JPH08153751A - Electronic device assembly, and manufacture thereof - Google Patents

Abstract

PURPOSE: To improve reliability between a first and second substrates by forming between both substrates a member for connecting a connection structure of the first substrate to first pads of the second substrate and resin to secure the first substrate to the second one. CONSTITUTION: A chip carrier 13 is positioned so as to place connection structures 4 and 45 on a solder 9 and solder paste 12. A thermosetting resin 10 is formed on the top face of a substrate 7, except the solder 9 and solder paste 12. By heating to reflow the solder 9, it penetrates into through-holes until appearing on the top face of a flexible substrate 2. This serves for identifying any abnormal connection of the solder 9. And part of the carrier 13 drops to result in contact of the lower face of the substrate 2 with the thermosetting resin 10. The paste 12 also melts to connect pads 81 to the connection structure 45 and the resin 10 hardens to secure the carrier 13 to the substrate 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device assembly, and more particularly to a first substrate, a second substrate mounted on the first substrate, and a second substrate mounted on the second substrate. The present invention relates to an electronic device assembly including an electronic device.

[0002]

2. Description of the Related Art One example of a conventional electronic device assembly is disclosed in US Pat. No. 5,203,075.

Referring to FIG. 10 of the publication, a semiconductor device 43 is mounted on a flexible substrate 31. The flexible board 31 is connected to the board 13 by soldering.

Referring to FIGS. 6 and 9, the flexible substrate 31 and the substrate 13 are connected by a soldering member 32 and a solder paste 27. A part of the soldering member 32 penetrates into the through hole provided in the flexible substrate 31.

[0005]

The above structure has the following problems.

First, since the flexible substrate 31 and the substrate 13 are connected only by solder, the reliability of solder bumps is low. Specifically, peeling of solder bumps, destruction of solder bumps, and short circuit (migration) between adjacent solder bumps are likely to occur.

This problem is serious when a heavy member such as a heat sink is provided on the semiconductor device 43. Further, the destruction of the solder bump also occurs due to repeated heating during operation and cooling during rest. Furthermore, the humidity of the atmosphere also reduces the reliability of the solder bumps.

Secondly, since the flexible substrate 31 has low flatness, it is difficult to provide a predetermined gap between the flexible substrate 31 and the substrate 13. If the error of this gap becomes large, the reliability of the solder connection portion is significantly reduced.

Therefore, a first object of the present invention is to improve the reliability of the connecting portion between the first substrate and the second substrate. More specifically, it is to prevent deterioration of the connection portion due to mechanical stress, repeated heating / cooling, or moisture in the atmosphere.

A second object of the present invention is to provide a first substrate and a second substrate.
The purpose is to reduce the connection failure of the part connecting the substrates. More specifically, it is to accurately adjust the gap between the first substrate and the second substrate.

[0011]

In view of the above problems, the electronic device assembly of the present invention has a first substrate having first and second surfaces and a connection structure provided on the second surface. A second substrate having first and second surfaces, the first pad being provided on the first surface, and the first pad facing the connection structure of the first substrate; A connection member provided between the first and second substrates for connecting the connection structure of the first substrate and the first pad of the second substrate, the first substrate and the second substrate. The first is provided between the substrates.
And a resin for fixing the substrate to the second substrate.

As the connecting member, solder, a film containing conductors protruding on the upper and lower surfaces, or an anisotropic conductive sheet can be used.

When solder is used as the connecting member, a through hole may be provided in the connecting structure. When a through hole is provided, part of the solder may penetrate the through hole and appear on the upper surface of the first substrate.

A flexible substrate may be used as the first substrate.

A sheet-like material may be used as the thermosetting resin.

When solder is used as the connecting member, the method of manufacturing an electronic device assembly according to the present invention is
A first step of providing solder on the first pad of the second substrate; a second step of positioning the first substrate so that the connecting member is located on the solder; The third step of injecting a thermosetting resin between the first substrate and the second substrate; and the first pad and the connection structure by simultaneously heating the solder and the thermosetting resin. A fourth step of connecting with solder and curing the thermosetting resin to fix the first substrate on the second substrate.

When the thermosetting resin is in the form of a sheet, the method of manufacturing an electronic device assembly according to the present invention comprises the first step of providing solder on the first pad of the second substrate, and the first step. A second step of positioning a thermosetting resin on the second board; a third step of positioning the first board so that the connecting member is located on the solder; and the solder and the thermosetting resin. By heating the resin at the same time, the first pad and the connection structure are connected by the solder and the thermosetting resin is cured to fix the first substrate on the second substrate. 4 steps.

When a sheet having a conductor is used as the connecting member, the method of manufacturing an electronic device assembly according to the present invention is characterized in that the conductor is placed on the first pad of the second substrate. A first step of positioning a film; a second step of positioning the first substrate so that the connection structure is positioned on the conductor;
Connecting the pad and the conductor and connecting the conductor and the connection structure, a gap between the first substrate and the film, and a gap between the film and the second substrate. The method includes a fourth step of filling the gap with resin, and a fifth step of hardening the resin to fix the first substrate to the second substrate.

When an anisotropic conductive sheet is used as the connecting member, the method of manufacturing an electronic device assembly according to the present invention provides an anisotropic conductive sheet on the first surface of the second substrate. The first step of placing and the first and second steps
A second step of positioning the first substrate on the anisotropic conductive sheet so that the pads of the first substrate are electrically connected, and a gap between the first substrate and the anisotropic conductive sheet. A fourth step of filling a resin in a gap between the anisotropic conductive sheet and the second substrate, and a fifth step of curing the resin to fix the first substrate to the second substrate. And steps.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a first embodiment of the present invention will be described with reference to the drawings.

Referring to FIG. 1, the electronic device assembly according to the first embodiment of the present invention includes a substrate 7 and a chip carrier 13 mounted on the substrate 7.

In this embodiment, a glass epoxy substrate is used as the substrate 7. The material of the substrate 7 is not particularly limited. For example, a ceramic substrate can be used. On the upper surface of the substrate 7, the pads 8 and 8 are made of copper or the like.
1 is formed.

The chip carrier 13 includes the flexible substrate 2 and
It includes an LSI chip 1 mounted on the flexible substrate 2 and a resin 6 for sealing the lower surface of the flexible substrate 2.

In this embodiment, the LSI chip 1 has one side 1.
It presents a 7.5 mm square. In the peripheral portion of the LSI chip 1, about 800 input / output terminals are formed with a pitch of 80 μm. There is no particular limitation on the electronic device mounted on the flexible substrate 2, and devices other than the LSI chip 1 may be mounted.

The flexible substrate 2 is an organic insulating film. The flexible substrate 2 is preferably formed of a material having excellent heat resistance, a small coefficient of thermal expansion, and a wiring pattern 3 described later that can be easily mounted. Specifically, polyimide,
Fluorine-based materials and epoxy-based materials can be used. In this embodiment, the flexible substrate 2 has a thickness of about 5
0 μm.

The flexible substrate 2 has a device hole in the center. Internal leads 5 are provided on the upper surface of the flexible substrate 2 and project into the device holes. One end of the internal lead 5 is connected to the input / output terminal of the LSI chip 1. The inner lead 5 is sealed with resin 6.

Referring to FIGS. 1 and 2A, the flexible substrate 2 has a connection structure 4. The connection structure 4 includes a through hole 44, conductor patterns 41, 42, and 43.
including. The conductor pattern 41 is provided around the through hole 44 on the lower surface of the flexible substrate 2. Conductor pattern 42
Are provided on the inner surface of the through hole 44. The conductor pattern 43 is provided around the through hole 44 on the upper surface of the flexible substrate 2. Conductor patterns 41, 42, and
43 is formed of copper plated with gold.

Each connection structure 4 is connected to the corresponding internal lead 5 by the wiring pattern 3 provided on the upper surface of the flexible substrate 2. The wiring pattern 3 is formed of copper plated with gold. The thickness of the wiring pattern 3 is about 10 to 25 μm.
m.

Referring to FIGS. 1 and 2B, the flexible substrate 2 has a connection structure 45 around the device hole. The connection structure 45 includes a conductor pattern 48 provided on the upper surface of the flexible substrate 2, a conductor pattern (ground plane) 46 provided on the lower surface of the flexible substrate 2, and a via 47 connecting the conductor patterns 46 and 48. . The connection structure 45 is connected to the corresponding internal lead 5 by the wiring pattern 3. When power is supplied to the LSI chip 1 via the connection structure 45, noise that affects the operation of the LSI chip 1 can be suppressed. The connection structure 45 is also effective in matching impedance and suppressing crosstalk.

Referring again to FIG. 1, the solder paste 1
2, the connection structure 45 and the corresponding pad 81 are connected. The solder 9 connects the connection structure 4 to the corresponding pad 8. Part of solder 9 is through hole 4
4 and then appears on the upper surface of the flexible substrate 2.

A thermosetting resin 10 is filled between the flexible substrate 2 and the substrate 7. The flexible substrate 2 is fixed to the substrate 7 by the thermosetting resin 10. In addition, thermosetting resin 1
0 seals the solder 9 and the solder paste 12. Thereby, the flexible substrate 2 and the substrate 7 are integrated. The coefficient of thermal expansion of the thermosetting resin 10 is the same as that of the flexible substrate 2,
It is preferably between or close to the coefficient of thermal expansion of the substrate 7. Further, the curing temperature of the thermosetting resin 10 is 130.
The melting temperature of the solder 9 and the solder paste 12 is preferably 180 to 240 ° C. Specifically, as the material of the thermosetting resin 10, an epoxy fluororesin can be mentioned.

Next, the manufacturing method of the first embodiment will be described.

Referring to FIG. 3A, in the first step, the solder 9 and the solder paste 12 are placed on the pads 8 and 81. Before mounting the solder 9, the solder paste 12 may be applied to the pad 8 in advance.

Referring to FIG. 3B, in the second step, the chip carrier 13 is positioned so that the connection structure 4 and the connection structure 45 are located on the solder 9 and the solder paste 12. In advance, the LSI chip 1 is mounted on the flexible substrate 2 by tape automated bonding.

Referring to FIG. 3C, in the third step, the thermosetting resin 10 is provided on the upper surface of the substrate 7 excluding the solder paste 12 and the solder 9. The thermosetting resin 10 is injected through the gap between the flexible substrate 2 and the substrate 7. Alternatively, the flexible substrate 2 may be provided with an injection hole, and the thermosetting resin 10 may be injected through the injection hole.

Referring to FIG. 3D, reflow heating is performed in the fourth step.

By this heating, the solder 9 is melted. Part of the melted solder 9 enters the through hole 44,
Appears on the upper surface of the flexible substrate 2. By confirming that the solder 9 has appeared on the upper surface of the flexible substrate 2, the connection abnormality of the solder 9 can be identified. Since a part of the solder 9 has entered the through hole 44, a part of the chip carrier 13 descends, and the lower surface of the flexible substrate 2 has a thermosetting resin 10.
Contact with. Further, the solder paste 12 is also melted to connect the pad 81 and the connection structure 45.

By this heating, the thermosetting resin 10
Hardens. By hardening the thermosetting resin 10,
The chip carrier 13 is fixed to the substrate 7, and both are integrated.

As described above, in this embodiment, since the chip carrier 13 is fixed to the substrate 7 by the thermosetting resin 10, deterioration of reliability of the solder 9 due to mechanical stress or repeated heating / cooling is prevented. it can.

Further, in this embodiment, since the solder 9 is sealed with the thermosetting resin 10, it is possible to prevent the reliability of the solder 9 from being lowered due to the humidity in the atmosphere.

Furthermore, since the solder 9 and the thermosetting resin 10 are simultaneously cured by heating once,
The manufacturing process is simplified.

Next, a second embodiment of the present invention will be described with reference to the drawings.

The feature of the second embodiment is that the flexible substrate 2 is fixed to the substrate 7 by the thermosetting resin sheet 11, and the other structures and functions are the same as those of the first embodiment. Is.

Referring to FIG. 4, in the second embodiment, the flexible substrate 2 is fixed to the substrate 7 by the thermosetting resin sheet 11. In the portion of the thermosetting resin sheet 11 corresponding to the device holes, the pads 8 and 81,
There are holes. Solder 9 connects pad 8 and connecting structure 4 through this hole.

The thickness of the thermosetting resin sheet 11 is determined in consideration of the desired distance between the flexible substrate 2 and the substrate 7. By adjusting the thickness of the thermosetting resin sheet 11, the gap between the flexible substrate 2 and the substrate 7 can be adjusted.

Next, the manufacturing method of the second embodiment will be described.

Referring to FIG. 5A, in the first step, the solder 9 and the solder paste 12 are placed on the pads 8 and 81.

Referring to FIG. 5B, in the second step, the thermosetting resin sheet 11 is placed on the upper surface of the substrate 7. Due to the holes formed in the thermosetting resin sheet 11, the solder 9 and the solder paste 12 are not covered by the thermosetting resin sheet 11.

Referring to FIG. 5C, in the third step, the chip carrier 13 is positioned so that the connection structure 4 and the connection structure 45 are located on the solder 9 and the solder paste 12.

Referring to FIG. 5D, reflow heating is performed in the fourth step.

Similar to the manufacturing method of the first embodiment, the solder 9 is melted and the pad 8 and the connection structure 4 are connected. Further, the solder paste 12 is melted to connect the pad 81 and the connection structure 45. The position of the chip carrier 13 is lowered, and the lower surface of the flexible substrate 2 contacts the thermosetting resin sheet 11.

At the same time, this heating cures the thermosetting resin sheet 11. By hardening the thermosetting resin sheet 11, the chip carrier 13 is fixed to the substrate 7, and the two are integrated.

In addition to the effects of the first embodiment, the second embodiment has the effect that the gap between the flexible substrate 2 and the substrate 7 can be accurately adjusted by the thickness of the thermosetting resin sheet 11. Have.

Next, a third embodiment of the present invention will be described with reference to the drawings.

The characteristic of the third embodiment is that the flexible substrate 2 and the substrate 7 are connected via a connecting member, and other structures and features are the same as those of the first embodiment. .

Referring to FIG. 6, the flexible substrate 2 and the substrate 7
The connection member 93 is inserted between them. Connection member 9
3 includes a film 90 and a conductor 91 provided in the film 90.

In this embodiment, the film 90 is made of epoxy or polyimide material. In addition,
A ceramic sheet can be used instead of the film 90. In the case of this embodiment, the thickness of the film 90 is about 0.
It is 1 to 0.5 mm.

The conductor 91 is made of metal such as gold or copper, and has a solder layer formed on its surface. The upper and lower portions of the conductor 91 project from the upper surface and the lower surface of the film 90, respectively. Pad 8 and connection structure 4
Are connected via conductors 91. The pad 81 and the connection structure 45 are also connected via the conductor 91. Conductor 91
The upper part of is inserted into the through hole 44. Conductor 9
The through hole 44 is provided with a taper in order to make it easier to receive 1. Conductor 91 and through hole 44
By engaging with, the chip carrier 13 can be accurately positioned. The height of the connecting member 91 is determined in consideration of the desired distance between the flexible substrate 2 and the substrate 7. In this embodiment, it is about 0.2 to 0.5 mm.

A resin 10 is provided between the substrate 7 and the film 90.
1 is filled. The coefficient of thermal expansion of the resin 101 is preferably between or close to the coefficient of thermal expansion of the substrate 7 and the coefficient of thermal expansion of the film 90. A resin 102 is filled between the film 90 and the flexible substrate 2. The coefficient of thermal expansion of the resin 102 is preferably close to the coefficient of thermal expansion of the film 90 and the coefficient of thermal expansion of the LSI chip 1. In this embodiment, the resin 101 and the resin 102 are thermosetting resins. However, the resins 101 and 102 are not limited to thermosetting resins.
If it is a resin sealing material that cures by some method,
It can be used as the resins 101 and 102.

Next, the manufacturing method of the third embodiment will be described.

Referring to FIG. 7A, the substrate 7 is prepared in the first step.

Referring to FIG. 7B, in the second step, the connecting member 93 is positioned so that the conductor 91 is located on the corresponding pad 8.

Referring to FIG. 7C, in the third step, the chip carrier 13 is positioned so that the connection structure 4 is located on the corresponding conductor 91. Conductor 9
The upper part of 1 is inserted into the through hole 44. After the positioning, the reflow is performed, and the connecting structure 4 connects the connecting member 91.
Connected to.

Referring to FIG. 7D, in the fourth step, the resin 101 is filled between the substrate 7 and the film 90. A resin 102 is filled between the film 90 and the flexible substrate 2. After this, the resins 101 and 102
Is heated. By this heating, the resins 101 and 102
Hardens. By hardening the resins 101 and 102, the chip carrier 13, the connecting member 93, and the substrate 7 are integrated. The metal portion of the conductor 91 is not melted by this heating.

In the third embodiment, the chip carrier 13,
The connecting member 93 and the substrate 7 are made of resin 101 and 1
Since it is integrated by 02, it is possible to prevent the reliability of the connection part from being lowered due to mechanical stress or repeated heating and cooling.

Further, the connecting portions are made of resin 101 and 102.
Since it is sealed with, it is possible to prevent the reliability of the connection portion from being lowered due to the humidity in the atmosphere.

Further, the height of the conductor 91 allows the clearance between the flexible substrate 2 and the substrate 7 to be accurately adjusted.

Next, a fourth embodiment of the present invention will be described with reference to the drawings.

The feature of the fourth embodiment is that the flexible substrate and the substrate 7 are connected by the anisotropic conductive sheet 112.

Referring to FIG. 8, the structure and function of LSI chip 1, resin 6 and substrate 7 are the same as those of the first embodiment.

The chip carrier 131 is a flexible substrate 2.
0, and the LSI chip 1 mounted on the flexible substrate 20.

The flexible substrate 20 has a device hole in the center. Internal leads 5 are provided on the lower surface of the flexible substrate 20. One end of the internal lead 5 projects into the device hole and is connected to the input / output terminal of the LSI chip 1. Pads 21 are formed on the lower surface of the flexible substrate 20 from gold-plated copper. The internal lead 5 and the pad 21 are connected by a wiring conductor (not shown) provided on the lower surface of the flexible substrate 20.

An anisotropic conductive sheet 112 is formed on the substrate 7.
Is provided. The anisotropic conductive sheet 112 includes a thermosetting resin and the metal particles 15 mixed in the thermosetting resin. The thickness of the anisotropic conductive sheet 112 is the flexible substrate 2
It depends on the desired distance between 0 and the substrate 7.

The chip carrier 131 is provided on the anisotropic conductive sheet 112. Pad 2 of flexible substrate 20
1 and the corresponding pad 8 of the substrate 7 are connected via the anisotropic conductive sheet 112.

A resin 103 is filled between the substrate 7 and the anisotropic conductive sheet 112. The coefficient of thermal expansion of the resin 103 is preferably between the coefficient of thermal expansion of the substrate 7 and the coefficient of thermal expansion of the anisotropic conductive sheet 112. Anisotropic conductive sheet 11
A resin 104 is filled between 2 and the flexible substrate 20. The coefficient of thermal expansion of the resin 104 is preferably between the coefficient of thermal expansion of the anisotropic conductive sheet 112 and the coefficient of thermal expansion of the flexible substrate 20. In this embodiment, the resins 103 and 104 are
It is a thermosetting resin.

Next, the manufacturing method of the fourth embodiment will be described.

Referring to FIG. 9A, the substrate 7 is prepared in the first step.

Referring to FIGS. 9B and 10A, in the second step, the anisotropic conductive sheet 112 is placed on the pad 8. To facilitate handling, the separator 14 is provided on the upper surface of the anisotropic conductive sheet 112.
Is attached.

Referring to FIGS. 9C and 10B, in the third step, the anisotropic conductive sheet 112 is used.
The separator 14 is removed from the.

Referring to FIGS. 9D and 10C, in the fourth step, the anisotropic conductive sheet 112 is used.
The chip carrier 131 is placed on the above. Then, the pad 21 is thermocompression bonded to the anisotropic conductive sheet 112. By this thermocompression bonding, the thermosetting resin contained in the anisotropic conductive sheet 112 is cured. Further, due to this thermocompression bonding, the metal particles 15 are concentrated between the pad 8 and the pad 21. As a result, the pad 21 and the corresponding pad 8 are electrically connected.

Referring to FIGS. 9E and 10D, in the fifth step, the resin 103 is filled between the substrate 7 and the anisotropic conductive sheet 112. The resin 104 is provided between the anisotropic conductive sheet 112 and the flexible substrate 20.
Is filled. Then, the resins 103 and 104 are heated. By this heating, the resins 103 and 104 are cured, and the chip carrier 131, the anisotropic conductive sheet 112,
Also, the substrate 7 is integrated.

In the fourth embodiment, the chip carrier 13
1. Since the anisotropic conductive sheet 112 and the substrate 7 are integrated by the resins 101 and 102, it is possible to prevent the reliability of the connection portion from being lowered due to mechanical stress or repeated heating and cooling.

The connecting portions are made of resin 103 and 104.
Since it is sealed with, it is possible to prevent the reliability of the connection portion from being lowered due to the humidity in the atmosphere.

Further, the height of the anisotropic conductive sheet 112 allows the clearance between the flexible substrate 20 and the substrate 7 to be adjusted accurately.

Further, since the introduction of the anisotropic conductive sheet 112 eliminates the need for soldering, the manufacturing process can be simplified.

[0086]

As described above, according to the present invention,
Since the chip carrier is fixed to the substrate, there is an effect that it is possible to prevent a decrease in reliability of the connection portion due to mechanical stress or repeated heating and cooling.

Further, according to the present invention, since the connecting portion is sealed with the resin, it is possible to prevent the reliability of the connecting portion from being lowered due to the humidity in the atmosphere.

The first embodiment has an effect that the manufacturing process is simplified because the melting of the solder and the curing of the thermosetting resin are performed simultaneously by one heating.

The second to fourth embodiments have the effect that the gap between the flexible substrates can be adjusted accurately.

The fourth embodiment has an effect that soldering is unnecessary in the manufacturing process.

[Brief description of drawings]

FIG. 1 is a diagram showing a structure of a first embodiment of the present invention.

FIG. 2 is a diagram showing a detailed structure of the first embodiment.

FIG. 3 is a view showing the manufacturing method according to the first embodiment.

FIG. 4 is a diagram showing a structure of a second embodiment of the present invention.

FIG. 5 is a view showing the manufacturing method according to the second embodiment.

FIG. 6 is a diagram showing a structure of a third embodiment of the present invention.

FIG. 7 is a view showing the manufacturing method according to the third embodiment.

FIG. 8 is a diagram showing a structure of a fourth embodiment of the present invention.

FIG. 9 is a view showing the manufacturing method according to the fourth embodiment.

FIG. 10 is a view showing the manufacturing method according to the fourth embodiment.

[Explanation of symbols]

 1 LSI Chip 10 Thermosetting Resin 101 Resin 102 Resin 103 Resin 104 Resin 11 Thermosetting Resin Sheet 112 Anisotropic Conductive Sheet 12 Solder Paste 13 Chip Carrier 131 Chip Carrier 14 Separator 15 Metal Particles 2 Flexible Substrate 20 Flexible Substrate 21 pad 3 wiring pattern 4 connection structure 41 conductor pattern 42 conductor pattern 43 conductor pattern 44 through hole 45 connection structure 46 conductor pattern 47 via 48 conductor pattern 5 inner lead 6 resin 7 substrate 8 pad 81 pad 9 solder 90 film 91 conductor 93 connection Element

Claims (14)

[Claims] 1. A first substrate having first and second surfaces, a connection structure being provided on the second surface, and first and second surfaces, the first surface being the first surface. A first pad is provided on the first substrate, and the first pad is provided between the second substrate facing the connection structure of the first substrate and the first and second substrates. A connection member that connects the connection structure of the substrate to the first pad of the second substrate; and a connection member that is provided between the first substrate and the second substrate. An electronic device assembly comprising: a resin fixed to the second substrate. 2. The connection structure includes a through hole, the connection member includes a solder, a part of the solder penetrates into the through hole, and the resin is the first substrate and the second substrate. The electronic device assembly according to claim 1, wherein a gap between the two is filled. 3. The connection structure includes a through hole, the connection structure includes a film having first and second surfaces, and a conductor provided in the film. 2 portions project to the first and second surfaces of the film, and the first and second surfaces of the film are the second surface of the first substrate and the second surface of the second substrate. Facing the first surface, the first portion of the conductor is inserted into the through hole of the first substrate, and the first and second portions of the conductor are the first substrate. Of the connection structure and the first pad of the second substrate respectively, the resin is a gap between the first substrate and the film, a gap between the film and the second substrate It fills up with. Electronic device assembly on board. 4. The connection structure includes a second pad provided on the second surface of the first substrate, the connection member includes an anisotropic conductive sheet, and the first pad and The second pad is electrically connected to the anisotropic conductive sheet, and the resin is the gap between the first substrate and the anisotropic conductive sheet, the anisotropic conductive sheet and the anisotropic conductive sheet. The electronic device assembly according to claim 1, wherein the electronic device assembly is filled in a gap between two substrates. 5. The electronic device assembly according to claim 1, wherein the first substrate is a flexible substrate. 6. The electronic device assembly according to claim 1, wherein an electronic device is mounted on the first surface of the first substrate. 7. A first substrate having first and second surfaces and a connection structure provided on the second surface, and first and second substrates.
And a second substrate having a first surface and a first pad provided on the first surface, a solder is provided on the first pad of the second substrate. A first step of providing, a second step of positioning the first substrate so that the connection member is located on the solder, and a thermosetting property between the first substrate and the second substrate. A third step of injecting a resin and heating the solder and the thermosetting resin at the same time to connect the first pad and the connection structure with the solder and cure the thermosetting resin. And a fourth step of fixing the first substrate onto the second substrate, thereby manufacturing the electronic device assembly. 8. The manufacturing of an electronic device assembly according to claim 7, wherein the connection structure includes a through hole, and at least a part of the solder penetrates the through hole in the fourth step. Method. 9. A first substrate having first and second surfaces and a connection structure provided on the second surface, and first and second substrates.
And a second substrate having a first surface and a first pad provided on the first surface, a solder is provided on the first pad of the second substrate. A first step of providing, a second step of placing a thermosetting resin on the second substrate, and a step of positioning the first substrate so that the connecting member is located on the solder. By simultaneously heating the solder and the thermosetting resin in step 3, the first pad and the connection structure are connected by the solder, and the thermosetting resin is hardened to cure the first pad. And a fourth step of fixing the substrate of (1) on the second substrate. 10. The method of manufacturing an electronic device assembly according to claim 9, wherein in the second step, the resin has a sheet shape. 11. A first connection structure, wherein the connection structure is provided around the through hole on the second surface of the first substrate.
And a second conductor pattern provided on the inner surface of the through hole, wherein at least part of the solder penetrates into the through hole in the fourth step. Item 10. A method for manufacturing an electronic device assembly according to Item 9. 12. A first substrate having first and second surfaces and provided with a connection structure on the second surface, and a first substrate having first and second surfaces on the first surface. And a second substrate provided with one pad, wherein the first pad and the connection structure are connected by a connection member including a film and a conductor provided in the film. A method comprising: a first step of positioning the film such that the conductor is located on the first pad of the second substrate; and the first substrate such that the connection structure is located on the conductor. And a third step of connecting the first pad and the conductor and connecting the conductor and the connection structure, and a gap between the first substrate and the film. And the film and the 4 to fill the resin into the gap between the substrate
And the fifth step of fixing the first substrate to the second substrate by curing the resin, and a method of manufacturing an electronic device assembly. 13. The electronic device assembly according to claim 12, wherein the connection structure includes a through hole, and at least a part of the conductor is inserted into the through hole in the second step. Production method. 14. A first substrate having first and second surfaces and having first pads provided on the second surface, and the first surface having first and second surfaces. A method of manufacturing an electronic device assembly, comprising: a second substrate having a second pad provided on the first substrate, wherein an anisotropic conductive sheet is placed on the first surface of the second substrate. And a second step of positioning the first substrate on the anisotropic conductive sheet so that the first and second pads are electrically connected, and the first substrate, A gap between the anisotropic conductive sheets,
A fourth step of filling a resin in a gap between the anisotropic conductive sheet and the second substrate, and a fifth step of curing the resin to fix the first substrate to the second substrate. And a step of manufacturing the electronic device assembly.