JPH08186366A - Connecting device - Google Patents

Abstract

PURPOSE: To enable a lead soldering operation to be carried out in a short time and enhanced in workability by a method wherein a flexible printed wiring board is so disposed as to make its surface where lands are provided positioned in parallel with leads and a direction in which the leads are arranged, and the leads are soldered to the corresponding lands respectively. CONSTITUTION: A flexible printed wiring board 3 is so disposed as to make its surface where lands 4 are provided positioned in parallel with leads 2 and a direction in which the leads 2 are arranged, and the leads 2 of a part 1 are brought into contact with solder or close to solder. Then, a heater chip 6 are is made to descend and pressed against the leads 2. The leads 2 are heated by the heater chip 6, solder is fused and attached to the leads 2, and the leads 2 are soldered to the corresponding lands 4 respectively. At this point, the heater chip 6 is larger than the row of the leads 2 in width, so that all the leads 2 are soldered collectively, and a soldering operation is improved in workability.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a device for connecting a component having a large number of leads to a printed circuit board.

[0002]

2. Description of the Related Art For example, a laser unit used in an optical pickup for an optical information recording / reproducing apparatus incorporates many parts such as a semiconductor laser as a light source and a light receiving element. Therefore, as shown in FIG. 6, the laser unit 51 has a large number of cylindrical leads 52 ...
These leads 52 ... Are arranged in two rows.

On the other hand, the flexible printed circuit board 53 connected to the laser unit 51 is formed with a slit 54 through which the two lead rows of the laser unit 51 are inserted, and the leads 52 ... Are formed along one side of each slit 54. The corresponding land 55 is formed. Then, the laser unit 5 is inserted into the slit 54 of the flexible printed circuit board 53.
Each lead 52 with one lead 52 inserted ...
And the corresponding lands 55 ... Are fixed by soldering and electrically connected.

[0004]

By the way, in the above structure, the printed circuit board is arranged so that its plate surface is orthogonal to the leads of the laser unit. It is necessary to perform soldering individually, and the time required for soldering becomes longer as the number of leads increases, which is a major factor in lowering workability and increasing cost.

However, the present invention provides a connection device which is advantageous in terms of cost because soldering of leads is performed in a short time regardless of the number of leads and the workability thereof is improved.

[0006]

SUMMARY OF THE INVENTION The present invention has been made for the purpose of solving the above-mentioned problems, and a connecting device according to a first aspect of the present invention corresponds to a component in which a plurality of leads are linearly arranged and each of the leads. Then, the printed circuit board is soldered on the land, and the plate surface having the land is arranged parallel to the leads and the arrangement direction thereof. The leads are soldered to the corresponding lands by heating and melting the solder.

Further, in the connecting device according to the second aspect of the present invention, a lead row composed of a plurality of linearly arranged leads is provided in two rows in parallel with each other, and a land is formed corresponding to each lead. In the case where the flexible printed circuit board is connected to the flexible printed circuit board by soldering, the lands corresponding to all the leads of the component are formed on the same plate surface side, and solder is placed on each of the lands. The plate surface having the lands is arranged in parallel with each of the lead rows by arranging them in a curved manner between the two lead rows of the component, and each lead is soldered to the corresponding land by heating and melting the solder. The configuration is

Further, in the connecting device according to a third aspect, in addition to the structure of the connecting device according to the first or second aspect, a plurality of leads linearly arranged on the heater chip are simultaneously soldered. .

Further, in the connecting device according to a fourth aspect, in addition to the configuration of the connecting device according to the first or the second aspect, the printed circuit board divides a land corresponding to each lead into two, and separates the land on each divided land. Solder is laid on the lead, and leads are arranged between the divided lands for soldering.

[0010]

According to the connection device of the first aspect of the present invention, for example, a plurality of leads arranged in a straight line are heated and pressed at the same time to melt the solder placed on each land, thereby making the plurality of leads respectively. It can be soldered to the corresponding land.

Further, according to the connecting device of the second aspect, it is possible to solder a plurality of linearly arranged leads at the same time as in the first aspect, and at the same time, the flexible printed board is arranged in two rows. Can be accommodated between the lead rows, and the inconvenience that an unnecessarily large component arrangement space is required by the flexible printed circuit board is eliminated.

Further, according to the connecting device of the third aspect, the equipment for soldering can be dealt with by providing a single heater chip, and the equipment can be simplified.

Further, according to the connecting device of the fourth aspect,
When the leads are soldered, the leads will not be displaced to the left and right, and will be reliably soldered at the proper position.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention shown in FIGS. 1 to 5 will be described in detail below. 1 and 2 show a connecting device according to an embodiment of the present invention. The connecting device of this embodiment connects a component in which a plurality of leads are linearly arranged in a line and a flexible printed board. Is to do.

In FIGS. 1 and 2, reference numeral 1 denotes a component obtained by linearly arranging a plurality of (for example, four) cylindrical leads 2 in a line, and 3 denotes one plate surface corresponding to each lead 2 described above. Is a flexible printed circuit board on which land 4 is formed,
The plate surface having the lands 4 is arranged in the arrangement direction of the leads 2, and the cream solder 5 is applied to each of the lands 4 in advance to solidify the lands 4 and to arrange the lands 4.

Thus, in this embodiment, the flexible printed circuit board 3 is arranged such that the plate surface having the land 4 is parallel to the leads 2 and the arrangement direction thereof, and each lead 4 of the component 1 is cream soldered. Place in contact with or close to 5. After that, when the heater chip 6 is lowered from above and pressed against the leads 2, each lead 2 is heated by the heater chip 6, and this heat causes the cream solder 5 to melt and adhere to the leads 2. Since the cream solder 5 is solidified by the temperature decrease, the leads 2 and the corresponding lands 4 are soldered.

At this time, by using as the heater chip 6 a heater chip having a width larger than the width of a lead row formed by linearly arranging a plurality of leads 2, all of the leads 2 linearly arranged. Soldering is done all at once,
The workability is remarkably improved.

FIGS. 3 and 4 show a connection device according to another embodiment of the present invention, which is a further improvement of the embodiment shown in FIGS. 1 and 2. In the connection device of the embodiment shown in FIGS. 1 and 2, when the cream solder 5 is applied on the land 4 and solidified, the surface tension raises the mountain-like shape, and therefore the lead 2 is heated and pressed against the cream solder 5. 2 when the arrow a. As shown in b, there is a risk of displacement to the left and right, and especially when the pitch of the leads 2 is small, adjacent leads come into contact with each other.

However, in this embodiment, the land 4 corresponding to each lead 2 is divided into two, and the divided lands 4a. 4b
Put cream solder 5 on the top of these two divided lands 4a.
The lead 2 is arranged between 4b. Therefore, the heater chip 6
Even when the lead 2 is pressed against the lead 2, the lead 2 is divided into the divided lands 4a. The positional deviation between the left and right is restricted by 4b, and the soldering is surely performed at the proper position, so that the inconvenience caused by the positional deviation of the lead 2 as in the previous embodiment is not caused. In FIG. 4, reference numeral 12 denotes an insulating protective film of the flexible printed board 3.

FIG. 5 shows a connecting device according to another embodiment of the present invention, and in this embodiment, it particularly relates to connection of components having two lead rows.
Reference numeral 7 denotes a laser unit (component) used in an optical pickup for an optical information recording / reproducing apparatus, which has a semiconductor laser, a light receiving element and the like built therein, and has a large number of cylindrical leads 8 arranged in two rows. ing. In each lead row, a plurality of leads 8 are linearly arranged and provided in parallel with each other. Reference numeral 9 is a flexible printed circuit board for electrically connecting the optical pickup and the control board on the apparatus main body side, and lands 10 are formed on one plate surface corresponding to all the leads 8 of the laser unit 7. In addition, each land 10
Cream solder is previously applied and solidified on the top.

Thus, the flexible printed board 9
Is to be bent at the portion indicated by the reference numeral 9a and arranged between two lead rows. The plate surface having the lands 10 is arranged in parallel to each lead row, and each lead 8 corresponds to the land 10. Let In this state, the heater chip 11
Is abutted against a plurality of leads 8 arranged linearly and pushed down, the plurality of leads 8 respectively correspond to the flexible printed circuit board 9 as in the embodiment shown in FIGS.
To be soldered to the land 10.

In the embodiment shown in FIG. 5, a plurality of leads 8 can be soldered simultaneously as in the previous embodiment, and the working time can be shortened to improve the workability. Since the flexible printed circuit board 9 is housed between the lead rows arranged in the two rows of the laser unit 7, the flexible printed circuit board 9 does not stick out not only on the outer periphery of the laser unit 7 but also on the outer side of the leads, and thus the optical pickup As described above, it is possible to provide a very suitable connection device that is required to be small and thin.

In the embodiment shown in FIG. 5, the two-divided land structure shown in the embodiments shown in FIGS. 3 and 4 can be adopted, and by adopting the same, the positional deviation of the lead 8 can be eliminated. Of course. Further, in the embodiment of FIGS. 1 to 4, a hard printed circuit board may be used instead of the flexible printed circuit board.

[0024]

As described above, according to the first aspect of the present invention, a plurality of linearly arranged leads can be simultaneously soldered to the corresponding lands, and the work time required for the soldering can be greatly reduced. It is possible to provide a connection device that can be shortened for a long time, is not affected by the number of leads, has high workability, and is advantageous in terms of cost.

According to the second aspect of the invention, it is possible to simultaneously solder a plurality of linearly arranged leads as in the first aspect, and the flexible printed circuit board is arranged in two rows. It can be accommodated between the lead rows, the inconvenience that the flexible printed circuit board requires an unnecessarily large space for arranging components, and the size and thickness of the device that implements the connection device can be reduced.

According to the third aspect of the invention, the equipment for soldering can be dealt with by providing a single heater chip, which can contribute to simplification of the equipment.

Further, according to the invention of claim 4, when the leads are soldered, the leads can be surely soldered at proper positions without being displaced laterally, and the leads can be displaced with each other due to the displacement. It is possible to eliminate the risk of contact.

[Brief description of drawings]

FIG. 1 is a perspective view showing a connection device according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a configuration of the connection device.

FIG. 3 is an explanatory diagram of a main part configuration of a connection device according to another embodiment of the present invention.

FIG. 4 is a plan view of a printed circuit board used for the connection device.

FIG. 5 is an explanatory diagram of a main part configuration of a connection device according to another embodiment of the present invention.

FIG. 6 is an explanatory diagram of a configuration of a conventional connecting device.

[Explanation of symbols]

 1 component 2 lead 3 flexible printed circuit board 4 land 4a. 4b Divided land 5 Cream solder 6 Heater chip 7 Laser unit 8 Lead 9 Flexible printed circuit board 10 Land 11 Cream solder

Claims (4)

[Claims] 1. A component in which a plurality of leads are linearly arranged and a printed board on which a land is formed corresponding to each lead are connected by soldering, wherein the printed board has solder on the land. A connection device characterized in that a plate surface having the lands is arranged parallel to the leads and the arrangement direction thereof, and the leads are soldered to the corresponding lands by heating and melting the solder. 2. A component in which lead rows, each of which is composed of a plurality of linearly arranged leads, are provided in parallel with each other in two rows, and a flexible printed board for forming a land corresponding to each lead is connected by soldering. In the flexible printed circuit board, lands corresponding to all the leads of the component are formed on the same plate surface side, solder is placed on each of the lands, and between the two lead rows of the component. A connecting device characterized in that a plate surface having the lands is arranged in parallel with each of the lead rows by arranging in a curved manner, and each lead is soldered to a corresponding land by heating and melting the solder. 3. The connection device according to claim 1, wherein a plurality of leads linearly arranged by a single heater chip are soldered at the same time. 4. The printed circuit board is characterized in that a land corresponding to each of the leads is divided into two, solder is placed on each of the divided lands, and the leads are arranged between the divided lands for soldering. The connection device according to claim 1 or 2.