JPH09190686A - Magnetic head assembly, production of magnetic disk and magnetic disk device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate the assembly to a magnetic disk device and to improve the workability for assembling by assembling intermediate flexible substrates to the lead wires led out of a magnetic head. SOLUTION: This magnetic head device is constituted by positioning the through-holes 15 of the intermediate flexible substrates 11 of a magnetic head assembly consisting of the magnetic head 2, the lead wires 3 and the intermediate flexible substrates 11 and the solder pads 17 of base flexible substrates 6. The solder is melted by, for example, a pulse heat tool 18, thereby, these lead wires and solder pads are soldered and the magnetic head 2 and signal processing circuits 5 are electrically connected. Then, the laborious work for positioning the lead wires 3 by one piece each to the solder pads and soldering the wires and the pads by a soldering iron like heretofore is eliminated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head assembly used in a personal computer equipped with a hard disk drive, a magnetic disk manufacturing method, and a magnetic disk device.

[0002]

2. Description of the Related Art The storage capacity of magnetic disk devices used in personal computers and the like is increasing year by year. The number of storage media (media) and magnetic heads incorporated in the disk device is also increasing in proportion to the increase in storage capacity.

A magnetic head is mounted on the tip of a carriage incorporated in the magnetic disk device, and a lead wire is used to electrically connect the magnetic head and a signal processing circuit for processing signals of the magnetic head. It is connected.

The lead wire is usually a coated lead wire having a diameter of 25 to 35 μm. To connect the magnetic head and the lead wire, the polyurethane coating film at the tip of the lead wire is removed by an excimer laser or the like. The gold-plated lead wire of the core is ultrasonically pressure-bonded to the gold electrode pad on the magnetic head by an ultrasonic tool or the like. The other end of the lead wire is preliminarily solder-plated, or the coated lead wire is soldered as it is to the base flexible substrate led out from the signal processing circuit.

FIG. 5 shows a conventional magnetic disk device, and FIG. 6 shows how the lead wire and the base flexible substrate are soldered. In the figure, reference numeral 1 denotes a plurality of carriages as head arms incorporated in a magnetic disk device, and a magnetic head 2 is mounted on the tip of these carriages 1.

A plurality of lead wires 3 are connected to the electrode pads of each magnetic head 2. The lead wires 3 are covered with polyurethane, and a plurality of cover wires 4 are further covered. Then, the covering tube 4 is laid along the end surface of each carriage 1, and the base flexible substrate 6 to be described later by caulking several points in the middle.
Have been derived.

On the other hand, 5 is a signal processing circuit, and a base flexible substrate 6 is led to this signal processing circuit 5. The base flexible substrate 6 has a wiring 7 formed by printing a conductive layer on a polyimide resin substrate, and the base flexible substrate 6 is fixed to the base end of the carriage 1 by a fixing screw 8.

Further, a plurality of solder pads 9 corresponding to the number of the lead wires 3 are provided on the wiring 7 of the base flexible substrate 6. Then, in order to connect the plurality of lead wires 3 to the solder pads 9 of the base flexible substrate 6, the operator positions the lead wires 3 one by one on the solder pads 9 by using tweezers or the like, and then the soldering iron. 10
The lead wires 3 are soldered to the solder pads 9 one by one using.

[0009]

However, as described above, when assembling the magnetic disk device, a plurality of lead wires 3 are provided one by one on the fine electrode pads of the magnetic head 2 mounted on the tip of the carriage 1. The work of soldering and the work of positioning and soldering the plurality of lead wires 3 one by one to the fine solder pads 9 of the base flexible substrate 6 are difficult works and take a long time. When the lead wires 3 are soldered to the solder pads 9 one by one using the soldering iron 10, if the lead wires 3 are broken, it is necessary to remove them from the carriage 1 together with the magnetic head 2 and reassemble them.

The present invention has been made in view of the above circumstances. A first object of the present invention is to easily assemble a magnetic disk device by assembling an intermediate flexible substrate to a lead wire led from a magnetic head. It is to provide a magnetic head assembly that can be assembled and improved in assembling workability and can prevent defective connection.

A second object is to provide a method of manufacturing a magnetic disk device in which a lead wire derived from a magnetic head and a base flexible substrate derived from a signal processing circuit can be easily electrically connected. It is in.

A third object of the present invention is to provide a magnetic disk device which can easily electrically connect a lead wire derived from a magnetic head and a base flexible substrate derived from a signal processing circuit.

[0013]

In order to achieve the above-mentioned object, the present invention derives from a magnetic head installed at the tip of a carriage and a signal processing circuit for processing signals of the magnetic head. A magnetic head assembly for electrically connecting the base flexible substrate,
An intermediate flexible substrate having a lead wire led out from the magnetic head, a first terminal portion connected to the lead wire, and a second terminal portion connected to the base flexible substrate. To do.

Since the lead wire led out from the magnetic head and the intermediate flexible board are assembled, the troublesome work of soldering the lead wires one by one to connect the intermediate flexible board to the base flexible board is unnecessary. .

According to a second aspect of the present invention, in the intermediate flexible substrate, a conductive layer is printed and printed on a polyimide resin substrate. According to a third aspect of the present invention, the second terminal portion is an electrode provided on the intermediate flexible substrate, and is connected to the base flexible substrate by soldering.

A fourth aspect of the present invention is derived from a carriage, a magnetic head installed at a tip of the carriage, a lead wire derived from the magnetic head, and a signal processing circuit for processing a signal of the magnetic head. In a method of manufacturing a magnetic disk device including a base flexible substrate,
After electrically connecting the lead wire to the first terminal portion of the intermediate flexible substrate,
Is electrically connected to the base flexible substrate.

A fifth aspect of the present invention is characterized in that the lead wire and the first terminal portion are connected by soldering. Claim 6
Is characterized in that the connection between the second terminal portion and the base flexible substrate is soldering with a pulse heating tool.

A seventh aspect of the invention is derived from a carriage, a magnetic head installed at a tip of the carriage, a lead wire derived from the magnetic head, and a signal processing circuit for processing a signal of the magnetic head. A magnetic disk device comprising a base flexible substrate is characterized in that an intermediate flexible substrate is provided between the lead wire and the base flexible substrate to electrically connect the two. Therefore, the magnetic head can be electrically connected to the signal processing circuit only by connecting the intermediate flexible substrate to the base flexible substrate.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a carriage structure of a magnetic disk, and FIG. 2 shows a connection structure between an intermediate flexible substrate and a base flexible substrate.

As shown in FIGS. 1 and 2, a plurality of lead wires 3, one end of which is connected to the magnetic head 2, four lead wires 3 in this embodiment are covered with a covering tube 4, and the other lead wires 3 are covered. The end portion is electrically connected to the intermediate flexible substrate 11.

The intermediate flexible substrate 11 is provided with a wiring 13 in which a conductive layer is printed on a polyimide resin substrate 12 of the same material as the base flexible substrate 6, and solder resists 12a are applied on both sides of the polyimide flexible substrate 12 to form a polyimide resin substrate 12. The warpage is reduced as much as possible. Further, the wiring 13 is formed corresponding to the number of the lead wires 3.

Further, a solder pad 14 as a first terminal portion is provided at one end of the wiring 13, and a plurality of through holes 15 of about 0.2 mmφ as a second terminal portion are provided at the other end. Is provided.

The lead wires 3 led out from the magnetic head 2 are electrically and mechanically connected to the solder pads 14 of the intermediate flexible substrate 11 one by one by soldering. A magnetic head assembly 16 composed of 3 and the intermediate flexible substrate 11 is configured.

In addition, the wiring 7 of the base flexible substrate 6 has through holes 15 of the intermediate flexible substrate 11.
A plurality of solder pads 17 are provided corresponding to. Then, with the intermediate flexible substrate 11 superposed on the base flexible substrate 6, the intermediate flexible substrate 1
The through hole 15 of No. 1 and the solder pad 17 of the base flexible substrate 6 are soldered by, for example, a pulse heat tool 18 and electrically connected.

In this way, the magnetic head assembly 16 including the magnetic head 2, the lead wires 3 and the intermediate flexible substrate 11 has the through holes 15 in the intermediate flexible substrate 11 and the solder pads 17 in the base flexible substrate 6.
Can be positioned and soldered by melting the solder by, for example, the pulse heat tool 18, so that the magnetic head 2 and the signal processing circuit 5 can be electrically connected.

Therefore, as in the conventional case, the lead wire 3 is 1
The troublesome work of positioning the solder pads one by one on the solder pad and soldering with the soldering iron becomes unnecessary. Further, since the intermediate flexible substrate 11 is made of the same material as the base flexible substrate 6 (for example, polyimide resin), stress applied to the substrate due to thermal expansion and thermal contraction can be minimized, and the soldered portion or anisotropic conductive material can be used. The reliability of the film connection can be improved.

Next, referring to FIG. 3, a method of manufacturing the intermediate flexible substrate 11 and the intermediate flexible substrate 11 will be described.
A method of connecting the lead wire 3 to the wire will be described. FIG. 3 (a)
As shown in FIG. 3, the abacus ball-shaped lead wire holding portion 21 is provided on one side edge of the pallet 20, while the lead wires 3 inserted into the covering tube 4 are separated from each other in parallel on the upper surface of the pallet 20. The intermediate flexible substrate 11 is also arranged. As shown in FIG. 3B, the intermediate flexible substrate 11 is provided with a plurality of solder pads 14 as first terminal portions, a plurality of through holes 15 as second terminal portions, and a plurality of test pads 23. ing.

A plurality of long lead wires 3 led out from the coating tube 4 are passed over the intermediate flexible substrate 11 and extended toward the lead wire holding portion 21, and the middle portion of each lead wire 3 is soldered. The end portion of the lead wire 3 is held by the lead wire holding portion 21 with the pad 14 positioned. After positioning all the lead wires 3 on the solder pads 14 in this way, a pulse heat tool (not shown) is opposed along the row of the solder pads 14 to melt the solder pads 14 by the pulse heat tool, The middle part of 3 is soldered to the solder pad 14 by heating at 300 to 350 ° C. for about 1 second. A soldering iron may be used instead of the pulse heat tool.

After the middle portions of all the lead wires 3 are soldered to the solder pads 14, the extra lead wires 3 extending in the vicinity of the solder pads 14 are cut, and the connecting portions thereof are exposed to UV.
Overcoat with adhesive 24 to mechanically protect the connections.

In this state, the terminals of the tester (not shown) are connected to the test pads 23 of the intermediate flexible substrate 11, the test signal is input to the magnetic head 2 via the intermediate flexible substrate 11 and the lead wire 3, and each magnetic head is connected. The quality of 2 is judged.

After the test of the magnetic head 2 is completed, the intermediate flexible substrate 11 is cut along the cutting line 25 to separate the test pad 23 and the through hole 15 from each other.
As shown in FIG. 3C, the intermediate flexible substrate 11 can be formed in a small size.

As shown in FIG. 3D, the obtained product (component) is the above-mentioned magnetic head assembly 16, and the through holes 15 of the intermediate flexible substrate 11 of the magnetic head assembly 16 and the base flexible substrate 6 are formed. When the solder pad 17 is positioned and soldered by, for example, a pulse heat tool, the through hole 15 and the solder pad 17 of the base flexible substrate 6 are soldered, and the magnetic head 2 and the signal processing circuit 5 are soldered as shown in FIG. And are electrically connected.

Next, the function of the entire carriage structure is inspected to determine whether it is good or bad. When a defect is found in the magnetic head 2 in the carriage structure, only the intermediate flexible substrate 11 corresponding to the defective head is heated and removed from the intermediate flexible substrate 11, and the good magnetic head 2 is processed by the method described above. It is connected to the intermediate flexible substrate 11.

In the above embodiment, when the solder pad 17 of the base flexible substrate 6 and the through hole 15 of the intermediate flexible substrate 11 were connected, the solder was melted and soldered by the pulse heat tool. May be used, or they may be electrically collectively connected by an anisotropic conductive film (ACF). Further, although the through hole 15 is provided as the second terminal portion of the wiring 13, the through hole 15 is not limited to the through hole and may be an electrode without a hole.

[0035]

As described above, according to claims 1 to 3 of the present invention, since the intermediate flexible substrate is assembled to the lead wire led out from the magnetic head,
It is possible to provide a magnetic head assembly that can be easily assembled to a magnetic disk device, can improve assembly workability, and can prevent defective wiring. Moreover, since the magnetic head, the lead wire, and the intermediate flexible substrate are assembled, the magnetic assembly can be stocked as a replacement part, and the replacement can be easily performed.

According to the present invention, the lead wire led out from the magnetic head and the base flexible board led out from the signal processing circuit can be easily electrically connected, and the assembling workability is improved. It is possible to provide a method of manufacturing a magnetic disk device that can be realized.

According to the present invention, the lead wire derived from the magnetic head and the base flexible substrate derived from the signal processing circuit can be easily electrically connected,
Further, it is possible to provide a magnetic disk device in which the connecting portion is simplified, there is no interference with other parts, and contact failure can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a carriage structure of a magnetic disk according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a connection state between a base flexible substrate and an intermediate flexible substrate of the same embodiment.

FIG. 3 is a perspective view showing a manufacturing sequence of the magnetic assembly according to the embodiment.

FIG. 4 is a vertical cross-sectional side view showing a state in which an intermediate flexible substrate is connected to the base flexible substrate of the same embodiment.

FIG. 5 is a perspective view showing a carriage structure of a conventional magnetic disk.

FIG. 6 is a perspective view showing a connection state between a conventional base flexible substrate and a lead wire.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Carriage 2 ... Magnetic head 3 ... Lead wire 5 ... Signal processing circuit 6 ... Base flexible substrate 11 ... Intermediate flexible substrate 14 ... Solder pad 16 ... Magnetic assembly

Claims (7)

[Claims] 1. A magnetic head assembly for electrically connecting a magnetic head installed at a tip portion of a carriage and a base flexible substrate derived from a signal processing circuit for processing a signal of the magnetic head, comprising: A lead wire led out from the magnetic head; and an intermediate flexible substrate having a first terminal portion connected to the lead wire and a second terminal portion connected to the base flexible substrate. Magnetic head assembly. 2. The magnetic head assembly according to claim 1, wherein the intermediate flexible substrate has a conductive layer printed on a polyimide resin substrate. 3. The magnetic head assembly according to claim 1, wherein the second terminal portion is an electrode provided on the intermediate flexible substrate and is connected to the base flexible substrate by soldering. 4. A carriage, a magnetic head installed at a tip of the carriage, lead wires derived from the magnetic head, and a base flexible substrate derived from a signal processing circuit for processing signals of the magnetic head. A method of manufacturing a magnetic disk device, comprising: electrically connecting the lead wire to a first terminal portion of an intermediate flexible substrate;
A method of manufacturing a magnetic disk device, wherein the terminal portion of is electrically connected to the base flexible substrate. 5. The method of manufacturing a magnetic disk device according to claim 4, wherein the connection between the lead wire and the first terminal portion is soldering. 6. The method of manufacturing a magnetic disk device according to claim 4, wherein the connection between the second terminal portion and the base flexible substrate is soldering using a pulse heating tool. 7. A base, a flexible board derived from a carriage, a magnetic head installed at the tip of the carriage, lead wires derived from the magnetic head, and a signal processing circuit for processing signals of the magnetic head. A magnetic disk device comprising: an intermediate flexible substrate provided between the lead wire and the base flexible substrate to electrically connect the two to each other.