JPH0810218Y2 - Hybrid integrated circuit module - Google Patents

Description

TECHNICAL FIELD The present invention relates to a structure that facilitates automatic mounting of a hybrid integrated circuit (hybrid IC) module.

Conventional technology DIP type hybrid integrated circuit modules are widely used. In this DIP type hybrid integrated circuit module, as shown in FIG. 2, electronic components 2a, 2b, 2c, 2d and 2e are mounted on a circuit board 1 and lead terminals 3a and 3a are provided on both side edges of the board at right angles to the electronic parts 2a, 2b, 2c, 2d and 2e.
.. and 3b, 3b .. are provided. As shown in the figure, this module can be used without being packaged, but it is also possible to package the above electronic component with a resin film.

In such a DIP type hybrid integrated circuit module, the height of each electronic component is different whether the electronic component is coated with resin or not, so that the entire top surface is uneven.

Problems to be solved by the invention If the top surface of the DIP type hybrid integrated circuit module is uneven as described above, the module cannot be picked up and picked up by the nozzle of the automatic mounter, and the module is mounted on the mother circuit board. DI that can be sucked by the above nozzle because it must be done manually
The advent of P-type hybrid integrated circuit modules has been desired.

Means for Solving the Problems In order to solve the above problems, the present invention derives a plurality of lead terminals from an edge of a circuit board on which a plurality of low-level electronic components are mounted, at a right angle to the circuit board. And in the hybrid integrated circuit module that is automatically mounted on the mother circuit board by suction from the nozzle of the automatic mounting machine,
It has a flat upper surface that can be adsorbed by the nozzle,
Corresponding to reaching the plane from the upper surface of each of the other electronic components except at least the least electronic component of the plurality of low electronic components on the circuit board that keeps the distance from the circuit substrate to the plane constant. A hybrid integrated circuit module characterized in that a nozzle suction flat plate having a projection on the lower surface is provided by being bonded to the upper surface of each of the electronic components via the respective projection.

Since the flat plate is provided by adhering to the upper surface of the electronic component mounted on the circuit board, the upper surface of the electronic component having height is flattened by the flat plate, and the nozzle can be attracted to the flat plate.

Next, an embodiment of the present invention will be described with reference to FIG.

First, as shown in FIG. 1A, an exterior coating material is applied to the same DIP type hybrid integrated circuit module as in FIG. 2 and dried and cured to form a resin coating film 4.

Then, as shown in FIG. 1B, an epoxy-based or silicon-based adhesive 5 is applied to the resin coating film on each electronic component using a dispenser.

Thereafter, as shown in FIG. 1C, a heat-resistant nozzle adsorption flat plate 6 made of a PBT (polybutylene terephthalate) material or a metal plate is adhered to the adhesive. That is, as shown in FIG. 1D, the nozzle suction flat plate 6
Is a flat plate portion 6a that contacts the highest electronic components 2a and 2b on the circuit board, and a protrusion that contacts the flat electronic components 2c, 2d, and 2e of different heights that are in contact with the flat plate portion 6a. It has parts 6c, 6d, and 6e, and the flat plate part 6a and the circuit board 1 are attached in parallel.

The adhesive can be cured by heating at 15 ° C for 30 minutes.

Alternatively, the nozzle suction flat plate 6 may be adhered after applying the exterior paint without using an adhesive.

In this way, since the height of the electronic components mounted on the circuit board is leveled by the nozzle suction flat plate, the flat upper surface can be sucked by the nozzles.

In the above description, the nozzle suction flat plate is provided with the protruding portion and is adhered to all electronic components, but it may be adhered only to a part thereof and not to contact other electronic components. In this case, it is also preferable that only the flat plate portion is hung over and bonded to the high electronic components without providing the protruding portion.

Advantageous Effects of Invention According to the present invention, a nozzle for adsorbing a nozzle having a flat upper surface that can be adsorbed by a nozzle on the upper surface of the electronic component of the hybrid integrated circuit module in which a plurality of low electronic components are mounted on the circuit board. Since the flat plate is provided by adhering it through the protrusion whose flatness is constant, when the nozzle of the automatic mounting device is sucked onto the upper surface of the nozzle suction flat plate, its deformation can be reduced. However, when storing the module with the nozzle suction plate attached, there is a change in the storage conditions such as temperature and humidity, and even if the number of storage days increases, the deformation of the upper surface can be reduced. Can always and surely be sucked, and the automatic mounting of the hybrid integrated circuit module to the mother circuit board can be performed accurately and reliably in the specified state. It can be performed and the work efficiency can be significantly improved. As described above, the number of electronic devices aiming at miniaturization and performance has recently increased, and the demand can be met while it is necessary to densely mount the hybrid integrated circuit modules on the mother circuit board.

[Brief description of drawings]

1 (a) to 1 (c) are perspective views showing a manufacturing process of a DIP hybrid integrated circuit module of one embodiment of the present invention, FIG. 1 (d) is a side view of the one process, and FIG. Is a DIP hybrid integrated circuit module. In the figure, 1 is a circuit board, 2a to 2e are electronic parts, 3a and 3b are lead terminals, 4 is a resin film, 5 is an adhesive, and 6 is a nozzle suction flat plate.

Claims (1)

[Scope of utility model registration request] 1. A mother circuit in which a plurality of lead terminals are led out from an edge portion of a circuit board on which a plurality of low-level electronic components are mounted, at a right angle to the circuit board, and suction is performed by a nozzle of an automatic mounter. In a hybrid integrated circuit module that is automatically mounted on a board, a plurality of low-level boards on the circuit board that have a flat upper surface that can be adsorbed by the nozzles and that have a constant height from the circuit board to the flat surface. Nozzle suction flat plates having on their lower surfaces protrusions corresponding to the respective top surfaces of the other electronic components excluding at least the best electronic component of the certain electronic components, and the respective protrusions on the upper surfaces of the respective electronic components. A hybrid integrated circuit module, wherein the hybrid integrated circuit module is provided by being bonded via