JPH0770370B2 - Thick film resistor forming composition - Google Patents
Thick film resistor forming compositionInfo
- Publication number
- JPH0770370B2 JPH0770370B2 JP1139978A JP13997889A JPH0770370B2 JP H0770370 B2 JPH0770370 B2 JP H0770370B2 JP 1139978 A JP1139978 A JP 1139978A JP 13997889 A JP13997889 A JP 13997889A JP H0770370 B2 JPH0770370 B2 JP H0770370B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- powder
- glass
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Thermistors And Varistors (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Non-Adjustable Resistors (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はセラミック基体上に厚膜抵抗体を形成するため
の厚膜抵抗体形成用組成物に関する。TECHNICAL FIELD The present invention relates to a thick film resistor forming composition for forming a thick film resistor on a ceramic substrate.
軟化点400〜700℃のガラスフリツトに所要の抵抗値にな
るように導電性粉末を混合し、これを有機ビヒクルに分
散したペーストを、アルミナ等のセラミック基体上にス
クリーン印刷法や転写法により所要形状に塗布し、600
〜900℃で焼成して、基体上に電子回路部品としての厚
膜抵抗体を形成することが行なわれている。A glass frit with a softening point of 400 to 700 ° C is mixed with conductive powder so that the required resistance value is obtained, and the paste is dispersed in an organic vehicle, and the paste is applied onto a ceramic substrate such as alumina by a screen printing method or a transfer method. Apply to 600
A thick film resistor as an electronic circuit component is formed on a substrate by firing at ~ 900 ° C.
この導電粉末としてRuO2やIrO2を使用することにより抵
抗値の安定性を改善したり、MnやCuの酸化物を添加する
ことによつて抵抗温度係数（TCR）を小さくすることは
公知である。又、RuO2と鉛系ガラスを用い、これにNb酸
化物を添加することによつて、更にTCRを小さくするこ
とも提案されている。It is known that the stability of the resistance value is improved by using RuO 2 or IrO 2 as the conductive powder, or the temperature coefficient of resistance (TCR) is reduced by adding an oxide of Mn or Cu. is there. It has also been proposed to use RuO 2 and lead glass and add Nb oxide to the glass to further reduce the TCR.
本発明は従来よりもTCRの小さい主として低抵抗値を有
する厚膜抵抗体形成用組成物を提供することを課題とす
る。An object of the present invention is to provide a composition for forming a thick film resistor, which has a TCR smaller than that of a conventional one and mainly has a low resistance value.
本発明は、PbO30〜60重量％、SiO2９〜37重量％を含有
する組成のガラス粉末10〜65重量部、RuO2粉末10〜40重
量部、有機ビヒクル20〜40重量部、Ti化合物粉末をTiと
して0.06〜0.6重量部の割合にこれらを含有する厚膜抵
抗体形成用組成物、及びPbO30〜60重量％、SiO2９〜37
重量％、TiO2をTiとして0.10〜６重量％を含有する組成
のガラス粉末10〜65重量部、RuO2粉末10〜40重量部、有
機ビヒクル20〜40重量部の割合にこれらを含有する厚膜
抵抗体形成用組成物を課題を解決するための手段とする
ものである。The present invention comprises 10 to 65 parts by weight of glass powder having a composition containing 30 to 60% by weight of PbO and 9 to 37% by weight of SiO 2 , 10 to 40 parts by weight of RuO 2 powder, 20 to 40 parts by weight of organic vehicle, and Ti compound powder. As Ti, a composition for forming a thick film resistor containing 0.06 to 0.6 parts by weight of these, PbO 30 to 60% by weight, SiO 2 9 to 37
% By weight, 10 to 65 parts by weight of glass powder having a composition containing 0.10 to 6% by weight of TiO 2 as Ti, 10 to 40 parts by weight of RuO 2 powder, and 20 to 40 parts by weight of organic vehicle. The composition for forming a film resistor is used as a means for solving the problems.
固形物粉末は、ビヒクルと混合してペースト状とし、15
0〜400メツシユスクリーンを通して基体に塗布するた
め、ペーストが円滑にスクリーンを通過しうるようにす
るため、平均粒径10μｍ以下の粉末として用いる。Solid powder is mixed with vehicle to form a paste, 15
Since it is applied to the substrate through a mesh screen of 0 to 400, it is used as a powder having an average particle size of 10 μm or less so that the paste can smoothly pass through the screen.
有機ビヒクルは、従来と同様にターピネオール、ブチル
カルビトールアセテート、トルエンなどの溶媒にエチル
セルロース、メタクリレート樹脂等を溶解したものが用
いられる。As the organic vehicle, a solvent obtained by dissolving ethyl cellulose, a methacrylate resin, or the like in a solvent such as terpineol, butyl carbitol acetate, or toluene is used as in the conventional case.
Ti化合物としてはTiO2、BaTiO3などの無機化合物のほか
有機化合物を用いることもでき、Ti化合物はガラス中に
配合しても、ガラスの外に配合しても良い。As the Ti compound, it is possible to use an organic compound in addition to an inorganic compound such as TiO 2 and BaTiO 3, and the Ti compound may be compounded in the glass or may be compounded outside the glass.
上記のガラス粉末、RuO2粉末、Ti化合物粉末、有機ビヒ
クル以外に、従来からTCRを小さくするために用いられ
ているMnO2、Mn2O3、Mn3O4、CuO、Nb2O3、Sb2O3、を添
加することも出来る。The above glass powder, RuO 2 powder, Ti compound powder, other than the organic vehicle, MnO 2 , Mn 2 O 3 , Mn 3 O 4 , CuO, Nb 2 O 3 , which have been conventionally used to reduce the TCR, Sb 2 O 3 can also be added.
上記のガラスとしては、PbO、SiO2のほかにガラス成分
として通常配合されているZnO、B2O3、Al2O3、CaO等を
一種３〜35重量％を熱膨張率、軟化点などを調節するた
めに添加することができる。As the glass, PbO, in addition to SiO 2 ZnO, which is normally formulated as a glass component, B 2 O 3, Al 2 O 3, CaO , etc. thermal expansion coefficient a type 3 to 35% by weight, such as softening point Can be added to adjust
本発明におけるガラス組成において、PbOの含有量を60
重量％までとするのは、PbOが60重量％を超えるように
なると、基体に塗布したペーストを焼成して皮膜とする
とき最高焼成温度での軟化が著しくパターン形状がくず
れるようになるからである。PbOが30重量％よりも少な
いかSiO2が37重量％を超えるようになると、逆に焼成の
際の軟化が不充分となるため、焼成した被膜が多孔質と
なり弱くなる。SiO2が９重量％未満ではガラス化しにく
くなる。以上からPbO30〜60重量％、SiO2９〜37重量％
とした。In the glass composition of the present invention, the content of PbO is 60
The reason why the content is up to 60% by weight is that when the PbO content exceeds 60% by weight, when the paste applied to the substrate is fired to form a film, the softening at the highest firing temperature becomes remarkable and the pattern shape becomes distorted. . If the PbO content is less than 30% by weight or the SiO 2 content exceeds 37% by weight, on the contrary, the softening during firing becomes insufficient and the fired coating becomes porous and weak. If SiO 2 is less than 9% by weight, it becomes difficult to vitrify. From the above, PbO 30-60% by weight, SiO 2 9-37% by weight
And
ガラス粉末は、導電成分であるRuO2の10〜40重量部に対
して、65重量部を超えると抵抗値が高くなりすぎ、10重
量部未満では被膜の基体に対する接着強度が低下するの
で、10〜65重量部とする。Glass powder, with respect to 10 to 40 parts by weight of RuO 2 which is a conductive component, if the amount exceeds 65 parts by weight, the resistance value becomes too high, and if less than 10 parts by weight, the adhesive strength of the coating film to the substrate decreases. ~ 65 parts by weight.
RuO2粉末が、ガラス粉末10〜65重量部に対して40重量部
を超えるようになると、焼成後の被膜が極端に多孔質と
なり被膜強度が弱くなり信頼性が低下し、10重量部より
少ないと抵抗値の変動が大きくなるので、RuO2の添加範
囲を10〜40重量部の範囲とする。If the content of RuO 2 powder exceeds 40 parts by weight with respect to 10 to 65 parts by weight of glass powder, the film after firing becomes extremely porous and the film strength becomes weak and the reliability decreases, and the amount is less than 10 parts by weight. Therefore, the range of addition of RuO 2 is set to 10 to 40 parts by weight because the resistance value will vary greatly.
Ti化合物は、TCRを小さくするために添加するものであ
るが、ガラス粉末10〜65重量部に対してTiとして0.06重
量部未満では添加効果がなく、0.6重量部を超えても添
加効果が薄れてくるのでTiの添加量を0.06〜0.6重量部
とした。ガラス内にTiO2としてTiを添加する場合も同様
の理由により、ガラス外に添加する場合と同比率で添加
するものである。The Ti compound is added in order to reduce the TCR, but there is no addition effect at less than 0.06 parts by weight as Ti with respect to 10 to 65 parts by weight of glass powder, and the addition effect is weakened even if it exceeds 0.6 parts by weight. Therefore, the addition amount of Ti was set to 0.06 to 0.6 part by weight. For the same reason, when Ti is added as TiO 2 into the glass, it is added at the same ratio as when it is added outside the glass.
有機ビヒクルはこの組成物をインキ状にして印刷するに
は欠かせないものであるが、ガラス粉末及びRuO2粉末の
量に対して20重量部未満ではインキ状にすることが困難
となり、40重量部を超えると現在一般に使用されている
印刷条件では被膜が薄くなり過ぎ抵抗値が大きく変動す
るようになるので、有機ビヒクルの配合比率を20〜40重
量部とする。The organic vehicle is indispensable for printing this composition as an ink, but if it is less than 20 parts by weight with respect to the amount of glass powder and RuO 2 powder, it becomes difficult to form an ink, and If the amount exceeds 100 parts, the coating becomes too thin under the printing conditions generally used at present, and the resistance value fluctuates greatly, so the compounding ratio of the organic vehicle is set to 20 to 40 parts by weight.
Tiはガラス中に分散してガラス中に分相を生ぜしめ、ガ
ラス相を安定化することによりTCRの変化を小さくする
のではないかと考えられる。It is considered that Ti is dispersed in the glass to cause a phase separation in the glass and stabilizes the glass phase to reduce the change in TCR.
RuO2、TiO2、BaTiO3、MnO2、Pd粉末として平均粒径0.1
μｍ以下のものを、Ag粉末として平均粒径1.2μｍのも
のを、ガラス粉末として200メツシユの篩を全部通過し
た第１表に示す組成のものを使用した。RuO 2 , TiO 2 , BaTiO 3 , MnO 2 and Pd powder have an average particle size of 0.1
As the Ag powder, those having an average particle diameter of 1.2 μm were used, and as the glass powder, those having a composition shown in Table 1 which passed through a sieve of 200 mesh were used.
これらの無機粉末にエチルセルロース10重量％を含有す
るターピネオール溶液30重量部を添加して３本ロールミ
ルで混練して第２表に示す組成の低抵抗体用ペーストを
調整した。 To these inorganic powders, 30 parts by weight of a terpineol solution containing 10% by weight of ethyl cellulose was added and kneaded with a three-roll mill to prepare a low resistance paste having the composition shown in Table 2.
純度96％のアルミナ基板の上に、Ag/Pdペーストからな
る導電ペーストをスクリーン印刷法により塗布して、ピ
ーク温度150℃のベルト炉で溶剤を乾燥し、次いでピー
ク温度850℃×９分間の温度分布を有するベルト炉を通
して焼成して電極を形成する。Conductive paste consisting of Ag / Pd paste is applied on 96% pure alumina substrate by screen printing method, solvent is dried in a belt furnace with peak temperature of 150 ℃, then peak temperature is 850 ℃ for 9 minutes. The electrodes are formed by firing through a belt furnace having a distribution.
電極間を橋渡しするように上記のペーストを印刷し電極
と同じ方法で乾燥焼成して抵抗体被膜を形成した。抵抗
体被膜の大きさは1mm角である。The above paste was printed so as to bridge the electrodes, and dried and fired in the same manner as the electrodes to form a resistor film. The size of the resistor film is 1 mm square.
抵抗体は一組成当り20個作成し、まずデジタルマルチメ
ーターで抵抗値を測定した。この中から任意に５個選択
しTCRを測定した。20 resistors were prepared per composition, and the resistance value was measured with a digital multimeter. TCR was measured by arbitrarily selecting 5 of them.
TCRの測定は、恒温槽中に外部にあるデジタルマルチメ
ーターと電極が接続された抵抗体を配置し、一般にTCR
の指標としている高温TCRと低温TCRとを25℃、125℃、
−55℃の順序でその温度での抵抗値を測定し次式で求め
た。To measure TCR, place an external digital multimeter and a resistor with electrodes connected in a thermostatic chamber.
The high temperature TCR and the low temperature TCR, which are the indices of
The resistance value at that temperature was measured in the order of −55 ° C. and was calculated by the following formula.
但し R25:25℃の測定抵抗値 R125:125℃の測定抵抗値 R-55：−55℃の測定抵抗値 第２表にその結果を示す。 However, R 25 : measured resistance value at 25 ° C R 125 : measured resistance value at 125 ° C R -55 : measured resistance value at -55 ° C Table 2 shows the results.
〔発明の効果〕 第２表に示すように、本発明によればTCRを従来よりも
小さい±50以内の抵抗被膜を形成しうる組成物を提供で
きる。 [Effects of the Invention] As shown in Table 2, the present invention can provide a composition capable of forming a resistance film having a TCR within ± 50, which is smaller than that of the conventional one.
Claims (2)
有する組成のガラス粉末10〜65重量部、RuO2粉末10〜40
重量部、有機ビヒクル20〜40重量部、Ti化合物粉末をTi
として0.06〜0.6重量部の割合にこれらを含有する厚膜
抵抗体形成用組成物。1. A glass powder having a composition containing 30 to 60% by weight of PbO and 9 to 37% by weight of SiO 2 , 10 to 65 parts by weight, and 10 to 40 of RuO 2 powder.
Parts by weight, 20 to 40 parts by weight of organic vehicle, Ti compound powder to Ti
A composition for forming a thick film resistor, containing 0.06 to 0.6 part by weight of these.
2をTiとして0.10〜６重量％を含有する組成のガラス粉
末10〜65重量部、RuO210〜40重量部、有機ビヒクル20〜
40重量部の割合にこれらを含有する厚膜抵抗体形成用組
成物。 2. PbO 30 to 60% by weight, SiO 2 9 to 37% by weight, TiO 2.
10 to 65 parts by weight of glass powder having a composition containing 0.10 to 6% by weight of 2 as Ti, 10 to 40 parts by weight of RuO 2 , and 20 to 20 parts of organic vehicle.
A composition for forming a thick film resistor containing 40 parts by weight thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1139978A JPH0770370B2 (en) | 1989-06-01 | 1989-06-01 | Thick film resistor forming composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1139978A JPH0770370B2 (en) | 1989-06-01 | 1989-06-01 | Thick film resistor forming composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH034501A JPH034501A (en) | 1991-01-10 |
| JPH0770370B2 true JPH0770370B2 (en) | 1995-07-31 |
Family
ID=15258098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1139978A Expired - Fee Related JPH0770370B2 (en) | 1989-06-01 | 1989-06-01 | Thick film resistor forming composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0770370B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100274210B1 (en) * | 1998-11-02 | 2000-12-15 | 오세종 | Array Multichip Components |
| KR100819200B1 (en) * | 2007-05-15 | 2008-04-04 | (주)조은포장 | Folding type package box |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3974107A (en) * | 1974-03-27 | 1976-08-10 | E. I. Dupont De Nemours And Company | Resistors and compositions therefor |
| JPS53100496A (en) * | 1977-02-15 | 1978-09-01 | Sumitomo Metal Mining Co | Method of manufacturing paste for resistance body |
-
1989
- 1989-06-01 JP JP1139978A patent/JPH0770370B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH034501A (en) | 1991-01-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |