JPH03230894A - Solder powder, production thereof and solder paste using this method - Google Patents
Solder powder, production thereof and solder paste using this methodInfo
- Publication number
- JPH03230894A JPH03230894A JP2026945A JP2694590A JPH03230894A JP H03230894 A JPH03230894 A JP H03230894A JP 2026945 A JP2026945 A JP 2026945A JP 2694590 A JP2694590 A JP 2694590A JP H03230894 A JPH03230894 A JP H03230894A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- particles
- powder
- solder powder
- medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 102
- 239000000843 powder Substances 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 title description 2
- 239000002245 particle Substances 0.000 claims abstract description 27
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 239000010419 fine particle Substances 0.000 claims abstract description 11
- 239000002612 dispersion medium Substances 0.000 claims abstract description 7
- 239000002826 coolant Substances 0.000 claims abstract description 4
- 229920002545 silicone oil Polymers 0.000 claims description 13
- 239000006185 dispersion Substances 0.000 claims description 8
- 239000002609 medium Substances 0.000 claims description 8
- 239000010705 motor oil Substances 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000010687 lubricating oil Substances 0.000 claims description 2
- 238000007639 printing Methods 0.000 abstract description 3
- 238000007650 screen-printing Methods 0.000 abstract description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 33
- 239000003921 oil Substances 0.000 description 7
- 235000019198 oils Nutrition 0.000 description 7
- 238000000889 atomisation Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000010908 decantation Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 239000011297 pine tar Substances 0.000 description 2
- 229940068124 pine tar Drugs 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000012798 spherical particle Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 235000005074 zinc chloride Nutrition 0.000 description 2
- 239000011592 zinc chloride Substances 0.000 description 2
- 240000005220 Bischofia javanica Species 0.000 description 1
- 235000010893 Bischofia javanica Nutrition 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004859 Copal Substances 0.000 description 1
- 241000782205 Guibourtia conjugata Species 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 235000019482 Palm oil Nutrition 0.000 description 1
- 240000008299 Pinus lambertiana Species 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000019486 Sunflower oil Nutrition 0.000 description 1
- BIVUUOPIAYRCAP-UHFFFAOYSA-N aminoazanium;chloride Chemical compound Cl.NN BIVUUOPIAYRCAP-UHFFFAOYSA-N 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000010727 cylinder oil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 235000019197 fats Nutrition 0.000 description 1
- 239000012208 gear oil Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910001502 inorganic halide Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000010721 machine oil Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004006 olive oil Substances 0.000 description 1
- 235000008390 olive oil Nutrition 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002540 palm oil Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000002600 sunflower oil Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明はプリント基板上のファインパターンを形成する
のに用いられる半田粉末、その製造法およびこれを用い
た半田ペーストに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solder powder used to form a fine pattern on a printed circuit board, a method for producing the same, and a solder paste using the same.
［従来の技術］
近年さまざまな技術分野で一層の技術の精密化が進展し
ているが、プリント基板の製造技術に関しては特にこの
ような要請が強い。[Prior Art] In recent years, technology has become more sophisticated in various technical fields, and such demands are particularly strong in the field of printed circuit board manufacturing technology.
現在、プリント基板に用いられるスクリーン印刷用半田
としては、アトマイズ法にて製造された半田粉末をフラ
ックス中に分散したクリーム半田が広く用いられている
。アトマイズ法による半田粒子の製造は、高温にて液状
とした半田溶湯に圧縮ガスを噴射して、半田溶湯を飛散
、粉末化させ、凝固した半田粉末を回収するものである
。Currently, as screen printing solder used for printed circuit boards, cream solder in which solder powder produced by an atomization method is dispersed in flux is widely used. In the production of solder particles by the atomization method, compressed gas is injected into the molten solder that has been liquefied at high temperature, the molten solder is scattered and powdered, and the solidified solder powder is recovered.
［発明が解決しようとする課題］
しかしながら、アトマイズ法では、球形を有する半田粒
子を得ることは困難であり、かつその粒径も約３０μｍ
以上の粒子が９０重量％以上と大きく、また半田粒子の
形状も不揃いである（第３図（ａ）および（ｂ）参照）
。さらに、アトマイズ法では、ガス圧力、溶湯温度、冷
却条件などのさまざまな製造条件が粒子形状に影譬を与
え、球形の粒子を安定して得ることは困難である。また
、この製法では半田溶湯が凝固するまでの間に粒子の表
面に酸化物が形成し、半田の流れが非常に悪くなる。し
たがって、このような半田を用いてプリント基板上に精
密なパターン形成することは非常に困難である。[Problems to be solved by the invention] However, with the atomization method, it is difficult to obtain solder particles having a spherical shape, and the particle size is also approximately 30 μm.
The solder particles are large, accounting for more than 90% by weight, and the shape of the solder particles is also irregular (see Figures 3 (a) and (b)).
. Furthermore, in the atomization method, various manufacturing conditions such as gas pressure, molten metal temperature, and cooling conditions affect the particle shape, making it difficult to stably obtain spherical particles. Furthermore, in this manufacturing method, oxides are formed on the surfaces of the particles until the molten solder solidifies, resulting in extremely poor solder flow. Therefore, it is very difficult to form a precise pattern on a printed circuit board using such solder.
特開昭６３−４．３７９４号には、アトマイズ法にて半
田粉末を製造するにあたり、圧縮ガスおよび回収容器内
の酸素濃度および湿度を所定の値以下に規制することに
より、酸化被膜のない球状の半田粉末を得ることが記載
されている。しかしながら、この方法によっても未だ充
分に微細で、かつ粒子形状が球形の半田粉末を安定して
得ることはできない。JP-A No. 63-4.3794 discloses that when producing solder powder using the atomization method, by regulating the compressed gas and the oxygen concentration and humidity in the recovery container to below predetermined values, it is possible to create a spherical shape without an oxide film. It is described that a solder powder of However, even with this method, it is still not possible to stably obtain solder powder that is sufficiently fine and has a spherical particle shape.
本発明の目的は、プリント基板に半田ペーストを均一に
印刷するため、粒径が小さく、しかも粒度の揃った酸化
被膜のない球状の半田粒子からな一
る半田を提供することにある。An object of the present invention is to provide solder made of spherical solder particles with small and uniform particle sizes and no oxide film, in order to uniformly print solder paste on a printed circuit board.
［課題を解決するための手段］
本発明は、半田をその融点以上の温度に加熱された液状
の分散媒体中に微粒子状の分散し、該分散系に冷却媒体
を添加して前記の分散された液体半田微粒子を固化させ
ることを特徴とする半田粉末の製造法を提供するもので
ある。本発明の半田粉末は、粒径５〜３０μｍの半田粒
子の割合が８０重量％以上であるこ七を特徴とする。[Means for Solving the Problems] The present invention involves dispersing solder in the form of fine particles in a liquid dispersion medium heated to a temperature equal to or higher than its melting point, and adding a cooling medium to the dispersion system to disperse the solder as described above. The present invention provides a method for producing solder powder, which is characterized by solidifying liquid solder fine particles. The solder powder of the present invention is characterized in that the proportion of solder particles having a particle size of 5 to 30 μm is 80% by weight or more.
本発明の半田粉末に用いられる半田は、共晶半田など従
来プリント配線に用いられているものであればいずれで
あってもよい。例えば５ｎ−Ｐｂ系（６３Ｓｎ、３７Ｐ
ｂ： ５０Ｓｎ、５０Ｐｂ； ３５Ｓｎ。The solder used in the solder powder of the present invention may be any solder conventionally used in printed wiring, such as eutectic solder. For example, 5n-Pb system (63Sn, 37P
b: 50Sn, 50Pb; 35Sn.
残Ｐｂ、０．５Ｓｂなど）、５ｎ−Ｐｂ−８ｂ系（３２
Ｓｎ、６６Ｐｂ、２Ｓｂなど）、Ｓｎ系（９５Ｓｎ、５
Ｓｂ； ９５Ｓｎ、５Ａｇなど）、その他９７．５Ｐｂ
。residual Pb, 0.5Sb, etc.), 5n-Pb-8b system (32
Sn, 66Pb, 2Sb, etc.), Sn-based (95Sn, 5
Sb; 95Sn, 5Ag, etc.), other 97.5Pb
.
２．５Ａｇ； ５７Ｂｉ、１７Ｓｎ、２６ Ｉｎ； ３
０Ｓｎ。2.5Ag; 57Bi, 17Sn, 26In; 3
0Sn.
７０Ｚｎ；６０Ｃｄ、３０Ｚｎ、１０Ｓｎ；９５Ｃｄ。70Zn; 60Cd, 30Zn, 10Sn; 95Cd.
５Ａｇなどの組成を有する半田がいずれも用いられてよ
い。これら半田表面の酸化膜は、サンドペ−パー等で物
理的に完全除去して使用する。Any solder having a composition such as 5Ag may be used. The oxide film on the solder surface is physically completely removed using sandpaper or the like before use.
つぎに、加熱容器に高沸点の液体の分散媒体を入れる。Next, a high boiling point liquid dispersion medium is placed in the heating container.
かかる媒体としてはシリコンオイル、エンジンオイノ区
工業用潤滑油（例えばスピンドル油、マシン油、シリン
ダー油、ギヤ油、絶縁油）、油脂（例えばヤシ油、パー
ム油、オリーブ油、ひまわり油、大豆油、あまに油、な
たね油、ひまし油）、樹脂（例えば松やに、コーパル、
ダンマル）などが挙げられる。Such media include silicone oil, industrial lubricating oils (e.g. spindle oil, machine oil, cylinder oil, gear oil, insulation oil), fats and oils (e.g. coconut oil, palm oil, olive oil, sunflower oil, soybean oil, linseed oil, rapeseed oil, castor oil), resins (e.g. pine tar, copal,
Danmar) etc.
ついで、該液体媒体をオイルバスなどを用いて溶融する
半田の融点に応じて約７５〜４００℃、好ましくは１９
０〜２３０℃に加熱する。加熱された分散媒体中に酸化
被膜を除去した半田を入れて溶融しながら撹拌し、半田
を液体の微粒子として分散する。分散には従来公知の装
置が用いられてよいが、ホモジナイザーを用いてに容易
に撹拌、分散できる。加熱媒体中に半田が充分微粒子状
に分散した後、低温、例えば室温程度の液体媒体を流し
込み、急冷させて分散系の温度を低下させ半田粒子を凝
固沈降させる。得られた半田粉末の粒子形状はほぼ真球
であり、粒径約５〜３０μｍの微細粒子を８０重量％以
上含む。Then, the liquid medium is melted using an oil bath or the like at a temperature of about 75 to 400°C, preferably 19°C depending on the melting point of the solder.
Heat to 0-230°C. Solder from which the oxide film has been removed is placed in a heated dispersion medium and stirred while melting, thereby dispersing the solder as liquid fine particles. Although conventionally known devices may be used for dispersion, stirring and dispersion can be easily achieved using a homogenizer. After the solder is sufficiently dispersed in the form of fine particles in the heating medium, a liquid medium at a low temperature, for example, around room temperature, is poured into the heating medium and rapidly cooled to lower the temperature of the dispersion system and solidify and precipitate the solder particles. The particle shape of the obtained solder powder is almost perfect sphere, and contains 80% by weight or more of fine particles with a particle size of about 5 to 30 μm.
半田粉末は適宜の溶剤で加熱媒体を除去し、ついで酸化
防止のため非水性媒体中に保存する。かかる媒体として
は、例えばガソリン、灯油などの石油系媒体；ベンゼン
、トルエン、キシレンなどの芳香族系媒体：トリクレン
、パークレン、クロロセン、四塩化炭素などの塩素系媒
体：メタノール、エタノール、イソプロパツールなどの
炭化水素系媒体がいずれも用いられてよい。The heating medium is removed from the solder powder using a suitable solvent, and then the solder powder is stored in a non-aqueous medium to prevent oxidation. Such media include, for example, petroleum-based media such as gasoline and kerosene; aromatic media such as benzene, toluene, and xylene; chlorine-based media such as trichlene, perchlorene, chlorocene, and carbon tetrachloride; methanol, ethanol, isopropanol, etc. Any of the following hydrocarbon-based media may be used.
このようにして得られた半田粉末は、フラックスを添加
して印刷用ペースト半田とする。かかるフラックスの組
成としては、例えば活性化松脂、非活性化松脂、塩化亜
鉛、塩化亜鉛と無機ハロゲン化物または無機酸との混合
物など従来フラックスとして公知のものがいずれも用い
られてよい。The solder powder thus obtained is made into a printing paste solder by adding flux. As for the composition of such a flux, any conventionally known flux such as activated pine resin, non-activated pine resin, zinc chloride, or a mixture of zinc chloride and an inorganic halide or an inorganic acid may be used.
［実施例］ つぎに本発明を実施例によりさらに具体的に説明する。[Example] Next, the present invention will be explained in more detail with reference to Examples.
実施例１ （６，４共晶半田）
鉛・錫が６４４の半田表面をサンドペーパーで磨いて酸
化膜の物理的除去を行い、ついでトルエンにより洗浄し
た。トールビーカー（５００ｃｃ）にシリコンオイル２
００ｃｃを入れ、オイルバスで１９０℃に加熱した。加
熱されたシリコンオイルに前記半田５０ｇを入れ完全に
溶融した。半田が溶融したならばホモジナイザー（約１
００ Ｏｒｐｍ）を差し込み、液状となった半田を約１
５秒間撹拌して分散させ、液体の半田を充分微粒子状態
に分散した。ついで、加熱をやめ、これに常温のシリコ
ンオイル２００ｃｃを加えて分散系を急冷した。Example 1 (6,4 eutectic solder) The surface of the 644 lead/tin solder was polished with sandpaper to physically remove the oxide film, and then cleaned with toluene. Silicone oil 2 in a tall beaker (500cc)
00cc and heated to 190°C in an oil bath. 50 g of the solder was placed in heated silicone oil and completely melted. Once the solder has melted, use a homogenizer (approximately 1
00 Orpm) and apply approximately 1 ounce of liquid solder.
The liquid solder was dispersed by stirring for 5 seconds to sufficiently disperse the liquid solder into fine particles. Then, heating was stopped, and 200 cc of silicone oil at room temperature was added to rapidly cool the dispersion.
半田粉末が沈澱したらデカンテーションによりシリコン
オイルを除去し、沈澱した半田粉末を４００ ｍｅｓｈ
のフルイに通した。半田粉末に付着したシリコンオイル
をトルエンにより洗浄除去し、酸化しないようトルエン
中に浸漬した。第１図（ａ）および（ｂ）に得られた半
田粉末の顕微鏡写真を示す。第１図に示すごとく、半田
粒子はほぼ球状で粒径５〜２０μ尻の微細な粒子を９０
重量％含有する。Once the solder powder has precipitated, silicone oil is removed by decantation, and the precipitated solder powder is separated into 400 mesh pieces.
passed through the sieve. The silicone oil adhering to the solder powder was removed by washing with toluene, and the solder powder was immersed in toluene to prevent oxidation. FIGS. 1(a) and 1(b) show micrographs of the obtained solder powder. As shown in Figure 1, the solder particles are approximately spherical and have a diameter of 5 to 20 μm.
Contains % by weight.
実施例２（７：３銀入り半田）
鉛：錫が７；３の半田の表面酸化膜をサンドペーパーで
磨いて物理的に除去し、ついでトルエンで洗浄した。ト
ールビーカー（５００ｃｃ）にシリコンオイル２５０ｃ
ｃを入れ、オイルバスで２００°Ｃに加熱した。加熱さ
れたシリコンオイルのなかに前記半田ｔ ＯＯｇを入れ
、完全に溶融した。半田が溶融した後、ホモジナイザー
を差し込み、約３０秒間撹拌して半田を分散させた。こ
れに常温のシリコンオイルを２５０ｃｃ加え分散系を急
冷した。半田粉末が沈澱したらデカンテーションにより
シリコンオイルを除去し、沈澱した半田粉末を４００
ｍｅｓｈのフルイに通した。半田粉末に付着したシリコ
ンオイルをトルエンで洗浄除去し、酸化しないようトル
エン中に浸漬しておく。得られた半田粉末の顕微鏡写真
を第２図（ａ）および（ｂ）に示す。得られた半田粒子
は、はぼ球状で粒径５〜３０μｌの微細な粒子を約９０
重量％含有する。Example 2 (7:3 silver-containing solder) The surface oxide film of the 7:3 lead:tin solder was physically removed by polishing with sandpaper, and then washed with toluene. Silicone oil 250c in tall beaker (500cc)
c and heated to 200°C in an oil bath. The solder tOOg was placed in heated silicone oil and completely melted. After the solder was melted, a homogenizer was inserted and stirred for about 30 seconds to disperse the solder. 250 cc of room temperature silicone oil was added to this and the dispersion system was rapidly cooled. After the solder powder has precipitated, silicone oil is removed by decantation, and the precipitated solder powder is
It was passed through a mesh sieve. Wash and remove silicone oil adhering to the solder powder with toluene, and immerse it in toluene to prevent oxidation. Microscopic photographs of the obtained solder powder are shown in FIGS. 2(a) and 2(b). The obtained solder particles are approximately 90 spherical and have a diameter of 5 to 30 μl.
Contains % by weight.
実施例３
鉛：錫が６＝４の半田の表面酸化膜をサンドペ８
−バーで磨いて物理的に除去し、ついでトルエンで洗浄
した。トールビーカー（５００ｃｃ）にエンジンオイル
２００ｃｃを入れ、オイルバスにて２００℃に加熱した
。加熱されたエンジンオイルのなかに前記半田５０ｇを
入れ、完全に溶融した。半田が溶融した後、ホモジナイ
ザーを差し込み、約３０秒間撹拌して分散させた。これ
に常温のエンジンオイルを２００ｃｃ加え分散系を急冷
させた。Example 3 The surface oxide film of lead:tin 6=4 solder was physically removed by polishing with a sandpaper 8-bar, and then washed with toluene. 200 cc of engine oil was placed in a tall beaker (500 cc) and heated to 200° C. in an oil bath. 50 g of the solder was placed in heated engine oil and completely melted. After the solder was melted, a homogenizer was inserted and stirred for about 30 seconds to disperse it. 200 cc of room temperature engine oil was added to this to rapidly cool the dispersion system.
半田粉末が沈澱したらデカンテーションによりシリコン
オイルを除去し、沈澱した半田粉末を４００ ｍｅｓｈ
のフルイに通した。半田粉末に付着したエンジンオイル
をトルエンで洗浄除去し、酸化しないようトルエン中に
浸漬保存した。得られた半田粒子は、はぼ球状で粒径５
〜３０μ肩の微細な粒子を９０重量％含有する。Once the solder powder has precipitated, silicone oil is removed by decantation, and the precipitated solder powder is separated into 400 mesh pieces.
passed through the sieve. Engine oil adhering to the solder powder was removed by washing with toluene, and the solder powder was immersed in toluene and stored to prevent oxidation. The obtained solder particles were spherical and had a particle size of 5.
Contains 90% by weight of fine particles with a diameter of ~30μ.
実施例４
松やに２０ｇおよび塩酸ヒドラジン２ｇを加熱溶融して
混合し、これにトルエン１０ｇを加えてラックスを得た
。該ラックス５ｇと実施例１にて得られた半田粉末１０
ｇとを混合してクリーム半田を製造した。Example 4 20 g of pine tar and 2 g of hydrazine hydrochloride were heated and melted and mixed, and 10 g of toluene was added thereto to obtain lux. 5 g of said Lux and 10 of the solder powder obtained in Example 1
A cream solder was produced by mixing with g.
［発明の効果コ
本発明の半田粉末は微細な球形を有しファインパターン
のスクリーン印刷に好適であり、また粒子表面の酸化物
が少ないため半田の流れがよい。[Effects of the Invention] The solder powder of the present invention has a fine spherical shape and is suitable for screen printing of fine patterns, and since there are few oxides on the particle surface, the solder flows well.
また、ファインパターンの印刷に好適なりリーム半田が
得られる。In addition, ream solder suitable for printing fine patterns can be obtained.
第１図および第２図は本発明半田粉末の粒子構造を示す
顕微鏡写真（いずれも（ａ）１００倍、（ｂ）５００倍
）、第３図は従来のアトマイズ法にて得られた半田粉末
の粒子構造を示す顕微鏡写真（（ａ）１００倍、（ｂ）
５００倍）である。Figures 1 and 2 are micrographs showing the particle structure of the solder powder of the present invention (both (a) 100x and (b) 500x), and Figure 3 is the solder powder obtained by the conventional atomization method. Micrograph showing the particle structure of ((a) 100x, (b)
500 times).
Claims (4)
以上であることを特徴とする半田粉末。(1) The proportion of solder particles with a particle size of 5 to 30 μm is 80% by weight
A solder powder characterized by the above.
散媒体中に微粒子状の分散し、該分散系に冷却媒体を添
加して前記の分散された液体半田微粒子を固化させるこ
とを特徴とする半田粉末の製造法。(2) The solder is dispersed in the form of fine particles in a liquid dispersion medium heated to a temperature equal to or higher than its melting point, and a cooling medium is added to the dispersion system to solidify the dispersed liquid solder fine particles. A method for producing solder powder.
あり、これら媒体がシリコンオイル、エンジンオイルお
よび工業用潤滑油から選ばれた少なくとも１種の液状媒
体である前記請求項２記載の半田粉末の製造法。(3) The solder powder according to claim 2, wherein the dispersion medium and the cooling medium are the same liquid medium, and the medium is at least one liquid medium selected from silicone oil, engine oil, and industrial lubricating oil. manufacturing method.
合したことを特徴とする半田ペースト。(4) A solder paste containing the solder powder and flak according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2026945A JPH03230894A (en) | 1990-02-06 | 1990-02-06 | Solder powder, production thereof and solder paste using this method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2026945A JPH03230894A (en) | 1990-02-06 | 1990-02-06 | Solder powder, production thereof and solder paste using this method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03230894A true JPH03230894A (en) | 1991-10-14 |
Family
ID=12207294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026945A Pending JPH03230894A (en) | 1990-02-06 | 1990-02-06 | Solder powder, production thereof and solder paste using this method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03230894A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08252687A (en) * | 1995-03-14 | 1996-10-01 | Sony Corp | Cream solder and method for supplying solder |
| JP2002519509A (en) * | 1998-06-29 | 2002-07-02 | シュルツェ・ユルゲン | Method and apparatus for producing solder powder |
| US6521176B2 (en) | 1994-09-29 | 2003-02-18 | Fujitsu Limited | Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy |
| EP2548677A2 (en) | 2011-07-19 | 2013-01-23 | Mitsubishi Materials Corporation | Solder powder-cleaning agent and method for making solder powder |
| JP2013163185A (en) * | 2012-02-09 | 2013-08-22 | Asahi Kasei E-Materials Corp | Filler metal, solder paste, and connecting structure |
-
1990
- 1990-02-06 JP JP2026945A patent/JPH03230894A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6521176B2 (en) | 1994-09-29 | 2003-02-18 | Fujitsu Limited | Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy |
| US6984254B2 (en) | 1994-09-29 | 2006-01-10 | Fujitsu Limited | Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy |
| JPH08252687A (en) * | 1995-03-14 | 1996-10-01 | Sony Corp | Cream solder and method for supplying solder |
| JP2002519509A (en) * | 1998-06-29 | 2002-07-02 | シュルツェ・ユルゲン | Method and apparatus for producing solder powder |
| EP2548677A2 (en) | 2011-07-19 | 2013-01-23 | Mitsubishi Materials Corporation | Solder powder-cleaning agent and method for making solder powder |
| JP2013023534A (en) * | 2011-07-19 | 2013-02-04 | Mitsubishi Materials Corp | Solder powder-cleaning agent and method for producing solder powder |
| JP2013163185A (en) * | 2012-02-09 | 2013-08-22 | Asahi Kasei E-Materials Corp | Filler metal, solder paste, and connecting structure |
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