成比
を占めるようにはんだ粒子３と混練されている。In the case of this embodiment, the flux 2 having a solid content of 50 to 80 [%] is used so that the weight composition ratio of the whole cream solder 1 is about 9.0 to 11.0 [%]. It is kneaded with the solder particles 3.
【００１３】以上の構成において、このクリームはんだ
１は、フラツクス２に混練するはんだ粒子３として粒径
が15〜20〔μm 〕のものが使用されており、従つてマス
クに形成された貫通孔の口径が微小であつても各貫通孔
内に均一にはんだ粒子を供給できる分、転写性良く基板
の電極上に印刷することができる。従つてスクリーン印
刷法によるはんだ供給時にこのクリームはんだ１を用い
ることによつて、微細な電極パターンをもつ基板の電極
上にもマスクに目詰まりを生じさせることなく一定の膜
厚を確保して均一量のはんだを供給することができる。In the above structure, the cream solder 1 has the solder particles 3 to be kneaded in the flux 2 having a particle size of 15 to 20 [μm], and accordingly, the through holes formed in the mask. Even if the diameter is small, the solder particles can be uniformly supplied into each through hole, and therefore printing can be performed on the electrode of the substrate with good transferability. Therefore, by using the cream solder 1 at the time of supplying the solder by the screen printing method, a constant film thickness can be ensured even on the electrodes of the substrate having a fine electrode pattern without causing clogging of the mask. Amount of solder can be supplied.
【００１４】実際上スクリーン印刷法による基板電極へ
のはんだ供給方法では、スクリーンに形成される貫通孔
の口径がマスクの板厚の２倍以上になると目詰まり等に
より印刷が困難であり、また貫通孔の口径がマスクの板
厚の２倍以上でも100 〔μm〕以下である場合にも印刷
が困難なことが実験により確認されている。In practice, in the method of supplying solder to the substrate electrode by the screen printing method, if the diameter of the through hole formed in the screen is more than twice the plate thickness of the mask, printing is difficult due to clogging, etc. It has been confirmed by experiments that printing is difficult even when the diameter of the hole is more than twice the plate thickness of the mask and 100 [μm] or less.
【００１５】しかしながら、この実施例のクリームはん
だを用いることによつて、例えば図２（Ａ）のような孔
径Ｋ1 ＝75〔μm 〕の貫通孔１０Ａが複数穿設された板
厚Ｈ1 ＝30〜50〔μm 〕のマスク１０を用いて図２
（Ｂ）のような電極間ピツチＬ1＝150 〔μm 〕で半径
Ｒ＝70〔μm 〕のベアチツプ実装用の電極１１が形成さ
れた基板の当該各電極１１上にクリームはんだを印刷す
るような場合や、図３（Ａ）のような幅Ｋ2 ＝150 〔μ
m 〕の長方形状の貫通孔１３Ａが複数穿設された板厚Ｈ
2 ＝150 〔μm 〕のマスク１３を用いて図３（Ｂ）のよ
うな電極間ピツチＬ2 ＝0.3 〔mm〕で長さＮ＝１〔m
m〕、幅Ｍ＝0.15〔mm〕のＱＦＰ型ＩＣ実装用の電極１
４が順次形成された基板の当該各電極１４上にクリーム
はんだを印刷する場合にもマスクに目詰りを生じさせる
ことなく良好な状態でクリームはんだを転写することが
できる。However, by using the cream solder of this embodiment, for example, the plate thickness H 1 = a plurality of through holes 10A having a hole diameter K 1 = 75 [μm] as shown in FIG. FIG. 2 using a mask 10 of 30 to 50 [μm]
The solder paste is printed on each electrode 11 of the substrate on which the electrode 11 for bare chip mounting having the electrode pitch L 1 = 150 [μm] and the radius R = 70 [μm] as in (B) is formed. In some cases, width K 2 = 150 [μ as shown in FIG. 3 (A)
m], a plate thickness H having a plurality of rectangular through holes 13A
Using a mask 13 of 2 = 150 [μm], a pitch between electrodes L 2 = 0.3 [mm] as shown in FIG. 3B and a length N = 1 [m]
m], width M = 0.15 [mm] electrode 1 for mounting QFP type IC
Even when cream solder is printed on the respective electrodes 14 of the substrate on which 4 is sequentially formed, the cream solder can be transferred in a good state without causing clogging of the mask.
【００１６】以上の構成によれば、クリームはんだ１を
形成するはんだ粒子３として粒径が15〜20〔μm 〕以下
のものだけを選択的に使用するようにしたことにより、
クリームはんだ１を微小な口径の貫通孔を通して転写性
良く基板の電極上に印刷することができ、かくして微小
量のはんだを一定の膜厚を確保して供給することのでき
るクリームはんだ及びはんだ供給方法を実現できる。According to the above construction, only the solder particles 3 having a particle size of 15 to 20 [μm] or less are selectively used as the solder particles 3 forming the cream solder 1.
The cream solder 1 and the solder supplying method capable of printing the cream solder 1 on the electrodes of the substrate with good transferability through the through holes having a small diameter and thus supplying a minute amount of solder while securing a constant film thickness. Can be realized.
【００１７】なお上述の実施例においては、フラツクス
２として固形分50〜80〔％〕のものを適用するようにし
た場合について述べたが、本発明はこれに限らず、これ
以外の固形分の割合をもつフラツクスを適用するように
しても良い。In the above-mentioned embodiment, the case where the solid content of the flux 2 is 50 to 80% is described. However, the present invention is not limited to this, and other solid content is used. You may make it apply the flux with a ratio.
【００１８】また上述の実施例においては、フラツクス
２をクリームはんだ１全体の9.0 〜11.0〔％〕程度の重
量比を占めるようにはんだ粒子３と混練するようにした
場合について述べたが、本発明はこれに限らず、これ以
外の重量比を占めるようにはんだ粒子３と混練するよう
にしても良い。Further, in the above embodiment, the case where the flux 2 is kneaded with the solder particles 3 so as to occupy a weight ratio of about 9.0 to 11.0 [%] of the whole cream solder 1 has been described. Is not limited to this, and may be kneaded with the solder particles 3 so as to occupy a weight ratio other than this.
【００１９】さらに上述の実施例においては、本発明に
よるクリームはんだを基板の電極上に印刷する場合に適
用するようにした場合について述べたが、本発明はこれ
に限らず、この他種々のはんだ供給対象物のはんだ供給
位置上にはんだを供給する場合にも広く本発明によるク
リームはんだを適用することができる。Furthermore, in the above-mentioned embodiments, the case was described in which the cream solder according to the present invention was applied to the case where it was printed on the electrodes of the substrate, but the present invention is not limited to this, and various other solders. The cream solder according to the present invention can be widely applied to the case where the solder is supplied onto the solder supply position of the supply target.
【００２０】さらに上述の実施例においては、はんだ供
給対象物のはんだ供給位置に対応させて貫通孔が設けら
れたマスクを、一面がはんだ供給対象物のはんだ供給面
と当接するように、かつ貫通孔を通してはんだ供給対象
物のはんだ供給位置が露出するように位置合わせして配
置し、マスクの貫通孔を通してはんだ供給対象物のはん
だ供給位置上に、フラツクスとはんだ粒子とをそれぞれ
所定の割合で混練することにより形成されたクリームは
んだを供給する、いわゆるスクリーン印刷法によるはん
だ供給時に本発明によるクリームはんだを適用するよう
にした場合について述べたが、本発明はこれに限らず、
この他のはんだ供給方法によるはんだ供給時にも本発明
によるクリームはんだを広く適用することができる。Further, in the above-mentioned embodiment, the mask having through holes provided corresponding to the solder supply positions of the solder supply target is penetrated so that one surface thereof abuts the solder supply surface of the solder supply target. Arranged so that the solder supply position of the solder supply target is exposed through the hole, and kneading the flux and the solder particles at a predetermined ratio on the solder supply position of the solder supply target through the through hole of the mask. Supplying the cream solder formed by doing, the case of applying the cream solder according to the present invention at the time of solder supply by a so-called screen printing method was described, but the present invention is not limited to this.
The cream solder according to the present invention can be widely applied even when solder is supplied by other solder supplying methods.
【００２１】[0021]
【発明の効果】上述のように本発明によれば、クリーム
はんだを形成するはんだ粒子として粒径が15〜20〔μm
〕以下のものだけを使用するようにしたことにより、
このクリームはんだを微小な孔径の孔を通して転写性良
くはんだ供給対象物のはんだ供給位置上に供給すること
ができ、かくして微小量のはんだを一定の膜厚を確保し
て供給することのできるクリームはんだを実現できる。As described above, according to the present invention, the solder particles forming the cream solder have a particle size of 15 to 20 [μm.
] By using only the following,
This cream solder can be supplied to the solder supply position of the object to be solder-supplied with good transferability through a hole having a small hole diameter, and thus a minute amount of solder can be supplied while ensuring a constant film thickness. Can be realized.
【００２２】またはんだ供給対象物のはんだ供給面に設
定されたはんだ供給位置上に必要量のはんだを供給する
はんだ供給方法において、はんだ供給対象物のはんだ供
給位置に対応させて貫通孔が設けられたマスクを、一面
がはんだ供給対象物のはんだ供給面と当接するように、
かつ貫通孔を通してはんだ供給対象物のはんだ供給位置
が露出するように位置合わせして配置し、マスクの貫通
孔を通してはんだ供給対象物のはんだ供給位置上に、フ
ラツクスと粒径が15〜20〔μm 〕以下のはんだ粒子とを
それぞれ所定の割合で混練することにより形成されたク
リームはんだを供給するようにしたことにより、マスク
の貫通孔が微小な場合にも転写性良くクリームはんだを
転写することができ、かくして微小量のはんだを一定の
膜厚を確保して供給することのできるはんだ供給方法を
実現できる。In the solder supply method for supplying a required amount of solder onto the solder supply position set on the solder supply surface of the solder supply target, a through hole is provided corresponding to the solder supply position of the solder supply target. The mask so that one side contacts the solder supply surface of the solder supply target,
Also, the solder supply position of the solder supply target is arranged so as to be exposed through the through hole, and the flux and the particle size are 15 to 20 (μm) on the solder supply position of the solder supply target through the through hole of the mask. ] By supplying the cream solder formed by kneading the following solder particles in a predetermined ratio, respectively, it is possible to transfer the cream solder with good transferability even when the through holes of the mask are minute. Therefore, it is possible to realize a solder supply method capable of supplying a minute amount of solder while ensuring a constant film thickness.
【図１】実施例によるクリームはんだの構成を示す概念
的な略線図である。FIG. 1 is a conceptual schematic diagram showing a configuration of cream solder according to an embodiment.
【図２】メタルマスクの構成及び基板に形成された電極
の様子をそれぞれ示す断面図及び正面図である。2A and 2B are a cross-sectional view and a front view, respectively, showing the structure of a metal mask and the appearance of electrodes formed on a substrate.
【図３】メタルマスクの構成及び基板に形成された電極
の様子をそれぞれ示す断面図及び正面図である。3A and 3B are a cross-sectional view and a front view, respectively, showing the structure of a metal mask and the appearance of electrodes formed on a substrate.
【符号の説明】 １……クリームはんだ、２……フラツクス、３……はん
だ粒子。[Explanation of symbols] 1 ... Cream solder, 2 ... Flux, 3 ... solder particles.
Claims (3)
の割合で混練することにより形成されるクリームはんだ
において、 上記はんだ粒子の粒径が15〜20〔μm 〕以下でなること
を特徴とするクリームはんだ。1. A cream solder formed by kneading a flux and solder particles at a predetermined ratio, wherein the solder particles have a particle size of 15 to 20 [μm] or less. .
れたはんだ供給位置上に必要量のはんだを供給するはん
だ供給方法において、 上記はんだ供給対象物の上記はんだ供給位置に対応させ
て貫通孔が設けられたマスクを、その一面が上記はんだ
供給対象物の上記はんだ供給面と当接するように、かつ
上記貫通孔を通して上記はんだ供給対象物の上記はんだ
供給位置が露出するように位置合わせして配置し、 上記マスクの上記貫通孔を通して上記はんだ供給対象物
の上記はんだ供給位置上に、フラツクスと粒径が15〜20
〔μm 〕以下のはんだ粒子とをそれぞれ所定の割合で混
練することにより形成されたクリームはんだを供給する
ことを特徴とするはんだ供給方法。2. A solder supply method for supplying a necessary amount of solder onto a solder supply position set on a solder supply surface of a solder supply target, wherein a through hole is provided corresponding to the solder supply position of the solder supply target. The mask provided with, so that one surface abuts the solder supply surface of the solder supply target object, and the solder supply position of the solder supply target object is exposed through the through hole The solder and the solder supply position of the solder supply target through the through hole of the mask, the flux and particle size is 15 to 20.
A solder supply method characterized in that a cream solder formed by kneading solder particles having a particle size of [μm] or less at a predetermined ratio is supplied.
求項１に記載のはんだ供給方法。3. The solder supply method according to claim 1, wherein the solder supply target is a substrate, and the solder supply position is an electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7083291A JPH08252687A (en) | 1995-03-14 | 1995-03-14 | Cream solder and method for supplying solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7083291A JPH08252687A (en) | 1995-03-14 | 1995-03-14 | Cream solder and method for supplying solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08252687A true JPH08252687A (en) | 1996-10-01 |
Family
ID=13798298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7083291A Pending JPH08252687A (en) | 1995-03-14 | 1995-03-14 | Cream solder and method for supplying solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08252687A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01309795A (en) * | 1988-06-08 | 1989-12-14 | Furukawa Electric Co Ltd:The | Cream solder |
| JPH03230894A (en) * | 1990-02-06 | 1991-10-14 | Daiken Kagaku Kogyo Kk | Solder powder, production thereof and solder paste using this method |
| JPH04237590A (en) * | 1991-01-22 | 1992-08-26 | Matsushita Electric Ind Co Ltd | Cream solder and production thereof and soldering material |
| JPH06125169A (en) * | 1992-10-13 | 1994-05-06 | Fujitsu Ltd | Pre-soldering method |
| JPH06122090A (en) * | 1992-10-12 | 1994-05-06 | Nippon Denkai Kk | Solder paste and solder layer forming method by using the same |
| JPH06142975A (en) * | 1992-11-11 | 1994-05-24 | Omron Corp | Older paste |
| JPH0819891A (en) * | 1994-07-01 | 1996-01-23 | Matsushita Electric Ind Co Ltd | Cream solder material |
| JPH08204322A (en) * | 1995-01-26 | 1996-08-09 | Ibiden Co Ltd | Forming method for bump |
-
1995
- 1995-03-14 JP JP7083291A patent/JPH08252687A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01309795A (en) * | 1988-06-08 | 1989-12-14 | Furukawa Electric Co Ltd:The | Cream solder |
| JPH03230894A (en) * | 1990-02-06 | 1991-10-14 | Daiken Kagaku Kogyo Kk | Solder powder, production thereof and solder paste using this method |
| JPH04237590A (en) * | 1991-01-22 | 1992-08-26 | Matsushita Electric Ind Co Ltd | Cream solder and production thereof and soldering material |
| JPH06122090A (en) * | 1992-10-12 | 1994-05-06 | Nippon Denkai Kk | Solder paste and solder layer forming method by using the same |
| JPH06125169A (en) * | 1992-10-13 | 1994-05-06 | Fujitsu Ltd | Pre-soldering method |
| JPH06142975A (en) * | 1992-11-11 | 1994-05-24 | Omron Corp | Older paste |
| JPH0819891A (en) * | 1994-07-01 | 1996-01-23 | Matsushita Electric Ind Co Ltd | Cream solder material |
| JPH08204322A (en) * | 1995-01-26 | 1996-08-09 | Ibiden Co Ltd | Forming method for bump |
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