JPH0810951Y2 - 電力半導体装置 - Google Patents
電力半導体装置Info
- Publication number
- JPH0810951Y2 JPH0810951Y2 JP1990114821U JP11482190U JPH0810951Y2 JP H0810951 Y2 JPH0810951 Y2 JP H0810951Y2 JP 1990114821 U JP1990114821 U JP 1990114821U JP 11482190 U JP11482190 U JP 11482190U JP H0810951 Y2 JPH0810951 Y2 JP H0810951Y2
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- opening
- outer frame
- semiconductor device
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H10W72/5363—
-
- H10W90/754—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990114821U JPH0810951Y2 (ja) | 1990-10-31 | 1990-10-31 | 電力半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990114821U JPH0810951Y2 (ja) | 1990-10-31 | 1990-10-31 | 電力半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0470755U JPH0470755U (cg-RX-API-DMAC10.html) | 1992-06-23 |
| JPH0810951Y2 true JPH0810951Y2 (ja) | 1996-03-29 |
Family
ID=31862538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990114821U Expired - Fee Related JPH0810951Y2 (ja) | 1990-10-31 | 1990-10-31 | 電力半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810951Y2 (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017063066A (ja) * | 2014-01-30 | 2017-03-30 | パナソニックIpマネジメント株式会社 | 半導体装置及び半導体パッケージ |
-
1990
- 1990-10-31 JP JP1990114821U patent/JPH0810951Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0470755U (cg-RX-API-DMAC10.html) | 1992-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5091341A (en) | Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member | |
| JP5696780B2 (ja) | 半導体装置およびその製造方法 | |
| US7919854B2 (en) | Semiconductor module with two cooling surfaces and method | |
| US6258630B1 (en) | Resin-sealed semiconductor device having island for mounting semiconductor element coupled to heat spreader | |
| TWI441300B (zh) | 具堆疊式中介層的引線架 | |
| JP2765278B2 (ja) | 電子装置の製造方法 | |
| JP2015536579A (ja) | 切換モジュールおよび付属の格子モジュールを作製する方法ならびに付属の格子モジュールおよび対応した電子ユニット | |
| CN111009475B (zh) | 光学模组的封装结构及其封装方法 | |
| US5445995A (en) | Method for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sink | |
| JP2560909Y2 (ja) | 複合半導体装置 | |
| JPH0810951Y2 (ja) | 電力半導体装置 | |
| JPH0661372A (ja) | ハイブリッドic | |
| JP4543542B2 (ja) | 半導体装置 | |
| JPH0810950Y2 (ja) | 電力半導体装置 | |
| JPH02266557A (ja) | 半導体装置 | |
| JP2765277B2 (ja) | 電子装置 | |
| KR19980045131A (ko) | 전력용 반도체 모듈 | |
| JP2759523B2 (ja) | 半導体装置の製造方法 | |
| CN113284871B (zh) | 一种dbc基板框架结构及其成型治具、成型方法 | |
| JPH0278265A (ja) | リードフレームおよびそのリードフレームを使用した複合半導体装置 | |
| JP2680110B2 (ja) | 放熱体を有する半導体装置用パッケージ | |
| JP2000323646A (ja) | 絶縁材料ケース及び半導体装置 | |
| JPH01120856A (ja) | リードフレーム | |
| JPH01133329A (ja) | 樹脂封止型半導体装置の製造方法 | |
| JPH0710552Y2 (ja) | 電子デバイス |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |