JPS59167036A - Semiconductor integrated circuit - Google Patents
Semiconductor integrated circuitInfo
- Publication number
- JPS59167036A JPS59167036A JP4166683A JP4166683A JPS59167036A JP S59167036 A JPS59167036 A JP S59167036A JP 4166683 A JP4166683 A JP 4166683A JP 4166683 A JP4166683 A JP 4166683A JP S59167036 A JPS59167036 A JP S59167036A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- input
- chip
- output
- input circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/118—Masterslice integrated circuits
Abstract
Description
【発明の詳細な説明】
本発明はMO8形集積回路における周辺部の入出力回路
のレイアウトに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a layout of peripheral input/output circuits in an MO8 type integrated circuit.
従来技術の説明 第1図にMO8形集積回路の従来のレイアウトを示す。Description of prior art FIG. 1 shows a conventional layout of an MO8 type integrated circuit.
従来、パッドと保護回路を含む入出力回路(以下入出力
回路という)は、チップ周辺4辺に対して入力端子、出
力端子がある程度機能ごとに集中して、個々の辺には、
入力回路、出力回路それぞれ配置されていた。外部入出
力端子数が少ない集積回路では問題ないが、大規模集積
回路が大型化するにつれて、外部入出力端子数が増加し
、入出力回路が、チップ周辺全体にレイアウトせざる得
なくなり、第2図のようにバッド4の上部に保護回路5
その上に人出力バッファ6とレイアウトし、縦に長いブ
ロックになる。第3図の入力回路と第4図の出力回路の
サイズを比較した場合、出力回路のトランジスタサイズ
が大きいためその分出力回路ブロックサイズが大きくな
る。チップ周辺の一辺に、第5図のように入力回路9、
出力回路10、それぞれ配置されていると入力回路の上
部に、トランジスタ領域、配線領域として利用できない
無駄な空き領域11が生じ、その−辺において入力回路
9の割合が増加すれば空き領域も増える。これはチップ
サイズを大きくすることになり歩留りを低下させるとい
う欠点となっている。Conventionally, input/output circuits (hereinafter referred to as input/output circuits) including pads and protection circuits have input terminals and output terminals concentrated for each function to some extent on the four sides around the chip, and each side has
The input circuit and output circuit were arranged separately. This is not a problem for integrated circuits with a small number of external input/output terminals, but as large-scale integrated circuits become larger, the number of external input/output terminals increases, and the input/output circuits have to be laid out all over the periphery of the chip. Protection circuit 5 is placed on top of pad 4 as shown in the figure.
A human output buffer 6 is laid out on top of it, forming a vertically long block. When comparing the sizes of the input circuit shown in FIG. 3 and the output circuit shown in FIG. 4, since the transistor size of the output circuit is large, the output circuit block size is correspondingly large. On one side of the periphery of the chip, there is an input circuit 9 as shown in FIG.
When the output circuits 10 are arranged, a wasteful empty area 11 that cannot be used as a transistor area or a wiring area is created above the input circuit, and as the proportion of the input circuits 9 increases on the negative side, the empty area also increases. This has the disadvantage of increasing the chip size and lowering the yield.
本発明は従来、チップ周辺の一辺に入力回路。The present invention conventionally has an input circuit on one side of the periphery of the chip.
出力回路が配置されていたために生じる無駄な空き領域
をなくすために、チップ周辺4辺のうち少なくとも一辺
以上に入力回路のみを配置し、出力回路と入力回路の大
きさの差の無駄な空き領域をなくシ、チップサイズを小
さくシ、歩留pの向上を提供するものである。In order to eliminate the wasted free space caused by the placement of the output circuit, only the input circuit is placed on at least one of the four sides around the chip, eliminating the wasted free space due to the difference in size between the output circuit and the input circuit. This eliminates the problem, reduces the chip size, and improves the yield.
発明の構成
本発明の構成を第6図にて説明する。中央部1の部分は
内部論理部であり、周辺部2はパッドを含む入出力回路
である。Structure of the Invention The structure of the present invention will be explained with reference to FIG. The central part 1 is an internal logic part, and the peripheral part 2 is an input/output circuit including pads.
本発明では、チップ周辺4辺のうち少なくとも一辺(1
2の部分)を入力回路のみ配置し、入力回路(第3図)
と出力回路(第4図)のブロックサイズの差のトランジ
スタ領域及び配線領域として利用できない空き領域(第
5図11)をなくすことによってチップサイズを小さく
する。In the present invention, at least one side (one
2 part), place only the input circuit, and input circuit (Fig. 3)
The chip size is reduced by eliminating the empty area (FIG. 5, 11) that cannot be used as a transistor area and a wiring area due to the difference in block size between the output circuit and the output circuit (FIG. 4).
次に本発明の実施例について述べる。Next, examples of the present invention will be described.
第7図は従来のチップレイアウト図を示している。FIG. 7 shows a conventional chip layout diagram.
チップ各辺に入力回路、出力回路10がともに配置され
ている。第8図ではチップ周辺の一辺に入力回路12の
みを配置している。第9図では、外部入力端子が外部入
出力端子のうち半分はど占めれる時、4辺のうち2辺を
入力回路のみ、配置する。この場合は第8図の場合の2
倍の空き領域が生じチップサイズを小さくしている。つ
まり、第7図11の空き領域を第8,9図の13のよう
に空き領域をなくすことにより、チップサイズを小さく
シ、歩留りを向上させている。Both an input circuit and an output circuit 10 are arranged on each side of the chip. In FIG. 8, only the input circuit 12 is arranged on one side around the chip. In FIG. 9, when half of the external input/output terminals are occupied by external input terminals, only input circuits are arranged on two of the four sides. In this case, 2 of the case in Figure 8
This creates twice as much free space and reduces the chip size. That is, by eliminating the empty area in FIG. 7 and 11 as in 13 in FIGS. 8 and 9, the chip size is reduced and the yield is improved.
本発明は以上に説明したように、MO8O8撰集積回路
いて、チップ周辺の入出力回路を少なくとも一辺以上に
入力回路のみを配置して、トランジスタ領域、配線領域
として利用しない無駄な領域を削除し、チップサイズを
小さくすることによって歩留りを向上させる効果がある
。As explained above, the present invention has an MO8O8 integrated circuit, and arranges only the input circuit on at least one side of the input/output circuit around the chip, and eliminates wasted areas that are not used as transistor areas and wiring areas. Reducing the chip size has the effect of improving yield.
第1図はMO8O8撰集積回路レイアウト図2図は入出
力回路レイアウト図、第3図は入力回路レイアウト図、
第4図は出力回路レイアウト図、第5図は従来の入出力
回路グループを示す図、第6図は本発明チップレイアウ
ト図、第7図は従来のチップレイアウト図、第8図は本
発明による1辺に入力回路をレイアウトしたチップレイ
アウト図、第9図は本発明による2辺に入力回路をレイ
アウトしたチップレイアウト図。
1 内部論理部、2 周辺部(入出力回路のグループ)
、3 パッドと保護回路を含む入力及び出力バッファの
ブロック、4 パッド、5 保護回路、6 人力及び出
力バッフハ 7 入力回路(保護回路含む)+パッド、
8 出力回路(保護回路含む)+パッド。
第1図
第2図 擢3図 第4図
2
第6図
第8図 第?図Figure 1 is a MO8O8 selected integrated circuit layout diagram, Figure 2 is an input/output circuit layout diagram, Figure 3 is an input circuit layout diagram,
Fig. 4 is an output circuit layout diagram, Fig. 5 is a diagram showing a conventional input/output circuit group, Fig. 6 is a chip layout diagram of the present invention, Fig. 7 is a conventional chip layout diagram, and Fig. 8 is a diagram according to the present invention. FIG. 9 is a chip layout diagram in which input circuits are laid out on one side, and FIG. 9 is a chip layout diagram in which input circuits are laid out on two sides according to the present invention. 1 Internal logic section, 2 Peripheral section (input/output circuit group)
, 3 input and output buffer block including pad and protection circuit, 4 pad, 5 protection circuit, 6 human power and output buffer 7 input circuit (including protection circuit) + pad,
8 Output circuit (including protection circuit) + pad. Figure 1 Figure 2 Figure 3 Figure 4 Figure 2 Figure 6 Figure 8 Figure ? figure
Claims (1)
ッファ回路とを有するMO8型集積回路において、4辺
のうち少なくとも1辺に入力バッファ回路のみを配置し
たことを特徴とする半導体集積回路。What is claimed is: 1. An MO8 type integrated circuit having a plurality of input buffer circuits and output buffer circuits on four sides of a chip periphery, characterized in that only an input buffer circuit is disposed on at least one of the four sides.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4166683A JPS59167036A (en) | 1983-03-14 | 1983-03-14 | Semiconductor integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4166683A JPS59167036A (en) | 1983-03-14 | 1983-03-14 | Semiconductor integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59167036A true JPS59167036A (en) | 1984-09-20 |
Family
ID=12614706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4166683A Pending JPS59167036A (en) | 1983-03-14 | 1983-03-14 | Semiconductor integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59167036A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6378549A (en) * | 1986-09-20 | 1988-04-08 | Fujitsu Ltd | Semiconductor device |
JP2005294868A (en) * | 2005-06-27 | 2005-10-20 | Ricoh Co Ltd | Semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59159557A (en) * | 1983-03-01 | 1984-09-10 | Hitachi Ltd | Semiconductor integrated circuit device |
-
1983
- 1983-03-14 JP JP4166683A patent/JPS59167036A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59159557A (en) * | 1983-03-01 | 1984-09-10 | Hitachi Ltd | Semiconductor integrated circuit device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6378549A (en) * | 1986-09-20 | 1988-04-08 | Fujitsu Ltd | Semiconductor device |
JP2005294868A (en) * | 2005-06-27 | 2005-10-20 | Ricoh Co Ltd | Semiconductor device |
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