JPH0810218Y2 - 混成集積回路モジュール - Google Patents

混成集積回路モジュール

Info

Publication number
JPH0810218Y2
JPH0810218Y2 JP1989062488U JP6248889U JPH0810218Y2 JP H0810218 Y2 JPH0810218 Y2 JP H0810218Y2 JP 1989062488 U JP1989062488 U JP 1989062488U JP 6248889 U JP6248889 U JP 6248889U JP H0810218 Y2 JPH0810218 Y2 JP H0810218Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit board
electronic components
circuit module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989062488U
Other languages
English (en)
Japanese (ja)
Other versions
JPH032676U (enrdf_load_stackoverflow
Inventor
友彦 森尻
忠彦 大阿久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP1989062488U priority Critical patent/JPH0810218Y2/ja
Publication of JPH032676U publication Critical patent/JPH032676U/ja
Application granted granted Critical
Publication of JPH0810218Y2 publication Critical patent/JPH0810218Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
JP1989062488U 1989-05-31 1989-05-31 混成集積回路モジュール Expired - Lifetime JPH0810218Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989062488U JPH0810218Y2 (ja) 1989-05-31 1989-05-31 混成集積回路モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989062488U JPH0810218Y2 (ja) 1989-05-31 1989-05-31 混成集積回路モジュール

Publications (2)

Publication Number Publication Date
JPH032676U JPH032676U (enrdf_load_stackoverflow) 1991-01-11
JPH0810218Y2 true JPH0810218Y2 (ja) 1996-03-27

Family

ID=31591683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989062488U Expired - Lifetime JPH0810218Y2 (ja) 1989-05-31 1989-05-31 混成集積回路モジュール

Country Status (1)

Country Link
JP (1) JPH0810218Y2 (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6282772U (enrdf_load_stackoverflow) * 1985-11-14 1987-05-27
JPS6440574U (enrdf_load_stackoverflow) * 1987-09-02 1989-03-10

Also Published As

Publication number Publication date
JPH032676U (enrdf_load_stackoverflow) 1991-01-11

Similar Documents

Publication Publication Date Title
TWI575670B (zh) 包括一用於嵌入及／或間隔半導體晶粒之獨立薄膜層之半導體裝置
US7163137B2 (en) Method of manufacturing mounting boards
CN107995392A (zh) 一种多摄像头模组及其加工方法
JPH0787277B2 (ja) 表面実装部品の基板搭載方法
JPS63501254A (ja) はんだ保持リ−ドを有する表面実装可能な集積回路パッケ−ジ
JPH0529537A (ja) 半導体モジユール構造
JPH0810218Y2 (ja) 混成集積回路モジュール
JP3134925B2 (ja) 回路基板等の板状体の固着方法及び装置
JP2002204097A (ja) フレキシブル回路基板保持具及びそれを使用したフレキシブル回路基板の保持方法。
CN1190799A (zh) 电子模件的制造
JPH06244304A (ja) リードレスチップキャリアパッケージ
CN206946065U (zh) 取放固化装置
KR100839493B1 (ko) 칩 트레이
US20120279651A1 (en) Epoxy coating on substrate for die attach
JP2019140358A (ja) 部品実装方法及び部品実装装置
US6399422B1 (en) Radiating plate structure and method for manufacturing semiconductor devices using the same structure
JP2910739B2 (ja) リードレス混成集積回路装置
JP3769881B2 (ja) 電子回路装置
JPH0536301Y2 (enrdf_load_stackoverflow)
KR20010038101A (ko) 다공질의 흡착부를 갖는 칩 흡착 수단을 구비하는 칩 접착 장치
CN210984725U (zh) 一种集成式的led面光源装置
JP2001110847A (ja) 電子部品の保持治具、保持方法および電子部品の製造方法
JPS5824459Y2 (ja) 電気部品装着基板
JP2964095B2 (ja) ダイパッドを吊下した電子部品搭載用基板
JPS61240687A (ja) 発光素子