JPH0824749A - Adhesive applying method and device therefor - Google Patents

Abstract

PURPOSE:To accurately recognize the diameter (coated area) and height of an adhesive-applying part on a substrate with a simple structure. CONSTITUTION:An adhesive is applied on a substrate 20 by a dispenser 2 provide on an applying head 1. In this case, the adhesive is applied on the substrate by the dispenser 2, and the diameter and height of the adhesive-applying part on the substrate are calculated from the output obtained by scanning the laser beam spots of a laser displacement meter 3 provided on the applying head 1 at least in two directions and measuring the distance between the meter 3 and the spot.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive application method and apparatus for applying an adhesive for fixing electronic components to a substrate used in the manufacturing process of electronic circuit device components.

[0002]

2. Description of the Related Art It is important to guarantee the quality of a substrate coated with an adhesive in this type of adhesive coating device. In the conventional technology as a method for that purpose, an image of the adhesive application state on the substrate is imaged from directly above with a camera, and the portion where the adhesive is applied, that is, the application diameter (application area) of the adhesive application part is recognized, It is known and practiced to change the coating conditions based on this recognition result.

[0003]

However, in the method of imaging the coating diameter (coating area) of the adhesive coating portion with the camera, the coating diameter (coating area) can be recognized but the coating height cannot be directly measured. There is a dislike that the amount of adhesive applied cannot be accurately determined.

The adhesive used for the substrate of various electronic circuit device parts has a viscosity that slightly changes depending on the type and the temperature. Even if the adhesive application portion has the same application diameter, the adhesive amount is not always the same. However, it may be an unsuitable amount depending on the parts to be bonded thereto.

Therefore, if a method capable of directly detecting the coating diameter and the coating height of the adhesive coating portion on the substrate and determining the coating amount, the substrate can be optimally coated with the adhesive. It is possible to improve the substrate quality.

[0006] Japanese Patent Laid-Open No. 1-307470 discloses a viscous fluid coating device equipped with a recognition camera for measuring the area of the adhesive applied to a plate material and a sensor for measuring the height of the adhesive. A device is disclosed. However, since the area and height of the adhesive are measured by separate measuring means, the device configuration becomes complicated.

In view of the above points, the first object of the present invention is to:
It is an object of the present invention to provide an adhesive application method and apparatus that can accurately recognize both the application diameter (application area) and the application height of an adhesive application section on a substrate with a simple configuration.

A second object of the present invention is to provide an adhesive coating method and apparatus which can perform optimal adhesive coating on a substrate and can improve the quality of the substrate.

Other objects and novel features of the present invention will be clarified in Examples described later.

[0010]

In order to achieve the above object, the adhesive coating method of the present invention is such that when the adhesive is coated on a substrate by a dispenser provided in a coating head, the substrate is coated by the dispenser. An adhesive is applied onto the substrate, and the application diameter and height of the adhesive application part where the adhesive is applied onto the substrate is scanned in at least two directions with a laser beam spot of a laser displacement meter provided on the application head. The distance between the laser displacement meter and the spot is calculated from the measured output.

In the adhesive application method, the application diameter and height are calculated with reference to the output obtained by measuring the distance obtained by scanning the spot on the substrate surface where the adhesive is not applied on the substrate. It may be configured to.

In the above adhesive applying method, the laser displacement meter cannot detect the substrate surface where the adhesive is not applied on the substrate, and the adhesive applying portion where the adhesive is applied can be detected. The wavelength of the laser light of the laser displacement meter, the irradiation intensity, and the color of the substrate surface may be set.

In the adhesive application method, the spot of the laser displacement meter may be scanned around the same coordinate position as the adhesive application section.

In the above adhesive coating method, if the adhesive is discarded on the substrate by the dispenser and the detection result by the laser displacement meter of the adhesive coating portion by the discarding is within an allowable range, the substrate is You may make it apply | coat adhesive agent with the said dispenser to the above-mentioned actual application position which actually needs application.

Further, the application diameter and height of the last adhesive application portion by the last adhesive application operation including the adhesive application operation to the actual application position is at least 2 by the laser displacement meter.
The measurement may be performed by scanning in the direction, and the quality of the adhesive application at the actual application position may be determined based on the detection result of the last adhesive application section.

The adhesive coating device of the present invention comprises a substrate positioning and holding means for positioning and holding a substrate, a coating head provided so as to be relatively movable in a plane parallel to the substrate, and a coating head which can be raised and lowered. And a laser displacement meter provided on the coating head, the relative displacement of the coating head with respect to the substrate scans the laser displacement meter in at least two directions, and the dispenser coats on the substrate. This is a configuration for measuring the applied adhesive application part.

[0017]

In the adhesive applying method and apparatus of the present invention,
A laser displacement meter is mounted on a coating head having a dispenser, and the coating head is moved relative to the substrate so that the laser beam spot of the laser displacement meter is scanned in at least two directions to bond the adhesive on the substrate. The coating diameter (coating area) and coating height of the agent coating section can be measured with high accuracy.

When the laser displacement meter can detect the substrate surface of the substrate, the laser displacement meter and the spot obtained by scanning the substrate surface on which the adhesive is not applied on the substrate with the spot are scanned. The application diameter and height can be calculated using the output of the measured distance as a reference distance, and the laser displacement meter cannot detect the substrate surface where the adhesive is not applied on the substrate and the adhesive is applied. Calculate the coating diameter (coating area) and coating height by setting the wavelength and irradiation intensity of the laser beam of the laser displacement meter and the color of the substrate surface so that the adhesive coating section can be detected. You can also do it. That is, the coating diameter (coating area) and the coating height can be calculated even when the substrate surface in a state where the adhesive is not applied can be detected by the laser displacement meter, and conversely when it cannot be detected. .

Further, by scanning the spot of the laser displacement meter around the same coordinate position as the adhesive application portion, the scanning range can be at least the minimum necessary crossing (longitudinal) crossing the adhesive application portion. As the range, the coating diameter (coating area) and coating height can be calculated with sufficient accuracy.

In addition, when the adhesive is discarded by the dispenser on the substrate before the adhesive is applied to the actual application position where the application is actually required on the substrate, the adhesive application part by the discarding is applied. It is possible to determine whether or not the detection result of the adhesive application amount (determined from the application diameter and the application height) is within the allowable range by measuring the application diameter and the application height of the above with the laser displacement meter. As a result, in actual coating, it is possible to control so as to always supply the optimum coating amount to the mounted component, and it is possible to prevent the occurrence of defective substrates.

Further, the laser displacement gauge is scanned in at least two directions for the coating diameter and height of the final adhesive application portion by the final adhesive application operation including the adhesive application operation to the actual application position. When measuring, the quality of the adhesive application amount at the actual application position can be determined by the detection result of the adhesive application amount of the last adhesive application part, and the adhesive of the last adhesive application part can be determined. If the detection result of the coating amount is within the allowable range, it can be sent to the subsequent process as a good quality substrate (component mounting process, etc.), and if it is outside the allowable range, it can be sent to the subsequent process as a substrate requiring attention (allowable range) When it is outside, it may be discharged as a defective substrate.).

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an adhesive coating method and apparatus according to the present invention will be described below with reference to the drawings.

FIGS. 1 to 3 show the essential structure of an embodiment of the present invention, and FIGS. 4 and 5 show the overall structure. FIG. 6 shows the configuration of the laser displacement meter used in the embodiment.

1 to 5, reference numeral 1 denotes a coating head, and a plurality of dispensers 2 for coating an adhesive are provided on the coating head 1 so as to be movable up and down (in this embodiment, there are three dispensers). The case is illustrated). A laser displacement meter 3 is fixed to the coating head 1.
The operation of the laser displacement meter 3 will be described later.

As shown in FIGS. 4 and 5, the substrate transfer 11 disposed on the base 10 has a pair of substrate support rails 12 fixed on the base 10, and supports the substrate from the substrate receiving side. The printed circuit board 20 is received on the rail 12, transferred on the circuit board support rail 12 and positioned and held at a predetermined position, and the printed circuit board 20 on which the adhesive application operation is completed is transferred on the circuit board support rail 12 and discharged. With the function of discharging from the side.

Below the positioning stop position of the printed circuit board 20, as shown in FIG.
A support plate 14 to which a large number of are fixed is provided on the base 10 so as to be movable up and down by a fixed air cylinder 15. The large number of backup pins 13 have a function of contacting and supporting the lower surface of the printed circuit board 20 when the support plate 14 rises. Also, the vertical slider 1 interlocking with the support plate 14
A positioning pin (reference pin) 17 is fixed to the upper end of 6 so that when the support plate 14 rises, the positioning pin 17 fits into the positioning hole 18 of the printed circuit board 20 in the stopped state to position the printed circuit board 20. Has become. The printed circuit board 20 has a plurality of positioning holes 1 as shown in FIG.
8 and electrode patterns 90 and through holes 91. Adhesive application for mounting electronic components is performed in a region P or the like between a pair of electrode patterns.

The positioning pin 17 and the positioning hole 1
8 are provided at, for example, two places as shown in FIG.

The coating head 1 is mounted on the base 10.
An XY drive mechanism 21 for driving the board in the X direction and in the Y direction orthogonal to the plane in a plane parallel to the printed circuit board surface is provided above the board transfer 11. That is, the XY drive mechanism 21 includes a pair of Y-direction slide rails 28 fixedly arranged in the Y-direction, and a Y-direction moving head 22 that slides on the Y-direction slide rails 28 in the Y-direction.
A Y-direction ball screw shaft 23 for screwing the Y-direction moving head 22 to move the Y-direction moving head 22 and a guide shaft 24 provided in the X-direction so as to connect the pair of Y-direction moving heads 22. 3 has an X-direction ball screw shaft 25 and a spline shaft 26 which are parallel to each other. And
The coating head 1 includes a guide shaft 24 and a spline shaft 26.
Slidably provided on the coating head 1 for moving the coating head 1 in the X direction.
It is screwed to. The Y-direction ball screw shaft 23 is rotationally driven by a Y-axis motor (not shown), and the X-direction ball screw shaft 25 is rotationally driven by an X-axis motor 27 mounted on the Y-direction moving head 22. Therefore,
The coating head 1 is driven by rotating the X-direction ball screw shaft 25.
Can be driven in the X direction, and the coating head 1 can be driven in the Y direction by rotationally driving the Y-direction ball screw shaft 23.
The spline shaft 26 is for vertically driving the dispenser 2 provided in the coating head 1, and is rotated by a spline motor (not shown) mounted on the Y-direction moving head 22. There is.

As shown in FIGS. 2 and 3, the coating head 1
Has an integrated ball screw nut 30 that is screwed onto the X-direction ball screw shaft 25, and moves in the X-direction as the X-direction ball screw shaft 25 is rotationally driven. The coating head 1 has
An elevating block 31 corresponding to each dispenser 2 is attached movably in the vertical direction (vertical direction) via a vertical slider 32 as shown in FIG. A rotation holder 33 is attached to each lifting block 31 so as to be rotatable around a vertical axis. These rotating holders 3
A gear 34 for direction change is integrated with 3. Each dispenser 2 is detachably attached to each rotation holder 33 so as to rotate integrally therewith. Therefore, each dispenser 2 can be vertically moved by vertically moving the elevating block 31 and the rotation holder 33 with respect to the application head 1, and the dispenser 2 is moved to the application head 1 by rotating the rotation holder 33 with respect to the elevating block 31. You can rotate it.

Here, each dispenser 2 is, as shown in FIGS. 1 to 3, a container 41 for accommodating the adhesive 40 and an adhesive discharge nozzle fixed to the lower part of the container and communicating with the inside of the container. 42, a detachable upper lid 43 that seals the upper opening of the container 41, and an inner lid 44 that is inwardly in contact with the inner circumference of the container to push down the liquid surface of the adhesive 40 and can be raised and lowered. The tube 46 is connected to the upper lid 43 having the through hole 45, and the inner lid 44, the inner wall of the container 41 and the upper lid 43 are connected.
Pressure air from a pressure air source is supplied through a tube 46 into the space surrounded by. The lower end of the adhesive discharge nozzle 42 has a pair of adhesive discharge ports for attaching two points of adhesive on the printed circuit board surface. In some cases, it has a discharge port. In these cases, each nozzle 4
It is desirable that the two discharge port shapes be different for each dispenser.

Although not shown, the adhesive 40
Each dispenser 2 is provided with a heater for adjusting the temperature of the container 41 accommodating the.

As shown in FIG. 2, the direction changing gear 34 for changing the direction of the dispenser 2 meshes with each other via a planetary gear 55 pivotally supported on the coating head 1 side and rotates in the same direction and at the same angle. To do. Further, as shown in FIG. 3, a direction changing motor 50 is attached to the coating head 1, and a belt wheel 52 fixed to the rotary drive shaft of the motor 50 and one of the planetary gears 55 are integrated. A belt 54 is stretched between the converted belt wheel 53. As a result, each dispenser 2 is rotationally driven in the same direction by the same angle in proportion to the rotation amount of the direction conversion motor 50.

As shown in FIG. 3, the spline nut 6 is mounted on the spline shaft 26 for driving the dispensers 2 up and down.
0 is fitted together with the coating head 1 so as to be slidable in the X direction. This spline nut 60 has a plate cam 6 for raising and lowering drive.
A roller 63 pivotally attached to one end of a bell crank 62 pivotally supported by the coating head 1 is in contact with the plate cam 61. The roller 64 pivotally attached to the other end of the bell crank 62 is inserted between the lower surface of the convex portion 65 on the back surface of each lifting block 31 corresponding to each dispenser 2 and the lifting drive selection piece 66. Here, the raising / lowering drive selection pieces 66 are individually provided in the respective raising / lowering blocks 31, and are provided between a selected position in which the air cylinder (not shown) abuts the roller 64 and a non-selected position in which the roller 64 does not abut. It is designed to move. In addition, each lifting block 3
1, 1 is urged in the pulling direction by an extension spring 65 (provided between the coating head 1 and the block 31). Therefore, when the elevating block 31 is in the raised state, the spline shaft 26 rotates, the spline nut 60 and the elevating drive plate cam 61 rotate accordingly, and the roller 64 descends. If it is in the selected position where it abuts on the roller 64, the lifting block 3 is moved along with the lowering operation of the roller 64.
1 and the dispenser 2 corresponding to this perform the lowering operation, but when the lifting drive selection piece 66 is in the non-selected position, the roller 64 is idle and the lifting block 31 and the dispenser 2 corresponding thereto do not descend. in this way,
The plurality of dispensers 2 can be selectively moved up and down to perform an adhesive application operation on the printed circuit board 20.

FIG. 6 is a configuration diagram of the laser displacement meter 3 mounted on the coating head 1. The measuring unit 70 which irradiates a laser beam and receives the reflected light from the measurement surface, and the measurement output of the measuring unit 70 are shown in FIG. The controller unit 71 performs signal processing. The measuring unit 70 includes a semiconductor laser driving circuit 72, a semiconductor laser 73 driven by the semiconductor laser driving circuit 72 to generate a laser beam and a light projecting lens 74, and a light receiving lens for receiving the laser beam reflected by the measurement surface. 75 and an optical position detection element 76, and an amplifier 77 that amplifies a detection signal at each detection end of the optical position detection element 76. The semiconductor laser 73 serving as the light source of the laser displacement meter 3 has a wavelength of 67, for example.
With a laser displacement meter having a wavelength of 0 to 780 nm and in which red visible light appears, it is easy to perform positioning while observing the laser light spot hitting the measurement surface.

The laser displacement meter 3 has a function of measuring the distance between the laser displacement meter 3 and the laser light spot hitting the measurement surface. The operation of the laser displacement meter 3 will be briefly described. Now the measurement surface 80 at the reference distance
In the case of, the projection lens 74 generated by the semiconductor laser 73
The laser light emitted from is reflected as shown by the alternate long and short dash line in FIG. 6, passes through the light receiving lens 75, and is incident on the center position of the optical position detection element 76. That is, the spot of the laser light on the light position detection element 76 is at the center position. In the case of the measurement surface 80A located closer than the reference distance, the laser light is the dotted line a.
As a result, the spot of the laser light moves toward the A-side detection end of the optical position detection element 76. On the contrary, in the case of the measurement surface 80B at a position farther than the reference distance, the laser light is reflected as shown by the dotted line b, and as a result, the spot of the laser light moves to the B-side detection end of the light position detection element 76. . Such a change in the detection signal at each detection end due to the movement of the spot of the laser light on the optical position detection element 76 is amplified by the amplifier 77 and output to the controller unit 71. The controller unit 71 calculates the spot movement amount. Output signal indicating the height of the measurement surface (height with reference to the reference distance) by converting to digital signal and performing linear correction and averaging (can be output as both analog and digital signals)
Give out.

The mounting position of the laser displacement meter 3 on the coating head 1 is fixed so that the stroke of the XY drive mechanism 21 can cover the entire coating range of the maximum specification substrate of the apparatus main body. The height is fixed based on the height of the substrate at the time of coating.

Next, the operation of this embodiment will be described with reference to the flowchart of FIG. 8 in the case where the adhesive is applied to the printed circuit board 20 of FIG.

First, in step # 1, the printed circuit board 20 is received on the substrate transfer 11 shown in FIGS. 4 and 5, and after being transferred to the positioning stop position by the substrate transfer 11, the support plate 14 is lifted to position the positioning pins 17 on the printed circuit board. Two
It fits into the positioning hole 18 of 0 and the printed circuit board 2
Clamp (hold) 0 at its positioned position.

Next, in step # 2, it is assumed that the first dispenser 2 from the left in FIG. This is done with the first dispenser 2. In this case, the discarding is performed in a separated area Q that does not interfere with the electrode pattern 90, the positioning hole 18, the through hole 91, etc. of the printed board 20. In this discarding application of the adhesive, the application head 1 is moved by the XY drive mechanism 21 to set the position of the first dispenser 2 on the area Q of the substrate surface, and then the spline shaft 26 is rotated to apply the adhesive. This is performed by lowering the dispenser 2 via the cam mechanism on the head 1 side to bring the lower end (adhesive discharge port) of the nozzle 42 into contact with the substrate surface, and then returning to the raised position.

In step # 3, the laser displacement meter 3 measures the adhesive application portion by the discarding application. As shown in FIG. 9, the adhesive application section 10 in which the adhesive 40 is applied to the substrate surface.
0 has a predetermined coating diameter (coating area) and coating height (however, in FIG.
The figure shows the case of dot marking. ). In order to measure the adhesive application section 100 with the laser displacement meter 3, the application head 1 is moved to the application position in parallel with the substrate surface. The positional relationship between the installation position of the dispenser 2 in the coating head 1 and the installation position of the laser displacement meter 3 is set in advance in the X direction and the Y direction as known amounts on the apparatus main body side. After the discard coating, the laser displacement meter 3 moves according to the set amount. That is, the laser light spot on which the laser light from the laser displacement meter 3 strikes the measurement surface also moves. The same coordinate position is used for the point to which the adhesive is applied and the designated point for measurement by the laser displacement meter 3 (the designated point for applying the laser beam spot).

This laser displacement meter 3 uses a laser displacement meter 3 which moves about 3 mm around the designated point in the X direction and the Y direction with respect to the designated point to be measured as shown in FIG. The measurement point (the laser light spot that hits the measurement surface) is held and scanned. Where X-
As the moving speed of the Y drive mechanism 21, that is, the moving speed of the coating head 1, a speed suitable for measurement can be selected.

The recognition of the adhesive applied to the substrate surface of the printed circuit board 20 utilizes the fact that the laser displacement meter 3 cannot detect objects of different colors, that is, different reflectances at the same level. In practice, the substrate to which the adhesive is applied is often a dark color, and the dark color substrate cannot be detected by the laser displacement meter 3, but the applied adhesive can be set to be detectable. (For example, the wavelength and irradiation intensity of laser light are appropriately set according to the color of the substrate.). Here, the following description will be given assuming that the substrate cannot be detected by the laser displacement meter 3.

The measuring process is performed by measuring the amount of displacement with the minimum value at the place where the laser displacement meter 3 starts or ends detecting the adhesive 40 of the adhesive applying section 100 as a reference value (0 value). By going, the height can be obtained, and the application diameter can be determined by the movement amount of the XY drive mechanism 21 within the range where the adhesive is detected. By performing this in two directions, the X direction and the Y direction, and averaging the numerical values, the coating diameter and height of the adhesive coating section 100 are determined, and the actual coating amount can be calculated.

At step # 4, it is judged whether or not the measured value by the laser displacement meter 3 is within the allowable range. That is, it is determined whether the adhesive application amount of the adhesive application unit 100 obtained in step # 3 is within the allowable range, and if it is within the allowable range, step # 5 is executed. That is, the bonding by the first dispenser 2 without changing the adhesive coating condition at the actual coating position where the coating is actually required (for example, the region P between the pair of electrode patterns 90 in FIG. 7). Apply the agent (actual application).

When it is determined in step # 4 that the adhesive application amount of the adhesive application part 100 is out of the allowable range, the application conditions (eg, dispenser 2) are determined in step # 6.
Of the pressure air to be supplied into the container 41, the coating time, the descending speed of the dispenser 2, the temperature of the heater for heating the container 41, etc.), and the coating is again discarded in step # 2, the laser displacement meter in step # 3. It is determined whether the measurement by 3 and the measured value in step # 4 are within the allowable range. In step # 4, if it is judged that the value measured by the laser displacement meter 3 is outside the allowable range several times consecutively and the set number of times is reached, it is regarded as an abnormality of the device and an alarm is generated and the device is stopped. Let

When the actual coating operation on the substrate surface corresponding to the electrode pattern 90 or the like of the printed circuit board 20 is completed, the laser displacement meter 3 detects the coating amount for confirming the final coating point in step # 7. This application amount detection can be performed in the same manner as the application amount detection in the case of the discarding application in step # 3. Then, in step # 8, it is determined whether or not the value measured by the laser displacement meter 3 is within the allowable range (the determination method is the same as in step # 4), and the adhesive application amount at the final application point is within the allowable range. In this case, in step # 9, the support plate 14 supporting the lower surface of the printed circuit board 20 of the substrate transfer 11 is lowered and the positioning pins 17 are removed to release the clamp of the printed circuit board 20. 20 is sent to the next process (component mounting process, etc.). If it is determined that the printed circuit board 20 is out of the allowable range, it is displayed in step # 10 that the printed circuit board 20 needs attention for the next step and is sent (however, it may be discharged as a defective product).

In determining the coating points in steps # 4 and # 8, allowable ranges are set for the coating diameter and the coating height, and it is judged whether or not these are also within the allowable range. Good.

The flow chart of FIG. 8 illustrates the case where the first dispenser 2 from the left is used.
When using the second or third dispenser 2,
Steps # 2 to # 8 are repeated for those dispensers 2.

It should be noted that in the flow chart of FIG.
The case where the adhesive 40 is applied at one point as described above has been described as an example. However, when the adhesive 40 is applied at two points as shown in FIG. 10 or 11, the application parts of steps # 3 and # 7 in FIG. The measurement is as follows.

When the nozzle of the dispenser 2 has a pair of adhesive ejection ports for performing two-point attachment, two adhesive application portions are formed. At this time, the laser displacement meter 3 uses a laser displacement meter 3 with respect to a designated point to be measured (the same as the coating designated point) in two directions from the nozzle pitch P of the dispenser 2 to the X direction and the Y direction. The measurement position and its movement amount are determined.

Two coating parts 1 in the X direction as shown in FIG.
If 00A and 100B are possible, the scanning position in the X direction passes over the specified point for measurement, and the movement amount is (P + 4) mm.
About. In the Y direction, the scanning position is set at the X coordinate position of ± P / 2 evenly distributed around the designated point, and after measuring one coating portion, move Pmm to measure the other coating portion. Make a reciprocating motion. The amount of movement in the Y direction at each coating part may be about 3 mm.

Further, as shown in FIG. 11, since the coating condition is set such that the discharge port pitch P of the nozzles of the dispenser 2 is small or the adhesive coating amount is large, two points of coating as shown in FIG. 11 are applied. When the portions have overlapping shapes, the measurement processing cannot determine the coating diameter in the X direction, and thus the numerical values in the two directions of the Y direction cannot be averaged. The coating diameter y _{1 in} only the direction will be used as a representative value. However, an allowable range can be set for the length x ₁ at both ends in the direction in which the two coating portions are arranged.

In the case of measuring the two-point adhesive coating portion, the coating amount is calculated for each of the two-point coating portions. In the case of determining the allowable range of the adhesive application amount in steps # 4 and # 8, when handling the two-point application section, the determination is made for each of the two application sections, and the two application sections are both within the acceptable range. If it is within the range, the process proceeds to the next step # 5 (actual application) and step # 9 (delivery as non-defective product). If the two points are out of the allowable range, the process proceeds to step # 6 (change of coating conditions) and step # 10 (delivery as a substrate requiring attention). Here, if one of the two coating parts is within the allowable range and the other is outside the allowable range, a problem such as clogging inside the nozzle may be considered. The device is stopped regardless of the set number of times, and the nozzle confirmation is prompted.

It should be noted that it is known in advance in the main body of the apparatus whether to attach two points along the X direction or two points along the Y direction. Therefore, according to the set value, The direction of two points on the adhesive application part is judged. When two points are marked along the Y direction, the X direction and the Y direction of FIG. 10 or FIG. 11 may be switched and the scanning of the laser displacement meter 3 may be performed.

In the description of the flow chart of FIG. 8, the laser displacement meter 3 can recognize the adhesive applied to the substrate surface of the printed circuit board 20, but the substrate surface cannot. The measurement operation of the adhesive application section using the laser displacement meter 3 when the surface can be recognized is as follows.

Before performing the discard coating in step # 2,
The height of the substrate surface at the coordinate position to be discarded is measured according to the coordinate position to be discarded (the laser displacement spot is scanned on the substrate surface by the laser displacement meter 3 to determine the laser displacement meter and the laser light spot on the substrate surface). The substrate surface height can be obtained by measuring the distance. Then, based on the same coordinate position data, the dispenser 2 dispenses the adhesive by discarding, and in step # 3, the height of the substrate surface is measured by the laser displacement meter 3. Sa X
And scan in the Y and Y directions. Since the portion to which the adhesive is applied has a much larger height with respect to the roughness of the substrate surface, the substrate and the adhesive are applied from the measured values when the laser displacement meter 3 is scanned in the X and Y directions. The boundary of the part with the adhesive can be determined as a place where a certain height is exceeded or a certain displacement change amount is exceeded, and the application diameter (application area) of the application point can be measured from this. Judgment in Step # 4,
The actual coating of step # 5 and the measurement of the final coating part of step # 7 may be similarly performed. Here, the printed circuit board 20
Is firmly fixed by the positioning pins 17 of the substrate transfer 11, so it can be said that the substrate height before and after the coating operation does not change.

Further, even when the laser displacement meter 3 can recognize the board surface, when the laser displacement meter 3 measures a printed board having no warp such as a thick printed board, the entire board surface is measured in advance. (For example, as shown by the dotted line R on the printed circuit board 20 in FIG. 7, the Y direction is folded back once and the laser displacement meter 3 is scanned so that the X direction proceeds in one direction.) After the inclination of the printed circuit board is calculated, it is discarded. Substrate surface height at position and final coating position (initial height)
Can be calculated before application and stored in the device body. Therefore, it is not necessary to detect the substrate surface height at the coating point immediately before the discarding coating or immediately before the final coating.

According to this embodiment, the following effects can be obtained.

(1) The laser displacement meter 3 is used, and the laser displacement meter 3 is mounted on the coating head 1 to scan in the X and Y directions. Both the coating height and the coating diameter (coating area) can be measured, and the configuration can be simplified as compared with the configuration in which separate sensors are used for measuring the coating height and the coating diameter. Also,
The coating height is 0.05μ by using the laser displacement meter 3.
A resolution of m can be realized, and highly accurate measurement is possible.

(2) Since the laser displacement meter 3 is used to measure the adhesive application portion for each printed circuit board to be applied, the effect of the type of adhesive used and the viscosity at that time, or the dispenser 2 It is possible to select the optimum amount of coating for each component to be mounted, in response to the influence of the remaining amount in the container on the coating state.

(3) For each printed circuit board to be coated, by measuring the adhesive coating portion by discarding before actual coating,
The generation of a defective substrate can be prevented in advance, and the substrate quality can be assured by performing the measurement for confirming the adhesive application by the final application operation with the laser displacement meter 3.

(4) The adhesive application amount can be calculated from the application diameter and the application height measured by the laser displacement meter 3, and it can be determined whether or not the adhesive application amount is within the allowable range. In addition to this, it is also possible to determine independent allowable ranges for the coating diameter and the coating height, and determine whether the coating diameter and the coating height are within the respective allowable ranges. If the coating diameters are extremely different, it is possible to judge that the thread is not properly drawn (the state where the adhesive pulls the thread).

(5) When the measurement result by the laser displacement meter 3 in step # 4 or step # 8 is determined, the defect determination data is fed back to the main body of the apparatus, for example, the pressure of the pressure air supplied to the dispenser container. By combining with functions such as control, application time control by the dispenser 2, dispenser ascending / descending speed control, and heater for adjusting temperature of the dispenser container, higher-level automatic application amount control can be performed.

The color of the printed circuit board to which the adhesive is applied is not fixed, and the surface of the printed circuit board may be detected by the laser displacement meter 3 depending on the type of the printed circuit board. In order to facilitate the measurement of the adhesive application portion by the laser displacement meter, it is better to use a laser displacement meter that can adjust the detection level (for example, the amount of emitted light or the output of the amount of received light).
In the laser displacement meter 3 of FIG. 6, the detection level (setting level) described below can be adjusted by the controller unit 71 so that the measurement of the adhesive application portion is reliable.

(1) Gain Setting By adjusting the gain, the input level to the signal processing circuit built in the controller unit 71 can be adjusted to an optimum place. By setting the gain to an appropriate amount value in this way, the laser displacement meter 3 can perform measurement in a state in which the received light amount obtained has good repeatability.

(2) Setting of Average Number of Sampling By averaging the measured data obtained by sampling the measured values of the measuring unit 70 of the laser displacement meter 3, fluctuation of the measured data can be reduced. When the laser displacement meter is sent at a constant speed, output fluctuation can be suppressed.

(3) Setting of upper limit and lower limit The upper limit and the lower limit of the measured value can be set to limit the quality judgment of the measuring object.

(4) Setting of the received light amount detection level If the received light amount when the measured value of the measuring unit 70 is obtained is smaller than a certain value, the reliability of the displacement output cannot be obtained. The measured value can be held at the previous value by adjusting.

(5) Setting of correction value When measuring a measurement target portion into which light enters, since the linearity between the displacement amount of the measuring unit 70 and the output data is inclined, the linearity can be obtained by changing the sensitivity value. It is possible to set to correct the inclination of.

In the laser displacement meter 3 of FIG. 6, the amount of light received by the optical position detecting element 76 of the measuring section 70 is used as correction data until the controller section 71 outputs a displacement output. When the light quantity is smaller than a certain value, the reliability of the displacement output cannot be obtained, and therefore the laser displacement meter 3 indicates that measurement is impossible. A laser displacement meter with detection level adjustment can be used to adjust the level of the substrate surface to be discarded and applied to a level that cannot be detected (emission light amount or received light amount output) to clarify the distinction from the detected adhesive application part. desirable.

On the substrate to which the adhesive is applied, there may be through holes and cream solder in addition to the electrode pattern. Therefore, the last application part of the discarding application or actual application operation is adjacent to them. If it is, there is a concern that misrecognition may occur depending on the scanning direction of the laser displacement meter 3. There is no problem because the through hole indicates that the laser displacement meter 3 cannot detect it, but since the electrode pattern and the cream solder are detected in the same manner as the adhesive, they are distinguished by the coordinate position that specifies the coating position. . In particular, if there is a possibility that the adhesive application part measured by the final actual application operation measured in step # 7 described in the flowchart of FIG. 8 interferes with the electrode pattern or cream solder and is erroneously recognized, it is used for confirmation after the actual application. It suffices to perform the final discard coating at an appropriate position on the substrate surface and measure this with the laser displacement meter 3.

It is conceivable that the light beam of the laser displacement meter may adversely affect the detection of a small amount of adhesive applied depending on the direction of light projection and light reception. Therefore, it is more preferable that the fixing direction of the laser displacement meter with respect to the coating head can be switched by 90 °.

In the above embodiment, it was explained that when the laser displacement meter 3 measures the adhesive application portion in step # 3 and step # 7, scanning is performed in two directions, that is, the X direction and the Y direction which are orthogonal to each other. If the number of directions in which the laser displacement meter 3 is scanned is increased, as in the case of scanning in 4 directions scanning at every 30 ° or scanning in 6 directions scanning at every 30 °, the adhesive coating amount can be calculated more accurately. become.

Further, the shape of the applied adhesive can be recognized in the cross section of the adhesive applying portion in the scanning direction, and the position deviation of the application is detected at the position of the application range and the maximum application height with respect to the designated point of measurement. Therefore, it is possible to expand the range of use of the measurement data by the laser displacement meter 3.

In the above embodiment, the printed circuit board 20 is used.
Is fixed, and the coating head 1 equipped with the dispenser 2 and the laser displacement meter 3 is mounted on the printed circuit board 2 by the XY drive mechanism 21.
I tried to move in a horizontal plane parallel to the substrate surface of 0,
The coating head 1 may be fixed and the printed circuit board 20 may be held by the XY table.

Although the embodiment of the present invention has been described above, it is obvious to those skilled in the art that the present invention is not limited to this and various modifications and changes can be made within the scope of the claims. Let's do it.

[0077]

As described above, according to the adhesive coating method and apparatus of the present invention, the laser displacement meter is mounted on the coating head having the dispenser, and the laser displacement is performed by moving the coating head relative to the substrate. Total at least 2
By scanning in the direction, the coating diameter (coating area) and the coating height of the adhesive coating section where the adhesive is coated on the substrate can be measured with high accuracy. As a result, it is possible to obtain a high quality substrate to which an appropriate amount of the adhesive has been applied.

Further, the measurement of the adhesive application portion can be performed by the laser displacement meter for each printed circuit board to be applied, and the influence of the viscosity of the type of adhesive used and the temperature at that time, and
Alternatively, it is possible to select the optimum coating amount for each component to be mounted, in response to the influence of the remaining amount in the container of the dispenser on the coating state.

Further, the structure can be simplified as compared with the structure in which separate sensors are used for measuring the adhesive coating height and the coating diameter, and the quality of the adhesive coating portion can be easily determined.

[Brief description of drawings]

FIG. 1 is a front view showing a configuration of a main part of an embodiment of an adhesive applying method and apparatus according to the present invention.

FIG. 2 is a plan view of the same.

FIG. 3 is a side sectional view of the same.

FIG. 4 is a plan view showing the overall configuration of the embodiment.

FIG. 5 is a side sectional view of the same.

FIG. 6 is a configuration diagram of a laser displacement meter used in an example.

FIG. 7 is a perspective view showing an example of a printed circuit board on which an adhesive is applied.

FIG. 8 is a flowchart for explaining the operation of the embodiment.

FIG. 9 is a perspective view showing an example of an adhesive application part by one-point application in which an adhesive is applied to a substrate surface.

FIG. 10 is a perspective view showing an example of an adhesive application part by two-point application in which an adhesive is applied to a substrate surface.

FIG. 11 is a perspective view showing another example of an adhesive application section by two-point attachment in which an adhesive is applied to the substrate surface.

[Explanation of reference numerals] 1 coating head 2 dispenser 3 laser displacement meter 10 base 11 substrate transfer 17 positioning pin 18 positioning hole 20 printed circuit board 21 XY drive mechanism 26 spline shaft 31 lifting block 33 rotating holder 40 adhesive 41 container 70 Measurement unit 71 Controller unit 73 Semiconductor laser 76 Optical position detection element 80 Measurement surface 100, 100A, 100B Adhesive application unit

Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location G01B 11/00 B // H05K 3/34 505 D 8718-4E

Claims (7)

[Claims] 1. An adhesive application method for applying an adhesive on a substrate by a dispenser provided in an application head, wherein the adhesive is applied on the substrate by the dispenser, and the adhesive is applied on the substrate. The application diameter and height of the adhesive application section are calculated from the output of the laser displacement meter provided on the application head, which scans the laser beam spot in at least two directions to measure the distance between the laser displacement meter and the spot. An adhesive application method characterized by the above. 2. The coating diameter and height are calculated with reference to an output obtained by measuring the distance obtained by scanning the substrate surface on which the adhesive is not applied on the substrate, as a reference distance. Adhesive application method. 3. The laser displacement meter according to claim 1, wherein the laser displacement meter cannot detect a substrate surface on which the adhesive is not applied on the substrate, and the adhesive application portion to which the adhesive is applied can be detected. The adhesive application method according to claim 1, wherein the wavelength of the laser light, the irradiation intensity, and the color of the substrate surface are set. 4. The spot of the laser displacement meter is scanned around the same coordinate position as the adhesive application section.
The adhesive application method described. 5. The adhesive is discarded on the substrate by the dispenser, and if the detection result by the laser displacement meter of the adhesive application portion by the discarding is within an allowable range, the adhesive is actually applied on the substrate. The adhesive application method according to claim 1, wherein the adhesive application is executed by the dispenser at an actual application position where the adhesive is required. 6. The laser displacement gauge is scanned in at least two directions for the coating diameter and height of the last adhesive application portion by the last adhesive application operation including the adhesive application operation to the actual application position. The adhesive application method according to claim 5, wherein the quality is measured and the quality of the adhesive application at the actual application position is determined based on the detection result of the last adhesive application section. 7. A substrate positioning and holding means for positioning and holding a substrate, a coating head provided so as to be relatively movable within a plane parallel to the substrate, a dispenser provided for the coating head so as to be movable up and down, A laser displacement meter provided on the coating head, wherein the laser displacement meter is scanned in at least two directions by relative movement of the coating head with respect to the substrate, and an adhesive coating section coated on the substrate by the dispenser is formed. An adhesive application device characterized by being measurable.