JPH0810951Y2 - 電力半導体装置 - Google Patents

電力半導体装置

Info

Publication number
JPH0810951Y2
JPH0810951Y2 JP1990114821U JP11482190U JPH0810951Y2 JP H0810951 Y2 JPH0810951 Y2 JP H0810951Y2 JP 1990114821 U JP1990114821 U JP 1990114821U JP 11482190 U JP11482190 U JP 11482190U JP H0810951 Y2 JPH0810951 Y2 JP H0810951Y2
Authority
JP
Japan
Prior art keywords
power semiconductor
opening
outer frame
semiconductor device
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990114821U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0470755U (enExample
Inventor
達也 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1990114821U priority Critical patent/JPH0810951Y2/ja
Publication of JPH0470755U publication Critical patent/JPH0470755U/ja
Application granted granted Critical
Publication of JPH0810951Y2 publication Critical patent/JPH0810951Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1990114821U 1990-10-31 1990-10-31 電力半導体装置 Expired - Fee Related JPH0810951Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990114821U JPH0810951Y2 (ja) 1990-10-31 1990-10-31 電力半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990114821U JPH0810951Y2 (ja) 1990-10-31 1990-10-31 電力半導体装置

Publications (2)

Publication Number Publication Date
JPH0470755U JPH0470755U (enExample) 1992-06-23
JPH0810951Y2 true JPH0810951Y2 (ja) 1996-03-29

Family

ID=31862538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990114821U Expired - Fee Related JPH0810951Y2 (ja) 1990-10-31 1990-10-31 電力半導体装置

Country Status (1)

Country Link
JP (1) JPH0810951Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017063066A (ja) * 2014-01-30 2017-03-30 パナソニックＩｐマネジメント株式会社 半導体装置及び半導体パッケージ

Also Published As

Publication number Publication date
JPH0470755U (enExample) 1992-06-23

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees