JPH08240631A - Probing device - Google Patents

Abstract

PURPOSE: To cope with the miniaturization and the narrowing of pitches of leads effectively by providing a constitution, wherein the lead parts protruding from the edge part of an insulating substrate are backed up by an elastic insulating plate for supplementing pressure for the leads, the shortage of the elasticity of the leads is replenished, the adequate contact pressure to the electrodes of a liquid crystal board is secured, the unevenness of the contact levels of the leads and the dispersion and torsion of the pitches are corrected, and the relative positions to the object of the contact is kept so as to achieve the uniform contact. CONSTITUTION: Many leads 2 are extending in parallel on the surface of an insulating substrate 4. One end 2a of each lead is made to protrude from the edge part of the insulating substrate 4. The lead protruding parts are backed up by an elastic insulating plate 3 for supplementing the pressure for the leads, which is fixed to the insulating substrate 4 and provided for compressed contact in this constitution.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe unit, such as a probe unit used for inspecting a liquid crystal panel, which is suitable for a case where leads are arranged in parallel at a minute pitch and an elastic contact piece is required.

[0002]

2. Description of the Related Art Electrode layers arranged in parallel on the edges of a glass plate forming a liquid crystal panel tend to have a finer pitch, and in the inspection of these liquid crystal panels, the electrode layers having such a fine pitch are used on the inspection device side. It is necessary to provide a probe unit having a pitch corresponding to. At present, the pitch of the above electrode layers is ◯. It is 1 mm or less, and it has become difficult to mechanically punch and form the leads on the inspection side that come into contact with the electrode layers of the liquid crystal panel from the hoop material.

For this reason, there is adopted a method of forming a fine pitch lead unit by using an etching method or an additive method in which a metal is plated and grown in an etching groove formed by irradiating light through a mask. The latest technology using this method is Japanese Patent Application No. 4-297578 and Japanese Patent Application No. 4-297578.
No. 38289.

At present, a lead unit formed by an etching method is adhered to the surface of an insulating substrate such as a glass plate over the entire width, and the tip end side of each lead is extended from the surface edge of the insulating base. The tip of the part is brought into contact with the electrode layer of the liquid crystal panel, and leads such as ICs on the inspection device side are stacked and soldered on the base end side surface of each lead adhered to the surface of the insulating base. Is widely used.

[0005]

In the above-mentioned prior invention, the lead portion protruding from the edge of the insulating substrate functions as a spring, but the spring function is diminished with the miniaturization of the lead, and the required contact pressure is reduced. It is becoming difficult to secure it. Further, there is a problem that twisting or unevenness in the upper and lower portions (uneven contact level) occurs in the protruding portion of the lead, which impairs reliability of contact. In addition, there is a problem that the lead protruding portion is deformed by an external force.

Further, in the above-mentioned prior invention, it is necessary to fix each lead pitch of the lead group to the insulating substrate with an adhesive, but the lead pitch changes due to the shrinkage of the adhesive and the lead pressing pressure at the time of adhesion. Further, the adhesive flows out to the lead portion extended from the end portion of the insulating base plate due to the capillary phenomenon, and the lead tip pitch varies due to the contraction of the adhesive.

Further, there is a drawback that the contact point with the liquid crystal panel electrode terminal deviates from the center of the lead due to the twisting of the terminal on the tip end side of the lead, and the tolerance for the positional deviation of the contact point with the electrode terminal becomes small.

[0008]

The present invention provides a probe unit having a configuration that effectively solves the above problems.

In this probe unit, a large number of leads extend in parallel on the surface of the insulating substrate, and one end of the lead projects from the edge of the insulating substrate while the lead protruding portion is fixed to the insulating substrate. It is configured such that it is backed up by an elastic insulating plate for pressure compensation and used for pressure contact.

The lead projection is wholly backed up by a lead pressure elastic insulating plate, or the tip of the lead projection is projected from the edge of the lead pressure elastic insulating plate for pressure contact. To do. .

As another means, in the probe unit, the leads are extended in parallel with the surface of the insulating film and backed up by an elastic insulating plate for pressure compensation.

Then, one end of the lead is extended from the insulating film and protrudes from the edge of the elastic insulating plate for pressure compensation of the lead for pressure contact.

The lead compression elastic insulating plate is adhered to the surface of the insulating film on the side where the leads extend, or adheres to the surface opposite to the side where the leads extend.

Further, the leads in each of the probe units are formed by plating growth, and are provided with a parallel interval and a sharp tip shape.

[0015]

The above-mentioned elastic insulating plate for lead pressure compensation backs up the lead portion projecting from the edge of the insulating substrate to supplement the lack of elasticity of the lead to ensure proper contact pressure, and at the same time, the lead contact level is not uniform (up and down). Irregularity), pitch variation (unevenness on the left and right), and twist, and even contact can be made while maintaining the relative position with respect to the contact target, and it is possible to effectively cope with the miniaturization and narrowing of the pitch of the leads.

Further, the elastic insulating plate for compressing the lead protects the contact portion of the lead and contributes to prevention of deformation.

Similarly, the insulating film has the function of eliminating vertical and horizontal misalignment and twist without impairing the flexural elasticity of the portion functioning as the pressure contact portion of the lead due to its flexibility, and the elastic insulation The contact surface with each lead is secured in cooperation with the plate.

Further, by giving the lead pitch and the shape of the tip contact portion by plating growth, there is a problem of lead pitch change due to contraction of the adhesive as in the case of adhering the lead to the glass plate with the adhesive. Can be solved together.

Embodiments of the present invention will be described below in detail with reference to the drawings.

[0020]

【Example】

First Embodiment (FIG. 1, FIGS. 3 to 7) FIGS. 3 to 6 disclose a manufacturing method and a structure of a probe unit according to this embodiment.

First, as shown in FIG. 3, the conductive transfer plate 1
A large number of leads 2 extending in parallel to the surface of is formed by plating growth.

The material of the lead 2 is selected from nickel alloy, copper alloy and the like, which are highly elastic and have excellent plating characteristics.

As the transfer plate 1, a metal plate such as stainless steel, or a synthetic resin plate or a ceramic plate on which conductivity is attached is used. Then, the lead 2 is formed on the surface of the transfer plate 1.
A peeling layer for assisting peeling is formed, and the leads 2 are grown on the surface of the peeling layer by plating. Although not shown, the lead 2 formed by plating growth is formed on the transfer plate with an insulating partition having the same pattern as the lead pattern using a known additive method, and the plated metal is grown in the groove between the insulating partition. It can be formed by removing the insulating partition.

Next, as shown in FIG. 4, the lead insulation elastic insulation 3 is laminated and adhered on the surface of the lead 2. At this time, the elastic insulating plate 3 is adhered so as to cover the surface in the intermediate extending region of all the leads 2, and one end of each lead 2 is projected by a predetermined size from one edge part of the insulating plate 3 facing each other. The other end is bonded so that it projects from the other edge by a predetermined dimension.

That is, the lead 2 is overlaid with the lead insulating elastic insulating plate 3 in the intermediate extending region, and both ends of the lead are exposed from the elastic insulating plate 3 and extend on the surface of the transfer plate 1.

As the elastic insulating plate 3 for lead compression, for example, silicone resin, polyurethane resin or the like is used.

The adhesive is a silicone-based adhesive or the like, which is an adhesive that adheres to the lead compression elastic insulating plate 3 and the lead 2 but does not adhere to the transfer plate 1, or an adhesive that has a relatively good peeling property. To use.

Then, as shown in FIG. 5, the lead 2 is fixed to the transfer plate 1 after the lead insulating elastic insulating plate 3 and the lead 2 are completely bonded, that is, until the adhesive is solidified. Then, after the adhesive stops shrinking, the lead 2 together with the elastic insulation 3 is peeled off from the transfer plate 1.

Thus, using the elastic insulating plate 3 shown in FIG. 5 as a carrier, a group of unit leads in which the leads 2 are arranged in parallel at an equal pitch is obtained. As shown in FIG. 6, the group of unit leads is made of synthetic resin or glass. The probe unit is formed by adhering it to the surface of the insulating substrate 4 made of ceramics or the like and having a relatively high rigidity.

As shown in FIG. 6, the insulating substrate 4 is adhered to the surface of the opposite side of the lead 2 to which the elastic insulating plate 3 for lead pressure is adhered, and one end of the lead 2 is predetermined from the edge of the insulating substrate 4. Only the size is projected.

That is, the insulating substrate 4 is adhered to all the leads except the protruding portion of the lead 2,
The pressure contact piece 2a is formed by the lead portion protruding from the edge portion of the.

In other words, the insulating substrate 4 is adhered over the entire length of the other end of the lead 2, which is a pressure contact piece, excluding one end, to carry the entire lead and also the elastic insulating plate 3.

That is, the elastic insulating plate 3 for lead pressure compensation is adhered and fixed to the surface of the insulating substrate 4 on the lead bonding surface side, and is protruded from the edge of the insulating substrate 4 to lead 2.
Back up.

The lead portion (pressing contact piece 2a) protruding from the edge of the insulating substrate 4 further has its end protruding from the edge of the elastic insulating plate 3 for lead pressure compensation, and its end serves as a contact target. Subject to pressure contact.

The end of the lead 2 used for this pressure contact is sharpened, and this sharpened portion is shaped by the plating growth.

Further, the other end (base end side) of the lead is exposed from the edge of the elastic insulating plate 3 opposite to the side where one end (tip end side) of the lead projects and extends to the surface of the insulating substrate 4. Then, a connection 2b with the inspection device side is formed at this extended portion.

Therefore, the elastic insulating plate 3 for lead pressure compensation has one end in the lead extending direction backing up the base of the pressure contact piece protruding from the edge of the insulating substrate 4, and the other end thereof on the surface of the insulating substrate 4. Then, the elastic insulating plate 3 is fixed to the insulating substrate 4 while the other end portion (base end portion) of the lead is exposed by adhering to the surface of one end portion of the lead portion extending to the.

The probe unit thus formed is attached to a holder 6 as shown in FIG. 1 and is subjected to pressure contact with the electrode 5a of the liquid crystal 5, for example.

The probe unit is attached to the holder 6 so as to be inclined forward and downward, and the end of the pressure contact piece of the lead 2 is brought into pressure contact with the surface of the electrode 5a.

A recess 7 into which the elastic insulating plate 3 for lead compression is fitted is formed in the holder 6, and the insulating substrate 1 is attached to the lower surface of the holder 6 on the surface of the lead extending side and the recess is formed. The elastic insulating plate 3 is received in the place 7 and the position of the elastic insulating plate 3 is regulated by the inner surface of the recess to form an integral structure with the holder 6. By tilting the holder 6 forward, the pressure contact piece 2 of the lead 2
The end of a is pressed against the electrode 5a, and at this time the pressure contact piece 2a warps due to its own elasticity, but while the elastic insulating plate 3 for lead pressure compensation is supported by the holder 6,
It is compressed by the pressure contact piece 2 of the lead, and as a reaction thereof, a supplementary pressure is applied to the pressure contact piece 2.

FIG. 7 shows a modification of the first embodiment.

In FIG. 6, a probe unit having a structure in which the elastic insulating plate 3 is adhered to the surface opposite to the side to which the insulating substrate 4 is adhered, that is, the lead 2 is interposed between the elastic insulating plate 3 and the insulating substrate 4. 7 shows an example in which the elastic insulation 3 is arranged so as to back it up on the lead surface on the side to which the insulating substrate 1 is adhered.

That is, the lead 2 is extended in parallel on the surface of the insulating substrate 4, one end of the lead 2 is projected from the edge of the substrate 4 by a predetermined length, and the edge of the insulating substrate 4 is exposed. The elastic insulating plate 3 adhered and fixed backs up the base of the pressure contact piece 2 a protruding from the edge of the substrate 4 on the same side as the substrate 4.

In this case, the pressure contact piece 2a of the lead 2 has a pressure receiving end on the end surface opposite to the elastic insulating plate 3 which backs up the pressure contact piece 2a.

3 to 7 show an example in which the pressure contact piece 2a at one end of the lead 2 is projected from the edge of the elastic insulating plate 3 to be used for pressure contact with the contact target, the present invention is not limited to this. Three
However, it includes the case of backing up so as to cover the entire length of the pressure contact piece 2a protruding from the edge of the insulating substrate 4.

Second Embodiment (FIGS. 2 and 8 to 12) Similar to the first embodiment, a manufacturing method and a structure will be disclosed based on FIGS. 8 to 11.

The process shown in FIG. 8 is exactly the same as the process shown in FIG. 3, and the description thereof is incorporated herein by reference.

That is, as shown in FIG. 3, a large number of leads 2 extending in parallel at equal pitch are formed on the surface of the conductive transfer plate 1 by plating growth.

Next, the surfaces of all the leads 2 extending on the surface of the transfer plate 1 are covered with a flexible insulating film and bonded to the same surface.

For this adhesion, the surface of the film in contact with the leads is melted and adhered by an adhesive or by thermocompression without using an adhesive.

The insulating film 8 is adhered so as to cover substantially the entire surface of the entire lead 2 over its substantially entire length. Alternatively, one end of the lead 2 forming the pressure contact piece 2a is laminated and bonded so as to cover the lead surface so that only a part of the end side is exposed from the edge of the film.

The film 8 is adhered by using an adhesive such as a silicone adhesive as in the first embodiment, or by thermocompression bonding.

At this time, it does not prevent the other end of the lead 2 from being exposed from the opposite edge of the insulating film on the terminal side.

Next, as shown in FIG. 10, an elastic insulating plate 3 for lead pressure compensation is overlaid and bonded on the surface of the insulating film 8. At this time, the elastic insulating plate 3 is adhered so as to cover its surface in the intermediate extending region of all the leads 2, and one end of the lead 2 together with the insulating film 8 has a predetermined size from one edge of the insulating plate 3 facing each other. The insulating film 8 and the insulating film 8 are protruded from the other edge portion by a predetermined dimension.

That is, in the intermediate extending region of the lead 2, the above-mentioned lead insulating elastic insulating plate 3 is superposed on the surface of the fill 8, and both ends of the lead are exposed together with the insulating film 8 from the opposite edges of the elastic insulating plate 3. To do.

Next, as shown in FIG. 11, the lead 2 is separated from the transfer plate 8 together with the insulating film 8 and the elastic insulating plate 3 to form a probe unit.

The film 8 is formed on the surface of the insulating substrate 4 made of synthetic resin, glass, ceramic or the like described in the first embodiment.
It is possible to form a probe unit by adhering the lead group carried on the substrate.

The elastic insulating plate 3 is not directly adhered to the surface of the film 8 but is adhered to the surface opposite to the lead 2 to which the insulating film 8 is adhered as shown in FIG.
One end of the elastic insulating plate 3 is projected together with the insulating film 8 by a predetermined dimension from the edge portion of the elastic insulating plate 3, and the portion backed up by the elastic insulating plate 3 and the lead portion projecting from the edge portion of the insulating plate 3 are pressed contact pieces 2a. To form. That is, the pressure contact piece 2
The base a is backed up by an elastic insulating plate 3 for pressure compensation of the lead, which is integrated with the film 8, and the lead end is brought into pressure contact with the contact target on the side opposite to FIG.

That is, the end of the pressure contact piece 2a is brought into pressure contact with the contact target on the side opposite to the side where the elastic insulating plate 3 is bonded.

Therefore, in FIG. 12, at least the lead terminal is projected from the edge of the insulating film 8.

As a suitable example, the insulating film 8 shown in the second embodiment is a transparent or translucent film which is transparent.

The lead 2 has a task of inspecting the relative relationship of the electrodes 5a of the liquid crystal plate 5 from above, and facilitates the inspection through the insulating film 8, and the film 8 serves as lead aligning means.

The probe unit thus formed is
For example, as shown in FIG. 2, the probe unit shown in FIG. 11 is attached to the holder 6 and is subjected to pressure contact with the electrode 5a of the liquid crystal 5, for example.

The probe unit is attached to the holder 6 so as to be inclined forward and downward, and the end of the pressure contact piece of the lead 2 is brought into pressure contact with the surface of the electrode 5a.

Similarly to the above, the holder 6 is formed with a recess 7 into which the elastic insulating plate 3 for lead compression is fitted, an insulating film 8 is attached to the lower surface of the holder 6, and the recess 7 is formed. Then, the elastic insulating plate 3 is received and the position of the elastic insulating plate 3 is regulated on the inner surface of the recess to form an integral structure with the holder 6.

By tilting the holder 6 forward, the end of the pressure contact piece 2a of the lead 2 is pressed against the electrode 5a. At this time, the lead 2a warps due to its own elasticity. While being supported by the holder 6, the elastic insulating plate 3 is compressed by the pressure contact piece 2 of the lead, and a complementary pressure is applied to the pressure contact piece 2 as a reaction thereof.

Third Embodiment (FIGS. 13 to 17) In the second embodiment, the lead 2 plated and grown on the surface of the transfer plate 1 is transferred (bonded) to the surface of the flexible insulating film 8. However, in the third embodiment, the leads 2 are directly plated and grown on the surface of the insulating film 8 to extend in parallel.

More specifically, as shown in FIG. 13, a metal layer 9 is deposited on the surface of the insulating film 8 to impart conductivity,
The vapor-deposited metal layer 9 of the insulating film 8 is used as a lead base,
The lead 2 is grown on the surface by plating.

A known additive method described with reference to FIG. 3 is suitable as a method of growing the leads 2 in parallel at equal pitches.

After forming the leads 2, the vapor-deposited metal layer between the leads 2 is removed by etching, and the elastic insulating plate 3 for compressing the leads is laminated and adhered on the surface of the insulating film 8 to form a probe unit. . The elastic insulating plate 3 is attached to the film surface on the side opposite to the side to which the lead 2 is adhered and is integrated with the film 8, or is attached to the film surface on the side to which the lead 2 is adhered so as to sandwich the lead 2.

The bonding area of the elastic insulating plate 3 and the relational arrangement with the leads are as described in detail with reference to FIG.

[0072]

According to the present invention, in the probe unit, the leads extend in parallel on the surface of the insulating substrate and the lead ends project from the edge of the substrate to form the pressure contact pieces. Since the pressure contact piece is configured to be backed up by the elastic insulating plate fixed to the insulating substrate, the lack of the spring constant of the lead can be compensated by the above backup to ensure a sufficient contact pressure and the upper and lower levels of the pressure contact piece. It is possible to effectively prevent the left and right pitch deviations, the twisting, and the like, thereby ensuring proper pressure contact and improving the reliability.

Further, it is expected that the bending load of the pressure contact piece originally applied to the edge portion of the insulating substrate is absorbed by the elastic insulating plate to prevent the deformation, and the impact is absorbed to protect the lead.

Similarly, when the leads are extended in parallel on the surface of the flexible insulating film, the flexibility of the insulating film follows the elastic displacement of the leads, so that the leads cover substantially the entire length of the leads. They can be aligned and are extremely effective in eliminating vertical and horizontal misalignment, twisting, etc. of the pressure contact piece at the lead end.

The insulating film complements the pressure contact force of the leads in cooperation with the lead insulating elastic insulating plate, so that even a fine lead can secure a sufficient contact pressure by the pressure contact pieces.

Further, the lead pitch and the tip shape of the pressure contact portion are given by plating growth to eliminate the pitch error and harmful burrs, and the narrow pitch can be easily achieved.

[Brief description of drawings]

FIG. 1 is a sectional view showing an example in which an inspection unit is formed by a probe unit according to the present invention.

FIG. 2 is a sectional view showing another example in which an inspection unit is formed by the probe unit according to the present invention.

3 to 6 show a manufacturing process of a probe unit (first embodiment) according to the present invention, and FIG. 3 is a perspective view of a lead group formed by plating growth on a transfer plate surface.

FIG. 4 is a perspective view of a transfer plate in which an elastic insulating plate for lead compression is attached to the lead group of FIG.

5 is a perspective view of a unit lead group separated from the transfer plate of FIG.

6 is a perspective view of a probe unit in which the unit lead group of FIG. 5 is attached to an insulating substrate.

7 is a sectional view showing a modification of the probe unit shown in FIG.

8 to 11 show a manufacturing process of a probe unit (second embodiment) according to the present invention, and FIG. 8 is a perspective view of a lead group formed by plating growth on a transfer plate surface.

FIG. 9 is a perspective view of a transfer plate showing a state in which an insulating film is attached to the lead group of FIG.

FIG. 10 is a perspective view of a transfer plate showing a partially cutaway state in which an elastic insulating plate for lead compression is attached to the insulating film.

FIG. 11 is a perspective view showing the probe unit separated from the transfer plate with a part thereof cut away.

FIG. 12 is a perspective view showing a modification of the probe unit of FIG. 11 with a part thereof cut away.

13 to 17 show a manufacturing process of a probe unit (third embodiment) according to the present invention, and FIG. 13 is a sectional view showing a state in which a metal layer is deposited on an insulating film.

14 is a perspective view showing a state in which a lead group is formed on the insulating film of FIG. 13 by plating growth.

15 is a cross-sectional view of the leaded insulating film of FIG.

16 is a perspective view of a probe unit in which a lead pressure elastic insulating plate is attached to the lead group of FIG.

17 is a cross-sectional view of the probe unit of FIG.

[Explanation of symbols]

 2 Leads 3 Elastic insulating plate for lead pressure 4 Insulating substrate 8 Film

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[Procedure amendment]

[Submission date] February 8, 1996

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction content]

The lead projection is wholly backed up by a lead pressure elastic insulating plate, or the tip of the lead projection is projected from the edge of the lead pressure elastic insulating plate for pressure contact. To do.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0024

[Correction method] Change

[Correction content]

Next, as shown in FIG. 4, an elastic insulating plate 3 for lead pressure compensation is laminated and adhered on the surface of the lead 2. At this time, the elastic insulating plate 3 is adhered so as to cover the surface in the intermediate extending region of all the leads 2, and one end of each lead 2 is projected by a predetermined size from one edge part of the insulating plate 3 facing each other. The other end is bonded so that it projects from the other edge by a predetermined dimension.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0036

[Correction method] Change

[Correction content]

Further, the other end (base end side) of the lead is exposed from the edge of the elastic insulating plate 3 opposite to the side where one end (tip end side) of the lead projects and extends to the surface of the insulating substrate 4. Then, the extending portion forms the connecting piece 2b with the inspection device side.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0040

[Correction method] Change

[Correction content]

A recess 7 into which the elastic insulating plate 3 for lead compression is fitted is formed in the holder 6, and the insulating substrate 1 is attached to the lower surface of the holder 6 on the surface of the lead extending side and the recess is formed. The elastic insulating plate 3 is received in the place 7 and the position of the elastic insulating plate 3 is regulated by the inner surface of the recess to form an integral structure with the holder 6. By tilting the holder 6 forward, the pressure contact piece 2 of the lead 2
The end of a is pressed against the electrode 5a, and at this time the pressure contact piece 2a warps due to its own elasticity, but while the elastic insulating plate 3 for lead pressure compensation is supported by the holder 6,
The lead is compressed by the pressure contact piece 2a, and as a reaction thereof, a supplementary pressure is applied to the pressure contact piece 2a.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0042

[Correction method] Change

[Correction content]

In FIG. 6, a probe unit having a structure in which the elastic insulating plate 3 is adhered to the surface opposite to the side to which the insulating substrate 4 is adhered, that is, the lead 2 is interposed between the elastic insulating plate 3 and the insulating substrate 4. 7 shows an example in which the elastic insulating plate 3 is arranged so as to back it up on the lead surface on the side to which the insulating substrate 1 is adhered.

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0044

[Correction method] Change

[Correction content]

In this case, the pressure contact piece 2a of the lead 2 has the end surface on the side opposite to the elastic insulating plate 3 for backing up the pressure contact piece 2a as the pressure end.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0048

[Correction method] Change

[Correction content]

That is, as shown in FIG. 8, a large number of leads 2 extending in parallel at equal pitches are formed on the surface of the conductive transfer plate 1 by plating growth.

[Procedure Amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0049

[Correction method] Change

[Correction content]

Next, as shown in FIG. 9, the surfaces of all the leads 2 extending on the surface of the transfer plate 1 are covered with a flexible insulating film 8 and adhered to the surface.

[Procedure Amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0050

[Correction method] Change

[Correction content]

This bonding is performed by an adhesive or by thermocompression bonding without using an adhesive to melt and adhere the surface of the film 8 in contact with the leads.

[Procedure Amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0056

[Correction method] Change

[Correction content]

Next, as shown in FIG. 11, the lead 2 is separated from the transfer plate 1 together with the insulating film 8 and the elastic insulating plate 3 to form a probe unit.

[Procedure Amendment 11]

[Document name to be amended] Statement

[Correction target item name] 0059

[Correction method] Change

[Correction content]

That is, the end of the pressure contact piece 2a is brought into pressure contact with the contact target on the same side as the side to which the elastic insulating plate 3 is bonded.

[Procedure Amendment 12]

[Document name to be amended] Statement

[Correction target item name] 0060

[Correction method] Delete

[Procedure Amendment 13]

[Document name to be amended] Statement

[Correction target item name] 0063

[Correction method] Change

[Correction content]

The probe unit thus formed is
For example, as shown in FIG. 2, the probe unit shown in FIG. 11 is attached to the holder 6 and is subjected to pressure contact with the electrode 5a of the liquid crystal plate 5, for example.

[Procedure Amendment 14]

[Document name to be amended] Statement

[Name of item to be corrected] 0072

[Correction method] Change

[Correction content]

[0072]

According to the present invention, in the probe unit, the leads extend in parallel on the surface of the insulating substrate and the lead ends project from the edge of the substrate to form the pressure contact pieces. Since the pressure contact piece is configured to be backed up by the elastic insulating plate fixed to the insulating substrate, the lack of the spring constant of the lead can be compensated by the above backup to ensure a sufficient contact pressure and the upper and lower levels of the pressure contact piece. Further, it is possible to effectively prevent the pitch deviation from right and left, the twist, and the like to ensure proper pressure contact and improve the reliability.

[Procedure Amendment 15]

[Document name to be amended] Statement

[Correction target item name] Figure 8

[Correction method] Change

[Correction content]

8 to 11 show a manufacturing process of a probe unit (second embodiment) according to the present invention, and FIG. 8 is a perspective view of a lead group formed by plating growth on a transfer plate surface.

Claims (5)

[Claims] 1. A large number of leads extend in parallel on the surface of an insulating substrate, and one end of each lead projects from an edge of the insulating substrate.
A probe unit characterized in that the lead protrusion is backed up by an elastic insulating plate for pressure compensation of a lead fixed to an insulating substrate and is used for pressure contact. 2. The probe unit according to claim 1, wherein an end portion of the lead projecting portion is configured to project from an edge portion of the lead compensating elastic insulating plate to be used for the pressure contact. 3. A large number of leads extending parallel to the surface of the insulating film are backed up by an elastic insulating plate for lead pressure compensation integrated with the insulating film, and one end of the lead together with the insulating film is elastic for lead pressure compensation. A probe unit having a structure in which it projects from an edge of an insulating plate and is used for pressure contact. 4. The probe unit according to claim 2, wherein the elastic insulating plate for lead compression is adhered to the surface of the insulating film opposite to the side extending the leads. 5. The probe unit according to claim 1, wherein the lead is formed by plating growth.