JP2552084B2 - Lead unit - Google Patents
Lead unitInfo
- Publication number
- JP2552084B2 JP2552084B2 JP6052925A JP5292594A JP2552084B2 JP 2552084 B2 JP2552084 B2 JP 2552084B2 JP 6052925 A JP6052925 A JP 6052925A JP 5292594 A JP5292594 A JP 5292594A JP 2552084 B2 JP2552084 B2 JP 2552084B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- insulating base
- base
- end side
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は液晶パネルの検査等に
適したリードユニットに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead unit suitable for inspection of liquid crystal panels.
【０００２】[0002]
【従来の技術】液晶パネルを形成するガラス板端縁に並
列配置される電極層は益々微小ピッチ化する傾向にあ
り、これら液晶パネルの検査においては、検査装置側に
おいて、これら微小ピッチの電極層に対応するピッチの
リードユニットの提供が必要となる。現状では上記電極
層のピッチは０．１ｍｍ以下であり、これら液晶パネル
の電極層に接触する検査側のリードをフープ材から機械
的に打板加工して形成することは困難となってきてい
る。2. Description of the Related Art Electrode layers arranged in parallel on the edges of a glass plate forming a liquid crystal panel tend to have a finer pitch, and in the inspection of these liquid crystal panels, the electrode layers having such a fine pitch are used on the inspection device side. It is necessary to provide a lead unit with a pitch corresponding to. At present, the pitch of the electrode layers is 0.1 mm or less, and it is becoming difficult to mechanically plate the leads on the inspection side that come into contact with the electrode layers of the liquid crystal panel from a hoop material. .
【０００３】従って現在はエッチング法や、マスクを通
して光照射して形成された蝕刻溝に金属材を充填するア
ディティブ法等を使用して微小ピッチのリードユニット
を形成する方法が採られている。この方法を使用した最
新の技術が特願平４−２９７５７８号及び特願平４−３
８２８９号である。Therefore, at present, there is adopted a method of forming a fine pitch lead unit by using an etching method or an additive method of filling an etching groove formed by irradiating light through a mask with a metal material. The latest technology using this method is Japanese Patent Application No. 4-297578 and Japanese Patent Application No. 4-3.
No. 8289.
【０００４】この先行発明は何れもエッチング法によっ
て形成されたリードユニットをガラス板等の絶縁ベース
の表面に全巾に亘り接着し、各リードの先端側を絶縁ベ
ースの表面縁部から延出しこの延出部先端を上記液晶パ
ネルの電極層との接触に供すると共に、絶縁ベースの表
面に接着された各リードの基端側表面に検査装置側のＩ
Ｃ等のリードを重ねてハンダ付け等する構成としてい
る。In all the prior inventions, a lead unit formed by an etching method is adhered to the surface of an insulating base such as a glass plate over the entire width, and the tip side of each lead is extended from the surface edge of the insulating base. The tip of the extending part is brought into contact with the electrode layer of the liquid crystal panel, and I on the inspection device side is attached to the base end side surface of each lead adhered to the surface of the insulating base.
The leads such as C are stacked and soldered.
【０００５】更に上記先行発明におけるリードユニット
は何れも先端側端末と基端側端末をタイバーで母材連結
してピッチを保持した状態で絶縁ベースの表面に接着
し、接着後タイバーを切断する構成、換言するとリード
端末を切断する構成としている。Further, in any of the lead units in the above-mentioned prior inventions, the tip end side end and the base end side end are connected to the base material by a tie bar and are bonded to the surface of the insulating base in a state where the pitch is maintained, and the tie bar is cut after the bonding. In other words, the lead terminal is disconnected.
【０００６】[0006]
【発明が解決しようとする問題点】上記先行発明はリー
ドユニットを絶縁ベースに接着する前にメッキされた良
導電メッキ層を上記タイバーの切断によって除去しリー
ド端末の母材を露出する結果となる。この結果、殊にリ
ード先端側端末の切断部位が液晶パネルの電極端子層と
の接触に供されることとなり、接触の信頼性を損なう。
又この切断部位には必ずバリとダレが発生し、このバリ
又はダレと液晶パネルの電極端子層とが接触する状態が
形成され、良導電性メッキ層の機能を喪失し、接触の信
頼性を損なう結果となる。又、リード先端側端末の切断
面は矩形でありリードのねじれがあるから液晶パネル電
極端子との接触点がリードのセンター中心から外れ、上
記電極端子との接触点の位置ズレに対する許容が小さく
なる欠点があった。The above-mentioned invention results in exposing the base material of the lead terminal by removing the plated good conductive plating layer by cutting the tie bar before adhering the lead unit to the insulating base. . As a result, in particular, the cut portion of the terminal on the tip end side of the lead is provided for contact with the electrode terminal layer of the liquid crystal panel, which impairs reliability of contact.
In addition, burrs and sags are always generated at this cut portion, and a state in which the burrs and sags are in contact with the electrode terminal layer of the liquid crystal panel is formed, the function of the good conductive plating layer is lost, and contact reliability is improved. Will result in loss. In addition, since the cut surface of the lead end side terminal is rectangular and the lead is twisted, the contact point with the liquid crystal panel electrode terminal deviates from the center center of the lead, and the tolerance for positional deviation of the contact point with the electrode terminal becomes small. There was a flaw.
【０００７】又絶縁ベースの表面に接着された各リード
の基端側端末に検査装置側のＩＣのリードを重ね適正に
ハンダ付けすることは極めて困難であり、ハンダ材が嵩
高に重ねられたリード間の深い谷に（間隙）に流出して
短絡等の問題を生起する。Also, it is extremely difficult to properly solder the leads of the IC on the inspection device side to the base end side ends of the leads adhered to the surface of the insulating base, and the leads in which the solder material is bulky are stacked. It flows into a deep valley (gap) and causes a problem such as a short circuit.
【０００８】[0008]
【問題点を解決するための手段】この発明は上記液晶パ
ネルの如き検査対象品の電極端子の微小ピッチ化に有効
に対処し、健全なる接触を確保するリードユニットを提
供するものであり、その手段として絶縁ベースの表面に
多数のリードを接着し、各リードの先端側を絶縁ベース
から延出させて延出端を検査対象物の端子との接触に供
するようにしたリードユニットにおいて、上記絶縁ベー
スの表面に密着して上記リードと同一ピッチの多数の細
長導電層を並列配置し、この各細長導電層の一端側延在
部表面に上記各リードの基端側延在部を導電性接着材を
介して接着し、各細長導電層の他端側延在部を絶縁ベー
ス表面において露出させＩＣ等と接続する電極端子部を
構成したものである。SUMMARY OF THE INVENTION The present invention provides a lead unit which effectively copes with a fine pitch of electrode terminals of an object to be inspected such as the above liquid crystal panel and ensures a sound contact. As a means, a large number of leads are adhered to the surface of the insulating base, the tip side of each lead is extended from the insulating base, and the extended end is provided for contact with the terminal of the inspection object. A large number of elongated conductive layers having the same pitch as the leads are arranged in parallel so as to be in close contact with the surface of the base, and the proximal end side extended portions of the leads are electrically conductively adhered to the extended end surface of each elongated conductive layer. The electrode terminal portion is configured to be bonded via a material to expose the other end side extending portion of each elongated conductive layer on the surface of the insulating base to connect to an IC or the like.
【０００９】又上記リード群はその加工時に各リード間
をタイバーで母材連結して整列を保持した状態で絶縁ベ
ースに接着し、接着後タイバーを切断除去するが、この
発明においては上記タイバーの切断部位が各リードの相
互に隣接する内側面に存し、この切断部位から各リード
の先端側端末と基端側端末が突出される構成としたもの
である。Further, the lead group is bonded to the insulating base in a state in which the respective leads are connected to each other by the tie bar at the time of processing and the alignment is maintained and the tie bar is cut and removed after the bonding. The cutting site is located on the inner side surfaces of the leads that are adjacent to each other, and the distal end side end and the proximal end side end of each lead project from the cutting site.
【００１０】[0010]
【作用】上記リードユニットによれば、絶縁ベースから
遊離して延出する各リードの先端側端末を液晶パネル等
の電極端子に弾力的に加圧接触させながら、絶縁ベース
表面に露出せる細長導電層部分を以ってＩＣ等との健全
なる接続が図れる。According to the above-mentioned lead unit, the end portions of the leads extending separately from the insulating base are elastically pressure-contacted to the electrode terminals of the liquid crystal panel or the like, and are exposed on the surface of the insulating base. A sound connection with an IC or the like can be achieved by using the layer portion.
【００１１】又この発明によればリード群を絶縁ベース
表面（細長導電層表面）に接着する際に、タイバーによ
るリード群整列目的を有効に達成しながら、接着後のタ
イバー切断によってリード先端側端末の良導電メッキ層
が除去される事態を確実に防止し導電メッキ層による高
信頼の接触が確保できる。Further, according to the present invention, when the lead group is bonded to the surface of the insulating base (the surface of the elongated conductive layer), while effectively achieving the purpose of aligning the lead group by the tie bar, the end of the lead tip side is cut by cutting the tie bar after bonding. It is possible to reliably prevent the good conductive plating layer from being removed, and to ensure highly reliable contact by the conductive plating layer.
【００１２】同様に、タイバー切断によりリード基端側
端末の良導電メッキ層が除去される不具合も解消し、同
メッキ層による細長導電層との導通が健全に図れる。又
リード先端側端末を鋭く尖らせることができるので、接
触時の位置ズレ許容値を大きくとれる。Similarly, the problem of removing the good conductive plating layer of the lead proximal end by cutting the tie bar is also eliminated, and the conduction of the plating layer with the elongated conductive layer can be achieved soundly. Further, since the end of the lead tip side can be sharpened sharply, a large positional deviation allowable value at the time of contact can be obtained.
【００１３】又上記タイバーはリード基端側延在部が接
着された各細長導電層の隣接縁間において切断でき、タ
イバー切断に際しての細長導電層の損傷を有効に防止す
る。換言するとリード基端側延在部に配したタイバーの
切断除去作業が細長導電層の存在下で支障なく行なえ
る。Further, the tie bar can be cut between the adjacent edges of the elongated conductive layers to which the lead-base-end-side extending portions are adhered, effectively preventing damage to the elongated conductive layers when the tie bar is cut. In other words, the work of cutting and removing the tie bar arranged at the lead base end side extended portion can be performed without any trouble in the presence of the elongated conductive layer.
【００１４】更にこの発明によれば細長導電層を介する
ことにより絶縁ベース表面に接着されるリードの長さを
大巾に短かくできリード全長の長さを縮小できる。従っ
てリード全長の長さを可及的に縮小して剛性を高め整列
性を向上でき、極小ピッチのリードユニットの製作が極
めて有利に行なえる。Further, according to the present invention, the length of the lead bonded to the surface of the insulating base can be greatly shortened by interposing the elongated conductive layer, and the total length of the lead can be reduced. Therefore, it is possible to reduce the total length of the leads as much as possible to enhance the rigidity and the alignment, and it is extremely advantageous to manufacture a lead unit with an extremely small pitch.
【００１５】[0015]
【実施例】以下この発明の実施例を図１乃至図１０に基
いて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
【００１６】図１，図２は絶縁ベース１の表面に接着す
べく準備された薄肉で細長のリード２群を示す。FIGS. 1 and 2 show a group of thin, elongated leads 2 prepared for bonding to the surface of an insulating base 1.
【００１７】上記各リード２は互いに等ピッチで平行に
延在され、リード相互間をタイバー３によって母材連結
して並列配置状態を保持している。この時各リード２の
先端側端末２ａを鋭く尖らせこの尖端２ａ′をリード２
の中心線上に配置し、これを実際の接点部とする。The leads 2 extend in parallel at equal pitches, and the leads are connected to each other by a tie bar 3 to maintain a parallel arrangement. At this time, the tip end side 2a of each lead 2 is sharply pointed, and this tip 2a 'is set to the lead 2
It is placed on the center line of and is used as the actual contact point.
【００１８】上記配置のリード２群を前記エッチング法
やアディティブ法の適用によって形成した後、全表面に
良導電金属によるメッキを施す。このリード２の材質と
してはリン青銅の如きバネ性を富有する金属を用いる。
又絶縁ベース１はガラス製又は合成樹脂製、セラミック
製等である。After the lead 2 group having the above arrangement is formed by applying the etching method or the additive method, the entire surface is plated with a good conductive metal. As the material of the lead 2, a metal having a high spring property such as phosphor bronze is used.
The insulating base 1 is made of glass, synthetic resin, ceramic or the like.
【００１９】又他例として絶縁ベース１を圧縮・復原弾
力を有するゴム製等の弾性体で形成する。As another example, the insulating base 1 is formed of an elastic material such as rubber having compressive and restoring elasticity.
【００２０】而して上記タイバー３は上記各リード先端
側端末２ａと基端側端末２ｂを除いた、各リード２が相
互に隣接する内側面間を母材連結するように配置する。
例えば図１に示すように上記タイバー３は絶縁ベース１
から遊離して延出された上記各リード２の先端側延在部
の内側面間を連結し、この連結部位から上記先端側端末
２ａが突出されるように配置する。The tie bar 3 is arranged so as to connect the inner surfaces of the leads 2 which are adjacent to each other, excluding the leads 2a and the ends 2b, to each other.
For example, as shown in FIG. 1, the tie bar 3 is an insulating base 1.
The inner side surfaces of the distal end side extending portions of the respective leads 2 which are separated and extended from the above are connected, and the distal end side terminals 2a are arranged so as to project from this connecting portion.
【００２１】又別のタイバー３は上記絶縁ベース１の表
面に沿い延在せるリード基端側延在部の内側面間を連結
し、この連結部位から上記リード基端側端末２ｂが突出
されるように配置する。上記タイバー３は後記するよう
に、絶縁ベース１の表面にリード２群を接着後切断除去
される。Further, another tie bar 3 connects the inner side surfaces of the lead base end side extending portion extending along the surface of the insulating base 1, and the lead base end side terminal 2b is projected from this connecting portion. To arrange. As described later, the tie bar 3 is cut and removed after the lead 2 group is bonded to the surface of the insulating base 1.
【００２２】図３，図４は上記リード２群を接着支持す
るバックアップ材として準備された絶縁ベース１を示
し、この絶縁ベース１のリード２群を接着すべき表面に
は印刷、エッチング等の方法により上記リード群と同一
ピッチで細長導電層５を密着し形成する。3 and 4 show an insulating base 1 prepared as a backup material for adhering and supporting the above-mentioned lead 2 group, and the surface of the insulating base 1 on which the lead 2 group is to be adhered is printed or etched by a method such as etching. Thus, the elongated conductive layer 5 is formed in close contact with the lead group at the same pitch.
【００２３】上記各細長導電層５は図３に示すように、
全長が直線で互いに平行となるように並列配置する。又
は上記細長導電層５群は後記するように、一端延在部に
前記リード２群が接着され、他端延在部は絶縁ベース１
の表面に露出されるが、図５に示すようにこの露出端側
においてピッチを拡大し配置する。この広ピッチに変換
した細長導電層部分にてＩＣ等との接続用電極端子５ａ
を形成する（図７参照）。As shown in FIG. 3, each elongated conductive layer 5 has
Arrange them in parallel so that their entire length is straight and parallel to each other. Alternatively, as described later, in the elongated conductive layer group 5, the lead 2 group is adhered to one end extending portion, and the other end extending portion is insulated base 1.
However, the pitch is enlarged and arranged on the exposed end side as shown in FIG. In this elongated conductive layer portion converted into a wide pitch, electrode terminals 5a for connection with an IC or the like are provided.
Are formed (see FIG. 7).
【００２４】斯くして図１に示す如くタイバー３よって
連結されたリード群を形成すると共に、図３，図５に示
すように絶縁ベース１の表面に密着して細長導電層５を
上記リード２と同一ピッチで並列配置し、図６，図７に
示すように、上記各細長導電層５の一端側延在部表面に
上記各リード２の基端側の延在部下面を導電性接着材６
を介して接着すると共に、各細長導電層５の他端側延在
部を絶縁ベース表面において露出させ、この露出部を以
ってＩＣ等と接続せる電極端子５ａを形成する。上記導
電性接着材６としては異方性導電接着材材が最適であ
る。Thus, as shown in FIG. 1, a lead group connected by the tie bar 3 is formed, and as shown in FIGS. 3 and 5, the elongated conductive layer 5 is adhered to the surface of the insulating base 1 to form the lead 2 above. 6 and 7 are arranged in parallel with each other, and as shown in FIGS. 6 and 7, the lower surface of the extending portion on the base end side of each lead 2 is provided with a conductive adhesive on the surface of the extending portion on one end side of each elongated conductive layer 5. 6
And the other end side extending portion of each elongated conductive layer 5 is exposed on the surface of the insulating base, and the exposed portion forms an electrode terminal 5a that can be connected to an IC or the like. An anisotropic conductive adhesive material is most suitable as the conductive adhesive material 6.
【００２５】上記の如く絶縁ベース１の表面に細長導電
層５及び異方導電性接着材６を介して上記リード２群を
接着した後、図８に示すように上記各タイバー３をレー
ザー加工により切断除去する。上記各リード２間を母材
連結していたタイバー３は前記配置によって上記切断部
位３′が上記各リード先端側端末２ａと基端側端末２ｂ
を除いた、各リード２が相互に隣接する内側面に存する
構成となる。After the lead group 2 is bonded to the surface of the insulating base 1 through the elongated conductive layer 5 and the anisotropic conductive adhesive material 6 as described above, the tie bars 3 are laser-processed as shown in FIG. Remove by cutting. In the tie bar 3 which connects the leads 2 to each other as the base material, the cutting portions 3'are arranged so that the lead end side end 2a and the lead end side end 2b of each lead 2 are arranged.
Except for the above, each lead 2 exists on the inner side surface adjacent to each other.
【００２６】即ち図示の実施例においては図１，図８，
図９に示すように上記一方のタイバー３を各リード２の
先端側端末２ａに接近した位置に配し、上記一方のタイ
バー３の切断部位３′が絶縁ベース１から遊離して延出
した上記各リード２の先端側端末に接近した内側面間に
存し、この切断部位３′から上記先端側端末２ａが突出
されるようにしている。That is, in the embodiment shown in FIGS.
As shown in FIG. 9, the one tie bar 3 is arranged at a position close to the distal end 2a of each lead 2, and the cut portion 3'of the one tie bar 3 is separated from the insulating base 1 and extends. It exists between the inner side surfaces of the leads 2 which are close to the tip end, and the tip end 2a is projected from the cut portion 3 '.
【００２７】又他方のタイバー３を各リード２の基端側
端末に接近した位置に配し、タイバー３の切断部位３′
が上記絶縁ベース１の表面に沿い延在せるリード基端側
端末２ｂに接近した内側面間に存し、この切断部位３′
から上記リード基端側端末２ｂが突出されるようにして
いる。The other tie bar 3 is arranged at a position close to the proximal end of each lead 2, and the cut portion 3'of the tie bar 3 is arranged.
Exists between the inner side surfaces close to the lead base end 2b extending along the surface of the insulating base 1, and the cut portion 3 '
The lead proximal end 2b is projected from the above.
【００２８】図１０はリードユニットを使用して形成さ
れた検査装置を示している。図示の如く、前傾斜面７ａ
を有する絶縁材から成る担体７を形成し、この担体７の
前傾斜面７ａの下端に前記リードユニットのバックアッ
プ基板たる絶縁ベース１を接着し、リード２全体が前下
がりに傾斜し且つリード先端側端末２ａが担体７の下部
傾斜端から前傾して延出されるようにし、このリード先
端側端末２ａを液晶パネル８の端縁部表面に配置された
電極端子８ａに弾力的に加圧接触する。FIG. 10 shows an inspection device formed using a lead unit. As shown, the front sloped surface 7a
A carrier 7 made of an insulating material is formed, and an insulating base 1 which is a backup substrate of the lead unit is adhered to the lower end of a front inclined surface 7a of the carrier 7 so that the entire lead 2 is inclined downward toward the front and the tip end side of the lead. The terminal 2a is made to extend forward from the lower tilted end of the carrier 7, and the lead end side terminal 2a is elastically pressed into contact with the electrode terminal 8a arranged on the surface of the edge of the liquid crystal panel 8. .
【００２９】他方絶縁ベース１の後端側表面に露出され
た前記細長導電層５から成る電極端子５ａにＩＣ９の一
側方に延出されたリード９ａをハンダを介して接続し、
他側方に突出されたリード９ａを配線基板１０にハンダ
を介して接続する。この配線基板１０は検査装置を電源
及び信号源に接続する手段であり、ＩＣ９は液晶パネル
８の駆動制御手段である。斯くして液晶パネル８の表示
状態を目視しつつ検査を行なう。On the other hand, a lead 9a extending to one side of the IC 9 is connected to the electrode terminal 5a formed of the elongated conductive layer 5 exposed on the rear end side surface of the insulating base 1 via solder,
The lead 9a protruding to the other side is connected to the wiring board 10 via solder. The wiring board 10 is means for connecting the inspection device to a power source and a signal source, and the IC 9 is drive control means for the liquid crystal panel 8. Thus, the inspection is performed while visually checking the display state of the liquid crystal panel 8.
【００３０】[0030]
【発明の効果】この発明によれば絶縁ベースから遊離し
て延出する各リードの先端側端末を液晶パネル等の電子
部品の端子層に弾力的に加圧接触させながら、絶縁ベー
ス表面に露出せる細長導電層部分を以ってＩＣ等の電子
部品との健全なる接続が図れる。According to the present invention, the tip end of each lead, which is separated from the insulating base and extends, is exposed to the surface of the insulating base while being elastically pressed into contact with the terminal layer of an electronic component such as a liquid crystal panel. A sound connection with an electronic component such as an IC can be achieved by the elongated conductive layer portion.
【００３１】又この発明によればリード群を絶縁ベース
表面（細長導電層表面）に接着して各リード間を母材連
結していたタイバーを切断する際に、この切断部位がリ
ード先端側端末の良導電メッキ層を除去してしまう事態
を確実に防止し導電メッキ層による高信頼の接触が確保
できる。Further, according to the present invention, when the lead group is adhered to the surface of the insulating base (the surface of the elongated conductive layer) to cut the tie bar connecting the leads to each other as the base material, the cut portion is the end on the lead tip side. It is possible to reliably prevent the situation where the good conductive plating layer is removed, and to ensure highly reliable contact by the conductive plating layer.
【００３２】同様に、タイバー切断によりリード基端側
端末の良導電メッキ層が除去される不具合も解消し、同
メッキ層による細長導電層との導通が健全に図れる。Similarly, the problem of removing the good conductive plating layer of the lead base end side terminal by cutting the tie bar is eliminated, and the conduction with the elongated conductive layer by the plating layer can be achieved soundly.
【００３３】又上記タイバーはリード基端側延在部が接
着された各細長導電層の隣接縁間において支障なく切断
でき、タイバー切断に際しての細長導電層の損傷を有効
に防止する。又従来の如くリード端末を連結するタイバ
ーをシヤーカッター等の機械加工により切断する場合に
は、切断時の衝撃でリードのピッチズレが起こり、これ
を回避せんとしてレーザーカットを行なった場合にはリ
ード基端側及び先端側端末の母材やメッキが溶融して端
末形状が変形し、接触子としての機能を失う。Further, the tie bar can be cut without any trouble between the adjacent edges of the elongated conductive layers to which the lead-base-end-side extending portions are adhered, effectively preventing damage to the elongated conductive layers when the tie bar is cut. Also, when cutting the tie bar that connects the lead terminals by mechanical processing such as a shear cutter as in the conventional case, the lead pitch shift occurs due to the impact at the time of cutting, and when laser cutting is performed to avoid this, the lead base The base material and plating of the end on the end side and the tip end are melted, the shape of the end is deformed, and the function as a contact is lost.
【００３４】これに対しこの発明においては接触点とし
て供されるリード先端側端末と基端側端末を除いたリー
ド内側面間にダイバー切断部位が存するのでレーザー加
工による切断を適用することができ、機械加工によるピ
ッチズレの問題を解決できることに加えて、上記端末は
エッチングやアディティブ法で形成された健全な状態を
保って接触に供することができる。On the other hand, in the present invention, since there is a diver cutting site between the inner surface of the lead excluding the end on the tip side and the end on the proximal side serving as contact points, cutting by laser processing can be applied, In addition to being able to solve the problem of pitch deviation due to machining, the terminal can be brought into contact while maintaining a sound state formed by etching or an additive method.
【００３５】又ダイバーの切断部位がリード端末に存し
ないのでリードの先端側端末を鋭く尖らせる加工が可能
であり、これにより前記従来例におけるリードのねじれ
による接触点の接触不良の問題を確実に解消できる。Further, since the cutting portion of the diver does not exist in the lead terminal, it is possible to sharpen the tip end side of the lead, which surely causes the problem of poor contact at the contact point due to the twist of the lead in the conventional example. It can be resolved.
【００３６】更にこの発明によれば細長導電層の一端側
延在部にリードを接着する構成とすることにより絶縁ベ
ース表面に接着されるリードの長さを大巾に短かくでき
リード全長の長さを縮小できる。従ってリードの全長の
長さを可及的に縮小して剛性を高め整列性を向上でき、
極小ピッチのリードユニットの製作が著しく有利に行な
える。Further, according to the present invention, by adopting a constitution in which the lead is bonded to the one end side extending portion of the elongated conductive layer, the length of the lead bonded to the surface of the insulating base can be greatly shortened and the total length of the lead can be increased. Can be reduced. Therefore, the overall length of the leads can be reduced as much as possible to increase rigidity and improve alignment.
Very small pitch lead units can be manufactured with great advantage.
【図１】リード群の平面図である。FIG. 1 is a plan view of a lead group.
【図２】同リード群の断面図である。FIG. 2 is a cross-sectional view of the lead group.
【図３】細長導電層群を形成した絶縁ベースの平面図で
ある。FIG. 3 is a plan view of an insulating base on which elongated conductive layer groups are formed.
【図４】同ベースの断面図である。FIG. 4 is a sectional view of the base.
【図５】上記絶縁ベースの他例を示す平面図である。FIG. 5 is a plan view showing another example of the insulating base.
【図６】図３の絶縁ベースに図１のリード群を接着した
例を示す平面図である。6 is a plan view showing an example in which the lead group of FIG. 1 is bonded to the insulating base of FIG.
【図７】図５の絶縁ベースに図１のリード群を接着した
例を示す平面図である。FIG. 7 is a plan view showing an example in which the lead group of FIG. 1 is bonded to the insulating base of FIG.
【図８】図６の状態を形成した後、タイバーを切断除去
して形成されたリードユニットの平面図である。FIG. 8 is a plan view of a lead unit formed by cutting and removing the tie bar after forming the state of FIG. 6;
【図９】上記リードユニットの断面図である。FIG. 9 is a cross-sectional view of the lead unit.
【図１０】上記リードユニットを使用した検査装置の断
面図である。FIG. 10 is a cross-sectional view of an inspection device using the lead unit.
１ 絶縁ベース ２ リード ２ａ リード先端側端末 ２ｂ リード基端側端末 ３ タイバー ３′ 切断部 ５ 細長導電層 ５ａ 電極端子 ６ 導電性接着材 1 Insulation Base 2 Lead 2a Lead Tip Side Terminal 2b Lead Base Side Terminal 3 Tie Bar 3'Cut Section 5 Elongated Conductive Layer 5a Electrode Terminal 6 Conductive Adhesive
フロントページの続き (72)発明者 奥野 敏雄 福岡県福岡市博多区半道橋１丁目６番46 号 九州日東精工株式会社内 (72)発明者 人見 保幸 京都府綾部市井倉新町瓜田８番地の１ 日東公進株式会社内 (56)参考文献 特開 平３−1848（ＪＰ，Ａ) 実開 昭60−49479（ＪＰ，Ｕ) 実開 平５−84869（ＪＰ，Ｕ)Front Page Continuation (72) Inventor Toshio Okuno 1-6-46 Hanmichibashi, Hakata-ku, Fukuoka City, Fukuoka Prefecture Kyushu Nitto Seiko Co., Ltd. Koshin Co., Ltd. (56) Reference Japanese Unexamined Patent Publication No. 3-1848 (JP, A) Actually open 60-49479 (JP, U) Actually open 5-84869 (JP, U)
Claims (4)
ードを微小間隔で並列配置し、該各リードの先端側を上
記絶縁ベースから遊離して所定寸法だけ延出させ、この
各リード先端側端末部で接点部を形成すると共に、上記
絶縁ベース表面に接して延在せる各リード基端側を同ベ
ース表面に接着して成るリードユニットにおいて、上記
絶縁ベースの表面に密着して多数の細長導電層を上記リ
ードと同一ピッチで並列配置し、この各細長導電層の一
端側表面に上記各リードの基端側の延在部下面を導電性
接着材を介して接着すると共に、各細長導電層の他端側
延在部を絶縁ベース表面において露出させたことを特徴
とするリードユニット。1. A large number of thin and elongated leads are arranged in parallel on the surface of an insulating base at minute intervals, and the tip side of each lead is separated from the insulating base and extended by a predetermined dimension. In the lead unit formed by forming the contact portion at the side terminal portion and adhering each lead base end side extending in contact with the insulating base surface to the same base surface, a large number of them are closely attached to the insulating base surface. The elongated conductive layers are arranged in parallel with the leads at the same pitch, and the lower surface of the extending portion on the base end side of each of the leads is bonded to the surface of one end side of each of the elongated conductive layers through a conductive adhesive and A lead unit in which an extending portion on the other end side of the conductive layer is exposed on the surface of the insulating base.
ーの切断部位が上記各リード先端側端末と基端側端末を
除いた、各リードが相互に隣接する内側面に存すること
を特徴とする請求項１記載のリードユニット。2. The cutting portion of the tie bar connecting the leads to each other in the base material is located on the inner side surface adjacent to each other except the tip end side end and the base end side end of each lead. The lead unit according to claim 1.
遊離して延出した上記各リードの先端側延在部の内側面
間に存し、この切断部位から上記先端側端末が突出され
ていることを特徴とする請求項２記載のリードユニッ
ト。3. The cutting portion of the tie bar is located between inner surfaces of the tip side extending portions of the leads extending free from the insulating base, and the tip end is projected from the cutting portion. The lead unit according to claim 2, wherein:
の表面に沿い延在せるリード基端側延在部の内側面間に
存し、この切断部位から上記リード基端側端末が突出さ
れていることを特徴とする請求項２記載のリードユニッ
ト。4. The cutting portion of the tie bar is located between inner surfaces of a lead base end side extending portion extending along the surface of the insulating base, and the lead base end terminal is projected from the cutting portion. The lead unit according to claim 2, wherein
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6052925A JP2552084B2 (en) | 1994-02-24 | 1994-02-24 | Lead unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6052925A JP2552084B2 (en) | 1994-02-24 | 1994-02-24 | Lead unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07234248A JPH07234248A (en) | 1995-09-05 |
| JP2552084B2 true JP2552084B2 (en) | 1996-11-06 |
Family
ID=12928420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6052925A Expired - Fee Related JP2552084B2 (en) | 1994-02-24 | 1994-02-24 | Lead unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2552084B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6998857B2 (en) | 2001-09-20 | 2006-02-14 | Yamaha Corporation | Probe unit and its manufacture |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20114544U1 (en) * | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | wafer probe |
| JP2007078359A (en) * | 2005-09-09 | 2007-03-29 | Japan Electronic Materials Corp | Method of attaching probe on substrate, and probe unit used therefor |
| JP5266155B2 (en) * | 2009-07-21 | 2013-08-21 | 日本電子材料株式会社 | Probe card manufacturing method |
| WO2011122068A1 (en) * | 2010-03-30 | 2011-10-06 | 住友電気工業株式会社 | Contact probe, contact probe connecting body and methods for manufacturing same |
| KR101517409B1 (en) * | 2014-03-05 | 2015-05-19 | 주식회사 이노 | Semiconductor test socket and manufacturing method thereof |
-
1994
- 1994-02-24 JP JP6052925A patent/JP2552084B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6998857B2 (en) | 2001-09-20 | 2006-02-14 | Yamaha Corporation | Probe unit and its manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07234248A (en) | 1995-09-05 |
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