JPH0810204Y2 - 半導体部品取付構造 - Google Patents
半導体部品取付構造Info
- Publication number
- JPH0810204Y2 JPH0810204Y2 JP13816089U JP13816089U JPH0810204Y2 JP H0810204 Y2 JPH0810204 Y2 JP H0810204Y2 JP 13816089 U JP13816089 U JP 13816089U JP 13816089 U JP13816089 U JP 13816089U JP H0810204 Y2 JPH0810204 Y2 JP H0810204Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor component
- electrode
- radiator
- mounting plate
- planar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 53
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13816089U JPH0810204Y2 (ja) | 1989-11-29 | 1989-11-29 | 半導体部品取付構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13816089U JPH0810204Y2 (ja) | 1989-11-29 | 1989-11-29 | 半導体部品取付構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377453U JPH0377453U (enrdf_load_stackoverflow) | 1991-08-05 |
| JPH0810204Y2 true JPH0810204Y2 (ja) | 1996-03-27 |
Family
ID=31685281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13816089U Expired - Lifetime JPH0810204Y2 (ja) | 1989-11-29 | 1989-11-29 | 半導体部品取付構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810204Y2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4525273B2 (ja) * | 2004-09-27 | 2010-08-18 | パナソニック電工株式会社 | 圧力波発生装置 |
| DE102009024814A1 (de) * | 2009-06-09 | 2010-12-16 | Leinemann Gmbh & Co. Kg | Flammensperranordnung |
-
1989
- 1989-11-29 JP JP13816089U patent/JPH0810204Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0377453U (enrdf_load_stackoverflow) | 1991-08-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |