JPS60236291A - Printed circuit board structure - Google Patents
Printed circuit board structureInfo
- Publication number
- JPS60236291A JPS60236291A JP9487384A JP9487384A JPS60236291A JP S60236291 A JPS60236291 A JP S60236291A JP 9487384 A JP9487384 A JP 9487384A JP 9487384 A JP9487384 A JP 9487384A JP S60236291 A JPS60236291 A JP S60236291A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- connection pattern
- board structure
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、リジッド印刷配線板とフレキシブル印刷配
線板とを接続してなる印刷配線板構造に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a printed wiring board structure formed by connecting a rigid printed wiring board and a flexible printed wiring board.
第１図は、従来のこの種の２枚の印刷配線板の接合方法
を示す平面図、第一２図はその側面断面図であり、図に
おいて、１はフレキシブル印刷配線板、Ｉａ、ｌｂ及び
１ｃはフレキシブル印刷配線板１に加工された銅箔によ
る接続パターン、レジスト、及び予備はんだ、２はリジ
ッド印刷配線板、２ａ、２ｂ及び２Ｃはリジッド印刷配
線板２に加工された銅箔による接続パターン、レジスト
及び予備はんだ、３はヒーターブロックユニットである
。Fig. 1 is a plan view showing a conventional method of joining two printed wiring boards of this type, and Fig. 12 is a side sectional view thereof. 1c is a connection pattern made of copper foil processed on the flexible printed wiring board 1, resist, and preliminary solder; 2 is a rigid printed wiring board; 2a, 2b, and 2C are connection patterns made of copper foil processed on the rigid printed wiring board 2. , resist and preliminary solder, and 3 is a heater block unit.
フレキシブル印刷配線板ｌとリジッド印刷配線板２とを
接合するには、フレキシブル印刷配線板１の上面からヒ
ーターブロックユニット３によりフレキシブル印刷配線
板ｌの接続パターン１ａに付着させた予備はんだＩＣと
、リジッド印刷配線板２の接続パターン２ａに付着させ
た予備はんだ２ｃとを、両印刷配線板１．２の接続パタ
ーン１ａ、２ａを位置決めしてから、加圧熱溶融して両
印刷配線板１，２を熱圧着により接合する。In order to join the flexible printed wiring board 1 and the rigid printed wiring board 2, a preliminary solder IC is attached to the connection pattern 1a of the flexible printed wiring board 1 from the top surface of the flexible printed wiring board 1 by the heater block unit 3, and the rigid After positioning the connection patterns 1a and 2a of both printed wiring boards 1.2, the preliminary solder 2c attached to the connection pattern 2a of the printed wiring board 2 is melted under pressure to form both the printed wiring boards 1, 2. are joined by thermocompression bonding.
従来のフレキシブル印刷配線板１とリジッド印刷配線板
２との接続は、以上のように熱圧着により行なっている
ので、接続パターンのピッチ間隔の狭いファインパター
ン、特にピッチ１／２インチ以下のファインパターンで
は、０．４ｍｍ以下とパターン巾が細くなり、接合強度
が低くならざるを得なかった。またその上、熱圧着は加
圧力、加熱時間、加熱温度、ヒーターブロックの平行度
、ヒータ清掃など品質管理にかかわる要因が多く、接続
信頼性に問題があった。さらに、接合強度を高くするた
め、予備はんだ量を増すと、隣接パターンとブリッジし
易い。更に、接続パターン部が広い面積を占有し、配線
板、ひいては機器が小型化できないなどの欠点があった
。Since the conventional flexible printed wiring board 1 and rigid printed wiring board 2 are connected by thermocompression bonding as described above, fine patterns with a narrow pitch of the connection pattern, particularly fine patterns with a pitch of 1/2 inch or less, are used. In this case, the pattern width was reduced to 0.4 mm or less, and the bonding strength was inevitably reduced. Moreover, thermocompression bonding involves many factors related to quality control, such as pressure, heating time, heating temperature, parallelism of the heater block, and cleaning of the heater, resulting in problems with connection reliability. Furthermore, if the amount of preliminary solder is increased in order to increase the bonding strength, bridging with adjacent patterns is likely to occur. Furthermore, the connection pattern section occupies a large area, making it impossible to downsize the wiring board and, by extension, the device.
この発明は、上記のような従来のものの欠点を除去する
ためになされたもので、フレキシブル印刷配線板とりジ
ッド印刷配線板のいずれか一方の接続パターン部にスル
ーホールを設け、該スルーホールに導電接合剤を埋め込
んで再配線板を接続することにより、接合強度を高くす
ることができる印刷配線板構造を提供することを目的と
している。This invention was made in order to eliminate the drawbacks of the conventional ones as described above. A through hole is provided in the connection pattern portion of either a flexible printed wiring board or a rigid printed wiring board, and the through hole is provided with a conductive wire. It is an object of the present invention to provide a printed wiring board structure that can increase bonding strength by embedding a bonding agent and connecting rewiring boards.
以下、この発明の実施例を図について説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第３図は本発明の一実施例による印刷配線板構造の平面
図、第４図はその側面断面図を示す０図において、４は
接続バクーン４ａ、レジスト４ｂを有するフレキシブル
印刷配線板、７は接続パターン７ａ、レジスト７ｂを有
するリジッド印刷配線板、５はフレキシブル印刷配線板
４の接続パターン４ａの部分に設けられたスルーホール
、６はスルーホール５の中に充てんされた導電接合剤で
ある。FIG. 3 is a plan view of a printed wiring board structure according to an embodiment of the present invention, and FIG. 4 is a side sectional view thereof. In FIG. A rigid printed wiring board has a connection pattern 7a and a resist 7b, 5 is a through hole provided in a portion of the connection pattern 4a of the flexible printed wiring board 4, and 6 is a conductive bonding agent filled in the through hole 5.
フレキシブル印刷配線板４とリジッド印刷配線板７とを
接合するには、フレキシブル印刷配線板４とリジッド印
刷配線板７の再接続パターン４ａ及び７ａを位置決めし
てから、フレキシブル印刷配線板４の接続パターン４ａ
に設けたスルーホール５の中へ、例えばソルダーペース
トのような導電接合剤６を、図示しないディスペンサな
どの機器により、又は手作業で充てんした後、導電接合
剤６の硬化又は溶融接合のための加熱処理を行えばよく
、これにより十分な接合強度を得ることができる。In order to join the flexible printed wiring board 4 and the rigid printed wiring board 7, after positioning the reconnection patterns 4a and 7a of the flexible printed wiring board 4 and the rigid printed wiring board 7, the connection pattern of the flexible printed wiring board 4 is 4a
After filling a conductive bonding agent 6 such as solder paste into the through hole 5 provided in the through hole 5 using a device such as a dispenser (not shown) or by hand, the conductive bonding agent 6 is cured or melted for bonding. Heat treatment may be performed, and sufficient bonding strength can be obtained by this.
例えば融点１８３℃の共晶はんだ組成のソルダーペース
トを用い、フレキシブル印刷配線板４０表面温度を２４
０℃として加熱処理した場合、その引きはがし強さはス
ルーホール直径１１ＩＩｌで接続パターン１本当り５１
６ ｇの接合強度が得られた。For example, using a solder paste with a eutectic solder composition with a melting point of 183°C, the surface temperature of the flexible printed wiring board 40 is set to 24°C.
When heat treated at 0°C, the peel strength is 51 per connection pattern with a through hole diameter of 11II.
A bond strength of 6 g was obtained.
このように本実施例の印刷配線板構造では、フ合強度を
高くでき、接続信頼性を向上できる。また、接続部の占
有面積を縮減でき、印刷配線板を小型化できる。更に接
合強度が高いので接続補助具などの補強部品も不要とな
る。In this way, with the printed wiring board structure of this embodiment, the bonding strength can be increased and the connection reliability can be improved. Furthermore, the area occupied by the connecting portion can be reduced, and the printed wiring board can be made smaller. Furthermore, since the joint strength is high, reinforcing parts such as connection aids are not required.
なお、上記実施例では、フレキシブル印刷配線板４の接
続パターン４ａをリジッド印刷配線板７側に配置したも
のを示したが、第５図の本発明の他の実施例のように、
フレキシブル印刷配線板４を反転し、該配線板４の接続
パターン４ａのない面とりジッド印刷配線板７の接続パ
ターン７ａ面とを密着して接合してもよい。In the above embodiment, the connection pattern 4a of the flexible printed wiring board 4 was arranged on the rigid printed wiring board 7 side, but as in another embodiment of the present invention shown in FIG.
The flexible printed wiring board 4 may be inverted, and the surface of the connection pattern 7a of the chamfered printed wiring board 7 without the connection pattern 4a of the wiring board 4 may be closely bonded.
また、接続パターンのピンチ間隔を更に小さくじたい場
合は、接続部の占有面積が多少広くなるが、第６図の本
発明の更に他の実施例のようにスルーホール５を千鳥状
に配置することにより、これを行なうことができる。In addition, if the pinch interval of the connection pattern is to be further reduced, the area occupied by the connection portion becomes somewhat larger, but the through holes 5 may be arranged in a staggered manner as in still another embodiment of the present invention shown in FIG. This can be done by:
以上のようにこの発明によれば、印刷配線板間の接続に
スルーホールを用いたので、接合強度を高くでき、接続
信頼性が向上できる。また接続パターン面積縮減により
、印刷配線板を小型化できる効果がある。As described above, according to the present invention, since through-holes are used for connection between printed wiring boards, bonding strength can be increased and connection reliability can be improved. Further, by reducing the area of the connection pattern, there is an effect that the printed wiring board can be made smaller.
第１図は従来の印刷配線板構造の平面図、第２図はその
断面側面図、第３ＦＩ！Ｊはこの発明の一実施例による
印刷配線板構造の平面図、第４図はその断面側面図、第
５図はこの発明の他の実施例の印刷配線板構造の断面側
面図、第６図はこの発明のさらに他の実施例の印刷配線
板構造の平面図である。
４・・・フレキシブル印刷配線板、４ａ・・・フレキシ
ブル印刷配線板の接続パターン、５・・・スルーホール
、６・・・導電接合剤、７・・・リジッド印刷配線板、
７ａ・・・リジッド印刷配線板の接続パターン。
なお図中同一符号は同−又は相当部分を示す。
代理人 大岩増雄
第１図
第３図
０
第４図
第５図
′第６図Fig. 1 is a plan view of a conventional printed wiring board structure, Fig. 2 is a cross-sectional side view thereof, and Fig. 3 FI! J is a plan view of a printed wiring board structure according to an embodiment of the present invention, FIG. 4 is a cross-sectional side view thereof, FIG. 5 is a cross-sectional side view of a printed wiring board structure according to another embodiment of the present invention, and FIG. FIG. 2 is a plan view of a printed wiring board structure according to still another embodiment of the present invention. 4... Flexible printed wiring board, 4a... Connection pattern of flexible printed wiring board, 5... Through hole, 6... Conductive bonding agent, 7... Rigid printed wiring board,
7a...Connection pattern of rigid printed wiring board. Note that the same reference numerals in the figures indicate the same or equivalent parts. Agent Masuo Oiwa Figure 1 Figure 3 Figure 0 Figure 4 Figure 5' Figure 6
Claims (1)
とからなる印刷配線板構造において、上記両印刷配線板
のいずれか一方の接続パターン部にスルーホールが設け
られ、該スルーホールに導電接合剤が埋込まれて上記両
印刷配線板が接続されていることを特徴とする印刷配線
板構造。fi+ In a printed wiring board structure consisting of a flexible printed wiring board and a rigid printed wiring board, a through hole is provided in the connection pattern portion of either one of the printed wiring boards, and a conductive bonding agent is embedded in the through hole. A printed wiring board structure characterized in that both of the printed wiring boards are connected to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9487384A JPS60236291A (en) | 1984-05-09 | 1984-05-09 | Printed circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9487384A JPS60236291A (en) | 1984-05-09 | 1984-05-09 | Printed circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60236291A true JPS60236291A (en) | 1985-11-25 |
Family
ID=14122165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9487384A Pending JPS60236291A (en) | 1984-05-09 | 1984-05-09 | Printed circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60236291A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014089797A (en) * | 2010-07-15 | 2014-05-15 | Dainippon Printing Co Ltd | Suspension substrate, suspension, suspension with head, hard disk drive, suspension substrate manufacturing method and suspension manufacturing method |
| CN107278027A (en) * | 2017-07-12 | 2017-10-20 | 武汉华星光电技术有限公司 | Circuit board and mobile terminal |
-
1984
- 1984-05-09 JP JP9487384A patent/JPS60236291A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014089797A (en) * | 2010-07-15 | 2014-05-15 | Dainippon Printing Co Ltd | Suspension substrate, suspension, suspension with head, hard disk drive, suspension substrate manufacturing method and suspension manufacturing method |
| CN107278027A (en) * | 2017-07-12 | 2017-10-20 | 武汉华星光电技术有限公司 | Circuit board and mobile terminal |
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