JP2599895B2 - Probe unit and its manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe unit suitable for a case where leads must be arranged in parallel at a fine pitch and an elastic contact piece must be provided, such as a probe unit used for inspection of a liquid crystal panel, etc. About.

[0002]

2. Description of the Related Art There is a tendency that electrode layers arranged in parallel with the edge of a glass plate forming a liquid crystal panel have an increasingly smaller pitch. It is necessary to provide a probe unit having a pitch corresponding to the above.

At present, the pitch of the above electrode layers is 0.1 mm.
As described below, it has become difficult to mechanically punch and form the lead of the probe unit on the inspection side that comes into contact with the electrode layer of the liquid crystal panel from the hoop material.

At present, therefore, a method of forming a lead group having a fine pitch by using an etching method or an additive method of filling a metal material into an etching groove formed by irradiating light through a mask is employed. The latest technology using this method is disclosed in Japanese Patent Application Nos. 4-297578 and 4-3828.
No. 9.

In each of the prior arts, a lead group formed by an etching method or the like is bonded to the surface of an insulating base plate such as a glass plate over an entire width via an adhesive, and one end of each lead is connected to the insulating base plate. And projecting the tip of the protruding portion into pressure contact with the electrode layer of the liquid crystal panel,
The configuration is such that leads such as ICs on the inspection device side are overlapped and connected to the base end surface of each lead bonded to the surface of the insulating base plate.

[0006]

In the above prior art, it is necessary to fix the lead pitch of the lead group to the insulating base plate with an adhesive while maintaining the lead pitch accurately. However, each lead pitch changes due to shrinkage of the adhesive, particularly heat shrinkage. To prevent this, each lead is adhered while applying pressure.
Also in this case, the lead pitch changes due to the pressing force. Further, there is a disadvantage that the adhesive flows out to the lead portion extending from the end of the insulating base plate due to the capillary phenomenon, and the pitch of the lead tip varies due to the contraction of the adhesive.

[0007]

SUMMARY OF THE INVENTION The present invention is to provide a probe unit having a configuration for effectively solving the above problems and a method for manufacturing the same. The probe unit is a group of leads arranged in parallel on the surface of a base plate. Are formed by plating growth and are fixed to the base plate, and at the same time, an elastic contact piece protruding from the end of the base plate is obtained by the lead formed by the plating growth. Each of the leads is fixed to the base plate via an elongated conductive layer, and the elongated conductive layer is exposed from the end of each lead to the surface of the base plate to form an electrode terminal for connecting to an IC or the like.

The probe unit is manufactured by the following method.

In a first method, a first base plate and a second base plate are abutted on an end face, and the abutted surfaces are bonded or free contact surfaces. Next, a large number of leads are plated and grown on the surfaces of the first and second base plates in parallel so as to cross both base plates. Next, the idea of manufacturing the probe unit by peeling the second base plate from the lead end extending on the second base plate and projecting the lead end from the end of the first base plate. Is provided.

In a second method, a large number of leads are plated and grown on the surface of the base plate in parallel, and then the end of the base plate is cut off to extend the lead end portion extending on the cutout of the base plate. Is projected from the end of the remaining base plate to produce a probe unit.

An elongated conductive layer having the same pitch as the leads is formed in advance by printing or the like as a base on which a lead group is to be plated and grown on the surface of the base plate, and each of the elongated conductive layers is directly used as an electrode on the surface. A lead having a predetermined thickness is formed by promoting plating growth.

Therefore, in this case, the probe unit has a large number of elongated conductive layers as plating growth base layers which are closely arranged in parallel on the surface of the base plate, and a plurality of elongated conductive layers formed by plating with the respective elongated conductive layers as bases. An elastic contact piece having a lead and protruding from one end of the base plate is obtained by the plating growth lead.

[0013]

As described above, the probe unit according to the present invention has a parallel lead group formed by plating on the surface of the base plate, and a parallel elastic contact group protruding from the base plate formed by the lead group. Have.

Accordingly, a lead group formed by an etching method or the like is prepared, and a problem such as a change in pitch due to contraction of the adhesive, unlike the case where the lead group is adhered to the surface of the base plate with an adhesive, is not caused. Also, it is not necessary to use a tie bar or other connecting means such as a tie bar for maintaining the alignment until the bonding, and thus it is possible to eliminate the difficult work of subsequently cutting the tie bar.

Further, the lead group can be formed at a very small pitch with high precision by plating growth, and the thickness required for the elasticity and strength of the elastic contact piece can be sufficiently secured.

[0016]

2 to 9 show a first embodiment of the present invention.
As shown in FIGS. 2A and 2B, the base plate 2 made of an insulating plate such as a glass plate, a synthetic resin plate, or a ceramic plate has a stripe-shaped pattern having the same pitch as the pitch of the leads 3 to be formed on the surface of the base plate 2. 3.) forming an elongated conductive layer 3 '.

The elongated conductive layer 3 'is formed by forming a metal film on the base plate 2 and then patterning the metal film by a photo-etching process or applying a known method of manufacturing a pattern on a printed wiring board, such as a method of printing a conductive paste. Can be easily formed.

According to these known methods, the parallel elongated conductive layers 3 'are formed on the surface of the base plate 2 in parallel, and the leads 3 and the elastic contact pieces 3a are formed on the surface by plating. is there.

The elongated conductive layer 3 'is formed as shown in FIG.
In the one end extending portion b, when the lead 3 is formed by plating, a metal (for example, a copper material) is selected, in which the lead 3, that is, the plating layer has a sufficient strength and bonds to the elongated conductive layer 3 'as a base material. The end extending portion a is a metal that can be formed by plating and has a relatively small peeling force and a plated growth layer, that is, a lead 3.
It is formed of a metal (or a metal having a releasable surface layer) that can be peeled from the substrate. For example, a method of forming an extremely thin chromium material on a copper material or a method of forming a nickel film as a metal having such releasability is adopted.

As a specific example, as shown in FIG. 2, elongated conductive layers 3 'made of a copper material are formed in parallel on the surface of the base plate 2, and the surface of the one end extending portion a of the elongated conductive layer 3' is formed on the surface. For example, an elongated release layer 8 such as a chromium material is formed. The portion a where the release layer 8 is formed is a portion where the elastic contact piece 3a is formed. In other words, a is the area where the elastic contact piece of the lead 3 is formed, while b is the area where the connecting piece of the lead 3 is formed.

As shown in FIG. 3, the surface of the base plate 2 as shown in FIG. 2 is covered with a photosensitive resin layer 9 (resist layer). For example, a photosensitive resin film is attached or a photosensitive resin material is applied.

Next, as shown in FIGS. 4A and 4B, an exposure mask 10 is superposed on the surface of the photosensitive resin layer 9 and the photosensitive resin layer 9 is exposed by irradiating light 11 from above. As shown in FIG. 4B, the exposure mask 10 has a light-transmitting portion 10a having the same pattern as the lead 3 (when the photosensitive resin layer 9 is a negative resist, 10a is a non-light-transmitting portion having the same pattern as the lead 3). The mask 10 is provided so that the light-transmitting portion 10a (or the non-light-transmitting portion) corresponds to the elongated conductive layer 3 ', and the exposure is performed.

Next, as shown in FIGS. 5A and 5B, the exposed resin (non-exposed in the case of a negative resist) of the photosensitive resin layer 9 corresponding to the translucent portion (non-transmissive portion in the case of a negative resist) 10a by development. The resin is removed to form a lead forming groove (plating growth groove) 9a penetrating through the photosensitive resin layer 9, and the elongated conductive layer 3 'is exposed at a portion facing the groove 9a.
The lead forming grooves 9 a are naturally arranged in parallel at the same pitch as the leads 3.

As shown in FIG. 6, the state shown in FIG. 5 is electroplated with an appropriate plating solution to promote the plating growth in the lead forming groove 9a. That is, the surface of the elongated conductive layer 3 ′ (plating growth base) exposed on the bottom surface of the lead forming groove 9 a is directly plated by electroplating, and the growth in the groove 9 a is promoted. The leads 3 having substantially the same thickness are generated.

The above-mentioned plating metal is one having appropriate hardness and elasticity, for example, nickel or a nickel alloy.
By forming the portion b of the elongated conductive layer 3 ', which is the base for plating growth, with copper or a copper alloy, it is extremely strongly bonded to the nickel or nickel alloy, and the metal 8 having a releasable property at the portion a of the elongated conductive layer 3'. For a certain degree of strength.

Next, as shown in FIGS. 7A and 7B, when the photosensitive resin layer 9 is removed, a base plate in which the leads 3 formed by the plating growth are arranged in parallel at equal intervals is obtained.

Next, as shown in FIG. 8, one end of the base plate 2 is cut off from the lead over a predetermined length from the cut 12 while being peeled off from the lead.

As a result, as shown in FIGS.
Is a probe unit which is firmly connected to the surface of the remaining base plate 2 by the connecting piece 3b and the lead portion extending on the cut-out portion of the base plate 2 is released sideways from one end of the remaining base plate 2 and protrudes. Is formed. The resilient contact piece 3a is formed by the lead protrusion.

As an example to facilitate peeling from the lead 3 when cutting off one end of the base plate 2, a peeling layer 8 is formed on the surface of the elastic contact piece forming area a in the elongated conductive layer 3 '. is there. Therefore, by cutting off the end of the base plate from the vicinity of the inner edge of the peeling layer 8, the peeling from the lead 3 can be performed relatively easily.

The end of the base plate is removed while peeling off from the interface between the peeling layer 8 and the lead 3, so that the elongated conductive layer 3 'is attached to the cut end of the base plate where the peeling layer 8 is formed. Is removed by

In other words, as shown in FIG. 9, the lead 3 is fixed to the base plate 2 via the elongated conductive layer 3 'serving as a plating growth base at the joint piece 3b with the base plate 2, and protrudes from the base plate 2. The structure is such that the elongated conductive layer 3 'does not remain on the back surface of the elastic contact piece 3a.

As shown in FIG. 9, the lead 3 is plated and grown on the surface of the one end extending portion of the elongated conductive layer 3 ', and the other end is exposed on the surface of the base plate 2 to form an IC or the like. The electrode terminals 3a 'used for the connection are formed.

In other words, the lead 3 formed by the plating growth is provided on the surface of the one end extending portion of the elongated conductive layer 3 'with the connecting piece 3b.
And connected to the base plate 2 via one end extending portion of the elongated conductive layer 3 ', and the other end of the elongated conductive layer 3' extends rearward from the rear end of the lead connecting piece 3b. The portion is led out and exposed to form an electrode terminal 3a '.

Although not shown, the present invention includes a case where the leads 3 are formed by plating over the entire length of the elongated conductive layer 3 '. In this case, the electrode terminal 3a 'is formed at one end of the connection of the lead 3.

Next, a second embodiment of the present invention will be described.

In this embodiment, as shown in FIG. 10, a first base plate 2A and a second base plate 2B are abutted on an end face, and both base plates are crossed on the surfaces of the first and second base plates 2A and 2B. A large number of leads 3 to be plated are grown in parallel, and the second base plate 2B is peeled off so that the lead ends extending on the second base plate are projected from the ends of the first base plate 2A. Discloses a method of manufacturing the probe unit 1 described above.

More specifically, referring to FIG. 11 to FIG. 17, specific examples are shown. In addition to the first base plate 2A serving as a lead carrier when the probe unit 1 is completed, it is removed after the lead is formed by plating and growing. A second base plate 2B is prepared.

The first and second base plates 2A and 2B are insulating base plates such as a glass plate and a synthetic resin plate, and both have a rectangular shape.

As shown in FIGS. 11A and 11B, the first base plate 2
A conductive layer 3 ″ is solidly laminated on the entire surface of A.

The conductive layer 3 ″ is formed by applying a known pattern manufacturing method on a printed wiring board such as a method of printing a conductive paste.

When the lead 3 is formed by plating growth, the conductive layer 3 "is formed of a metal (for example, a copper material) whose base material is bonded to the conductive layer 3" with sufficient strength.

On the other hand, a metal which can be plated and grown on the entire surface of the second base plate 2B and which can be peeled from the plating growth layer, that is, the lead 3 with a relatively weak peeling force (or a metal having a peelable surface layer). Thus, the release layer 8 'is solidly layered.

The present invention includes a case where the release layer 8 ′ and the conductive layer 3 ″ are arranged in parallel with the same pitch of the intended lead 3.

For example, a method of forming an extremely thin chromium material on the surface of the second base plate 2B as a metal forming the release layer 8 'as described above is adopted. The release layer 8 'formed on the surface of the second base plate 2B forms a base layer on which the elastic contact pieces 3a of the leads 3 are plated and grown, whereas the release layer 8' is formed on the surface of the first base plate 2A. The conductive layer 3 ″ forms a base layer for plating and growing the coupling piece 3b of the lead 3.

The first base plate 2A and the second base plate 2B as described above are prepared, and the two base plates 2A and 2B are butted against each other at a straight end face.

By this butting, the conductive layer 3 ″ of the first base plate 2A and the release layer 8 ′ are made continuous at the butting line c.

The first base plate 2A and the second base plate 2B
Is a free contact surface at the abutting surface, and the abutting state is maintained by a jig.

Alternatively, the two base plates 2A and 2B are temporarily adhered to each other at an abutting surface via an adhesive to maintain the abutting state.
This bonding is a weak bonding with a strength that facilitates peeling.

As shown in FIG. 12, the surfaces of the first and second base plates 2A and 2B as shown in FIG. 11 are covered with a photosensitive resin layer 9 (resist layer). For example, a photosensitive resin film is attached or a photosensitive resin material is applied.

Next, as shown in FIGS. 13A and 13B, an exposure mask 10 is placed on the surface of the photosensitive resin layer 9, and the photosensitive resin layer 9 is exposed by irradiating light 11 from above.
As shown in FIG. 13B, the exposure mask 10 has a light-transmitting portion 10a having the same pattern as the lead 3 (when the photosensitive resin layer 9 is a negative resist, 10a is a non-light-transmitting portion having the same pattern as the lead 3). Have.

Next, as shown in FIGS. 14A and 14B, the exposed resin of the photosensitive resin layer 9 corresponding to the light-transmitting portion (non-light-transmitting portion in the case of a negative resist) 10a by development (non-exposed in the case of a negative resist). The resin is removed to form a lead forming groove (plating growth groove) 9a penetrating the photosensitive resin layer 9, and the conductive layer 3 ″ is exposed at a portion facing the groove 9a. 9a is naturally arranged in parallel with the lead 3 at the same pitch.

As shown in FIG. 15, the substrate in the state shown in FIG. 14 is electroplated with a suitable plating solution to promote plating growth in the lead forming groove 9a. That is, the surface of the conductive layer 3 ″ (plating growth base) exposed on the bottom surface of the lead forming groove 9a is directly plated by electroplating, and the growth in the groove 9a is promoted.
Lead 3 having a thickness substantially equal to the depth of the lead 3 is generated.

The above-mentioned plating metal is one having appropriate hardness and elasticity, for example, nickel or nickel alloy.
By forming the conductive layer 3 ″ as a plating growth base from copper or a copper alloy, the conductive layer 3 ″ is extremely strongly bonded to the nickel or the nickel alloy.

Next, as shown in FIGS. 16A and 16B, when the photosensitive resin layer 9 of FIG. 15 is removed, the conductive layer 3 ″ and the release layer 8 ′ are removed.
A base plate is obtained in which the leads 3 formed by the plating growth are arranged in parallel at equal intervals across the surface of the substrate.

Next, the solid conductive layer 3 ″ formed in FIG. 16 is removed (for example, removed by etching) between the leads 3 formed by plating growth, and FIG.
As shown in FIGS. 3A and 3B, an elongated conductive layer 3 'remains as a base of each lead 3. FIG.

As a result, elongated conductive layers 3 'arranged in parallel are formed on the surface of the first base plate 2A, and the leads 3 formed by plating growth on the surface of the elongated conductive layer 3' are formed.
And the elongated stripping layer 8 arranged in parallel is formed on the surface of the second base plate 2B. The elastic contact of the lead 3 formed by plating on the surface of the elongated stripping layer 8 is formed. A piece 3a is formed.

Thereafter, by peeling and removing the second base plate B from the leads 3, a probe unit similar to that shown in FIGS. 7A and 7B is formed.

That is, the lead 3 is firmly connected to the surface of the first base plate 2A by the connecting piece 3b, and the lead portion extending on the second base plate 2B is located at one side of the first base plate 2A. A protruding probe unit is formed. The resilient contact piece 3a is formed by the lead protrusion.

In order to facilitate separation from the leads 3 when removing the second base plate 2B, a release layer 8 'is formed on the surface of the second base plate B.

The second base plate 2B is removed while being separated from the interface between the release layer 8 'and the lead 3, so that the release layer 8'
Is removed while attached to the second base plate 2B.

Accordingly, as shown in FIGS. 9A and 9B, the lead 3 is fixed to the base plate 2A via the elongated conductive layer 3 'serving as a base for plating growth at the joint piece 3b with the base plate 2, and the lead plate 2A The structure is such that the release layer 8 'does not remain on the back surface of the elastic contact piece 3a protruding from the elastic contact piece 3a.

At this time, the release layer 8 'can be left on the lower surface of the elastic contact piece 3a.

As shown in FIG. 9, the lead 3 is grown by plating on the surface of one end extending portion of the conductive layer 3 '.
The other end extension is exposed on the surface of the base plate 2A to form an electrode terminal for connection to an IC or the like.

In other words, the lead 3 formed by plating growth is joined to the surface of the one end extending portion of the conductive layer 3 'by the coupling piece 3b, and the base plate is connected via the one end extending portion of the conductive layer 3'. 2A, the extension of the other end of the elongated conductive layer 3 'is led out from the rear end of the lead connection piece 3b to the rear and exposed to form an electrode terminal.

[0065]

FIG. 1 shows an inspection unit formed by the above-mentioned probe unit. The probe unit 1 is adhered to a slope of a carrier 4 with a base plate 2 and one end of a lead 3 (an elastic contact piece 3a). ) Is brought down frontward, and is elastically pressed into contact with the electrode layer 5a of the liquid crystal panel 5. On the other hand, the IC 6 and the circuit board 7 are set on the slope of the carrier 4 and the other end (coupling piece) 3b of the lead bonded to the surface of the base plate 2 is connected to the IC
6 to a circuit board 7.

[0067]

As described above, according to the present invention, problems such as a change in pitch due to shrinkage of an adhesive, such as a case where a lead group formed by an etching method or the like is adhered to the surface of a base plate with an adhesive, are effective. Can be prevented.

Further, it is possible to eliminate the difficulty of applying or bonding the adhesive, or the need for a means for connecting leads such as a tie bar for maintaining alignment until the bonding, thereby eliminating the difficult work of subsequently cutting the tie bar.

Further, the lead group can be formed with extremely small pitch and high precision by plating growth, and the thickness required for imparting elasticity of the elastic contact piece can be sufficiently secured. In addition, the electrode terminals formed at the exposed ends of the elongated conductive layer serving as the plating base of the leads can be soundly connected to an IC or the like.

The elastic contact piece is properly supported by the base plate during plating growth and maintained at a proper pitch. The elastic contact piece is released by removing a part of the base plate or removing the second base plate. The projected state can be easily formed.
Further, the second base plate can be easily removed from the first base plate and peeled off from the elastic contact piece, and it is possible to eliminate the difficulty in removing a part of the base plate and peeling off the elastic contact piece.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example in which an inspection unit is formed by a probe unit according to the present invention.

2A is a sectional view of a base plate showing a first embodiment of a method of forming the probe unit, FIG. 2B is a perspective view of the same, and FIG. 2A is a sectional view taken along the line AA in FIG.

FIG. 3 is a cross-sectional view of a base plate illustrating a step subsequent to that of FIG. 2;

FIG. 4A is a cross-sectional view of the base plate showing the next step of FIG. 3,
FIG. B is a perspective view of the mask.

5A is a sectional view of a base plate showing a step subsequent to that of FIG. 4,
FIG. B is a perspective view of the same, and FIG. A is a sectional view taken along line BB in FIG.

FIG. 6 is a cross-sectional view of a base plate illustrating a step subsequent to that of FIG. 5;

FIG. 7A is a cross-sectional view of a base plate showing the next step of FIG. 6,
FIG. B is a perspective view of the same, and FIG. A is a sectional view taken along line CC in FIG.

FIG. 8 is a cross-sectional view of a base plate illustrating a step subsequent to that of FIG. 7;

9A is a sectional view of the probe unit formed according to FIG. 8, and FIG. 9B is a perspective view of the same.

FIG. 10 is a cross-sectional view of a base plate showing a principle of a second embodiment of the present invention.

FIG. 11A is a sectional view taken along line DD of the base plate in FIG. B showing a specific example of the second embodiment, and FIG.

FIG. 12 is a cross-sectional view of a base plate illustrating a step subsequent to that of FIG. 11;

13A is a cross-sectional view of the base plate showing the next step of FIG. 12, and FIG.

14A is a sectional view taken along line EE of the base plate in FIG. B showing the next step of FIG. 13, and FIG.

FIG. 15 is a cross-sectional view of a base plate illustrating a step subsequent to that of FIG. 14;

16 is a sectional view taken along line FF of the base plate in FIG. B showing the next step of FIG. 15, and FIG.

17A is a sectional view taken along the line GG of the base plate in FIG. B showing the next step of FIG. 16, and FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Probe unit 2 Base plate 2A 1st base plate 2B 2nd base plate 3 Plating growth lead 3 'Elongated conductive layer 3 "Solid conductive layer 3a Elastic contact piece 3b Coupling piece 8 Elongated stripping layer 8' Solid stripping layer

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toshio Okuno 1-46-46 Handomibashi, Hakata-ku, Fukuoka, Fukuoka Prefecture Inside Kyushu Nitto Seiko Co., Ltd. (56) References JP-A-7-199219 (JP, A)

Claims (3)

(57) [Claims] The present invention has a plurality of leads formed by plating growth in parallel on the surface of a base plate, and the plating growth leads are connected to the base plate via an elongated conductive layer serving as a plating growth base. One end of the lead is projected from one end of the base plate to form an elastic contact piece, and the elongated conductive layer is exposed from the other end of the lead to the base plate surface to form an electrode terminal. Probe unit. 2. A first base plate and a second base plate are abutted on an end face, and a large number of leads crossing both base plates are plated and grown on the surfaces of the first and second base plates in parallel.
A method of manufacturing a probe unit, wherein a lead end portion that has been peeled off from a second base plate and extended on the second base plate is projected from an end portion of the first base plate. 3. A plurality of leads are grown in parallel on a surface of a base plate by plating, and an end of the base plate is cut off, and a lead end extending on the cutout of the base plate is used as a remaining base. A method for producing a probe unit, wherein the probe unit is projected from an end of a plate.