JPH08155784A - Cutting device having foam discharging means - Google Patents

Abstract

PURPOSE: To rapidly and easily discharge the foam even when a volume of foam is generated from the cutting fluid mixed with the surface active agent by providing a foam discharging means to suck and discharge the foam by the surface active agent mixed with the cutting fluid on a waste liquid tray. CONSTITUTION: When a work on a cutting means is cut and the cutting fluid mixed with the surface active agent is fed to generate a volume of foam, the foam is stored in a waste liquid tray 1 and sucked into a communicating tube 6a from a foam sucking port 6c of a foam discharging means 6, and rapidly discharged outside through a sucking pipe 6b. This constitution preliminarily prevents much generated foam from overflowing out of the waste liquid tray 1 to contaminate the circumference, or from being stored in the waste liquid tray 1 for a long time and entering inside from a water cover 3 or a waterproof bellows cover 4, or dropping from a square hole la of the waste liquid tray 1 to foul the inside of the device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting device having foam discharging means.

[0002]

2. Description of the Related Art In a cutting device for cutting a workpiece such as a semiconductor wafer, a cassette C is placed in a wafer placing area A which moves up and down as shown in FIG. The accommodated wafer W (fixed to the frame F via the adhesive tape N) is carried out to the standby area D by the carry-in / out means B, and the wafer W is transferred to the chuck table T by the carrying means E having a swing arm. The wafer W that has been conveyed and suction-held on the chuck table is positioned by the alignment means G and aligned, and then diced by the cutting means H having a rotating blade. When the wafer W is cut by the cutting means H, a cutting liquid such as pure water is supplied, but in order to prevent the cutting liquid from entering the inside of the apparatus, a water holding chuck table T is usually provided as shown in FIG. It has a cover 3 and a waterproof bellows cover 4 attached to both sides thereof.

[0003]

However, it is often the case that a surfactant is mixed in the cutting fluid so that the minute cutting dust generated during cutting does not remain on the wafer, but it is rotating at a high speed. When the cutting fluid is applied to the blade (grinding stone), a large amount of bubbles are generated, and not only the bubbles overflow around but also enter the inside of the covers 3 and 4 to contaminate the inside of the apparatus. The present invention has been made in order to solve such a conventional problem, and even if a large amount of bubbles are generated from a cutting fluid mixed with a surfactant, the bubbles can be quickly and easily discharged. An object of the present invention is to provide a cutting device having means.

[0004]

As a means for technically solving the above-mentioned problems, the present invention provides a cutting device for performing cutting while supplying cutting fluid to a workpiece held on a chuck table. This cutting device is provided with a cover to prevent the waste cutting liquid from entering the inside of the device, and a waste liquid tray for accommodating the waste liquid and discharging it to the outside. A gist is a cutting device having a bubble discharging means, which is provided with a bubble discharging means for sucking and discharging bubbles caused by a surfactant mixed in the cutting fluid.

[0005]

[Operation] The waste liquid containing a large amount of foam can be stored in the waste liquid tray, and the foam can be sucked out quickly by the foam discharging means provided in the waste liquid tray, so that the foam can be discharged around the cover. It does not collect, and it is possible to prevent bubbles from entering the inside of the cover and contaminating the inside of the device.

[0006]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 1 denotes a waste liquid tray, which is provided with a rectangular hole 1a for moving the chuck table T along the longitudinal direction at the center of the bottom plate, and a rising piece 1b is provided around the rectangular hole 1a. Further, a drainage hole 1c is provided in the main part of the bottom plate.

The waste liquid tray 1 is provided from the chuck table area of the cutting device to the cutting area, and a moving mechanism 2 for the chuck table T is arranged below the waste table 1. The moving mechanism 2 has a ball screw 2b that is rotated by a motor 2a and a moving table 2d that moves along a table guide 2c by the rotation of the ball screw 2b, and the chuck table is placed on the moving table 2d. T is rotatably held.

Reference numeral 3 denotes a water cover for holding the chuck table T, which is disposed so as to straddle the square hole 1a of the waste liquid tray 1, and the waterproof bellows is provided between both side portions thereof and the side wall of the waste liquid tray 1. The covers 4 are attached respectively. Therefore, even if the square hole 1a of the waste liquid tray 1 is closed by the water cover 3 holding the chuck table T and the waterproof bellows covers 4 on both sides, and the chuck table T is moved left and right by the moving mechanism 2,
One side of the waterproof bellows cover 4 extends and the other side contracts so that the square hole 1a can be always closed.

A roller 5 is attached to the inside of the water cover 3 and below the waterproof bellows cover 4 and is engaged with the rising piece 1b of the waste liquid tray 1. The roller 5 extends along the rising piece 1b. By rolling, the water cover 3 and the waterproof bellows cover 4 can be moved smoothly.

FIG. 2 shows an example of the bubble discharging means 6 according to the present invention, which is a square communication pipe 6a formed in a substantially U shape.
And a suction pipe 6b connected to the communication pipe 6a, both ends of the communication pipe 6a are closed, and slit-shaped foam suction holes 6c are provided inside the opposing pipes, respectively. Has been.

The bubble discharging means 6 is disposed inside the waste liquid tray 1 as shown by a phantom line in FIG. 1, and the suction pipe is provided through a through hole 1d formed in a side wall of the waste liquid tray 1. The end of 6b is connected to the communication pipe 6a, and the suction pipe 6b is connected to a suction source (not shown).

Since the cutting apparatus of the present invention is constructed as described above, when cutting a workpiece such as a silicon wafer by the cutting means H, a cutting liquid mixed with a surfactant is supplied to supply a large amount of the cutting liquid. Even if bubbles are generated, the bubbles are accommodated in the waste liquid tray 1, sucked into the communication pipe 6a from the bubble suction hole 6c of the bubble discharge means 6, and quickly discharged to the outside via the suction pipe 6b. To be done.

As a result, a large amount of foam overflows from the waste liquid tray 1 and contaminates the surroundings, or stays in the waste liquid tray 1 for a long time and invades from below the water cover 3 or the waterproof bellows cover 4. It is possible to prevent the situation in which the inside of the apparatus is contaminated by dropping from the square hole 1a of the waste liquid tray 1. The waste liquid is discharged from the drain hole 1c to the outside through a drain pipe (not shown).

[0014]

As described above, according to the present invention,
Since a large amount of bubbles generated by the surfactant mixed in the cutting fluid can be quickly sucked and easily discharged to the outside by the bubble discharging means arranged in the waste liquid tray,
The bubbles do not contaminate the peripheral portion or penetrate under the cover to contaminate the inside of the apparatus, and the effect is extremely remarkable.

[Brief description of drawings]

FIG. 1 is a schematic exploded perspective view of a main part showing an embodiment of the present invention.

FIG. 2 is a perspective view showing an example of a bubble discharging means.

FIG. 3 is a perspective view for explaining a cutting device.

[Explanation of symbols]

1 ... Waste liquid tray 1a ... Square hole 1b ... Standing piece 1
c ... drainage hole 1d ... through hole 2 ... moving mechanism 2a ...
Motor 2b ... Ball screw 2d ... Moveable table 3 ... Water cover 4 ... Waterproof bellows cover 5 ... Roller 6 ... Foam discharging means 6a ... Communication pipe 6b ... Suction pipe 6c ... Foam suction hole

Claims (1)

[Claims] 1. A cutting device for performing cutting while supplying a cutting liquid to a workpiece held on a chuck table, wherein the cutting device is provided with a cover for preventing the waste cutting liquid from entering the inside of the device. A waste liquid tray is provided that stores waste liquid and discharges it outside.
A cutting device having a foam discharging means, wherein the waste liquid tray is provided with a foam discharging means for sucking and discharging bubbles due to a surfactant mixed in the cutting fluid.