JPS62211886A - Laser soldering - Google Patents
Laser solderingInfo
- Publication number
- JPS62211886A JPS62211886A JP5272486A JP5272486A JPS62211886A JP S62211886 A JPS62211886 A JP S62211886A JP 5272486 A JP5272486 A JP 5272486A JP 5272486 A JP5272486 A JP 5272486A JP S62211886 A JPS62211886 A JP S62211886A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- laser soldering
- glass
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims description 20
- 239000011521 glass Substances 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、微細ピッチの接続端子を有するフレキシブル
回路基板とセラミック回路基板とのレーザ半田付は方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for laser soldering of a flexible circuit board and a ceramic circuit board having fine pitch connection terminals.
（従来の技術）
ポリイミド系樹脂を主材とするフレキシブル回路基板の
接続端子部とセラミック回路基板の接続端子部をレーザ
ビームによって半田付けする場合は、従来、第４図に示
されるように、セラミック回路基板ｌの接続端子部にフ
レキシブル回路基板７の接続端子８を重ね合わせ、上か
ら平板状の押えガラス９で押えて固定し、レーザビーム
５を送りながら照射することにより、フレキシブル回路
基板７の接続端子部８の半田メッキをリフローさせ、半
田付けを行うようにしていた。(Prior Art) When soldering the connection terminals of a flexible circuit board mainly made of polyimide resin and the connection terminals of a ceramic circuit board using a laser beam, conventionally, as shown in FIG. The connection terminals 8 of the flexible circuit board 7 are superimposed on the connection terminals of the circuit board l, fixed by pressing with a flat holding glass 9 from above, and the flexible circuit board 7 is irradiated with the laser beam 5 while being sent. The solder plating on the connection terminal portion 8 was reflowed and soldered.
（発明が解決しようとする問題点）
しかしながら、上記のレーザ半田付は方法では第４図乃
至第６図に示されるように、接続端子部の露出幅が狭く
、押えガラスの幅はその露出幅より広くなっており、押
えガラスはポリイミドテープの上から押さえることにな
るため、接続端子部に十分な圧力をかけることができず
、特に、フレキシブル回路基板の接続端子が微細ピッチ
となり、高密度化するに伴って接続端子の半田メッキ厚
が非常に薄くなった場合（１μｍ程度）、半田付けに必
要なぬれを促進させる圧力が得られず、半田付けが困難
であるといった問題があった。(Problems to be Solved by the Invention) However, in the above laser soldering method, as shown in FIGS. 4 to 6, the exposed width of the connecting terminal portion is narrow, and the width of the presser glass is the exposed width. Since the presser glass has to be pressed from above the polyimide tape, it is not possible to apply sufficient pressure to the connection terminals.In particular, the connection terminals of flexible circuit boards have a fine pitch and are high density. As a result, when the solder plating thickness of the connection terminal becomes very thin (about 1 μm), there is a problem that the pressure that promotes wetting necessary for soldering cannot be obtained, making soldering difficult.
本発明は、上記問題点を除去し、微細ピンチの接続端子
を有するフレキシブル回路基板とセラミック回路基板と
の接続の信幀性が高く、しかも安定したレーザ半田付は
方法を提供することを目的とする。The present invention aims to eliminate the above-mentioned problems and provide a highly reliable and stable laser soldering method for connecting a flexible circuit board and a ceramic circuit board that have connection terminals with fine pinches. do.
（問題点を解決するための手段）
本発明は、上記問題点を解決するために、微細ピッチの
接続端子を有するフレキシブル回路基板とセラミック回
路基板とのレーザ半田付は方法において、ポリイミドテ
ープを取り除いた接続端子の露出幅の広いフレキシブル
回路基板とその接続端子部を直接加圧固定できるような
押圧面を有する押えガラスを使用し、この押えガラスに
よってぬれを促進させる圧力を生じさせてその接続端子
部をレーザ半田付けするようにしたものである。(Means for Solving the Problems) In order to solve the above problems, the present invention provides a method for laser soldering between a flexible circuit board having fine-pitch connection terminals and a ceramic circuit board, by removing the polyimide tape. A presser glass with a pressing surface that can directly press and fix the flexible circuit board with a wide exposed width of the connection terminal and its connection terminal part is used, and the presser glass generates pressure that promotes wetting and secures the connection terminal. The parts are laser soldered.
（作用）
本発明によれば、微細ピッチの接続端子を有するフレキ
シブル回路基板とセラミック回路基板とのレーザ半田付
は方法において、ポリイミドテープ１１を取り除いた接
続端子の露出幅の広いフレキシブル回路基板２を用意し
、その接続端子部３を押えガラス４で直接加圧固定でき
るようにしたので、この押えガラスによってぬれを促進
させる圧力を生じさせることができる。つまり、接続端
子部３をセラミック回路基板の接続端子に確実に接触さ
せ、接続端子部にレーザビーム照射により溶融した半田
がぬれて良好な金属間化合物を形成するための十分な圧
力を与えることができる。(Function) According to the present invention, in the method of laser soldering between a flexible circuit board and a ceramic circuit board having fine-pitch connection terminals, the flexible circuit board 2 from which the polyimide tape 11 is removed and the connection terminals have a wide exposed width is used. Since the connecting terminal portion 3 can be directly pressurized and fixed with the holding glass 4, the holding glass can generate pressure that promotes wetting. In other words, it is possible to reliably bring the connecting terminal portion 3 into contact with the connecting terminal of the ceramic circuit board and apply sufficient pressure to the connecting terminal portion to wet the melted solder by laser beam irradiation and form a good intermetallic compound. can.
（実施例）
以下、本発明の実施例について図面を参照しながら詳細
に説明する。(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.
第１図は本発明の実施を示すレーザ半田付は状態を示す
図、第２図は第１図の■−■線断面図である。以下、こ
れらの図に基づいて本発明のレーザ半田付は方法を説明
する。FIG. 1 is a diagram illustrating the state of laser soldering according to the embodiment of the present invention, and FIG. 2 is a sectional view taken along the line ■--■ in FIG. 1. Hereinafter, the laser soldering method of the present invention will be explained based on these figures.
（１）まず、治具上のセラミック回路基板１の接続端子
部に、図に示されるような、接続端子部の露出部分が広
くなったフレキシブル回路基板２の接続端子部３を重ね
合わせる。続いて、その上に接″４１ｔ端子部を直接加
圧固定するための石英ガラスから成る押えガラス４を置
く、この場合、押えガラスとしては、従来のように幅の
広い平板状のもの（第４図乃至第５図参照）ではなく、
第１図及び第２図に示されるように幅を狭くして接続端
子部を直接押圧できるようにしたものを用い、押さえ力
を集中させるようにする。(1) First, the connecting terminal portion 3 of the flexible circuit board 2 with the exposed portion of the connecting terminal portion widened as shown in the figure is superimposed on the connecting terminal portion of the ceramic circuit board 1 on the jig. Next, a holding glass 4 made of quartz glass is placed on top of the holding glass 4 for directly pressurizing and fixing the contact 41t terminal part. (see Figures 4 to 5), but
As shown in FIGS. 1 and 2, a device with a narrow width so that the connecting terminal portion can be directly pressed is used to concentrate the pressing force.
次に、治具のガラス押圧子６により押えガラス４を締め
つけ接続端子部３を加圧固定する。このようにセットし
た状態でレーザビーム５を端子列の端から端まで照射す
る。この時、フレキシブル回路基板２の接続端子部３に
予めメッキしておいた半田が、レーザビーム照射による
加熱によって溶融する。同時に熔融した半田は押えガラ
スの加圧力によりセラミック回路基板ｌの接続端子をぬ
らし良好な金属間化合物を形成する。Next, the presser glass 4 is tightened using the glass presser 6 of the jig, and the connection terminal portion 3 is fixed under pressure. In this set state, the laser beam 5 is irradiated from end to end of the terminal row. At this time, the solder plated in advance on the connection terminal portion 3 of the flexible circuit board 2 is melted by heating by the laser beam irradiation. At the same time, the melted solder wets the connection terminals of the ceramic circuit board l due to the pressing force of the holding glass and forms a good intermetallic compound.
なお、上記実施例においては、押えガラス４は幅の狭い
平板状のものを用いたが、第７図に示されるように、押
さえ力を集中させ、効率良く押圧力を加えることのでき
る断面形状が台形のものや丸形のものを使用することが
できる。In the above embodiment, the presser glass 4 was a narrow flat plate, but as shown in FIG. A trapezoidal or round shape can be used.
また、本発明は上記実施例に限定されるものではなく、
本発明の趣旨に基づいて種々の変形が可能であり、これ
らを本発明の範囲から排除するものではない。Furthermore, the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.
（発明の効果）
以上、詳細に説明したように、本発明によれば、微細ピ
ッチ接続端子を有するフレキシブル回路基板とセラミッ
ク回路基板とのレーザ半田付は方法において、前記フレ
キシブル回路基板の接続端子の露出部分を広くし、該フ
レキシブル回路基板の接続端子部を押えガラスで直接加
圧固定するようにしたので、簡単な構成でもって、半田
がぬれるのに必要な圧力が得られ、良好なレーザ半田付
け接合を行うことができる。特に、フレキシブル回路基
板の接続端子部の半田メッキ厚が非常に薄い（１μｍ程
度）場合でも、良好なレーザ半田付は接合を行うことが
できる。(Effects of the Invention) As described above in detail, according to the present invention, in the method of laser soldering between a flexible circuit board having fine pitch connection terminals and a ceramic circuit board, the connection terminals of the flexible circuit board are Since the exposed area is widened and the connecting terminals of the flexible circuit board are directly pressed and fixed with a holding glass, the necessary pressure for solder to wet can be obtained with a simple configuration, resulting in good laser soldering. It is possible to perform side joining. Particularly, even when the solder plating thickness of the connecting terminal portion of the flexible circuit board is very thin (about 1 μm), good laser soldering can perform the bonding.
第１図は本発明の実施を示すレーザ半田付は状態を示す
図、第２図は第１図のｎ−ｎ線断面図、第３図は本発明
のフレキシブル回路基板の構成図、第４図は従来のレー
ザ半田付は説明図、第５図は第４図のＶ−Ｖ線断面図、
第６図は従来のフレキシブル回路基板の構成図、第７図
は押えガラスの他の実施例の斜視図である。
１・・・セラミック回路基板、２・・・フレキシブル回
路基板、３・・・接続端子部、４・・・押えガラス、５
・・・レーザビーム、６・・・ガラス押圧子。
特許出願人 沖電気工業株式会社
代 理 人 弁理士 清 水 ９本発明１；借
るレザ卑田付１尤明図
矧１図ａ＞ｌｌ−１！Ｍｆｌｆｒ面図
第２図
（ｂ） Ｗ （ｂ） −一；−一（、！
２） （ｂ）才甲を力７スの砲のヌ
ｊ包例の宗４イ麦、口笛７図
従来のし一すキ田付け「尤明図
第４図
￥Ｊ４図のＶ−Ｖ系泉断面図
第５図FIG. 1 is a diagram showing the state of laser soldering which shows the implementation of the present invention, FIG. The figure is an explanatory diagram of conventional laser soldering, and Figure 5 is a sectional view taken along the line V-V in Figure 4.
FIG. 6 is a block diagram of a conventional flexible circuit board, and FIG. 7 is a perspective view of another embodiment of the presser glass. DESCRIPTION OF SYMBOLS 1... Ceramic circuit board, 2... Flexible circuit board, 3... Connection terminal part, 4... Presser glass, 5
...Laser beam, 6...Glass presser. Patent Applicant: Oki Electric Industry Co., Ltd. Agent: Patent Attorney: Shimizu 9. Invention 1; Rental leather base attached 1 Yumeizu 1 Figure a>ll-1! Mflfr surface view Figure 2 (b) W (b) -1;-1(,!
2) (b) Saiko with a force of 7 cannons, 4 rices, whistle 7 figures, traditional Shiichisuki tagsuke, ``Yumeizu figure 4 ¥ J4 figure V-V system Izumi cross section Figure 5
Claims (3)
板とセラミック回路基板とのレーザ半田付け方法におい
て、前記フレキシブル回路基板の接続端子の露出部分を
広くし、該フレキシブル回路基板の接続端子部を押えガ
ラスで直接加圧固定することを特徴とするレーザ半田付
け方法。(1) In a method of laser soldering between a flexible circuit board having fine pitch connection terminals and a ceramic circuit board, the exposed portion of the connection terminal of the flexible circuit board is widened, and the connection terminal part of the flexible circuit board is held down with glass. A laser soldering method characterized by direct pressure fixation.
つムラなく加圧固定できる少面積の当接面を有する押え
ガラスを使用したことを特徴とする特許請求の範囲第１
項記載のレーザ半田付け方法。(2) A presser glass having a small contact surface that can directly and evenly pressurize and fix the connection terminal portion of the flexible circuit board is used.
Laser soldering method described in section.
田がぬれた半田接合部を形成することを特徴とする特許
請求の範囲第１項記載のレーザ半田付け方法。(3) The laser soldering method according to claim 1, wherein a solder joint portion with wet solder is formed even when the solder plating thickness of the connection terminal is thin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5272486A JPS62211886A (en) | 1986-03-12 | 1986-03-12 | Laser soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5272486A JPS62211886A (en) | 1986-03-12 | 1986-03-12 | Laser soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62211886A true JPS62211886A (en) | 1987-09-17 |
Family
ID=12922867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5272486A Pending JPS62211886A (en) | 1986-03-12 | 1986-03-12 | Laser soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62211886A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03127476A (en) * | 1989-10-06 | 1991-05-30 | Tokai Rika Co Ltd | Connecting method of flat cable and connector |
| JP2008288150A (en) * | 2007-05-21 | 2008-11-27 | Toyota Industries Corp | Soldering method, soldering device, and manufacturing method of semiconductor device |
-
1986
- 1986-03-12 JP JP5272486A patent/JPS62211886A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03127476A (en) * | 1989-10-06 | 1991-05-30 | Tokai Rika Co Ltd | Connecting method of flat cable and connector |
| JP2008288150A (en) * | 2007-05-21 | 2008-11-27 | Toyota Industries Corp | Soldering method, soldering device, and manufacturing method of semiconductor device |
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