JPH0823192A - Electronic part mounter - Google Patents

Abstract

PURPOSE:To provide an electronic part mounter capable of improving the working ratio thereof and preventing a reduction in mounting quality due to uncleaness and blockage by a method wherein a nozzle is cleaned without stopping operations of the electronic part mounter in mounting electronic parts. CONSTITUTION:In an electronic part mounter, a cleaner is arranged in a nozzle change part and a detergent is suppled from a detergent supply tank 9 to a nozzle receiving part 8 while a nozzle is received in the nozzle change part, whereby a nozzle can also be cleaned by an ultrasonic oscillator 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components on an electronic circuit board.

[0002]

2. Description of the Related Art In recent years, types, shapes and dimensions of electronic parts have been diversified, and in the field of mounting electronic parts, electronic parts having different shapes and sizes are accurately mounted on an electronic circuit board to improve product quality. Is required to do. A conventional electronic component mounting apparatus will be described below with reference to FIG. FIG. 5 is an overall schematic diagram of a conventional electronic component mounting apparatus. In FIG. 5, 2 is an electronic circuit board, 1 is a carrying section for loading and unloading the electronic circuit board 2, 3 is a drive section (XY robot) for positioning the head section 5 at an arbitrary position, and 6 is for supplying electronic parts. The electronic component supply unit 5 is a head unit having a nozzle unit 4 that sucks an electronic component from the electronic component supply unit 6 and mounts it on the electronic circuit board 2.

Next, the operation of the electronic component mounting apparatus will be described. The drive unit 3 connects the head unit 5 to the electronic component supply unit 6
After the positioning, the nozzle portion 4 descends to adsorb the electronic component. Next, the drive unit 3 positions the head unit 5 on the mounting position of the electronic circuit board. During this movement, the recognition device images the suction posture of the electronic component, corrects the position, and mounts the electronic component on the electronic circuit board 2. By repeating the above operation, electronic components are sequentially mounted on the electronic circuit board 2.

[0004]

In mounting electronic components, when the electronic components are mounted, dust, solder, adhesive, etc. may adhere to the tip of the nozzle, or the nozzle opening may be clogged so that the suction rate and mounting of the nozzle This leads to a decline in the mounting quality of electronic components. Further, in order to remove the dirt and clogging of the nozzle, when cleaning the nozzle, it is necessary to suspend the operation of the electronic component mounting device to perform cleaning, which causes a problem of lowering the operating rate.

In view of the above problems, it is an object of the present invention to improve the deterioration of quality due to dirt and clogging of nozzles and to improve the deterioration of operating rate due to cleaning of nozzles.

[0006]

According to the present invention, an electronic component supplied from an electronic component supply unit is sucked by a nozzle provided in a head unit and mounted on an electronic circuit board at a predetermined position. In the electronic component mounting device, the nozzle cleaning device is installed in the nozzle change portion for replacing the nozzle according to the type of electronic component to be mounted.

[0007]

According to the electronic component mounting apparatus of the present invention, since the nozzle cleaning device is installed in the nozzle change portion, the nozzle cleaning device can be automatically and periodically operated while the nozzle is housed in the nozzle change portion. By cleaning the nozzle, it is possible to prevent the suction rate and mounting rate from decreasing due to dirt and clogging of the nozzle, and to stop the electronic component mounting device for nozzle cleaning as in the conventional method and individually clean the nozzle. Since the nozzle can be cleaned without using it, the operating rate can be greatly improved.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the electronic component mounting apparatus of the present invention will be described below with reference to FIGS. In addition,
The same components as those shown in FIG. 5 showing the conventional example are designated by the same reference numerals, and detailed description thereof will be omitted. FIG.
FIG. 1 is an overall schematic view of an electronic component mounting device of the present invention.
In FIG. 1, reference numeral 1 is a transport unit for loading and unloading an electronic circuit board 2, and 3 is a drive unit for positioning a head unit 5 having a nozzle unit 4 for sucking and mounting electronic components in an XY robot at an arbitrary position. is there. Reference numeral 6 is an electronic component supply unit for supplying electronic components, and 7 is a nozzle unit 4 depending on the components to be mounted.
Is a nozzle change unit for replacing the nozzle held by the.
FIG. 2 is a detailed view of the nozzle change unit. Reference numeral 8 is a nozzle housing portion in which the nozzle 4a is housed, 9 is a cleaning liquid supply tank for supplying the cleaning liquid to the nozzle housing portion, 10 is an ultrasonic oscillator for generating ultrasonic waves, and 11 is a cleaning liquid discharged from the nozzle housing portion 8. Cleaning liquid recovery tank, 12 is a sensor for controlling the amount of cleaning liquid supplied to the nozzle housing, 1
Reference numeral 3 is a claw for holding the nozzle.

Next, the operation of the above electronic component mounting apparatus will be described. The electronic circuit board 2 is carried into the mounting position by the carrier 1. The drive unit 3 positions the head unit 5 on the electronic component supply unit 6, and after positioning, the nozzle unit 4 in the head unit 5 descends to adsorb the electronic component. After picking up the electronic component, the nozzle portion 4 moves up and the head portion 5 is positioned by the driving portion 3 at the mounting position of the electronic circuit board. At the time of this movement, the suction posture of the electronic component sucked by the nozzle portion 4 is imaged by the recognition device to correct the position. After the position correction, the nozzle portion 4 descends to mount the electronic component on the electronic circuit board 2.

Next, the mounting of new electronic components is started. The storage unit 14 is input with part data such as the dimensions and shape of the mounted electronic components and the supply method, and the optimum data for the next mounted electronic components is based on this data. A proper nozzle is determined, and the nozzle 4a held by the nozzle portion 4 in the head portion 5 is next replaced with a nozzle for a mounted electronic component. Therefore, the head portion 5
Is moved from the mounting position by the drive unit 3 and positioned at the nozzle change unit 7. At the same time that the head portion 5 is positioned on the nozzle change portion, the nozzle change portion 7 is shown in FIG.
As shown in FIG. 3A, the pawl 13 is opened and raised, and the nozzle portion 4 is lowered toward the empty nozzle housing portion 8 of the nozzle change portion 7 and held by the nozzle portion 4 as shown in FIG. 3B. The nozzle 4 a that has been opened is stored in the nozzle storage portion 8. When the nozzle 4a is housed in the housing part 8 of the nozzle change part 7, FIG.
As shown in (C), the claw 13 of the nozzle change portion 7 is closed and holds the nozzle. On the other hand, the nozzle part 4 rises and the nozzle 4
a is separated from the nozzle portion 4. Storage part after nozzle detachment 1
The head unit 5 is moved and positioned by the driving unit 3 on the nozzle 4a which is optimum for the electronic component to be mounted next based on the data input to the unit 4. As shown in FIG. 3D, at the same time as the positioning, the nozzle change portion 7 opens the claw 13, the nozzle portion 4 descends, and the nozzle 4 a of the nozzle change portion is attached to the nozzle portion 4. New nozzle 4
After the mounting of a, as shown in FIG. 3 (E), the nozzle portion 4 rises, the nozzle change portion 7 closes the claws 13 and descends, and the nozzle replacement is completed. By repeating the above operation, the electronic components are adsorbed by the optimum nozzles determined by the data such as the shape and the dimensions, and are sequentially mounted on the electronic circuit board 2.

The nozzle changing section 7 has a cleaning liquid supply tank 9 for cleaning the nozzle and an ultrasonic oscillator 10. The nozzle changing section 7 is changed every fixed number of times based on the number of times electronic parts are mounted or the number of times the nozzle is replaced. The cleaning liquid is supplied from the cleaning liquid supply tank 9 to the nozzles waiting in the nozzle housing portion 7 of No. 7, and all the nozzles are cleaned by the ultrasonic oscillator 10. After cleaning, the cleaning liquid is collected in the cleaning liquid recovery tank. At this time, the amount of the cleaning liquid supplied to the nozzle housing portion 8 is controlled by the sensor 12.

Next, the nozzle cleaning process will be described with reference to the flowchart of FIG. In step 1 of FIG.
When the specified number of times of mounting or the number of nozzle changes is reached, the nozzle cleaning operation is started and the process proceeds to step 2. In step 2, the cleaning liquid is supplied from the cleaning liquid supply tank 9 to the nozzle housing portion 8.
And then proceed to step 3. In step 3, the sensor 12 detects the amount of cleaning liquid in the nozzle housing portion, and when it reaches the specified amount, the process proceeds to step 4. In step 4, ultrasonic cleaning of the nozzle is performed, and after cleaning for a fixed time, the process proceeds to step 5. In step 5, the ultrasonic cleaning is completed and the process proceeds to step 6. In step 6, the cleaning liquid in the nozzle housing portion 8 is discharged to the cleaning liquid recovery tank, and the process proceeds to step 7. In step 7, the sensor 12 detects the amount of cleaning liquid in the nozzle housing portion 8, and if the cleaning liquid has been discharged, the nozzle cleaning operation is ended.

By cleaning the nozzle in this way, it is possible to prevent deterioration in quality due to a decrease in adsorption rate / mounting rate due to dirt / clogging of the nozzle, and without stopping the operation of the electronic component mounting apparatus. The nozzle can be washed and the operating rate can be improved. In the above-described embodiment, only the cleaning device is provided in the nozzle change section, but a drying device may be installed. Further, in the above-described embodiment, the cleaning liquid and the ultrasonic oscillator are used as the cleaning device, but chemicals may be used to decompose and clean the nozzles from dirt and clogging, or the heating means may be used for cleaning.

[0014]

According to the electronic component mounting apparatus of the present invention,
By installing a cleaning device in the nozzle change part, the nozzles waiting in the nozzle change part are cleaned, so the nozzles can be cleaned without stopping the operation of the electronic component mounting device. The rate can be significantly improved, and the deterioration of the mounting quality due to the reduction of the suction rate and the mounting rate due to the dirt and clogging of the nozzle can be improved.

[Brief description of drawings]

FIG. 1 is an overall schematic diagram of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a detailed view of a main part of a nozzle change portion according to the embodiment of the present invention.

3 (A), (B), (C), (D), and (E) are explanatory diagrams of a nozzle replacement operation of the electronic component mounting apparatus according to the exemplary embodiment of the present invention.

FIG. 4 is a flow chart of the operation of a cleaning process according to an embodiment of the present invention.

FIG. 5 is an overall schematic diagram of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transport part 2 Electronic circuit board 3 Drive part (XY robot) 4 Nozzle part 4a Nozzle 5 Head part 6 Electronic component supply part 7 Nozzle change part 8 Nozzle storage part 9 Cleaning liquid supply tank 10 Ultrasonic oscillator 11 Cleaning liquid recovery tank 12 Sensor 13 Nail 14 memory

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Osamu Okuda 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. A transport unit for loading and unloading an electronic circuit board, an electronic component supply unit for supplying electronic components, a storage unit for storing data such as the type of electronic components, and an electronic component for mounting the electronic components on the electronic circuit substrate. In an electronic component mounting apparatus having a head unit having a nozzle and a drive unit for positioning the head unit at an arbitrary position, the nozzle is replaced with a nozzle most suitable for mounting based on electronic component data stored in advance in a storage unit. An electronic component mounting device characterized in that a cleaning device is provided in the nozzle change part and the nozzle change part. 2. The nozzle changing section is provided with a cleaning device including a nozzle housing section and a cleaning liquid supply tank, and the nozzle is cleaned while the nozzle is housed in the nozzle housing section. Electronic component mounting device. 3. The nozzle replacement is performed in association with an up-and-down operation of a head section having a nozzle and a nozzle change section and an opening and closing operation of a claw provided in a nozzle housing section of the nozzle change section. 1. The electronic component mounting device according to 1.