JPH1146096A - Leadless hybrid integrated circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a leadless hybrid integrated circuit device, which is low in cost, thin and moreover is provided with an attracting plate capable of easily realizing mounting automation and corresponds to an automatic mounting, without being accompanied by an increase in the size of the external shape of the device to a leadless hybrid integrated circuit device being required a decrease in thickness. SOLUTION: A flat plate 16 for suction use is mounted to the central part of a hybrid integrated circuit device 12 with an adhesive resin. The flat plate 16 is provided with spacers for keeping the interval between components mounted to the surface part of the device 12 and an suction plate. The height of the spacers is set in a height of the smallest value conforming to the height of a mounting part, whereby it is made possible to inhibit increase in the size of the device 12 to be a minimum. Moreover, by providing an open part, a notch and a recess in the flat plate 16 with the object of avoiding the external shape of the mounted components, it enables the device 12 to correspond to an automatic mounting, without being accompanied by an increase in the size of the external shape of the device 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a leadless hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device having a thin surface mountable structure and an automatic mounting structure.

[0002]

2. Description of the Related Art Conventionally, as an integrated circuit device having a lead structure and provided with means for receiving a suction nozzle of a mounting machine in order to cope with automatic mounting, for example, Japanese Patent Application Laid-Open No. 5-235490 discloses an integrated circuit device. A surface-mounted hybrid integrated circuit device as shown in a perspective view in FIG. 6 has been proposed in order to be able to surely hold by suction by a nozzle and to enable automatic mounting by a mounting machine of a surface automatic mounting type hybrid integrated circuit device. Japanese Patent Laid-Open Publication No. 3-50793 proposes a hybrid integrated circuit device as shown in FIG. 7 as a perspective view.

Referring to FIG. 6, ceramic wiring board 3
After the external connection lead 4 is mounted on the substrate and the passive element 6 and the active element 5 are mounted, the metal plate 1 for nozzle suction is mounted substantially at the center of the surface of the ceramic wiring board 3. The foot 2 is formed at the corner,
The foot 2 is connected to the ceramic wiring board 3 with the high melting point solder 7.
It has a structure to be joined to.

[0004] Further, referring to FIG.
The external connection lead 4 is attached to the ceramic substrate 3 having the printed resistance element 9, and the electronic component 8 is mounted in a later step, and then the suction pad 11 is adhered. By doing so, the automatic mounting head can be sucked and the hybrid integrated circuit device can be automatically mounted.

Further, as another means, there has been proposed a method of providing a suction area by forming a pattern at the center of the substrate so as to provide an empty space with no components.

[0006]

However, the above prior art has the following problems.

The first problem is that, in the prior art described with reference to FIG. 6, an increase in height and weight of the device itself is expected, and an increase in the size of the device is unavoidable. This leads to increased costs.

[0008] The reason is that the metal plate is arranged at a distance from the upper part of the mounted component using the foot, and the foot is also connected to the high melting point solder so that the mounted component is not affected. This is because it is necessary to arrange them with a gap.

A second problem is that in the prior art described with reference to FIG. 7, the layout of components on the hybrid integrated circuit device is restricted, and finally, the size of the device is increased and the cost is increased. Is that it leads to

[0010] The reason is that it is necessary to form a suction member of about 5 mmφ in the center of the hybrid integrated circuit device.
For this reason, the degree of freedom in wiring and the arrangement of components are restricted, and the size of the substrate is increased.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a leadless hybrid integrated circuit device that is required to be reduced in thickness without increasing the size of the outer shape and at a low cost. It is another object of the present invention to provide a hybrid integrated circuit device which is thin and has a suction plate capable of easily realizing mounting automation and which is compatible with automatic mounting.

[0012]

In order to achieve the above object, a hybrid integrated circuit device for automatic mounting according to the present invention is a leadless hybrid integrated circuit device, wherein the device is attached to a central portion of the device by suction. Therefore, a flat plate is attached by an adhesive resin.

In the present invention, the shape of the flat plate is substantially circular.

Further, the present invention is characterized in that a spacer is provided for keeping an interval between the flat plate and the mounting component.

Further, in the present invention, the flat plate is
It is characterized by having at least one of an opening, a notch, and a recess corresponding to a component mounted on the hybrid integrated circuit device.

[Summary of the Invention] The mounting structure of the suction plate according to the present invention uses a circular flat plate made of heat-resistant resin. The circular flat plate is provided with a plurality of support spacers corresponding to the height of the mounted component on the suction plate mounting surface, instead of the conventional foot shown in FIG.

The circular flat plate itself has a weight and a shape that can be automatically mounted. The adhesion between the circular flat plate and the hybrid integrated circuit device is realized between the flat plate and the mounted components, and between the support spacer and the substrate.

Further, in order to further reduce the thickness, a notch or a square hole corresponding to the outer shape of the mounted component can be provided in the flat plate.

Further, as a substitute for the supporting spacer, it is also possible to substitute a mounting component below the suction plate.

In the present invention, the use of heat-resistant plastic (PPS) or the like makes it possible to easily form a light-weight adsorption plate having a unique shape.

Further, by providing a spacer having a height of about 200 μm from the mounted component or by supporting the mounted component, it is possible to minimize the size of the hybrid integrated circuit device itself.

Further, since the suction plate itself is light in weight, automatic mounting using a mounting machine after application of the adhesive is possible.

As described above, by providing the suction plate with the opening or the cutout recess for allowing the lower mounting component to escape the external shape, it is possible to further reduce the thickness.

[0024]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view for explaining an embodiment of the present invention. Referring to FIG. 1, the hybrid integrated circuit device 12 does not include external leads in order to achieve a reduction in thickness.
End electrode 14 and back electrode (not shown) of wiring substrate 13
Thereby, external terminals are formed. A surface mounting component such as a chip component 15 can be mounted on the surface of the wiring substrate 13. However, in order to support automatic mounting, the surface of the wiring substrate 13 must be , Near the center, 3cmφ ~ corresponding to the suction nozzle diameter
A flat space of 5 cmφ is required.

In this embodiment, a circular flat plate (adsorbing flat plate) 16 made of a heat-resistant plastic is used so as not to be deformed even in an infrared or air reflow oven. The flat plate 16 includes a spacer 17 having a height equal to or larger than the maximum height of the mounted components. However, in the case where the heights of the mounted components at the portion where the flat plate 16 is mounted are uniform, the mounted components can be used instead of the spacers.

In the attaching step of the suction flat plate 16, the chip component 15 is mounted on the wiring board 13 by a solder printing reflow method or the like, and then the contact portion or the suction between the wiring board 13 and the spacer portion 17 of the suction flat plate 16 is provided. The contact portion between the flat plate 16 and the chip component 15 is connected using an adhesive resin or a double-sided adhesive tape.

FIG. 2 is a view for explaining the state of attachment of the suction flat plate 16 according to the embodiment of the present invention. FIG. 2 (A) shows the state before mounting the suction flat plate, and FIG.
FIG. 4 is a diagram showing a state where a suction flat plate is attached. FIG.
The operation and effect of the embodiment of the present invention will be described with reference to FIG. As a result, there is no need to secure a space on the board surface, and the component mounting density does not decrease.

The height of the spacer 17 attached to the suction flat plate 16 is adjusted to the highest value among the components arranged below the suction flat plate, thereby minimizing the increase in the height of the hybrid integrated circuit device 12. Can be stopped.

FIG. 3 is a perspective view showing a second embodiment of the present invention. Referring to FIG. 3, in this embodiment, the suction flat plate 16 itself is provided with an opening 19 (including an opening, a notch, a concave portion, etc.) corresponding to the outer shape of the lower mounting component, and the suction flat plate thickness 16 and the spacer 17 are provided. By determining the dimensions so that the surface of the suction flat plate and the surface of the component are aligned, the height of the hybrid integrated circuit device 12 is not affected at all and the mounting of the suction flat plate 16 can be realized.

Attachment of the suction flat plate 16 to the hybrid integrated circuit device 12 is performed by using a room temperature curing type silicone adhesive resin 1.
By using 8, there is no need to go through unnecessary heat history, and there is no possibility of damaging already soldered and mounted components.

[0032]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to explain the above-mentioned embodiment in more detail, an embodiment of the present invention will be described below with reference to the drawings. FIG. 4 is a partial sectional view of the hybrid integrated circuit device 12 according to the first embodiment of the present invention.

Referring to FIG. 4, an end face electrode 14 connected from the front surface to the back surface of the organic substrate 20 having a thickness of 0.6 mm is provided as an external connection terminal of the device.

Next, a chip capacitor 21 having a thickness of 1.2 mm and a mini-mold transistor 22 having a thickness of 0.7 mm are mounted on the organic substrate 20 as surface mount components by a solder reflow method.

Next, a 0.5 mm thick circular suction flat plate 16 having a 0.8 mm high spacer 17 is coated with a room temperature curing type adhesive resin 17 on the surface mount component and the substrate, and then bonded. It is left at room temperature to be fixed.

The circular suction plate 16 is manufactured using a plastic (PPS: Polyphenylene Sulfide) having a heat resistance of 266 ° C., and has characteristics that can withstand the reflow process of the hybrid integrated circuit device 12 itself.

According to the first embodiment of the present invention, the increase in the thickness of the hybrid integrated circuit device caused by mounting the suction plate is such that the thickness of the suction plate is 0.5 mm and the components mounted on the lower portion of the suction plate. It can be suppressed to 0.6 mm which is the sum of the thickness and the gap of 0.1 mm. Also, the spacer is a 0.3φ post, and it is sufficient to provide only three places on the suction plate. The occupied area on the hybrid integrated circuit board is about 0.2 mm ^2. There is no need to consider the restrictions on the wiring to the components and the component layout.

FIG. 5 is a partial sectional view showing the structure of the second embodiment of the present invention. Referring to FIG. 5, in this embodiment, a 1.6-mm-thick chip capacitor 21 and a 0.7-mm-thick mini-mold transistor 22 are mounted on an organic substrate 20 having an end face electrode 14 as an external connection terminal. As the suction plate 16 corresponding to the hybrid integrated circuit device 12, a suction plate 16 having a thickness of 0.8 mm and an opening 19 corresponding to the outer shape of the chip capacitor 21 is exclusively designed. Since the spacer is applied on the mold and used as the spacer used in the first embodiment, the spacer is unnecessary in the present embodiment.

As described above, in the present embodiment, the thickness is not increased at all by providing the suction plate, and the spacer is mounted below the suction plate 16 on the hybrid integrated circuit board 12. It is unnecessary because a relatively thin part is used instead. As a result, no restrictions are required on the substrate, and the degree of freedom in design is significantly improved as compared with the related art.

[0040]

As described above, according to the present invention, the following effects can be obtained.

The first effect of the present invention is that the thickness and size of the hybrid integrated circuit itself can be reduced.

The reason is that, in the present invention, the height of the spacer supporting the suction flat plate for the automatic mounting machine is set according to the height of the mounting portion, or the suction plate itself has an opening corresponding to the mounting component. Due to having a section or notch.

A second effect of the present invention is that a hybrid integrated circuit device compatible with automatic mounting can be realized at relatively low cost.

The reason is that, in the present invention, the attachment of the flat plate for suction is facilitated without enlarging the size of the hybrid integrated circuit board. This is because it can be realized by a process that can be easily automated such as mounting of an adsorption plate and natural drying.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view illustrating an attaching process according to the embodiment of the present invention.

FIG. 3 is a perspective view showing a second embodiment of the present invention.

FIG. 4 is a partial sectional view of the first embodiment of the present invention.

FIG. 5 is a partial sectional view of a second embodiment of the present invention.

FIG. 6 is a perspective view showing a configuration of a conventional technique (Japanese Patent Laid-Open No. 5-235490).

FIG. 7 is a perspective view showing a configuration of a conventional technique (Japanese Patent Laid-Open No. 50793/1991).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Nozzle adsorption-like metal plate 2 Foot 3 Ceramic wiring board 4 External connection lead 5 Active element 6 Passive element 7 High melting point solder 8 Electronic component 9 Printed resistance 10 Conductor wiring 11 Suction pad 12 Hybrid integrated circuit device 13 Wiring board 14 End electrode DESCRIPTION OF SYMBOLS 15 Chip component 16 Suction plate 17 Spacer 18 Adhesive resin 19 Opening 20 Organic substrate 21 Chip capacitor 22 Mini-mold transistor

Claims (10)

[Claims] 1. A hybrid integrated circuit device for automatic mounting, wherein a flat plate is attached to a central portion of the device by an adhesive resin so as to attract and mount the device. 2. The hybrid integrated circuit device according to claim 1, wherein said flat plate has a substantially circular shape. 3. The hybrid integrated circuit device according to claim 1, further comprising a spacer for keeping an interval between said flat plate and a mounting component. 4. The device according to claim 1, wherein the flat plate has at least one of an opening, a notch, and a recess corresponding to a component mounted on the hybrid integrated circuit device. Hybrid integrated circuit device. 5. A leadless hybrid integrated circuit device, wherein a flat plate for suction is attached with an adhesive resin so as to cover one or a plurality of components mounted near a central portion on the front side of the wiring board. A hybrid integrated circuit device that supports automatic mounting. 6. The suction flat plate includes a support spacer for maintaining an interval between the component mounted on the surface of the wiring board (referred to as a “mounted component”) and the flat plate for suction. 6. The hybrid integrated circuit device according to claim 5, wherein the hybrid integrated circuit device supports automatic mounting. 7. The method according to claim 1, wherein the adhesion of the suction flat plate and the hybrid integrated circuit device is performed between the suction flat plate and the mounting component, and between the support spacer and the wiring board. 6. The hybrid integrated circuit device according to 6 which is compatible with automatic mounting. 8. The hybrid integrated circuit device for automatic mounting according to claim 5, wherein the suction flat plate has a cutout or a square hole corresponding to the outer shape of the mounted component. 9. The hybrid integrated circuit device for automatic mounting according to claim 6, wherein said supporting spacer is replaced with said mounting component under said suction flat plate, instead of said supporting spacer. . 10. The hybrid integrated circuit device according to claim 5, wherein said flat plate for suction is made of a heat-resistant plus chip.