JP2003303926A6 - Apparatus and method for manufacturing BGA product substrate - Google Patents

Abstract

An object of the present invention is to provide an apparatus and a method for manufacturing a BGA product substrate that can be used for a variety of small to medium-volume production.
In a BGA product substrate manufacturing apparatus comprising a flux mounting means, a solder ball aligning means, and a solder ball mounting means, the solder ball mounting means moves a product substrate (1) having passed through the flux applying means to a rotating arm (14). ), And rotate the rotary arm (14) by 180 degrees from the rotation axis (16) as a starting point. The solder ball mounting land (2) of the product substrate (1) mounted on the rotary arm (14) And the solder balls (8) aligned with the solder ball alignment holes 15 of the solder ball alignment plate (13) having passed through the solder ball alignment means so as to face each other, so that the solder ball mounting land (2) and the solder balls (8) ) Through a flux (4).
[Selection diagram] Fig. 4

Description

[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a BGA semiconductor module, and more particularly to an apparatus and a method for manufacturing a BGA product board on which a solder ball 8 is mounted on a solder ball mounting land 2 of a product board 1 on which an IC chip is mounted. Is concerned.
[0002]
2. Description of the Related Art An apparatus for manufacturing a BGA product board on which a solder ball 8 is mounted on a solder ball mounting land 2 of a product board 1 on which an IC chip is mounted is provided with a solder ball mounting land 2 on a product board 1 on which an IC chip is mounted. Means for applying the flux 4 thereon (hereinafter referred to as flux applying means), means for arranging the solder balls 8 (hereinafter referred to as solder ball arranging means), and solder balls 8 aligned by the solder ball arranging means. Means for mounting on the solder ball mounting lands 2 on which the flux 4 of the substrate 1 is formed (hereinafter, referred to as solder ball mounting means). The above means are mass-produced by an automated apparatus.
[0003] The means of the automation device is shown in FIGS.
FIGS. 7B to 7E are process sectional views showing the flux applying means. FIG. 7A is a plan view thereof. The opening of the screen mask 17 and the position of the solder ball mounting land 2 of the product substrate 1 are set and aligned, and the flux 4 is dropped on the screen mask 17 (FIG. 7A), and the squeegee 5 is moved in the direction of the arrow. The flux 4 is applied onto the solder ball mounting lands 2 of the product substrate 1 (FIGS. 7C, 7D, and 7E). 7 (b), (c), 4 (d), and (e), the product substrate 1 is set on a moving table (1) 26 that moves in the X, Y, and Z axis directions.
FIGS. 8 (a), 8 (b) and 8 (c) are cross-sectional views showing steps of the solder ball aligning means. The solder balls 8 in the pot 19 are sucked into the suction holes 20 of the suction head 18 (FIGS. 8A, 8B, and 8C). It goes without saying that the position of the suction hole 20 of the suction head 18 corresponds to the position of the solder ball mounting land 2 of the product substrate 1. The suction head 18 has a mechanism that can freely move in the X, Y, and Z directions.
FIGS. 9 (a), 9 (b) and 9 (c) are cross-sectional views showing steps of the solder ball mounting means. The suction ball 18 on which the solder balls 8 are aligned and sucked by the solder ball alignment means and the moving table (2) 27 on which the product substrate 1 is mounted are moved in the X, Y, and Z directions, and the solder balls of the suction head 18 are moved. When the solder ball 8 sucked into the suction hole 20 and the solder ball mounting land 2 of the product substrate 1 set on the moving table {circle around (2)} 27 are aligned, and the vacuum in the suction hole 20 is set to atmospheric pressure, The solder ball 8 is fixed to the solder ball mounting land 2 by the adhesive force of the flux 4 (FIGS. 9A, 9B, and 9C). The moving table (2) 27 of the solder ball mounting means may also serve as the moving table (1) 26 of the flux applying means.
[0007]
As described above, the prior art BGA product substrate manufacturing apparatus shown in FIGS. 7 to 9 is intended to be applied to mass production on the premise of automation of the apparatus. Not suitable for large-scale small-lot production. That is, the flux coating means by the screen printing method shown in FIG. 7 requires an expensive screen mask and requires many days to manufacture. This becomes more remarkable as the number of masks increases. The means shown in FIGS. 8 and 9 for sucking the solder ball 8 by vacuum suction into the solder ball suction hole 20 of the suction head is suitable for automation (the solder ball 8 faces downward with respect to the suction head). ), It is a large-scale apparatus, requires a large amount of cost for manufacturing the suction head, and requires many days to manufacture.
SUMMARY OF THE INVENTION In view of the foregoing, it is an object of the present invention to provide an apparatus and a method for manufacturing a BGA product substrate that can be used for a variety of small-quantity production.
[0009]
In order to solve the above-mentioned problems, a manufacturing apparatus for a BGA product board according to the present invention is a means for applying the flux 4 on the solder ball mounting lands 2 of a product board 1 on which an IC chip is mounted. (Hereinafter referred to as flux application means), means for aligning the solder balls 8 on the solder ball alignment plate 13 (hereinafter referred to as solder ball alignment means), and the solder balls 8 aligned and mounted on the solder ball alignment plate 13. Means for mounting on the solder ball mounting land 2 on which the flux 4 of the product substrate 1 is formed (hereinafter, referred to as solder ball mounting means). The flux 4 is dropped on the flux rotation table 6 and fixedly arranged at a predetermined distance from the surface of the flux rotation table 6. Means for forming the flux 4 on the flux rotary table 6 to a predetermined thickness by rotating the flux rotary table 6 with the squeegee 5, and forming the flux 4 on the flux rotary table 6 to a predetermined thickness. The surface of the flux 4 and the convex surface of the flux transfer jig 7 where the portion corresponding to the solder ball mounting land 2 portion of the product substrate 1 is convex are disposed to face each other, and the flux transfer jig 7 is mounted on the flux rotary table. Means for transferring the flux 4 formed on the flux rotating table 6 onto the convex surface of the flux transfer jig 7 by moving the flux transfer jig 7 up and down in the Y direction with respect to the six surfaces; Move in the X direction with respect to the rotary table 6 surface and the product substrate 1 surface set on the mounting jig 3 After the protrusion of the flux transfer jig 7 and the position of the solder ball mounting land 2 of the product substrate 1 are located, the flux transfer jig 7 is moved up and down in the Y direction with respect to the surface of the product substrate 1, Means for transferring the flux 4 of the convex surface of the flux transfer jig 7 onto the solder ball mounting lands 2, wherein the solder ball aligning means includes a portion corresponding to the solder ball mounting lands 2 of the product substrate 1. The solder ball alignment mask 11 having an opening 10 at a location corresponding to the solder ball mounting land 2 of the product substrate 1 is placed on the solder ball alignment plate 13 having a concave shape. The solder ball storing squeegee 9 is set on the solder ball aligning mask 11 by placing the recess of the plate 13 and the mask opening 10 so as to coincide with each other. The solder balls 8 are put into the ball storage squeegee 9 in contact with the solder ball alignment mask 11, and the solder ball storage squeegee 9 is placed on the solder ball alignment mask 11 with respect to the surface of the solder ball alignment mask 11. Means for aligning the solder balls 8 in the recesses of the solder ball alignment plate 13 through the mask opening 10 by moving in the X direction, wherein the solder ball mounting means is provided on the product substrate 1 through the flux applying means; Is mounted on the rotary arm 14, and the rotary arm 14 is rotated by 180 degrees from the rotary shaft 16 as a starting point, so that the solder ball mounting land 2 of the product substrate 1 mounted on the rotary arm 14 and the solder ball aligning means The solder balls 8 aligned with the recesses of the solder ball alignment plate 13 that have passed through It is characterized by comprising means for adhering the ball mounting lands 2 and the solder balls 8 via the flux 4.
In the above-described apparatus for manufacturing the BGA product substrate 1 of the present invention, the flux 4 applying means is the transfer means, and the solder ball aligning means is the solder ball 8 through the opening of the mask. In the solder ball mounting means, the product substrate 1 on which the flux 4 was applied to the solder ball mounting lands 2 by the above-described transfer means was placed on the rotating arm 14, and the rotating arm 14 was rotated by 180 degrees. Since the means for attaching the solder balls 8 aligned in the solder ball alignment holes 15 of the solder ball alignment plate 13 to the flux 4 formed on the surface of the solder ball mounting land 2 is used at the position, a large-scale apparatus is not required. Also, the jigs such as the flux transfer jig 7, the solder ball alignment plate 13, and the solder ball alignment mask 11 can be easily manufactured in a single time. It realized an apparatus for manufacturing a BGA product substrate 1 which is suitable for small production.
Further, in the method of manufacturing the BGA product substrate 1 of the present invention, the step of applying the flux 4 on the solder ball mounting lands 22 of the product substrate 1 on which the IC chip is mounted (hereinafter referred to as a flux application step), A step of aligning the balls 8 on the solder ball aligning plate 13 (hereinafter referred to as a solder ball aligning step), and forming the solder balls 8 aligned on the solder ball aligning plate 13 by the flux 4 of the product substrate 1 Mounting on the solder ball mounting land 22 (hereinafter referred to as “solder ball mounting step”), wherein the flux applying step includes the step of mounting a predetermined thickness on the flux rotating table 6. The portion corresponding to the solder ball mounting lands 2 of the product substrate 1 is convex. A step of transferring the flux 4 formed on the convex surface of the flux transfer jig 7 to the solder ball mounting land 2 of the product substrate 1; The aligning step includes, on the solder ball alignment plate 13 having a concave portion corresponding to the solder ball mounting land 2 portion of the product substrate 1, a portion corresponding to the solder ball mounting land 2 portion of the product substrate 1. A solder ball alignment mask 11 having an opening 10 is placed, the solder ball storage squeegee 9 is set on the solder ball alignment mask 11, and the solder ball alignment mask 11 is placed in the solder ball storage squeegee 9. The solder ball 8 is thrown in contact with the solder ball storage squeegee 9 while moving the solder ball storage squeegee 9 on the solder ball alignment mask 11. The solder balls 8 are aligned in the recesses of the solder ball alignment plate 13. The solder ball mounting step includes placing the product substrate 1 that has been subjected to the flux applying step on a rotary arm 14, The solder ball 14 is rotated by 180 degrees from the rotation axis 16 as a starting point, and the solder ball mounting land 2 of the product substrate 1 placed on the rotary arm 14 and the solder ball of the solder ball alignment plate 13 passed through the solder ball alignment means. A step of contacting the solder balls 8 aligned with the alignment holes 15 so as to face each other, and attaching the solder balls 8 to the solder ball mounting lands 2 of the product substrate 1 via the flux 4. .
In the method of manufacturing a BGA product substrate according to the present invention, the flux applying step is performed by a transfer method, and the solder ball aligning step aligns the solder balls 8 from the mask openings 10 to the recesses of the solder ball aligning plate 13. The solder ball mounting means rotates the product substrate 1 having undergone the flux application step from an upward state to a downward state when the product substrate 1 is turned downward. And the solder balls 8 having undergone the solder ball alignment process are opposed to each other, so that the jigs such as the flux transfer jig 7, the solder ball alignment plate 13, and the solder ball alignment mask 11 can be easily manufactured in a single time. This has made it possible to significantly reduce the number of days required for manufacturing BGA product substrates and to significantly reduce costs in the production of various types and small quantities.
[0013]
Embodiments of the present invention will be described below with reference to the drawings.
(Embodiment 1) FIGS. 1 (a) to 1 (g) are sectional views of an apparatus and a process for explaining a means and a process for applying a flux 4 to a solder ball mounting land 2 of a BGA product substrate. FIG. 2 shows a plan view of FIG. FIGS. 3A to 3E are cross-sectional views of an apparatus and a process for explaining a means and a process for aligning the solder balls 8. FIGS. 4B to 4F are cross-sectional views of an apparatus and a process for explaining means and steps for mounting the aligned solder balls 8 on the solder ball mounting lands 2 to which the flux 4 has been applied. FIG. 3A is a plan view of FIG. 3B.
First, referring to FIGS. 1 (a) to 1 (g) and FIG. 2, the flux applying means and steps of the present invention will be described.
An appropriate amount of flux 4 (commercial solder paste flux 4 for soldering) is dropped on the flux rotating table 6 using a syringe, and when the flux rotating table 6 is rotated, a predetermined gap is formed between the flux rotating table 6 and the surface. The flux 4 having a required thickness is applied onto the flux rotating table 6 by the squeegee 5 fixed and installed separately. A flux transfer jig 7 is provided on the flux rotation table 6. (FIG. 1 (a)) The transfer jig 7 has a convex portion at the portion corresponding to the solder ball mounting land 2 of the product substrate 1, and the convex surface faces the flux rotating table 6 surface.
Next, the flux transfer jig 7 moves vertically and horizontally. The flux transfer jig 7 descends to transfer the flux 4 applied to the surface of the flux rotating table 6 onto the convex surface of the transfer jig. (FIG. 1 (b), (c))
The flux transfer jig 7 rises, moves to the left, descends from just above the product substrate 1, and makes contact between the convex portion of the flux transfer jig 7 and the solder ball mounting land 2 of the product substrate 1. Let it. (FIGS. 1 (d), 4 (e), (f)) Next, when the flux transfer jig 7 is moved upward, the flux 4 of the convex portion of the flux transfer jig 7 is mounted on the product substrate 1 by solder balls. Transferred to land 2. (Fig. 1 (g))
As described above, the flux applying means and process of the present invention are suitable for small-quantity production of various types because the flux transfer jig 7 can be simplified. That is, the projections of the flux transfer jig 7 can be formed easily and in a short time by machining such as NC milling using a metal substrate or a resin substrate. Also, it can be easily achieved by using a photo-etching technique. This is a method in which a photosensitive dry film is attached to a substrate and exposed and developed to form a projection with a photosensitive resin, or to photo-etch a film formed on the substrate. Also, a BGA product substrate can be used as the flux transfer jig 7. That is, the solder ball mounting lands 2 of the BGA product substrate serve as projections of the flux transfer jig 7.
Next, the solder ball aligning means and steps of the present invention will be described with reference to FIGS.
The solder ball alignment mask 11 in which the mask opening 10 is formed is reinforced by spacers 12 except for the mask opening 10. Immediately below the mask opening 10, the place where the solder ball 8 is mounted is concave. The solder ball alignment plate 13 which is a solder ball alignment hole 15 is arranged. The solder ball storage squeegee 9 is placed on the solder ball alignment mask 11, and the solder balls 8 are put into the solder ball storage squeegee 9. (FIGS. 3A and 3B)
Next, the solder ball storage squeegee 9 is moved from left to right, and the solder ball 8 is placed in the solder ball alignment hole 15 of the solder ball alignment plate 13 through the mask opening 10 of the solder ball alignment mask 11. . (FIGS. 3 (c), (d), (e))
As described above, the solder ball alignment means and process of the present invention are suitable for mass production of various types because the solder ball alignment mask 11 and the solder ball alignment plate 13 can be easily formed. That is, the formation of the mask opening 10 of the solder ball alignment mask 11 and the formation of the solder ball alignment holes 15 of the solder ball alignment plate 13 can be easily and quickly performed by using a metal substrate or a resin substrate by machining such as NC milling. Can be done. Also, it can be easily achieved by using a photo-etching technique. A method in which the substrate is etched by a photo-etching technique to form a mask opening 10 of the solder ball alignment mask 11 or a method of exposing and developing to form a solder ball alignment hole 15 of the solder ball alignment plate 13 with a photosensitive resin is adopted. it can.
Referring to FIGS. 4A to 4F, the solder ball mounting means and the steps of the present invention will be described.
The product substrate 1 on which the flux 4 has been applied to the solder ball mounting lands 2 is fixedly set on the rotating arm 14. (FIG. 4 (a))
Next, the rotary arm 14 is rotated 180 degrees about the rotary shaft 18 as a fulcrum. The solder balls 8 mounted on the solder ball alignment holes 15 of the solder ball alignment plate 13 are adhered to the flux 4 applied on the solder ball mounting lands 2 of the product substrate 1 fixedly mounted on the rotating arm 14. . The solder ball alignment plate 13 is fixed to a solder ball alignment plate fixing plate 28. (FIGS. 4 (b), (c), (d))
Next, the rotary arm 14 is rotated 180 degrees about the rotary shaft 18 as a fulcrum, and returned to the mounting jig 3. (FIGS. 4E and 4F)
As described above, the mounting means and process of the solder ball 8 of the present invention can be performed by setting the positional relationship between the rotary arm 14 and the solder ball aligning plate 13 first, and then the specification of the product substrate 1 (the quantity of the solder ball 8). , Dimensions), the position of the product board 1 mounted on the rotary arm 14 always coincides with the position of the solder ball alignment plate 13, so that it can be said that this is suitable for various kinds of small-quantity production.
(Embodiment 2) Another embodiment is shown in FIGS.
FIGS. 5A to 5D show another embodiment of the solder ball aligning means and the steps of the present invention. The solder ball alignment plate 13 and the solder ball alignment mask 11 are set on the positioning jig 21 to which the guide pins 22 are fixed, and the horseshoe-shaped solder ball storage squeegee 9 is placed on the solder ball alignment mask 11, and the solder balls are arranged. The solder balls 8 are evenly distributed in the storage squeegee 9. (FIG. 5 (a))
Next, the squeegee 9 for storing the solder balls 8 is moved to be aligned with the solder ball alignment holes 15 of the solder ball alignment plate 13 through the mask openings 10 of the solder ball alignment mask 11. (FIGS. 5B and 5C)
Next, the solder ball alignment mask 11 is removed through the guide pins 22. (FIG. 5 (d))
As described above, since the solder ball aligning means and the process are performed by the guide pins 22 fixed to the positioning jig 21, the alignment between the solder ball aligning plate 13 and the solder ball aligning mask 11 is performed simply. , It will be a handy thing.
Another solder ball mounting means and process according to the present invention will be described with reference to FIGS.
The product board positioning jig 23 is placed on the positioning jig 21 shown in FIG. 5D on which the solder ball alignment plate 13 in which the solder balls 8 are aligned in the solder ball alignment holes 15 is mounted. Then, the product substrate 1 in which the flux 4 is applied to the solder ball mounting land 2 in the opening of the product substrate positioning jig is set so that the surface of the solder ball mounting land 2 and the solder ball 8 of the solder ball alignment plate 13 face each other. (FIGS. 6A and 6B)
Next, the positioning jig 21, the solder ball alignment plate 13, the product substrate 1, and the product substrate positioning jig 23 shown in FIG. 6B are turned over and placed on the product substrate fixing plate 24. Vibration is applied from above the positioning jig 21 with an impact bar 25 to cause the solder balls 8 to adhere to the flux 4 on the solder ball mounting lands 2 of the product substrate 1. (FIG. 6 (c))
Next, when the positioning jig 21 and the solder ball alignment mask 11 are removed from the product substrate 1 on the product substrate fixing plate 24, the solder balls 8 are mounted on the solder ball mounting lands 2 of the product substrate 1. (FIG. 6 (d))
As described above, the solder ball mounting means and the process are for positioning the solder ball alignment plate 13 and the solder ball alignment mask 11 by the guide pins 22 fixed to the positioning jig 21. Simple and convenient. Although the number of the solder ball mounting lands 2 of the product substrate 1 shown in FIGS. 1 to 9 has been described as being 16, the actual number of the solder ball mounting lands 2 of the product substrate 1 is 300 to 1000. Is commonly used. In the future, the number of the solder ball mounting lands 2 tends to increase as the density of the BGA product substrate is reduced. Therefore, it can be said that the value of the apparatus and method for manufacturing the BGA product substrate of the present invention is further increased. .
According to the apparatus for manufacturing the BGA product substrate 1 of the present invention, the flux applying means is the transfer means, and the solder ball aligning means is to place the solder balls 8 from the mask openings 10 into the solder ball aligning holes 15 of the solder ball aligning plate 13. The aligning means and the solder ball mounting means are placed on the rotating arm 14 by placing the product substrate 1 on which the flux 4 has been applied to the solder ball mounting lands 2 by the above-described transfer means, and rotating the rotating arm 14 by 180 degrees. Since the means for attaching the solder balls 8 aligned in the solder ball alignment holes 15 of the solder ball alignment plate 13 to the flux 4 formed on the surface of the solder ball mounting land 2 is used, a large-scale apparatus is not used. Also, the jigs such as the flux transfer jig 7, the solder ball alignment plate 13, and the solder ball alignment mask 11 can be easily manufactured in a single time. It realized an apparatus for manufacturing a BGA product substrate suitable for production.
Further, in the method of manufacturing a BGA product substrate according to the present invention, the flux applying step is performed by a transfer method, and the solder ball aligning step is to insert the solder balls 8 from the mask openings 10 into the solder ball aligning holes of the solder ball aligning plate 13. 15, the solder ball mounting means rotates the product substrate 1 after the above-mentioned flux application step from an upward state to a downward state, and mounts the solder ball on the product substrate 1. Since the land 2 and the solder ball 8 having undergone the solder ball alignment step face each other, the jigs such as the flux transfer jig 7, the solder ball alignment plate 13, and the solder ball alignment mask 11 can be easily and in a single time. This has made it possible to significantly reduce the number of days required to manufacture BGA product boards and reduce costs in large-scale production of various types.
[Brief description of the drawings]
1 (a) to 1 (g) are a device and a process sectional view for explaining a means and a process for applying a flux 4 to a solder ball mounting land 2 of a BGA product substrate.
FIG. 2 shows a plan view of FIG. 1 (a).
3 (a) to 3 (e) are cross-sectional views of a device and a process for explaining a means and a process for aligning solder balls 8. FIG.
FIGS. 4 (b) to 4 (f) are cross-sectional views of a device and a process for explaining means and steps for mounting the aligned solder balls 8 on the solder ball mounting lands 2 to which the flux 4 has been applied.
FIGS. 5 (a) to 5 (d) show another embodiment of the present invention and are a device and a process sectional view for explaining means and steps for aligning solder balls 8. FIGS.
FIGS. 6 (a) to 6 (e) show another embodiment of the present invention, and are an apparatus and a process sectional view for explaining means and steps for mounting a solder ball 8. FIGS.
FIGS. 7 (a) to 7 (e) show a prior art and show an apparatus and a process cross-sectional view for explaining a means and a process for applying a flux 4 to a solder ball mounting land 2 of a BGA product substrate. FIGS. FIGS. 1A to 1C show a prior art, and show an apparatus and a process cross-sectional view for explaining a means and a process for aligning solder balls 8.
9 (a) to 9 (c) are related arts, and show an apparatus and a process cross-sectional view for explaining means and a process for mounting a solder ball 8. FIG.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 product board 2 solder ball mounting land terminal 3 mounting jig 4 flux 5 squeegee 6 flux rotating table 7 flux transfer jig 8 solder ball 9 solder ball storage squeegee 10 mask opening 11 solder ball alignment mask 12 spacer 13 solder ball alignment plate 14 Rotating arm 15 Solder ball alignment hole 16 Rotating shaft 17 Screen mask 18 Suction head 19 Pot 20 Solder ball suction hole 21 Positioning jig 22 Guide pin 23 Product board positioning jig 24 Product board fixing plate 25 Impact rod 26 Moving table (1)
27 Moving table (2)
28 Solder ball alignment plate fixing plate

DETAILED DESCRIPTION OF THE INVENTION
[0002]
2. Description of the Related Art An apparatus for manufacturing a BGA product board on which a solder ball 8 is mounted on a solder ball mounting land 2 of a product board 1 on which an IC chip is mounted is equipped with the solder ball mounting land 2 of the product board 1 on which circuit wiring is provided. Means for applying the flux 4 thereon (hereinafter referred to as flux applying means), means for arranging the solder balls 8 (hereinafter referred to as solder ball arranging means), and solder balls 8 aligned by the solder ball arranging means. Means for mounting on the solder ball mounting land 2 on which the flux 4 of the substrate 1 is formed (hereinafter, referred to as solder ball mounting means). The above means are mass-produced by an automated apparatus.
[0007]
As described above, the prior art BGA product substrate manufacturing apparatus shown in FIGS. 7 to 9 is intended to be applied to mass production on the premise of automation of the apparatus. It is not suitable for small to medium volume production. That is, the flux coating means by the screen printing method shown in FIG. 7 requires an expensive screen mask and requires many days to manufacture. This becomes more remarkable as the number of masks increases. The means shown in FIGS. 8 and 9 for sucking the solder ball 8 by vacuum suction into the solder ball suction hole 20 of the suction head is suitable for automation (the solder ball 8 faces downward with respect to the suction head). ), It is a large-scale apparatus, requires a large amount of cost for manufacturing the suction head, and requires many days to manufacture.
SUMMARY OF THE INVENTION In view of the foregoing, it is an object of the present invention to provide an apparatus and a method for manufacturing a BGA product substrate that can be used for a variety of small to medium-volume production.
[0009]
In order to solve the above-mentioned problems, a manufacturing apparatus for a BGA product board according to the present invention is a means for applying the flux 4 on the solder ball mounting lands 2 of a product board 1 on which circuit wiring is provided. (Hereinafter referred to as flux application means), means for aligning the solder balls 8 on the solder ball alignment plate 13 (hereinafter referred to as solder ball alignment means), and the solder balls 8 aligned and mounted on the solder ball alignment plate 13. Means for mounting on the solder ball mounting land 2 on which the flux 4 of the product substrate 1 is formed (hereinafter, referred to as solder ball mounting means). The flux 4 was dropped on the flux rotating table 6 and fixedly arranged at a predetermined interval from the surface of the flux rotating table 6. Means for forming the flux 4 to a predetermined thickness on the flux rotation table 6 by rotating the flux rotation table 6 with a squeegee 5; and forming the flux 4 to a predetermined thickness on the flux rotation table 6 A surface of the flux transfer jig 7 whose surface and a portion corresponding to the solder ball mounting land 2 portion of the product substrate 1 are convex is disposed to face each other, and the flux transfer jig 7 is placed on the surface of the flux rotary table 6. Means for moving the flux 4 formed on the flux rotary table 6 on the convex surface of the flux transfer jig 7 by moving the flux transfer jig 7 up and down in the Y direction. 6 in the X direction with respect to the product substrate 1 set on the mounting jig 3 After the projections of the flux transfer jig 7 and the positions of the solder ball mounting lands 2 of the product substrate 1 are located, the flux transfer jig 7 is moved up and down in the Y direction with respect to the surface of the product substrate 1, and The flux transfer jig 7 includes a means for transferring the flux 4 of the convex surface onto the solder ball mounting land 2. The solder ball alignment means includes a portion corresponding to the solder ball mounting land 2 portion of the product substrate 1. The solder ball alignment mask 11 having an opening 10 at a position corresponding to the solder ball mounting land 2 portion of the product substrate 1 is placed on the concave solder ball alignment plate 13. 13 and the mask opening 10 are aligned, and the solder ball storage squeegee 9 is set on the solder ball alignment mask 11. The solder balls 8 are put into the storage ball squeegee 9 in contact with the solder ball alignment mask 11, and the solder ball storage squeegee 9 is placed on the solder ball alignment mask 11 with respect to the surface of the solder ball alignment mask 11. Means for aligning the solder balls 8 in the recesses of the solder ball alignment plate 13 through the mask opening 10 by moving in the X direction, wherein the solder ball mounting means is provided on the product substrate 1 through the flux applying means; Is mounted on the rotary arm 14, and the rotary arm 14 is rotated by 180 degrees from the rotary shaft 16 as a starting point, so that the solder ball mounting land 2 of the product substrate 1 mounted on the rotary arm 14 and the solder ball aligning means The solder balls 8 aligned with the recesses of the solder ball alignment plate 13 that has passed through And a means for adhering the solder mounting land 2 and the solder ball 8 via the flux 4.
In the above-described apparatus for manufacturing the BGA product substrate 1 of the present invention, the flux 4 applying means is the transfer means, and the solder ball aligning means is the solder ball 8 through the opening of the mask. In the solder ball mounting means, the product substrate 1 on which the flux 4 was applied to the solder ball mounting lands 2 by the above-described transfer means was placed on the rotating arm 14, and the rotating arm 14 was rotated by 180 degrees. Since the means for attaching the solder balls 8 aligned in the solder ball alignment holes 15 of the solder ball alignment plate 13 to the flux 4 formed on the surface of the solder ball mounting land 2 is used at the position, a large-scale apparatus is not required. Also, the jigs such as the flux transfer jig 7, the solder ball alignment plate 13, and the solder ball alignment mask 11 can be easily manufactured in a single time. It realized an apparatus for manufacturing a BGA product substrate 1 which is suitable for low to medium volume production.
Further, in the method of manufacturing the BGA product substrate 1 of the present invention, the step of applying the flux 4 on the solder ball mounting lands 22 of the product substrate 1 on which the circuit wiring is provided (hereinafter, referred to as a flux application step), A step of aligning the balls 8 on the solder ball aligning plate 13 (hereinafter referred to as a solder ball aligning step), and forming the solder balls 8 aligned on the solder ball aligning plate 13 by the flux 4 of the product substrate 1 Mounting on the solder ball mounting land 22 (hereinafter referred to as “solder ball mounting step”), wherein the flux applying step includes the step of mounting a predetermined thickness on the flux rotating table 6. The flux 4 formed on the product substrate 1 has a convex portion corresponding to the solder ball mounting land 2 portion. A step of transferring the flux 4 formed on the projecting surface of the flux transfer jig 7 to the solder ball mounting land 2 of the product substrate 1. The aligning step includes, on the solder ball alignment plate 13 having a concave portion corresponding to the solder ball mounting land 2 portion of the product substrate 1, a portion corresponding to the solder ball mounting land 2 portion of the product substrate 1. A solder ball alignment mask 11 having an opening 10 is placed, the solder ball storage squeegee 9 is set on the solder ball alignment mask 11, and the solder ball alignment mask 11 is placed in the solder ball storage squeegee 9. The solder ball 8 is thrown in contact with the solder ball storage squeegee 9 while moving the solder ball storage squeegee 9 on the solder ball alignment mask 11. Aligning the solder balls 8 in the recesses of the solder ball alignment plate 13. The solder ball mounting step includes placing the product substrate 1 that has undergone the flux application step on a rotary arm 14, The solder ball 14 is rotated by 180 degrees from the rotation axis 16 as a starting point, and the solder ball mounting land 2 of the product substrate 1 placed on the rotary arm 14 and the solder ball of the solder ball alignment plate 13 passed through the solder ball alignment means. A step of contacting the solder balls 8 aligned with the alignment holes 15 so as to face each other, and attaching the solder balls 8 to the solder ball mounting lands 2 of the product substrate 1 via the flux 4. .
In the method of manufacturing a BGA product substrate according to the present invention, the flux applying step is performed by a transfer method, and the solder ball aligning step aligns the solder balls 8 from the mask openings 10 to the recesses of the solder ball aligning plate 13. The solder ball mounting means rotates the product substrate 1 having undergone the flux application step from an upward state to a downward state when the product substrate 1 is turned downward. And the solder balls 8 having undergone the solder ball alignment process are opposed to each other, so that the jigs such as the flux transfer jig 7, the solder ball alignment plate 13, and the solder ball alignment mask 11 can be easily manufactured in a single time. This has made it possible to significantly reduce the number of days required for manufacturing BGA product substrates and to significantly reduce costs in a wide variety of small to medium-volume production.
As described above, the flux applying means and process of the present invention are suitable for small to medium-volume production because the flux transfer jig 7 can be easily formed. That is, the projections of the flux transfer jig 7 can be formed easily and in a short time by machining such as NC milling using a metal substrate or a resin substrate. Also, it can be easily achieved by using a photo-etching technique. This is a method in which a photosensitive dry film is attached to a substrate and exposed and developed to form a projection with a photosensitive resin, or to photo-etch a film formed on the substrate. Also, a BGA product substrate can be used as the flux transfer jig 7. That is, the solder ball mounting lands 2 of the BGA product substrate serve as projections of the flux transfer jig 7.
As described above, the solder ball aligning means and process of the present invention can be easily applied to the solder ball aligning mask 11 and the solder ball aligning plate 13, so that it is suitable for various kinds of medium-volume production. That is, the formation of the mask opening 10 of the solder ball alignment mask 11 and the formation of the solder ball alignment holes 15 of the solder ball alignment plate 13 can be easily and quickly performed by using a metal substrate or a resin substrate by machining such as NC milling. Can be done. Also, it can be easily achieved by using a photo-etching technique. A method in which the substrate is etched by a photo-etching technique to form a mask opening 10 of the solder ball alignment mask 11 or a method of exposing and developing to form a solder ball alignment hole 15 of the solder ball alignment plate 13 with a photosensitive resin is adopted. it can.
As described above, the mounting means and process of the solder ball 8 of the present invention can be performed by setting the positional relationship between the rotary arm 14 and the solder ball aligning plate 13 first, and then the specification of the product substrate 1 (the quantity of the solder ball 8). , Dimensions), the position of the product board 1 placed on the rotating arm 14 always coincides with the position of the solder ball alignment plate 13, so that it can be said that this is suitable for a wide variety of small to medium-volume production.
As described above, since the solder ball aligning means and the process are performed by the guide pins 22 fixed to the positioning jig 21, the alignment between the solder ball aligning plate 13 and the solder ball aligning mask 11 is performed simply. , It becomes simple.
The product board positioning jig 23 is placed on the positioning jig 21 shown in FIG. 5D on which the solder ball alignment plate 13 in which the solder balls 8 are aligned in the solder ball alignment holes 15 is mounted. Then, the product substrate 1 in which the flux 4 is applied to the solder ball mounting land 2 in the opening of the product substrate positioning jig is set so that the surface of the solder ball mounting land 2 and the solder ball 8 of the solder ball alignment plate 13 face each other. (FIGS. 6A and 6B)
According to the apparatus for manufacturing a BGA product substrate 1 of the present invention, the flux applying means is the transfer means, and the solder ball aligning means is the solder balls 8 from the mask openings 10 to the solder ball aligning holes 15 of the solder ball aligning plate 13. The aligning means and the solder ball mounting means are placed on the rotating arm 14 by placing the product substrate 1 on which the flux 4 has been applied to the solder ball mounting lands 2 by the above-described transfer means, and rotating the rotating arm 14 by 180 degrees. Since the means for attaching the solder balls 8 aligned in the solder ball alignment holes 15 of the solder ball alignment plate 13 to the flux 4 formed on the surface of the solder ball mounting land 2 is used, a large-scale apparatus is not used. Also, the jigs such as the flux transfer jig 7, the solder ball alignment plate 13, and the solder ball alignment mask 11 can be easily manufactured in a single time. It realized an apparatus for manufacturing a BGA product substrate suitable for medium production volumes.

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[0002]
2. Description of the Related Art An apparatus for manufacturing a BGA product board on which a solder ball 8 is mounted on a solder ball mounting land 2 of a product board 1 on which an IC chip is mounted is equipped with the solder ball mounting land 2 of the product board 1 on which circuit wiring is provided. Means for applying the flux 4 thereon (hereinafter referred to as flux applying means), means for arranging the solder balls 8 (hereinafter referred to as solder ball arranging means), and solder balls 8 aligned by the solder ball arranging means. Means for mounting on the solder ball mounting land 2 on which the flux 4 of the substrate 1 is formed (hereinafter, referred to as solder ball mounting means). The above means are mass-produced by an automated apparatus.

[0007]
As described above, the prior art BGA product substrate manufacturing apparatus shown in FIGS. 7 to 9 is intended to be applied to mass production on the premise of automation of the apparatus. It is not suitable for small to medium volume production. That is, the flux coating means by the screen printing method shown in FIG. 7 requires an expensive screen mask and requires many days to manufacture. This becomes more remarkable as the number of masks increases. The means shown in FIGS. 8 and 9 for sucking the solder ball 8 by vacuum suction into the solder ball suction hole 20 of the suction head is suitable for automation (the solder ball 8 faces downward with respect to the suction head). ), It is a large-scale apparatus, requires a large amount of cost for manufacturing the suction head, and requires many days to manufacture.

SUMMARY OF THE INVENTION In view of the foregoing, it is an object of the present invention to provide an apparatus and a method for manufacturing a BGA product substrate that can be used for a variety of small to medium-volume production.

[0009]
In order to solve the above-mentioned problems, a manufacturing apparatus for a BGA product board according to the present invention is a means for applying the flux 4 on the solder ball mounting lands 2 of a product board 1 on which circuit wiring is provided. (Hereinafter referred to as flux application means), means for aligning the solder balls 8 on the solder ball alignment plate 13 (hereinafter referred to as solder ball alignment means), and the solder balls 8 aligned and mounted on the solder ball alignment plate 13. Means for mounting on the solder ball mounting land 2 on which the flux 4 of the product substrate 1 is formed (hereinafter, referred to as solder ball mounting means). The flux 4 was dropped on the flux rotating table 6 and fixedly arranged at a predetermined interval from the surface of the flux rotating table 6. Means for forming the flux 4 to a predetermined thickness on the flux rotation table 6 by rotating the flux rotation table 6 with a squeegee 5; and forming the flux 4 to a predetermined thickness on the flux rotation table 6 A surface of the flux transfer jig 7 whose surface and a portion corresponding to the solder ball mounting land 2 portion of the product substrate 1 are convex is disposed to face each other, and the flux transfer jig 7 is placed on the surface of the flux rotary table 6. Means for moving the flux 4 formed on the flux rotary table 6 on the convex surface of the flux transfer jig 7 by moving the flux transfer jig 7 up and down in the Y direction. 6 in the X direction with respect to the product substrate 1 set on the mounting jig 3 After the projections of the flux transfer jig 7 and the positions of the solder ball mounting lands 2 of the product substrate 1 are located, the flux transfer jig 7 is moved up and down in the Y direction with respect to the surface of the product substrate 1, and The flux transfer jig 7 includes a means for transferring the flux 4 of the convex surface onto the solder ball mounting land 2. The solder ball alignment means includes a portion corresponding to the solder ball mounting land 2 portion of the product substrate 1. The solder ball alignment mask 11 having an opening 10 at a position corresponding to the solder ball mounting land 2 portion of the product substrate 1 is placed on the concave solder ball alignment plate 13. 13 and the mask opening 10 are aligned, and the solder ball storage squeegee 9 is set on the solder ball alignment mask 11. The solder balls 8 are put into the storage ball squeegee 9 in contact with the solder ball alignment mask 11, and the solder ball storage squeegee 9 is placed on the solder ball alignment mask 11 with respect to the surface of the solder ball alignment mask 11. Means for aligning the solder balls 8 in the recesses of the solder ball alignment plate 13 through the mask opening 10 by moving in the X direction, wherein the solder ball mounting means is provided on the product substrate 1 through the flux applying means; Is mounted on the rotary arm 14, and the rotary arm 14 is rotated by 180 degrees from the rotary shaft 16 as a starting point, so that the solder ball mounting land 2 of the product substrate 1 mounted on the rotary arm 14 and the solder ball aligning means The solder balls 8 aligned with the recesses of the solder ball alignment plate 13 that has passed through And a means for adhering the solder mounting land 2 and the solder ball 8 via the flux 4.

In the above-described apparatus for manufacturing the BGA product substrate 1 of the present invention, the flux 4 applying means is the transfer means, and the solder ball aligning means is the solder ball 8 through the opening of the mask. In the solder ball mounting means, the product substrate 1 on which the flux 4 was applied to the solder ball mounting lands 2 by the above-described transfer means was placed on the rotating arm 14, and the rotating arm 14 was rotated by 180 degrees. Since the means for attaching the solder balls 8 aligned in the solder ball alignment holes 15 of the solder ball alignment plate 13 to the flux 4 formed on the surface of the solder ball mounting land 2 is used at the position, a large-scale apparatus is not required. Also, the jigs such as the flux transfer jig 7, the solder ball alignment plate 13, and the solder ball alignment mask 11 can be easily manufactured in a single time. It realized an apparatus for manufacturing a BGA product substrate 1 which is suitable for low to medium volume production.

Further, in the method of manufacturing the BGA product substrate 1 of the present invention, the step of applying the flux 4 on the solder ball mounting lands 22 of the product substrate 1 on which the circuit wiring is provided (hereinafter, referred to as a flux application step), A step of aligning the balls 8 on the solder ball aligning plate 13 (hereinafter referred to as a solder ball aligning step), and forming the solder balls 8 aligned on the solder ball aligning plate 13 by the flux 4 of the product substrate 1 Mounting on the solder ball mounting land 22 (hereinafter referred to as “solder ball mounting step”), wherein the flux applying step includes the step of mounting a predetermined thickness on the flux rotating table 6. The flux 4 formed on the product substrate 1 has a convex portion corresponding to the solder ball mounting land 2 portion. A step of transferring the flux 4 formed on the projecting surface of the flux transfer jig 7 to the solder ball mounting land 2 of the product substrate 1. The aligning step includes, on the solder ball alignment plate 13 having a concave portion corresponding to the solder ball mounting land 2 portion of the product substrate 1, a portion corresponding to the solder ball mounting land 2 portion of the product substrate 1. A solder ball alignment mask 11 having an opening 10 is placed, the solder ball storage squeegee 9 is set on the solder ball alignment mask 11, and the solder ball alignment mask 11 is placed in the solder ball storage squeegee 9. The solder ball 8 is thrown in contact with the solder ball storage squeegee 9 while moving the solder ball storage squeegee 9 on the solder ball alignment mask 11. Aligning the solder balls 8 in the recesses of the solder ball alignment plate 13. The solder ball mounting step includes placing the product substrate 1 that has undergone the flux application step on a rotary arm 14, The solder ball 14 is rotated by 180 degrees from the rotation axis 16 as a starting point, and the solder ball mounting land 2 of the product substrate 1 placed on the rotary arm 14 and the solder ball of the solder ball alignment plate 13 passed through the solder ball alignment means. A step of contacting the solder balls 8 aligned with the alignment holes 15 so as to face each other, and attaching the solder balls 8 to the solder ball mounting lands 2 of the product substrate 1 via the flux 4. .

In the method of manufacturing a BGA product substrate according to the present invention, the flux applying step is performed by a transfer method, and the solder ball aligning step aligns the solder balls 8 from the mask openings 10 to the recesses of the solder ball aligning plate 13. The solder ball mounting means rotates the product substrate 1 having undergone the flux application step from an upward state to a downward state when the product substrate 1 is turned downward. And the solder balls 8 having undergone the solder ball alignment process are opposed to each other, so that the jigs such as the flux transfer jig 7, the solder ball alignment plate 13, and the solder ball alignment mask 11 can be easily manufactured in a single time. This has made it possible to significantly reduce the number of days required for manufacturing BGA product substrates and to significantly reduce costs in a wide variety of small to medium-volume production.

As described above, the flux applying means and process of the present invention are suitable for small to medium-volume production because the flux transfer jig 7 can be easily formed. That is, the projections of the flux transfer jig 7 can be formed easily and in a short time by machining such as NC milling using a metal substrate or a resin substrate. Also, it can be easily achieved by using a photo-etching technique. This is a method in which a photosensitive dry film is attached to a substrate and exposed and developed to form a projection with a photosensitive resin, or to photo-etch a film formed on the substrate. Also, a BGA product substrate can be used as the flux transfer jig 7. That is, the solder ball mounting lands 2 of the BGA product substrate serve as projections of the flux transfer jig 7.

As described above, the solder ball aligning means and process of the present invention can be easily applied to the solder ball aligning mask 11 and the solder ball aligning plate 13, so that it is suitable for various kinds of medium-volume production. That is, the formation of the mask opening 10 of the solder ball alignment mask 11 and the formation of the solder ball alignment holes 15 of the solder ball alignment plate 13 can be easily and quickly performed by using a metal substrate or a resin substrate by machining such as NC milling. Can be done. Also, it can be easily achieved by using a photo-etching technique. A method in which the substrate is etched by a photo-etching technique to form a mask opening 10 of the solder ball alignment mask 11 or a method of exposing and developing to form a solder ball alignment hole 15 of the solder ball alignment plate 13 with a photosensitive resin is adopted. it can.

As described above, the mounting means and process of the solder ball 8 of the present invention can be performed by setting the positional relationship between the rotary arm 14 and the solder ball aligning plate 13 first, and then the specification of the product substrate 1 (the quantity of the solder ball 8). , Dimensions), the position of the product board 1 placed on the rotating arm 14 always coincides with the position of the solder ball alignment plate 13, so that it can be said that this is suitable for a wide variety of small to medium-volume production.

As described above, since the solder ball aligning means and the process are performed by the guide pins 22 fixed to the positioning jig 21, the alignment between the solder ball aligning plate 13 and the solder ball aligning mask 11 is performed simply. , It becomes simple.

The product board positioning jig 23 is placed on the positioning jig 21 shown in FIG. 5D on which the solder ball alignment plate 13 in which the solder balls 8 are aligned in the solder ball alignment holes 15 is mounted. Then, the product substrate 1 in which the flux 4 is applied to the solder ball mounting land 2 in the opening of the product substrate positioning jig is set so that the surface of the solder ball mounting land 2 and the solder ball 8 of the solder ball alignment plate 13 face each other. (FIGS. 6A and 6B)
According to the apparatus for manufacturing a BGA product substrate 1 of the present invention, the flux applying means is the transfer means, and the solder ball aligning means is the solder balls 8 from the mask openings 10 to the solder ball aligning holes 15 of the solder ball aligning plate 13. The aligning means and the solder ball mounting means are placed on the rotating arm 14 by placing the product substrate 1 on which the flux 4 has been applied to the solder ball mounting lands 2 by the above-described transfer means, and rotating the rotating arm 14 by 180 degrees. Since the means for attaching the solder balls 8 aligned in the solder ball alignment holes 15 of the solder ball alignment plate 13 to the flux 4 formed on the surface of the solder ball mounting land 2 is used, a large-scale apparatus is not used. Also, the jigs such as the flux transfer jig 7, the solder ball alignment plate 13, and the solder ball alignment mask 11 can be easily manufactured in a single time. It realized an apparatus for manufacturing a BGA product substrate suitable for medium production volumes.

Claims (2)

Means for applying the flux (4) on the solder ball mounting land (2) of the product substrate (1) on which the IC chip is mounted (hereinafter, referred to as flux applying means); Means for arranging the solder balls (8) (hereinafter referred to as solder ball arranging means), the solder balls (8) aligned and mounted on the solder ball arranging plate (13), and (4) means for mounting on the solder ball mounting land (2) on which the solder ball mounting land (2) is formed (hereinafter referred to as solder ball mounting means). The flux (4) is dropped on the table (6), and the squeegee 5 is fixedly arranged at a predetermined distance from the surface of the flux rotating table (6). Means for forming the flux (4) to a predetermined thickness on the flux rotation table (6) by rotating the flux rotation table (6), and forming the flux (4) to a predetermined thickness on the flux rotation table (6). The flux (4) surface and the convex surface of the flux transfer jig (7) in which a portion corresponding to the solder ball mounting land (2) portion of the product substrate (1) is convex are disposed so as to face each other. The flux transfer jig (7) was moved up and down in the Y direction with respect to the surface of the flux rotation table (6), and was formed on the flux rotation table (6) on the convex surface of the flux transfer jig (7). The means for transferring the flux (4) and the flux transfer jig (7) were set on the surface of the flux rotary table (6) and the mounting jig (3). After moving in the X direction with respect to the surface of the product substrate (1), there is a projection of the flux transfer jig (7) and a position of the solder ball mounting land (2) of the product substrate (1). The flux transfer jig (7) is moved up and down in the Y direction with respect to the surface of the product substrate (1), and the flux (4) having a convex surface of the flux transfer jig (7) is transferred to the solder ball mounting land (2). ) Means for transferring onto the solder ball aligning means, wherein the solder ball aligning means has a concave portion corresponding to the solder ball mounting land (2) portion of the product substrate (1). The solder ball alignment mask (11) having an opening (10) at a location corresponding to the solder ball mounting land (2) of the product substrate (1) is placed on the solder ball alignment plate (13). Recess and the mask opening (10) are placed so as to match each other, the solder ball storage squeegee (9) is set on the solder ball alignment mask (11), and the solder ball alignment mask is set in the solder ball storage squeegee (9). The solder ball (8) is thrown in contact with (11), and the solder ball storage squeegee (9) is placed on the solder ball alignment mask (11) in the X direction with respect to the surface of the solder ball alignment mask (11). To move the solder ball (8) into the recess of the solder ball alignment plate (13) through the mask opening (10). The solder ball mounting means passes through the flux applying means. The product substrate (1) is placed on a rotating arm (14), and the rotating arm (14) is rotated 180 degrees from a rotating shaft (16) as a starting point, and the product placed on the rotating arm (14) is rotated. The solder ball mounting lands (2) of the substrate (1) and the solder balls (8) aligned with the solder ball alignment holes 15 of the solder ball alignment plate (13) that have passed through the solder ball alignment means face each other. And a means for adhering the solder ball mounting lands (2) of the product substrate (1) and the solder balls (8) via the flux (4). A step of applying a flux (4) on a solder ball mounting land (2) of a product substrate (1) on which an IC chip is mounted (hereinafter, referred to as a flux applying step), and a step of applying a solder ball (8) to a solder ball alignment plate (13). ) (Hereinafter referred to as a solder ball arranging step), wherein the solder balls (8) arranged and mounted on the solder ball arranging plate (13) are combined with the flux (4) of the product substrate (1). A step of mounting on the formed solder ball mounting land (2) (hereinafter referred to as a solder ball mounting step), wherein the flux applying step is performed by the flux rotating table (6). The flux (4) formed on the product board (1) at a position corresponding to the solder ball mounting land (2) portion of the product substrate (1) is convex. Transferring the flux (4) formed on the convex surface of the flux transfer jig (7) to the solder ball mounting land (2) of the product substrate (1). The solder ball alignment step is performed on the solder ball alignment plate (13) having a concave portion corresponding to the solder ball mounting land (2) portion of the product substrate (1). A solder ball alignment mask (11) having an opening (10) at a position corresponding to the solder ball mounting land (2) of the product substrate (1) is placed, and the solder ball alignment mask (11) is placed. The solder ball storage squeegee (9) is set on the solder ball storage squeegee (9), and the solder ball (8) is thrown into the solder ball storage squeegee (9) by contact with the solder ball alignment mask (11). Ski (9) aligning the solder ball (8) in the recess of the solder ball alignment plate (13) through the mask opening (10) while moving the solder ball on the solder ball alignment mask (11); In the ball mounting step, the product substrate (1) that has undergone the flux application step is placed on a rotating arm (14), and the rotating arm (14) is rotated 180 degrees from a rotating shaft (16) as a starting point. The solder ball mounting land (2) of the product board (1) placed on the (14) is aligned with the solder ball alignment hole (15) of the solder ball alignment plate (13) through the solder ball alignment means. Contacting the solder balls (8) so as to face each other, and attaching the solder ball mounting lands (2) of the product substrate (1) to the solder balls (8) via the flux (4). A method for manufacturing a BGA product substrate, comprising:

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