JPH0760855B2 - Integrated circuit device - Google Patents

Description

The present invention relates to an integrated circuit device, and more particularly to a standard cell type integrated circuit device.

[Conventional technology]

Generally, the size of the input / output buffer block used in standard cell LSI design is perpendicular to the side of the semiconductor chip even if the width in the direction parallel to the side of the semiconductor chip is constant due to the difference in the driving capacity of the output buffer. Depth sizes in different directions are different. On the other hand, the layout of the input / output buffer blocks on the four sides of the semiconductor chip is determined by the customer's mounting condition requirements, and the positions of these different size input / output buffer blocks should be mutually adjusted within the four sides of the semiconductor chip. Is usually impossible.

FIG. 2 is a plan view of an example of a conventional integrated circuit device.

As shown in FIG. 2, the logic block 2 formed in the central region of the semiconductor chip 1a and a plurality of input chips having the same function and different driving capabilities formed on the semiconductor chip 1a around the logic block 2 are provided. The output buffer blocks 3, 3a, 3b and a plurality of bonding pads 5 for external connection are included.

The input / output buffer blocks 3, 3a, 3b have the same width in the direction parallel to the sides of the semiconductor chip 1a, but the depths in the direction perpendicular to the sides are different, and the input / output buffer blocks 3, 3a, 3b are different.
It becomes larger in the order of b.

When a plurality of such input / output buffer blocks 3, 3a, 3b are provided in a row along one side of the semiconductor chip 1a, the area between the logic block 2 and the area of the input / output buffer block row is The boundary is determined by the input / output buffer block 3b having the largest depth, and a large dead space 4 is generated between them.

In the case of automatic design, the dead space 4 becomes extremely difficult to be effectively used as an internal area, especially when an arbitrary uneven state occurs on the outer periphery of the internal area forming the logic block 2, and the processing speed is slow. Therefore, it was made by leaving it alone.

[Problems to be solved by the invention]

In the above-mentioned conventional integrated circuit device, since the input / output buffer blocks having different driving capabilities are arbitrarily arranged, there is a drawback that the size of the semiconductor chip becomes large.

[Means for solving problems]

An integrated circuit device according to the present invention includes a logic block formed in a central region of a semiconductor chip, and a semiconductor chip on the outer periphery of the logic block, the logic block being arranged along each side of the semiconductor chip and In a plurality of input / output buffer blocks having the same width in the direction parallel to the direction and different in depth in the direction perpendicular to the side in proportion to the magnitude of the driving capability. An I / O buffer block having a large driving capacity has an L-shaped shape in which the last part of the block is bent toward the back of an adjacent input / output buffer block having a small driving capacity.

[Embodiment] FIG. 1 is a plan view of a semiconductor chip showing an embodiment of the present invention.

As shown in FIG. 1, a logic part 2a is formed in a central region of the semiconductor chip 1, and a plurality of input / output buffer blocks 3, 3 are formed along the sides of the semiconductor chip 1 on the outer periphery of the logic part block 2a.
a, 6,7 are arranged. Here, these input / output buffer blocks 3, 3a, 6, 7 have the same width in the direction parallel to the side of the semiconductor chip 1, and the depth in the direction perpendicular to the side is proportional to the magnitude of the driving capability. The I / O buffer blocks 6 and 7 having a larger driving capacity are arranged in the order of 3, 3a, 6 (or 7) from the smaller one, and the I / O buffer blocks 6 and 7 having a smaller driving capacity are located behind the I / O buffer blocks 3 or 3a having a smaller driving capacity. It has an L-shaped shape in which the rearmost portion of the block is bent toward, and the depth of the input / output buffer blocks 6 and 7 can be reduced. Further, bonding pads 5 are arranged on the outer periphery of the arrangement of these input / output buffer blocks.

Therefore, the internal logic block 2a can be expanded as compared with the conventional logic block 2 of FIG. 2 shown by the broken line in FIG. 1, the dead space 4a is reduced, and the degree of integration is improved. In other words, the size of the semiconductor chip can be reduced for the same LSI scale.

〔The invention's effect〕

As described above, according to the present invention, the depth of the input / output buffer block row formed along one side of the semiconductor chip can be reduced by making the shape of the input / output buffer block having the maximum driving capability L-shaped. Therefore, there is an effect that the degree of integration can be improved.

[Brief description of drawings]

FIG. 1 is a plan view showing a first embodiment of the present invention, and FIG. 2 is a plan view showing an example of a conventional integrated circuit device. 1,1a …… Semiconductor chip, 2,2a …… Logic block, 3,3a, 3
b ... I / O buffer block, 4, 4a ... Dead space, 5 ... Bonding pad, 6, 7 ... I / O buffer block. 8 ... Input / output buffer blocks connected in parallel.

Claims (1)

[Claims] 1. A logic unit block formed in a central region on a semiconductor chip, and arranged on the semiconductor chip on the outer periphery of the logic unit block along each side of the semiconductor chip and parallel to the side. In an integrated circuit device having a plurality of input / output buffer blocks having the same width in the same direction and different depths in the direction perpendicular to the sides in proportion to the magnitude of the driving capability, the large driving capability of the input / output buffer blocks The I / O buffer block having the above-mentioned structure has an L-shape in which the last part of the block is bent toward the back of the adjacent I / O buffer block having a small driving capacity.