JP4301413B2 - Image processing method and apparatus for liquid coating material, and liquid coating apparatus - Google Patents

Image processing method and apparatus for liquid coating material, and liquid coating apparatus Download PDF

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JP4301413B2
JP4301413B2 JP2005218683A JP2005218683A JP4301413B2 JP 4301413 B2 JP4301413 B2 JP 4301413B2 JP 2005218683 A JP2005218683 A JP 2005218683A JP 2005218683 A JP2005218683 A JP 2005218683A JP 4301413 B2 JP4301413 B2 JP 4301413B2
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浩二 田中
一夫 山崎
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TDK Corp
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本発明は、各種樹脂等の液体を非貫通開口部内に塗布する場合において、その液体塗布物の量を測定するための液体塗布物の画像処理方法及び装置、並びにその画像処理装置を備えた液体塗布装置に関する。   The present invention relates to an image processing method and apparatus for a liquid application for measuring the amount of the liquid application when a liquid such as various resins is applied to the non-through opening, and a liquid provided with the image processing apparatus. The present invention relates to a coating apparatus.

従来、図15(A)のように基板等の平面80に液体を点状に塗布する場合において、その液体塗布物81の量を測定するのに、液体塗布物81を撮像装置(カメラ)82で撮像し、図15(B)のモニタ画像のように、撮像装置82の画像信号を画像処理して得た画像における液体塗布物81の径を測定する方法が採られていた。このような方法又は装置を開示するものとして下記特許文献1〜特許文献3がある。
特許第3410214号公報 特開平9−323057号公報 特開2005−40690号公報
Conventionally, in the case where a liquid is applied to a flat surface 80 such as a substrate as shown in FIG. 15A, the liquid application 81 is measured using an imaging device (camera) 82 in order to measure the amount of the liquid application 81. As shown in the monitor image of FIG. 15B, a method of measuring the diameter of the liquid application 81 in an image obtained by image processing of the image signal of the imaging device 82 has been adopted. The following Patent Documents 1 to 3 disclose such a method or apparatus.
Japanese Patent No. 3410214 JP-A-9-323057 JP 2005-40690 A

上記特許文献1〜3の従来技術では、液滴である液体塗布物の直径をもって体積を計算するため、誤差は多いが液体塗布装置の連続動作の中で測定が可能なのでフィードバック制御が可能である。但し、非貫通開口部つまり凹部への液体塗布に対しては、外径の変化による測定が不可能であるため、塗布量の測定ができない問題がある。このような例は、図16(A),(B)のように、基板(あるいは電子部品)90の凹部(キャビティー)91に実装されたチップ形電子部品95を充填剤となる樹脂92で封止する場合等が考えられる。   In the prior arts disclosed in Patent Documents 1 to 3, the volume is calculated based on the diameter of the liquid coating material, which is a droplet. Therefore, although there are many errors, measurement can be performed during the continuous operation of the liquid coating device, and feedback control is possible. . However, there is a problem in that the amount of coating cannot be measured for liquid application to a non-penetrating opening, that is, a recess, because measurement by changing the outer diameter is impossible. In such an example, as shown in FIGS. 16A and 16B, a chip-type electronic component 95 mounted in a concave portion (cavity) 91 of a substrate (or electronic component) 90 is made of a resin 92 as a filler. The case where it seals etc. can be considered.

さらに、透明液体を塗布する場合等は、基板等の対象物との明度の差を安定して得ることが難しく、測定対象となる液体が限定されるきらいがある。   Furthermore, when a transparent liquid is applied, it is difficult to stably obtain a difference in brightness from an object such as a substrate, and the liquid to be measured may be limited.

一方、基板等の平面に液体を点状に塗布する場合において、その液体塗布物の量を測定するのに、吐出した液体の重量(質量)を実測する方法が下記特許文献4にて提案されていた。
特開2004−209429号公報
On the other hand, in the case where a liquid is applied to a flat surface of a substrate or the like in the form of dots, a method of actually measuring the weight (mass) of the discharged liquid is proposed in the following Patent Document 4 to measure the amount of the liquid application. It was.
JP 2004-209429 A

特許文献4の従来技術では、測定専用ステージを用いて液体塗布物の重量を直接測るため、管理すべきパラメータである液体塗布物の体積は正確に求められるが、測定専用ステージが必要となるという問題がある。   In the prior art of Patent Document 4, since the weight of the liquid application is directly measured using the measurement-dedicated stage, the volume of the liquid application, which is a parameter to be managed, is accurately determined, but a measurement-dedicated stage is required. There's a problem.

本発明は、上記の点に鑑み、樹脂等の液体を非貫通開口部内に塗布し、その塗布量を測定する場合において、簡単かつ高精度に測定可能で、汎用性が高い液体塗布物の画像処理方法及び装置を提供することを目的とする。   In the present invention, in view of the above points, when a liquid such as a resin is applied in a non-penetrating opening and the amount of application is measured, an image of a liquid application that can be measured easily and with high accuracy and is highly versatile. It is an object of the present invention to provide a processing method and apparatus.

さらに、本発明は、上記液体塗布物の画像処理装置を備えることで、フィードバック制御による非貫通開口部内への液体の定量塗布が可能な液体塗布装置を提供することをもう1つの目的とする。   Furthermore, another object of the present invention is to provide a liquid coating apparatus that is capable of quantitatively coating a liquid into a non-penetrating opening by feedback control by including the image processing apparatus for the liquid coating.

本発明のその他の目的や新規な特徴は後述の実施の形態において明らかにする。   Other objects and novel features of the present invention will be clarified in embodiments described later.

上記目的を達成するために、本発明に係る液体塗布物の画像処理方法は、撮像手段を用いるとともに、照明手段として該撮像手段の周囲又は該撮像手段への入射光を囲む位置関係に設けられたリング状照明のみを用い、対象物の非貫通開口部内の液体塗布物の量を測定する液体塗布物の画像処理方法であって、
前記液体塗布物の表面で反射された前記リング状照明のリング状の像を前記撮像手段で撮像し、撮像された前記リング状照明のリング状の像の寸法によって前記非貫通開口部内の液体塗布物の量を測定することを特徴としている。
前記液体塗布物の画像処理方法において、前記リング状照明のリング状の像の寸法と、前記非貫通開口部内の液体塗布物の液面高さとの相関関係が略一次関数であるとして、前記非貫通開口部内の液体塗布物の量を測定してもよい。
To achieve the object, an image processing method for a liquid application consistent with the present invention, as well as there use the imaging means, provided at a position surrounding relation to light incident on the periphery or the image pickup means image pickup means as a lighting means A liquid application image processing method for measuring the amount of the liquid application in the non-through opening of the object using only the ring-shaped illumination,
The ring-shaped image of the ring- shaped illumination reflected on the surface of the liquid application object is imaged by the imaging means, and the liquid application in the non-penetrating opening is measured according to the size of the imaged ring-shaped image of the ring- shaped illumination. It is characterized by measuring the amount of objects.
In the image processing method of the liquid application product, the correlation between the size of the ring-shaped image of the ring-shaped illumination and the liquid level of the liquid application product in the non-through opening is assumed to be a substantially linear function. You may measure the quantity of the liquid coating material in a through-opening part.

本発明に係る液体塗布物の画像処理装置は、撮像手段と、該撮像手段の周囲又は該撮像手段への入射光を囲む位置関係に設けられたリング状照明のみの照明手段と、前記撮像手段で撮像された画像信号を処理する画像処理演算手段とを備え、対象物の非貫通開口部内の液体塗布物の量を測定する液体塗布物の画像処理装置であって、
前記液体塗布物の表面で反射された前記リング状照明のリング状の像を前記撮像手段で撮像し、撮像された前記リング状照明のリング状の像の寸法を前記画像処理演算手段によって算出することにより、前記非貫通開口部内の液体塗布物の量を測定することを特徴としている。
前記液体塗布物の画像処理装置において、前記画像処理演算手段で算出された前記リング状照明のリング状の像の寸法と、前記非貫通開口部内の液体塗布物の液面高さとの相関関係が略一次関数であるとして、前記非貫通開口部内の液体塗布物の量を測定することを特徴としている。
An image processing apparatus for a liquid application according to the present invention includes an imaging unit, an illumination unit including only ring-shaped illumination provided in a positional relationship around the imaging unit or surrounding incident light to the imaging unit , and the imaging unit. An image processing operation unit for processing an image signal captured in step (a), and an image processing apparatus for a liquid application product for measuring the amount of the liquid application product in the non-through opening of the object,
The ring-shaped image of the ring- shaped illumination reflected by the surface of the liquid application is captured by the imaging unit, and the size of the captured ring-shaped image of the ring- shaped illumination is calculated by the image processing calculation unit. Thus, the amount of the liquid application in the non-penetrating opening is measured.
In the liquid application image processing apparatus, there is a correlation between the size of the ring-shaped image of the ring-shaped illumination calculated by the image processing calculation unit and the liquid level of the liquid application material in the non-penetrating opening. It is characterized by measuring the amount of the liquid coating material in the non-through opening, assuming that it is a substantially linear function.

本発明に係る液体塗布装置は、対象物の非貫通開口部内に液体を塗布するディスペンサと、
該ディスペンサの液体吐出量を制御するディスペンスコントローラと、
撮像手段と、該撮像手段の周囲又は該撮像手段への入射光を囲む位置関係に設けられたリング状照明手段と、前記撮像手段で撮像された画像信号を処理する画像処理演算手段とを有し、前記非貫通開口部内の液体塗布物の表面で反射された前記リング状照明の像を前記撮像手段で撮像し、撮像された前記リング状照明の像の寸法を前記画像処理演算手段によって算出することにより、前記非貫通開口部内の液体塗布物の量を測定する液体塗布物の画像処理装置とを備え、
前記液体塗布物の量の測定値を前記ディスペンスコントローラにフィードバックして、前記液体塗布物の量を所望範囲内に制御することを特徴としている。
A liquid application apparatus according to the present invention includes a dispenser for applying a liquid in a non-through opening of an object;
A dispense controller for controlling the liquid discharge amount of the dispenser;
An imaging unit; a ring-shaped illumination unit provided in a positional relationship around the imaging unit or surrounding incident light to the imaging unit; and an image processing calculation unit that processes an image signal captured by the imaging unit. Then, the image of the ring-shaped illumination reflected by the surface of the liquid application material in the non-penetrating opening is captured by the imaging unit, and the size of the captured image of the ring-shaped illumination is calculated by the image processing calculation unit A liquid application image processing apparatus for measuring the amount of the liquid application object in the non-through opening ,
A measured value of the amount of the liquid application is fed back to the dispense controller, and the amount of the liquid application is controlled within a desired range.

前記液体塗布装置において、前記ディスペンサによって対象物に液体を塗布する塗布ステージとは別のステージで、前記対象物に塗布された液体塗布物の量を測定して、前記塗布ステージにある次の対象物への液体塗布のために測定値をフィードバックする構成としてもよい。   In the liquid application apparatus, a next object in the application stage is measured by measuring the amount of the liquid application applied to the object in a stage different from the application stage for applying the liquid to the object by the dispenser. It is good also as a structure which feeds back a measured value for the liquid application to a thing.

前記液体塗布装置において、前記ディスペンサによって対象物に液体を塗布する塗布ステージで、前記対象物に塗布された液体塗布物の量を測定して、前記塗布ステージでの当該対象物への液体塗布のために測定値をフィードバックする構成としてもよい。   In the liquid application apparatus, an amount of liquid application applied to the object is measured at an application stage for applying liquid to the object by the dispenser, and liquid application to the object at the application stage is performed. Therefore, a configuration may be adopted in which the measurement value is fed back.

本発明者は、撮像手段の周囲又は該撮像手段への入射光を囲む位置関係に設けられたリング状照明で照明して、対象物の非貫通開口部内の液体塗布物を撮像手段で撮像したときに、前記液体塗布物の表面で反射された前記リング状照明の像の径と、前記対象物の所定の基準面から前記液体塗布物の表面までの高さとの間に一定の関係があることを実験的に見いだした。従って、本発明に係る液体塗布物の画像処理方法及び装置によれば、上記関係を用いることで、前記非貫通開口部の形状(底面積、底面までの深さ等)が既知であれば、前記非貫通開口部内に塗布された液体塗布物の表面の高さから液体塗布物の量を特別な測定ステージを設けることなく簡単、高精度に測定可能である。また、対象物と液体塗布物との間に明度の差は不要であり、透明液体等であってもよく、測定可能な液体の範囲が広く、汎用性がある。   The inventor illuminates with a ring-shaped illumination provided around the imaging means or in a positional relationship surrounding incident light to the imaging means, and images the liquid application in the non-penetrating opening of the object with the imaging means. Sometimes, there is a certain relationship between the diameter of the ring-shaped illumination image reflected on the surface of the liquid application and the height from the predetermined reference surface of the object to the surface of the liquid application. I found this experimentally. Therefore, according to the image processing method and apparatus for a liquid application according to the present invention, if the shape of the non-through opening (bottom area, depth to the bottom, etc.) is known by using the above relationship, From the height of the surface of the liquid application applied in the non-through opening, the amount of the liquid application can be measured easily and with high accuracy without providing a special measurement stage. Further, there is no need for a difference in brightness between the object and the liquid application, and it may be a transparent liquid or the like. The range of liquids that can be measured is wide and versatile.

また、本発明に係る液体塗布装置によれば、前記液体塗布物の画像処理装置を備えることで、ディスペンサで塗布した液体塗布物の量を測定してフィードバックし、液体塗布量の高精度制御及び安定化を図ることができる。   In addition, according to the liquid application apparatus according to the present invention, by providing the image processing apparatus for the liquid application, the amount of the liquid application applied by the dispenser is measured and fed back, and the liquid application amount is controlled with high accuracy. Stabilization can be achieved.

以下、本発明を実施するための最良の形態として、液体塗布物の画像処理方法及び装置、並びに液体塗布装置の実施の形態を図面に従って説明する。   Hereinafter, as the best mode for carrying out the present invention, an embodiment of an image processing method and apparatus for a liquid coating material and a liquid coating apparatus will be described with reference to the drawings.

図1乃至図5で本発明に係る液体塗布物の画像処理方法の実施の形態を説明する。図1において、撮像手段としての撮像装置1はCCDカメラ等であり、撮像装置1の周囲(又は撮像装置1への入射光を囲む位置関係)にリング状照明2が配置されている。リング状照明2は例えば多数の発光ダイオード3をケース4の下面側に円環状に配置固定したものである。従って、全体として円環状に発光する。画像処理演算手段としての画像処理演算部5は撮像装置1で撮像された画像信号を処理するものであり、表示手段としてのモニタ6は画像演算処理部の処理結果を表示するものである。   An embodiment of an image processing method for a liquid application according to the present invention will be described with reference to FIGS. In FIG. 1, an imaging device 1 as an imaging unit is a CCD camera or the like, and a ring-shaped illumination 2 is arranged around the imaging device 1 (or a positional relationship surrounding incident light to the imaging device 1). The ring-shaped illumination 2 is, for example, one in which a large number of light emitting diodes 3 are arranged and fixed in an annular shape on the lower surface side of the case 4. Therefore, it emits light in an annular shape as a whole. An image processing calculation unit 5 as an image processing calculation unit processes an image signal picked up by the imaging apparatus 1, and a monitor 6 as a display unit displays a processing result of the image calculation processing unit.

基板等の対象物10は上面11が平面であり、ここに非貫通開口部としての凹部12が形成されている。ここでは底面が平坦な円形面で、開口となる円形面の方が、底面の円形面よりも大径となった、台形を反転した断面形状となっている。   The upper surface 11 of the target object 10 such as a substrate is a flat surface, and a recess 12 is formed as a non-through opening. Here, the bottom surface has a flat circular surface, and the circular surface serving as the opening has a larger diameter than the circular surface of the bottom surface.

そして、液体塗布装置により凹部12には樹脂等の液体が塗布されている。この場合、凹部12内に塗布された液体塗布物20が適量であれば、図1に図示のように凹部12の底面の全面は適度の厚さの液体塗布物20で覆われ、かつ対象物10の上面11より高くならない設定である。ここで、対象物10の上面11を基準とした液体塗布物20の表面の高さを液面高さ(深さ)dとする。   A liquid such as a resin is applied to the recess 12 by a liquid application device. In this case, if the liquid coating 20 applied in the recess 12 is an appropriate amount, the entire bottom surface of the recess 12 is covered with the liquid coating 20 having an appropriate thickness as shown in FIG. 10 is set so as not to be higher than the upper surface 11. Here, the height of the surface of the liquid application 20 with respect to the upper surface 11 of the object 10 is defined as a liquid level height (depth) d.

以下の表1は、液体塗布量が極少、やや少、標準、やや多、過多までの5段階の試料を作成し、前記上面11を基準とした液面高さdをレーザ変位計で実測したものである。   Table 1 below shows the preparation of five-stage samples with extremely small, slightly small, standard, slightly large, and excessive liquid application, and the liquid level height d with respect to the upper surface 11 was measured with a laser displacement meter. Is.

上記表1中、「−」は前記上面11よりも液面高さdが低いことを示す。AVEは1回目〜5回目までの試料の平均値、MAXは最大値、MINは最小値、Rはばらつき(最大値−最小値)を示している。但し、凹部12の直径は約2.4mmとし、塗布面は中心部分を見ている。   In Table 1 above, “−” indicates that the liquid level height d is lower than the upper surface 11. AVE represents the average value of the first to fifth samples, MAX represents the maximum value, MIN represents the minimum value, and R represents variation (maximum value-minimum value). However, the diameter of the recess 12 is about 2.4 mm, and the coated surface looks at the center.

前記表1の液面高さdの実測値に対応して、撮像装置1が捉えたリング状照明2の液体塗布物20の表面で反射された像(以下、反射像という)及びその直径は図2の通りである(反射像は白い円として写っている)。液体塗布量が極少の場合、実測−239.2μm、反射像の直径1.55mmであるのに対し、やや少、標準、やや多、過多と液体塗布量が増加するに従ってリング状照明2の反射像の直径が大きくなり、過多の場合、実測−13.4μm、反射像の直径1.98mmとなる。   Corresponding to the measured value of the liquid level height d in Table 1, the image reflected by the surface of the liquid application 20 of the ring-shaped illumination 2 captured by the imaging device 1 (hereinafter referred to as a reflected image) and its diameter are: It is as FIG. 2 (the reflected image is reflected as a white circle). When the liquid application amount is extremely small, the actual measurement is 239.2 μm and the reflected image has a diameter of 1.55 mm, whereas the reflection of the ring-shaped illumination 2 increases as the liquid application amount increases slightly, standard, slightly more, and excessively. When the diameter of the image is large and excessive, the actual measurement is −13.4 μm, and the diameter of the reflected image is 1.98 mm.

図3は前記液面高さdの実測値を横軸、リング状照明2の反射像の直径を縦軸にとったグラフであり、液面高さdの実測値とリング状照明2の反射像の直径との相関は略一次曲線を描いている。とくに、製品の標準仕様となる液面高さ−125μmの周辺はほぼ完全に一次関数と見て良く、相関関係が成り立つことが立証されている。   FIG. 3 is a graph in which the measured value of the liquid level height d is plotted on the horizontal axis, and the diameter of the reflected image of the ring-shaped illumination 2 is plotted on the vertical axis. The correlation with the image diameter is a substantially linear curve. In particular, the periphery of the liquid level height of −125 μm, which is the standard specification of the product, can be seen almost completely as a linear function, and it has been proved that a correlation is established.

図4は図1の凹部12に液体を塗布した場合において、液体塗布量が(A)極少、(B)やや少、(C)標準、(D)やや多、(E)過多までの5段階の試料を3次元測定器で測定した塗布面(液面)の3次元グラフである。塗布面の周囲が表面張力によって隆起し、液面高さが低い程(塗布量が少ない程)塗布面中央部の平面部が少ないことが判る。図4のグラフ下部に記載されている数字は、同じく3次元測定器で測定した極少〜過多の5段階における、塗布面断面の2次元グラフから読み取った平面領域の範囲であり、例えば(A)極少のグラフでは水平方向の位置900〜1750μmの範囲が平面領域であるから、平面領域の長さ寸法は1750−900=850μm、同様にして(B)やや少では1000μm、(C)標準では1150μm、(D)やや多では1350μmとなっている。   FIG. 4 shows five levels of liquid application amount when the liquid is applied to the recess 12 of FIG. 1 until the liquid application amount is (A) extremely small, (B) slightly small, (C) standard, (D) slightly large, and (E) excessive. It is a three-dimensional graph of the coating surface (liquid level) which measured the sample of (2) with the three-dimensional measuring device. It can be seen that the periphery of the coating surface rises due to surface tension, and that the lower the liquid level (the smaller the coating amount), the smaller the flat portion at the center of the coating surface. The numbers described in the lower part of the graph of FIG. 4 are the range of the planar region read from the two-dimensional graph of the coated surface cross section in five stages of the minimum to the excessive, similarly measured with a three-dimensional measuring instrument, for example, (A) In the extremely small graph, the range of horizontal positions 900 to 1750 μm is a planar region, so the length dimension of the planar region is 1750−900 = 850 μm. Similarly, (B) is slightly less than 1000 μm, and (C) 1150 μm is standard. , (D) 1350 μm is slightly more.

図5は前記リング状照明2の反射像直径(mm)と図4で測定した塗布面の平面部の長さ寸法(μm)との関係を示すグラフであり、やはり一次関数という形で相関が取れていることが判る。   FIG. 5 is a graph showing the relationship between the reflected image diameter (mm) of the ring-shaped illumination 2 and the length dimension (μm) of the flat portion of the coated surface measured in FIG. 4, and the correlation is also in the form of a linear function. You can see that it is removed.

以上の事象から、リング状照明2の反射像を撮像装置1で捉え、撮像された画像信号からリング状照明2の反射像の直径寸法を画像処理演算部5で画像処理で算出することにより、図3又は図5の一次関数で示された相関を利用して対象物10の上面11を基準とした液体塗布物20の液面高さdを測定することができる。そして、凹部2の形状(底面積、底面までの深さ等)を予め既知としておけば、液面高さdから液体塗布物20の塗布量を検知、測定可能である。前記反射像の直径から液面高さdを求め、さらに塗布量を求める演算は図示しないコントローラで行うことができる。   From the above events, the reflected image of the ring-shaped illumination 2 is captured by the imaging device 1, and the diameter size of the reflected image of the ring-shaped illumination 2 is calculated by image processing by the image processing calculation unit 5 from the captured image signal. The liquid level height d of the liquid application 20 with reference to the upper surface 11 of the object 10 can be measured using the correlation shown by the linear function of FIG. 3 or FIG. If the shape of the concave portion 2 (bottom area, depth to the bottom surface, etc.) is known in advance, the application amount of the liquid application 20 can be detected and measured from the liquid level height d. The calculation for obtaining the liquid level height d from the diameter of the reflected image and further obtaining the coating amount can be performed by a controller (not shown).

この実施の形態によれば、次の通りの効果を得ることができる。   According to this embodiment, the following effects can be obtained.

(1) 液体塗布物20の表面で反射されたリング状照明の像を撮像装置1で撮像し、撮像されたリング状照明2の像の寸法によって凹部12内の液体塗布物20の量を測定することができ、図3及び図5の相関から判るように、高精度の測定が可能である。また、特別の撮像のためのステージは不要であり、測定が簡単である。 (1) An image of the ring-shaped illumination reflected on the surface of the liquid application 20 is picked up by the imaging device 1 and the amount of the liquid application 20 in the recess 12 is measured according to the size of the image of the imaged ring-shaped illumination 2 As can be seen from the correlations in FIGS. 3 and 5, highly accurate measurement is possible. In addition, a special imaging stage is not required and measurement is easy.

(2) 基板等の平面対象物10と液体との明度や色彩の差は利用しないため、多様な液体の塗布に応用でき、汎用性が高い。 (2) Since the difference in brightness and color between the planar object 10 such as the substrate and the liquid is not used, it can be applied to various liquid applications and is highly versatile.

図6は本発明の液体塗布物の画像処理方法の実施例1であり、撮像手段としてCCDカメラ30を用い、70倍のズームレンズ31が装着してある。カメラ30の周囲には光ファイバーリング状照明32が一体的に設けられ、ファイバー中心間の直径は26mmである。   FIG. 6 shows a first embodiment of the image processing method for a liquid coating material according to the present invention, in which a CCD camera 30 is used as an imaging means, and a zoom lens 31 of 70 times is mounted. An optical fiber ring illumination 32 is integrally provided around the camera 30, and the diameter between the fiber centers is 26 mm.

凹部41を有する基板40はX−Yテーブル45上に機械的クランプ(又は真空吸着)で位置決め保持されている。凹部41の開口は直径2.4mm、深さ0.85mmである。カメラ30の基準から基板40上面までの距離(Work Distance)は35mmとした。また、前記凹部41に塗布した液体はエポキシ系樹脂である。   The substrate 40 having the recess 41 is positioned and held on the XY table 45 by a mechanical clamp (or vacuum suction). The opening of the recess 41 has a diameter of 2.4 mm and a depth of 0.85 mm. The distance from the reference of the camera 30 to the upper surface of the substrate 40 (Work Distance) was 35 mm. The liquid applied to the recess 41 is an epoxy resin.

図7は本発明の液体塗布物の画像処理方法の実施例2であり、撮像手段としてCCDカメラ30(KEYENCE社製CV−035C)を用い、レンズ31(KEYENCE社製CA−LH25)が装着してある。カメラ30の下方位置にはLEDリング状照明32(ローアングルタイプ、KEYENCE社製CA−DLR7)がカメラへの入射光を囲む位置関係設けられ、LED中心間の直径は56mmである。   FIG. 7 is a second embodiment of the image processing method for a liquid coating material according to the present invention. A CCD camera 30 (CV-035C made by KEYENCE) is used as an imaging means, and a lens 31 (CA-LH25 made by KEYENCE) is attached. It is. An LED ring-shaped illumination 32 (low-angle type, CA-DLR7 manufactured by KEYENCE, Inc.) is provided at a position below the camera 30 so as to surround incident light to the camera, and the diameter between the LED centers is 56 mm.

凹部41を有する基板40はX−Yテーブル45上に機械的クランプ(又は真空吸着)で位置決め保持されている。凹部41の開口は直径2.4mm、深さ0.85mmである。カメラ30の基準から基板40上面までの距離(Work Distance)は25mmで、基板40上面からリング状照明32までの距離は5〜20とした。また、前記凹部41に塗布した液体はエポキシ系樹脂である。   The substrate 40 having the recess 41 is positioned and held on the XY table 45 by a mechanical clamp (or vacuum suction). The opening of the recess 41 has a diameter of 2.4 mm and a depth of 0.85 mm. The distance from the reference of the camera 30 to the upper surface of the substrate 40 (Work Distance) was 25 mm, and the distance from the upper surface of the substrate 40 to the ring-shaped illumination 32 was 5 to 20. The liquid applied to the recess 41 is an epoxy resin.

なお、上記実施例1,2では対象物としての基板40の凹部41に液体を塗布した例であるが、対象物は基板に限らず、図8のように、上面に凹部47を形成した部材46をリードフレーム48に固着したリードフレーム付き部品等を塗布対象物としてもよい。なお、前記凹部47の開口は例えば直径2.4mm、深さ0.85mmである。   In the first and second embodiments, the liquid is applied to the concave portion 41 of the substrate 40 as the target. However, the target is not limited to the substrate, and a member in which the concave portion 47 is formed on the upper surface as shown in FIG. A component with a lead frame in which 46 is fixed to the lead frame 48 may be used as an object to be applied. The opening of the recess 47 is, for example, 2.4 mm in diameter and 0.85 mm in depth.

図9は図6や図7の実施例で示したカメラ30及びリング状照明32、並びに基板40を支持する機構を示す。基板40をX−Yテーブル45で位置決め保持する場合、カメラ30及びこれに一定位置関係で配置されたリング状照明32は装置基台50に対して固定される。つまり、装置基台50に立設固定された支柱51、水平シャフト52、垂直シャフト53及び取付部材54を介してカメラ30及びリング状照明32は、所定高さに支持され、基板40との間で所要距離(Work Distance)を確保している。   FIG. 9 shows a mechanism for supporting the camera 30 and the ring-shaped illumination 32 and the substrate 40 shown in the embodiments of FIGS. When the substrate 40 is positioned and held by the XY table 45, the camera 30 and the ring-shaped illumination 32 arranged in a fixed positional relationship with the camera 30 are fixed to the apparatus base 50. That is, the camera 30 and the ring-shaped illumination 32 are supported at a predetermined height via the support column 51, the horizontal shaft 52, the vertical shaft 53, and the mounting member 54 that are erected and fixed to the apparatus base 50. The required distance (Work Distance) is secured.

図10(A),(B)は上述の液体塗布物の画像処理装置を備えた液体塗布装置(ディスペンス装置)の実施の形態の正面図及び側断面図、図11は斜視図であり、図12は液体塗布装置の模式的構成図である。   FIGS. 10A and 10B are a front view and a side sectional view of an embodiment of a liquid coating apparatus (dispensing apparatus) provided with the above-described image processing apparatus for a liquid coating material, and FIG. 11 is a perspective view. 12 is a schematic configuration diagram of the liquid coating apparatus.

図10及び図11に示すように、液体塗布装置は、装置フレーム55上に基板ローダ60、ディスペンス部61、操作パネル62、基板アンローダ63を設けたものであり、ディスペンス部61はディスペンサにより基板に液体(各種樹脂等)を塗布する部分であり、基板ローダ60はディスペンス部61への基板の供給を行い、基板アンローダ63はディスペンス部61で液体を塗布後の基板を排出するものである。   As shown in FIGS. 10 and 11, the liquid coating apparatus is provided with a substrate loader 60, a dispensing unit 61, an operation panel 62, and a substrate unloader 63 on an apparatus frame 55, and the dispensing unit 61 is attached to the substrate by a dispenser. The substrate loader 60 supplies the substrate to the dispensing unit 61, and the substrate unloader 63 discharges the substrate after the liquid is applied by the dispensing unit 61.

液体塗布装置の基本は、基板搬送系と撮像装置とディスペンサとの組み合わせで、基板搬送系には少なくとも一つのステージを持つ。図12の例では、基板搬送系70は予熱ステージS1、塗布ステージS2及び冷却ステージS3の3個のステージを有している。   The basic of the liquid coating apparatus is a combination of a substrate transport system, an imaging device, and a dispenser, and the substrate transport system has at least one stage. In the example of FIG. 12, the substrate transport system 70 has three stages, a preheating stage S1, a coating stage S2, and a cooling stage S3.

予熱ステージS1は液体塗布前の基板40に対して予熱が必要な場合、ヒータ等の予熱手段で基板40の温度を上げ、塗布ステージS2での液体塗布における流動性を上げる役割を持つ。   When the substrate 40 before liquid application needs to be preheated, the preheating stage S1 has a role of increasing the temperature of the substrate 40 by a preheating means such as a heater and increasing fluidity in liquid application at the application stage S2.

塗布ステージS2の基板40に対して液体塗布を行うディスペンサ71の構造自体は周知であり、例えば液体を収容するシリンジの下端にニードル(ノズル)を連結したものであり、シリンジにより適量の液体を押し出してニードル先端から液体を吐出する構成である。液体吐出量、すなわち液体塗布量はディスペンサ71が接続されたディスペンスコントローラ72で制御される。塗布ステージS2では基板40に1箇所あるいは複数箇所に液体(液滴)を塗布する。   The structure of the dispenser 71 that performs liquid application on the substrate 40 of the application stage S2 is well known. For example, a needle (nozzle) is connected to the lower end of a syringe containing liquid, and an appropriate amount of liquid is pushed out by the syringe. Thus, the liquid is discharged from the tip of the needle. The liquid discharge amount, that is, the liquid application amount is controlled by a dispense controller 72 to which a dispenser 71 is connected. In the application stage S2, a liquid (droplet) is applied to the substrate 40 at one place or a plurality of places.

冷却ステージS3は塗布ステージS2で上昇した基板40の温度を下げ、塗布された液体を凝固、安定させる働きを持つ。   The cooling stage S3 has a function of lowering the temperature of the substrate 40 raised in the coating stage S2 and solidifying and stabilizing the applied liquid.

撮像装置1及びリング状照明2は用途に応じて塗布ステージS2又は冷却ステージS3に設けられる。また、撮像装置1で撮像された画像信号を処理する画像処理演算部5及びその処理結果を表示するモニタ6が設けられている。さらに、画像処理演算部5の処理結果(つまり、リング状照明の反射像の直径)を受けて撮像結果から測定された液体吐出量を算出し、ディスペンスコントローラ72をフィードバック制御するコントローラ75が設けられている。なお、コントローラ75は装置全体の各種制御も行う。   The imaging device 1 and the ring-shaped illumination 2 are provided on the coating stage S2 or the cooling stage S3 depending on the application. In addition, an image processing calculation unit 5 that processes an image signal captured by the imaging apparatus 1 and a monitor 6 that displays the processing result are provided. Further, a controller 75 is provided that receives the processing result of the image processing calculation unit 5 (that is, the diameter of the reflection image of the ring-shaped illumination), calculates the liquid discharge amount measured from the imaging result, and feedback-controls the dispense controller 72. ing. The controller 75 also performs various controls of the entire apparatus.

前記コントローラ75は予め設定された液体塗布量の最適範囲(最適値)と画像処理演算部5の処理結果(リング状照明の反射像の直径)から求めた液体塗布量の測定値とを比較して、ディスペンスコントローラ72を介してディスペンサ71の液体吐出圧力、吐出時間の一方又は両方を増減して液体塗布量が最適範囲となるようにフィードバック制御を行う。   The controller 75 compares the preset optimum range (optimum value) of the liquid application amount with the measured value of the liquid application amount obtained from the processing result of the image processing calculation unit 5 (the diameter of the reflected image of the ring illumination). Then, feedback control is performed so that one or both of the liquid discharge pressure and the discharge time of the dispenser 71 are increased or decreased via the dispense controller 72 so that the liquid application amount falls within the optimum range.

なお、塗布ステージS2が水平面内で前後左右の直交2軸方向に動くX−Yテーブルとしての機能を有する場合、ディスペンサ71はZ方向(上下方向)の動作を行えればよいが、塗布ステージS2が基板40の位置決め保持機能は有するがX−Yテーブルとしての機能を有しないときは、ディスペンサ71はX−Y−Z方向(直交3軸方向)に移動する機能を有する必要がある。この場合、ディスペンサ71を保持する塗布ヘッドで撮像装置1及びリング状照明2も保持して、X−Y方向に移動可能とする。   When the application stage S2 has a function as an XY table that moves in two horizontal directions, front, rear, left, and right within a horizontal plane, the dispenser 71 only needs to operate in the Z direction (up and down direction). However, the dispenser 71 needs to have a function of moving in the X-Y-Z direction (orthogonal three-axis directions) when it has a function of positioning and holding the substrate 40 but does not have a function as an XY table. In this case, the imaging device 1 and the ring-shaped illumination 2 are also held by the coating head that holds the dispenser 71 and can be moved in the XY directions.

前記フィードバック制御の方法がいくつか考えられるが、以下に3つの方法を例示する。   Several methods of the feedback control can be considered, and three methods will be exemplified below.

(1) 図13の基本動作フロー1の方法
塗布ステージS2で基板40の代表点aに塗布した液体塗布物を冷却ステージS3で実施例1又は2の方法で測定して塗布量を確認し、画像確認データを用いてディスペンスコントローラ72にフィードバックをかける方法である。塗布動作と測定動作がパラレルで(並行して)行われるため、スループットを優先したいときに用いることができる。図13の画像確認データ処理のステップでは、複数枚の基板に対する画像確認データの平均化処理を行い、平均化処理した数値の増減判断及び増減割合の算出を行い、その算出結果数値を用いてフィードバック制御を行っている。
(1) Method of Basic Operation Flow 1 in FIG. 13 The liquid application applied to the representative point a of the substrate 40 at the application stage S2 is measured by the method of Example 1 or 2 at the cooling stage S3 to confirm the application amount, This is a method of applying feedback to the dispense controller 72 using image confirmation data. Since the application operation and the measurement operation are performed in parallel (in parallel), it can be used when priority is given to throughput. In the step of image confirmation data processing of FIG. 13, the image confirmation data is averaged for a plurality of substrates, and the averaged numerical value increase / decrease judgment and the increase / decrease ratio are calculated, and the calculated result numerical value is used for feedback. Control is in progress.

(2) 図14の基本動作フロー2の方法
塗布ステージS2で基板40の代表点aに塗布した液体塗布物を、同じく塗布ステージS2で実施例1又は2の方法で測定して塗布量を確認し、画像確認データを用いてディスペンスコントローラ72にフィードバックをかけて、以降の塗布点に順次塗布する方法である。塗布動作と測定動作がシリアルとなるため、スループットは不利だが、測定直後にフィードバックをかけるため、精度を優先したいときに用いる。図14の画像確認データ処理のステップでは、複数枚の基板に対する画像確認データの平均化処理を行い、平均化処理した数値の増減判断及び増減割合の算出を行い、その算出結果数値を用いてフィードバック制御を行っている。
(2) Method of Basic Operation Flow 2 in FIG. 14 The liquid coating applied to the representative point a of the substrate 40 at the coating stage S2 is measured by the method of Example 1 or 2 on the coating stage S2 to confirm the coating amount. In this method, feedback is applied to the dispense controller 72 using the image confirmation data, and coating is performed sequentially on the subsequent coating points. Since the application operation and the measurement operation are serial, the throughput is disadvantageous. However, since feedback is applied immediately after measurement, it is used when priority is given to accuracy. In the step of image confirmation data processing of FIG. 14, the image confirmation data is averaged for a plurality of substrates, the increase / decrease determination of the averaged numerical value and the increase / decrease ratio are calculated, and the calculated result numerical value is used for feedback. Control is in progress.

(3) 図14の基本動作フロー2において全ての塗布点について画像確認処理を行う方法
塗布ステージS2で基板40に塗布した液体塗布物を、同じく塗布ステージS2で実施例1又は2の方法で測定して塗布量を確認し、画像確認データを用いてディスペンスコントローラ72にフィードバックをかけて、再び基板の次の塗布点に液体を塗布、以後この動作を繰り返す。この場合、スループットは不利だが、より高精度が要求される場合に用いる。
(3) Method for Performing Image Confirmation Process for All Application Points in Basic Operation Flow 2 of FIG. 14 The liquid application applied to the substrate 40 at the application stage S2 is also measured by the method of Example 1 or 2 at the application stage S2. Then, the application amount is confirmed, and feedback is applied to the dispense controller 72 using the image confirmation data to apply the liquid again to the next application point of the substrate. Thereafter, this operation is repeated. In this case, the throughput is disadvantageous, but it is used when higher accuracy is required.

以上本発明の実施の形態及び実施例について説明してきたが、本発明はこれに限定されることなく請求項の記載の範囲内において各種の変形、変更が可能なことは当業者には自明であろう。   Although the embodiments and examples of the present invention have been described above, it is obvious to those skilled in the art that the present invention is not limited thereto and various modifications and changes can be made within the scope of the claims. I will.

本発明は、基板あるいは電子部品等の対象物の非貫通開口部の底面に実装されたチップ形電子部品等の実装品を充填剤となる液体(樹脂等)で過不足なく(非貫通開口部から樹脂が盛り上がらずかつ実装品が露出しないように)封止する場合等に好適に利用できる。   In the present invention, a mounted product such as a chip-type electronic component mounted on the bottom surface of a non-penetrating opening of an object such as a substrate or an electronic component is filled with a liquid (resin etc.) serving as a filler (non-penetrating opening). Therefore, it can be suitably used in the case of sealing (so that the resin does not rise and the mounted product is not exposed).

本発明に係る液体塗布物の画像処理方法及び装置の実施の形態を示す一部を正断面とした構成図である。It is the block diagram which made one part the front cross section which shows embodiment of the image processing method and apparatus of the liquid coating material which concerns on this invention. 前記実施の形態において、凹部内の液体塗布物の液面高さとリング状照明の反射像の直径との相関を示す説明図である。In the said embodiment, it is explanatory drawing which shows the correlation with the liquid level height of the liquid coating material in a recessed part, and the diameter of the reflected image of ring-shaped illumination. 前記実施の形態において、凹部内の液体塗布物の液面高さとリング状照明の反射像の直径との相関がほぼ完全に一次関数であることを示すグラフである。In the said embodiment, it is a graph which shows that the correlation with the liquid level height of the liquid application material in a recessed part and the diameter of the reflected image of ring-shaped illumination is a linear function almost completely. 前記実施の形態において液体塗布物の塗布量と塗布面(液面)の平面部の長さ寸法との関係であって、(A)は塗布量が極小、(B)はやや少、(C)は標準、(D)はやや多、(E)は過多の場合の塗布面の3次元グラフである。In the embodiment, the relationship between the application amount of the liquid application and the length dimension of the flat portion of the application surface (liquid surface), (A) is the minimum application amount, (B) is slightly less, (C ) Is a standard, (D) is a little more, and (E) is a three-dimensional graph of the coated surface when there is too much. 前記実施の形態において、リング状照明の反射像の直径と液体塗布物の塗布面の平面部の長さ寸法との相関が略一次関数であることを示すグラフである。In the said embodiment, it is a graph which shows that the correlation with the diameter of the reflected image of ring-shaped illumination and the length dimension of the plane part of the application surface of a liquid coating material is a substantially linear function. 本発明に係る液体塗布物の画像処理方法の実施例1を示す一部を断面とした正面図である。It is the front view which made a part the cross section which shows Example 1 of the image processing method of the liquid coating material which concerns on this invention. 本発明に係る液体塗布物の画像処理方法の実施例2を示す一部を断面とした正面図である。It is the front view which made a part the cross section which shows Example 2 of the image processing method of the liquid coating material which concerns on this invention. 対象物の他の例を示す正断面図である。It is a front sectional view showing another example of the object. 実施例1,2で示したカメラ、リング状照明及び基板を支持する機構を示す正面図である。It is a front view which shows the mechanism which supports the camera, ring-shaped illumination, and board | substrate which were shown in Example 1,2. 本発明に係る液体塗布装置の実施の形態の全体外観であって、(A)は正面図、(B)は側断面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is the whole external appearance of embodiment of the liquid coating device which concerns on this invention, Comprising: (A) is a front view, (B) is a sectional side view. 同斜視図である。It is the same perspective view. 前記液体塗布装置の実施の形態の構成図である。It is a block diagram of embodiment of the said liquid application apparatus. 前記液体塗布装置の実施の形態における基本動作フロー1を示すフローチャートである。It is a flowchart which shows the basic operation | movement flow 1 in embodiment of the said liquid application apparatus. 前記液体塗布装置の実施の形態における基本動作フロー2を示すフローチャートである。It is a flowchart which shows the basic operation | movement flow 2 in embodiment of the said liquid application apparatus. 基板等の平面上に液体を点状に塗布する場合の従来の液体塗布量の測定方法であって、(A)は正面図、(B)はモニタ画像の例を示す正面図である。It is a conventional method for measuring the amount of liquid applied when a liquid is applied in the form of dots on a plane such as a substrate, where (A) is a front view and (B) is a front view showing an example of a monitor image. 基板(あるいは電子部品)の凹部(キャビティー)に実装されたチップ形電子部品を充填剤となる樹脂で封止する場合であって、(A)は平面図,(B)は正断面図である。This is a case where a chip-type electronic component mounted in a recess (cavity) of a substrate (or electronic component) is sealed with a resin serving as a filler, wherein (A) is a plan view and (B) is a front sectional view. is there.

符号の説明Explanation of symbols

1 撮像装置
2,32 リング状照明
3 発光ダイオード
4 ケース
5 画像処理演算部
6 モニタ
10 対象物
11 上面
12,41,47 凹部
20 液体塗布物
30 カメラ
40 基板
45 X−Yテーブル
46 部材
50 装置基台
51 支柱
54 取付部材
60 基板ローダ
61 ディスペンス部
62 操作パネル
63 基板アンローダ
70 基板搬送系
71 ディスペンサ
72 ディスペンスコントローラ
75 コントローラ
S1 予熱ステージ
S2 塗布ステージ
S3 冷却ステージ
DESCRIPTION OF SYMBOLS 1 Imaging device 2,32 Ring-shaped illumination 3 Light emitting diode 4 Case 5 Image processing calculating part 6 Monitor 10 Target object 11 Upper surface 12, 41, 47 Recessed part 20 Liquid coating material 30 Camera 40 Board | substrate 45 XY table 46 Member 50 Device base Base 51 Post 54 Mounting member 60 Substrate loader 61 Dispense section 62 Operation panel 63 Substrate unloader 70 Substrate transport system 71 Dispenser 72 Dispense controller 75 Controller S1 Preheating stage S2 Coating stage S3 Cooling stage

Claims (7)

撮像手段を用いるとともに、照明手段として該撮像手段の周囲又は該撮像手段への入射光を囲む位置関係に設けられたリング状照明のみを用い、対象物の非貫通開口部内の液体塗布物の量を測定する液体塗布物の画像処理方法であって、
前記液体塗布物の表面で反射された前記リング状照明のリング状の像を前記撮像手段で撮像し、撮像された前記リング状照明のリング状の像の寸法によって前記非貫通開口部内の液体塗布物の量を測定することを特徴とする液体塗布物の画像処理方法。
Together are use the imaging means, only ring-shaped illumination provided at a position surrounding relation to light incident on the periphery or the image pickup means image pickup means is used as illumination means, the liquid coated in the non-through openings of the object An image processing method for a liquid coating material for measuring an amount,
The ring-shaped image of the ring- shaped illumination reflected on the surface of the liquid application object is imaged by the imaging means, and the liquid application in the non-penetrating opening is measured according to the size of the imaged ring-shaped image of the ring- shaped illumination. An image processing method for a liquid coating product, comprising measuring the amount of the product.
前記リング状照明のリング状の像の寸法と、前記非貫通開口部内の液体塗布物の液面高さとの相関関係が略一次関数であるとして、前記非貫通開口部内の液体塗布物の量を測定する請求項1記載の液体塗布物の画像処理方法。Assuming that the correlation between the size of the ring-shaped image of the ring-shaped illumination and the liquid level of the liquid coating in the non-through opening is a substantially linear function, the amount of the liquid coating in the non-through opening is The image processing method for a liquid coating product according to claim 1 to be measured. 撮像手段と、該撮像手段の周囲又は該撮像手段への入射光を囲む位置関係に設けられたリング状照明のみの照明手段と、前記撮像手段で撮像された画像信号を処理する画像処理演算手段とを備え、対象物の非貫通開口部内の液体塗布物の量を測定する液体塗布物の画像処理装置であって、
前記液体塗布物の表面で反射された前記リング状照明のリング状の像を前記撮像手段で撮像し、撮像された前記リング状照明のリング状の像の寸法を前記画像処理演算手段によって算出することにより、前記非貫通開口部内の液体塗布物の量を測定することを特徴とする液体塗布物の画像処理装置。
An imaging means, an illumination means only for ring illumination provided in a positional relationship surrounding the incident light to the imaging means, or an image processing calculation means for processing an image signal imaged by the imaging means A liquid application image processing apparatus for measuring the amount of the liquid application in the non-through opening of the object,
The ring-shaped image of the ring- shaped illumination reflected by the surface of the liquid application is captured by the imaging unit, and the size of the captured ring-shaped image of the ring- shaped illumination is calculated by the image processing calculation unit. Accordingly, the liquid processing product image processing apparatus is characterized in that the amount of the liquid coating material in the non-through opening is measured.
前記画像処理演算手段で算出された前記リング状照明のリング状の像の寸法と、前記非貫通開口部内の液体塗布物の液面高さとの相関関係が略一次関数であるとして、前記非貫通開口部内の液体塗布物の量を測定する請求項3記載の液体塗布物の画像処理装置。Assuming that the correlation between the size of the ring-shaped image of the ring-shaped illumination calculated by the image processing calculation means and the liquid level of the liquid application in the non-through opening is a substantially linear function, the non-through 4. The image processing apparatus for a liquid application according to claim 3, wherein the amount of the liquid application in the opening is measured. 対象物の非貫通開口部内に液体を塗布するディスペンサと、
該ディスペンサの液体吐出量を制御するディスペンスコントローラと、
撮像手段と、該撮像手段の周囲又は該撮像手段への入射光を囲む位置関係に設けられたリング状照明手段と、前記撮像手段で撮像された画像信号を処理する画像処理演算手段とを有し、前記非貫通開口部内の液体塗布物の表面で反射された前記リング状照明の像を前記撮像手段で撮像し、撮像された前記リング状照明の像の寸法を前記画像処理演算手段によって算出することにより、前記非貫通開口部内の液体塗布物の量を測定する液体塗布物の画像処理装置とを備え、
前記液体塗布物の量の測定値を前記ディスペンスコントローラにフィードバックして、前記液体塗布物の量を所望範囲内に制御することを特徴とする液体塗布装置。
A dispenser for applying a liquid in a non-through opening of an object;
A dispense controller for controlling the liquid discharge amount of the dispenser;
An imaging unit; a ring-shaped illumination unit provided in a positional relationship around the imaging unit or surrounding incident light to the imaging unit; and an image processing calculation unit that processes an image signal captured by the imaging unit. Then, the image of the ring-shaped illumination reflected by the surface of the liquid application material in the non-penetrating opening is captured by the imaging unit, and the size of the captured image of the ring-shaped illumination is calculated by the image processing calculation unit A liquid application image processing apparatus for measuring the amount of the liquid application object in the non-through opening ,
A liquid coating apparatus that feeds back a measured value of the amount of the liquid coating material to the dispense controller to control the amount of the liquid coating material within a desired range.
前記ディスペンサによって対象物に液体を塗布する塗布ステージとは別のステージで、前記対象物に塗布された液体塗布物の量を測定して、前記塗布ステージにある次の対象物への液体塗布のために測定値をフィードバックすることを特徴とする請求項記載の液体塗布装置。 In a stage different from the application stage where the liquid is applied to the object by the dispenser, the amount of the liquid application applied to the object is measured, and the liquid application to the next object in the application stage is performed. The liquid coating apparatus according to claim 5 , wherein a measured value is fed back for the purpose. 前記ディスペンサによって対象物に液体を塗布する塗布ステージで、前記対象物に塗布された液体塗布物の量を測定して、前記塗布ステージでの当該対象物への液体塗布のために測定値をフィードバックすることを特徴とする請求項記載の液体塗布装置。 In the application stage for applying liquid to the object by the dispenser, the amount of the liquid application applied to the object is measured, and the measurement value is fed back for liquid application to the object at the application stage. The liquid coating apparatus according to claim 5, wherein
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