JPH0758253A - Ic package structure - Google Patents
Ic package structureInfo
- Publication number
- JPH0758253A JPH0758253A JP19968193A JP19968193A JPH0758253A JP H0758253 A JPH0758253 A JP H0758253A JP 19968193 A JP19968193 A JP 19968193A JP 19968193 A JP19968193 A JP 19968193A JP H0758253 A JPH0758253 A JP H0758253A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- functional component
- package
- component
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、小型化などを可能にし
たＩＣパッケージの構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an IC package which can be downsized.
【０００２】[0002]
【従来の技術】図６は従来のＩＣパッケージの構造を示
す断面図である。図において、１は配線基板、２はＩＣ
であり、このＩＣ２はダイペースト３によって配線基板
１に搭載される。４はワイヤであり、このワイヤ４は配
線基板１の配線（図示せず）とＩＣ２の端子（図示せ
ず）とを電気的に接続するワイヤ、５は抵抗、コンデン
サ等の受動部品であり、この受動部品５は半田６によっ
て配線基板１に搭載される。７はキャップであり、この
キャップ７はＩＣ２および受動部品５を保護する。８は
端子、９は放熱フィンであり、この放熱フィン９は熱伝
導性シリコーン接着剤１０で配線基板１に固定される。
１１はサーマルビアであり、このサーマルビア１１は配
線基板１を貫通し、一端がＩＣ搭載部に接触する。2. Description of the Related Art FIG. 6 is a sectional view showing the structure of a conventional IC package. In the figure, 1 is a wiring board, 2 is an IC
The IC 2 is mounted on the wiring board 1 by the die paste 3. Reference numeral 4 is a wire, and this wire 4 is a wire for electrically connecting a wiring (not shown) of the wiring board 1 and a terminal (not shown) of the IC 2 and 5 is a passive component such as a resistor and a capacitor. The passive component 5 is mounted on the wiring board 1 by the solder 6. A cap 7 protects the IC 2 and the passive component 5. Reference numeral 8 is a terminal, 9 is a heat radiation fin, and this heat radiation fin 9 is fixed to the wiring board 1 with a heat conductive silicone adhesive 10.
Reference numeral 11 denotes a thermal via. The thermal via 11 penetrates the wiring board 1 and has one end in contact with the IC mounting portion.
【０００３】この構成によるＩＣパッケージは、ＩＣ２
で発生した熱は、ダイペースト３、サーマルビア１１お
よび熱伝導性シリコーン接着剤１０を介して放熱フィン
９から放熱することができる。The IC package having this structure is IC2
The heat generated in 1 can be radiated from the radiation fin 9 through the die paste 3, the thermal via 11, and the heat conductive silicone adhesive 10.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記構
成の構造では、配線基板の上面のほぼ全体が放熱フィン
を固定するための固定領域となるので、部品は全て、配
線基板の下面に搭載しなければならず、ＩＣパッケージ
の外形寸法が大きくなる。更に、放熱フィンと配線基板
の固定領域が広いので、半田等の高熱伝導材を使用する
と、接着強度が強すぎるため、熱膨張差で配線基板にク
ラックが発生する恐れがある。このような理由から、熱
伝導率の悪い熱伝導性シリコーン接着剤を使用しなけれ
ばならず、放熱効率を低下するという問題点があった。However, in the structure of the above structure, almost all of the upper surface of the wiring board serves as a fixing area for fixing the heat radiation fins, so that all the components must be mounted on the lower surface of the wiring board. Therefore, the external dimensions of the IC package are increased. Further, since the fixing area between the radiation fin and the wiring board is wide, when a high thermal conductive material such as solder is used, the adhesive strength is too strong, so that the wiring board may be cracked due to a difference in thermal expansion. For this reason, there has been a problem that a heat conductive silicone adhesive having a low heat conductivity has to be used, and the heat radiation efficiency is lowered.
【０００５】本発明は、以上述べた、ＩＣパッケージの
外形寸法が大きくなること、および放熱効果が低下する
こと、などという問題点を除去するため、配線基板の一
方の面に固定する機能部品に少なくとも１個の凹部を形
成し、この凹部に位置する配線基板上に、受動部品を搭
載するようにした優れた構造を提供することを目的とす
る。The present invention provides a functional component fixed to one surface of a wiring board in order to eliminate the above-mentioned problems such as an increase in external dimensions of an IC package and a reduction in heat dissipation effect. An object of the present invention is to provide an excellent structure in which at least one recess is formed and a passive component is mounted on a wiring board located in this recess.
【０００６】[0006]
【課題を解決するための手段】本発明に係るＩＣパッケ
ージの第１の構造は、高発熱のＩＣを搭載するＩＣ搭載
部を一方の面に形成した配線基板と、この配線基板を貫
通し、ＩＣ搭載部に接続するサーマルビアと、少なくと
も２個の凸部と１個の凹部を設けた機能部品とを備え、
この機能部品は、その１個の凸部がサーマルビアに接続
するように半田等によって配線基板の他方の面に固定す
ることにより、その機能部品の凹部に位置する配線基板
上に受動部品の搭載を可能にするものである。A first structure of an IC package according to the present invention is a wiring board having an IC mounting portion for mounting an IC with high heat generation formed on one surface, and a wiring board that penetrates the wiring board. A thermal via connected to the IC mounting portion, and a functional component having at least two convex portions and one concave portion,
This functional component is mounted on the other surface of the wiring substrate by soldering or the like so that its one convex portion is connected to the thermal via, so that the passive component is mounted on the wiring substrate located in the concave portion of the functional component. Is what makes it possible.
【０００７】第２の構造は、高発熱のＩＣを搭載するＩ
Ｃ搭載部を一方の面に形成した配線基板と、この配線基
板を貫通し、ＩＣ搭載部に接続するサーマルビアと、少
なくとも２個の凸部と１個の凹部を設けた機能部品と、
この機能部品の凹部内に設けた高熱伝導性配線基板とを
備え、この高熱伝導性配線基板は、その一方の面が半田
等によってサーマルビアに接続するように配線基板に固
定し、その他方の面が半田等によって機能部品の凹部の
内壁に固定することにより、この機能部品の凹部に位置
する配線基板上および高熱伝導性配線基板上に、それぞ
れ受動部品の搭載を可能にするものである。The second structure is an I mounting an IC with high heat generation.
A wiring board having a C mounting portion formed on one surface, a thermal via penetrating the wiring board and connecting to the IC mounting portion, and a functional component having at least two convex portions and one concave portion,
The high-thermal-conductivity wiring board provided in the concave portion of the functional component is fixed to the wiring board so that one surface thereof is connected to the thermal via by soldering, etc. By fixing the surface to the inner wall of the concave portion of the functional component with solder or the like, the passive component can be mounted on the wiring substrate and the high thermal conductive wiring substrate located in the concave portion of the functional component, respectively.
【０００８】[0008]
【作用】この発明は、配線基板を小型化できることによ
り、ＩＣパッケージの小型化が可能になる。しかも、高
放熱効率を確保することができる。According to the present invention, since the wiring board can be downsized, the IC package can be downsized. Moreover, high heat dissipation efficiency can be secured.
【０００９】[0009]
【実施例】図１は本発明に係るＩＣパッケージの構造の
第１の実施例を示す断面図である。図において、１２は
機能部品であり、この機能部品１２は、例えば３つの凸
部１２ａ，１２ｂおよび１２ｃと２つの凹部１２ｄおよ
び１２ｅを備え、ＩＣ２から発生する熱を放出する放熱
フィンとしての機能、受動部品５を保護するキャップと
しての機能、図示せぬ回路部をシールドする機能、およ
び気密性を確保する機能を持つ。そして、この機能部品
１２の凸部１２ａ〜１２ｃは、半田６によって配線基板
１に固定され、機能部品１２の凹部１２ｄおよび１２ｅ
には、配線基板１に搭載された受動部品５が収容され
る。1 is a sectional view showing a first embodiment of the structure of an IC package according to the present invention. In the figure, reference numeral 12 is a functional component. The functional component 12 includes, for example, three convex portions 12a, 12b and 12c and two concave portions 12d and 12e, and functions as a heat radiation fin that radiates heat generated from the IC2. It has a function as a cap for protecting the passive component 5, a function for shielding a circuit unit (not shown), and a function for ensuring airtightness. The convex portions 12a to 12c of the functional component 12 are fixed to the wiring board 1 by the solder 6, and the concave portions 12d and 12e of the functional component 12 are formed.
Accommodates the passive component 5 mounted on the wiring board 1.
【００１０】この構成によるＩＣパッケージでは、ＩＣ
２で発生した熱はダイペースト３、サーマルビア１１お
よび熱伝導率の良い半田６を介して放熱フィンとして機
能する機能部品１２から放熱することができる。また、
この機能部品１２の凹部１２ｄおよび１２ｅに、受動部
品５が挿入できるため、配線基板１の両面に受動部品５
を搭載することができるので、配線基板１の面積を半分
にすることができ、ＩＣパッケージを小型化することが
でき、受動部品５を保護するキャップとしての機能もあ
り、さらに、図示せぬ回路部をシールドする機能、およ
び受動部品５の気密性を確保することができる。In the IC package having this structure, the IC
The heat generated in 2 can be radiated from the functional component 12 functioning as a radiation fin through the die paste 3, the thermal via 11, and the solder 6 having good thermal conductivity. Also,
Since the passive component 5 can be inserted into the recesses 12d and 12e of the functional component 12, the passive component 5 is provided on both sides of the wiring board 1.
Since the wiring board 1 can be mounted, the area of the wiring board 1 can be halved, the IC package can be downsized, and the IC can also function as a cap that protects the passive component 5. The function of shielding the part and the airtightness of the passive component 5 can be ensured.
【００１１】図２は本発明に係るＩＣパッケージの構造
の第２の実施例を示す断面図である。図において、１３
は機能部品であり、この機能部品１３は、例えば３つの
凸部１３ａ，１３ｂおよび１３ｃと２つの凹部１３ｄお
よび１３ｅを備え、ＩＣ２から発生する熱を放出する放
熱フィンとしての機能、および受動部品５を保護するキ
ャップとしての機能を持つ。そして、この機能部品１３
の凸部１３ｂは、半田によって配線基板１に固定され、
機能部品１３の凹部１３ｄおよび１３ｅには、配線基板
１に搭載した受動部品５が収容される。FIG. 2 is a sectional view showing a second embodiment of the structure of the IC package according to the present invention. In the figure, 13
Is a functional component, and the functional component 13 includes, for example, three convex portions 13a, 13b and 13c and two concave portions 13d and 13e, and has a function as a heat radiation fin that radiates heat generated from the IC 2 and a passive component 5 It has a function as a cap to protect. And this functional component 13
The convex portion 13b of is fixed to the wiring board 1 by soldering,
The passive components 5 mounted on the wiring board 1 are housed in the recesses 13d and 13e of the functional component 13.
【００１２】なお、機能部品１３の突起１３ａおよび１
３ｃと配線基板１との間には、隙間１４が形成されてお
り、通気を確保している。The projections 13a and 1 of the functional component 13 are
A gap 14 is formed between 3c and the wiring board 1 to ensure ventilation.
【００１３】この構成によるＩＣパッケージでは、ＩＣ
２で発生した熱は、ダイペースト３、サーマルビア１１
および熱伝導率のよい半田６を介して放熱フィンとして
機能する機能部品１３から放熱することができ、しか
も、隙間１４を介して外気が流入し、受動部品５をも冷
却することができる。また、この機能部品１３の凹部１
３ｄおよび１３ｅに、受動部品５が挿入できるため、配
線基板１の両面に受動部品５を搭載することができるの
で、配線基板１の面積を削減することができ、ＩＣパッ
ケージを小型化することができ、受動部品５を保護する
キャップとして機能することができる。In the IC package having this structure, the IC
The heat generated in 2 is applied to the die paste 3 and the thermal via 11.
Also, heat can be radiated from the functional component 13 functioning as a radiation fin through the solder 6 having a high thermal conductivity, and further, the outside air can flow in through the gap 14 to cool the passive component 5 as well. In addition, the concave portion 1 of the functional component 13
Since the passive component 5 can be inserted into 3d and 13e, the passive component 5 can be mounted on both surfaces of the wiring board 1, so that the area of the wiring board 1 can be reduced and the IC package can be miniaturized. It is possible to function as a cap that protects the passive component 5.
【００１４】図３は本発明に係るＩＣパッケージの構造
の第３の実施例を示す断面図である。図において、１５
は機能部品であり、この機能部品１５は、例えば５つの
凸部１５ａ〜１５ｅと４つの凹部１５ｆ〜１５ｉを備
え、ＩＣ２から発生する熱を放出する放熱フィンとして
の機能および受動部品５を保護するキャップとしての機
能を持つ。そして、この機能部品１５の凸部１５ｂ〜１
５ｄは、半田６によって配線基板１に固定され、機能部
品１５の凹部１５ｆ〜１５ｉには、配線基板１に搭載し
た受動部品５が収容される。FIG. 3 is a sectional view showing a third embodiment of the structure of the IC package according to the present invention. In the figure, 15
Is a functional component, and this functional component 15 includes, for example, five convex portions 15a to 15e and four concave portions 15f to 15i, and protects the passive component 5 and the function as a heat radiation fin that radiates heat generated from the IC2. Has a function as a cap. Then, the convex portions 15 b to 1 of the functional component 15
5d is fixed to the wiring board 1 by the solder 6, and the passive components 5 mounted on the wiring board 1 are housed in the concave portions 15f to 15i of the functional component 15.
【００１５】なお、機能部品１５の突起１５ａおよび１
５ｅと配線基板１との間には、隙間１４が形成されてお
り、通気を確保している。The projections 15a and 1 of the functional component 15 are
A gap 14 is formed between 5e and the wiring board 1 to ensure ventilation.
【００１６】また、この構成によるＩＣパッケージの放
熱については、図２と同様に機能することはもちろんで
ある。Regarding the heat dissipation of the IC package with this structure, it goes without saying that it functions similarly to FIG.
【００１７】図４は本発明に係るＩＣパッケージの構造
の第４の実施例を示す断面図である。図において、１６
はダイパッドであり、このダイパッド１６は配線基板１
上に設け、ＩＣ２を搭載する。１７はワイヤボンディン
グパッド、１８ａ〜１８ｄは導体パッド、１９は電源用
導体であり、この電源用導体１９は配線基板１上に設け
て、サーマルビア１１に電気的および熱的に接続され
る。２０は機能部品であり、この機能部品２０は熱伝導
率の優れた材料から作られ、例えば、２つの凸部２０ａ
および２０ｂと１つの凹部２０ｃを備え、ＩＣ２から発
生する熱を放出する放熱フィンとしての機能、受動部品
５を保護するキャップとしての機能、および図示せぬ回
路部をシールドするシールド機能を備えている。そし
て、この機能部品２０はその凸部２０ａおよび２０ｂが
半田６によって、配線基板１の導体パッド１８ｄに固定
される。そして、この導体パッド１８ｄはシールド効果
を目的としてグランド電位にする。２１は高熱伝導性配
線基板であり、この高熱伝導性配線基板２１はセラミッ
ク等の熱伝導率に優れており、機能部品２０の凹部２０
ｃと配線基板１の間に収納される。２２は受動部品であ
り、例えばデカップリングコンデンサであり、このデカ
ップリングコンデンサ２２は高熱伝導性配線基板２１に
搭載される。２３ａおよび２３ｂは導体であり、この導
体２３ａおよび２３ｂは高熱伝導性配線基板２１上に設
けられる。そして、この導体２３ａは、その一端がコン
デンサ２２の一方の電極に接続し、他端は半田６によっ
て電源用導体１９に電気的に接続し、電源側となる。こ
の導体２３ｂは、その一端がコンデンサ２２の他方の電
極に接続し、他端は半田６によって機能部品２０に電気
的に接続し、グランド側となる。FIG. 4 is a sectional view showing a fourth embodiment of the structure of the IC package according to the present invention. In the figure, 16
Is a die pad, and this die pad 16 is a wiring board 1.
It is provided on top and IC2 is mounted. Reference numeral 17 is a wire bonding pad, 18a to 18d are conductor pads, and 19 is a power supply conductor. The power supply conductor 19 is provided on the wiring board 1 and electrically and thermally connected to the thermal via 11. Reference numeral 20 denotes a functional component, and the functional component 20 is made of a material having excellent thermal conductivity, and for example, the two convex portions 20a are provided.
And 20b and one recess 20c are provided, and have a function as a heat radiation fin that radiates heat generated from the IC 2, a function as a cap that protects the passive component 5, and a shield function that shields a circuit unit (not shown). . Then, the convex portions 20 a and 20 b of the functional component 20 are fixed to the conductor pads 18 d of the wiring board 1 by the solder 6. Then, the conductor pad 18d is set to the ground potential for the purpose of shielding effect. Reference numeral 21 denotes a high heat conductive wiring board, and this high heat conductive wiring board 21 is excellent in thermal conductivity of ceramics or the like.
It is housed between c and the wiring board 1. Reference numeral 22 is a passive component, for example, a decoupling capacitor, which is mounted on the high thermal conductive wiring board 21. 23a and 23b are conductors, and the conductors 23a and 23b are provided on the high thermal conductive wiring board 21. The conductor 23a has one end connected to one electrode of the capacitor 22 and the other end electrically connected to the power supply conductor 19 by the solder 6 to be the power supply side. The conductor 23b has one end connected to the other electrode of the capacitor 22 and the other end electrically connected to the functional component 20 by the solder 6 and is on the ground side.
【００１８】この構成によるＩＣパッケージでは、ＩＣ
２で発生した熱は、ダイパッド１６、サーマルビア１
１、熱伝導率の良い半田６、高熱伝導性配線基板２１、
熱伝導率の良い半田６を介して機能部品２０から放熱す
ることができる。また、受動部品であるデカップリング
コンデンサ２２の一方の電極は、導体２３ａ、半田６、
電源用導体１９、およびサーマルビア１１を介して配線
基板１の図示せぬ電源配線に接続する。このデカップリ
ングコンデンサ２２の他方の電極は、導体２３ｂ、半田
６、機能部品２０およびその突起２０ａ，２０ｂ、半田
６および導体パッド１８ｄを介して配線基板１の図示せ
ぬグランド配線に接続する。In the IC package having this structure, the IC
The heat generated in 2 is the die pad 16 and the thermal via 1
1. Solder 6 having high thermal conductivity, high thermal conductive wiring board 21,
It is possible to radiate heat from the functional component 20 via the solder 6 having good thermal conductivity. In addition, one electrode of the decoupling capacitor 22 which is a passive component has the conductor 23a, the solder 6,
The power supply conductor 19 and the thermal via 11 are connected to the power supply wiring (not shown) of the wiring board 1. The other electrode of the decoupling capacitor 22 is connected to a ground wiring (not shown) of the wiring board 1 via the conductor 23b, the solder 6, the functional component 20 and the protrusions 20a and 20b thereof, the solder 6 and the conductor pad 18d.
【００１９】このように、機能部品の凹部と配線基板と
の間に設けた高熱伝導性配線基板に、受動部品を搭載す
るので、配線基板を小型化することができるので、ＩＣ
パッケージを小型化することができる。As described above, since the passive component is mounted on the high thermal conductive wiring substrate provided between the concave portion of the functional component and the wiring substrate, the wiring substrate can be downsized, and thus the IC can be manufactured.
The package can be downsized.
【００２０】図５は本発明に係るＩＣパッケージの構造
の第５の実施例を示す断面図である。図において、２４
は受動部品であり、例えば、高速信号における終端抵抗
とする。そして、この抵抗２４は高熱伝導性配線基板２
１に搭載する。FIG. 5 is a sectional view showing a fifth embodiment of the structure of the IC package according to the present invention. In the figure, 24
Is a passive component, and is, for example, a terminating resistor for high-speed signals. The resistor 24 is used for the high thermal conductive wiring board 2
Installed in 1.
【００２１】なお、この抵抗２４の一端は、導体２３
ａ、半田２５を介して配線基板１の信号用パッド２６に
接続する。Incidentally, one end of the resistor 24 is connected to the conductor 23.
a, connected to the signal pad 26 of the wiring board 1 via the solder 25.
【００２２】この構成によるＩＣパッケージにおいて、
ＩＣ２で発生した熱の放出径路およびＩＣパッケージの
小型化については図４と同様であることはもちろんであ
る。In the IC package having this structure,
It goes without saying that the heat radiation path of the IC2 and the miniaturization of the IC package are the same as those in FIG.
【００２３】[0023]
【発明の効果】以上、詳細に説明したように、本発明に
係るＩＣパッケージの構造によれば、配線基板の一方の
面に、少なくとも２個の凸部と１個の凹部を設けた機能
部品を取り付けることにより、その機能部品の凹部と配
線基板の間に、部品搭載領域を確保することができるた
め、配線基板を小型化することができる。しかも、機能
部品を配線基板に固定するため、機能部品の突起の面を
最小に抑えることができるので、半田等の接着強度が高
く、高熱伝導性の接着剤を使用できるため、高放熱効率
を確保することができる。特に、第１実施例、第４実施
例および第５実施例では、高放熱効率、受動部品のキャ
ップ、気密性およびシールド効果が得られ、第２実施例
および第３実施例では、高放熱効率、受動部品のキャッ
プおよび受動部品の通気による放熱などが得られる効果
がある。As described above in detail, according to the structure of the IC package of the present invention, the functional component in which at least two convex portions and one concave portion are provided on one surface of the wiring board. Since the component mounting area can be secured between the concave portion of the functional component and the wiring board by mounting the wiring board, the wiring board can be downsized. Moreover, since the functional component is fixed to the wiring board, the surface of the protrusion of the functional component can be minimized, so that the adhesive strength of solder or the like is high and the adhesive having high thermal conductivity can be used, so that high heat dissipation efficiency can be obtained. Can be secured. In particular, in the first, fourth, and fifth embodiments, high heat dissipation efficiency, cap of passive components, airtightness, and shielding effect can be obtained, and in the second and third embodiments, high heat dissipation efficiency. The effect is that heat can be obtained by the cap of the passive component and the ventilation of the passive component.
【図１】本発明に係るＩＣパッケージの構造の第１の実
施例を示す断面図である。FIG. 1 is a cross-sectional view showing a first embodiment of the structure of an IC package according to the present invention.
【図２】本発明に係るＩＣパッケージの構造の第２の実
施例を示す断面図である。FIG. 2 is a sectional view showing a second embodiment of the structure of the IC package according to the present invention.
【図３】本発明に係るＩＣパッケージの構造の第３の実
施例を示す断面図である。FIG. 3 is a sectional view showing a third embodiment of the structure of the IC package according to the present invention.
【図４】本発明に係るＩＣパッケージの構造の第４の実
施例を示す断面図である。FIG. 4 is a sectional view showing a fourth embodiment of the structure of the IC package according to the present invention.
【図５】本発明に係るＩＣパッケージの構造の第５の実
施例を示す断面図である。FIG. 5 is a sectional view showing a fifth embodiment of the structure of the IC package according to the present invention.
【図６】従来のＩＣパッケージの構造を示す断面図であ
る。FIG. 6 is a cross-sectional view showing a structure of a conventional IC package.
１２，１３，１５，２０ 機能部品 １６ ダイパッド １８ａ〜１８ｄ 導体パッド ２１ 高熱伝導性配線基板 ２３ａ，２３ｂ 導体 12, 13, 15, 20 Functional component 16 Die pad 18a-18d Conductor pad 21 High thermal conductive wiring board 23a, 23b Conductor
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 25/18 (72)発明者 岡野 直樹 東京都港区芝浦４丁目11番15号 株式会社 沖ビジネス内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Reference number within the agency FI Technical indication location H01L 25/18 (72) Inventor Naoki Okano 4-11-15 Shibaura, Minato-ku, Tokyo Oki Co., Ltd. Within business
Claims (4)
方の面に形成した配線基板と、この配線基板を貫通し、
ＩＣ搭載部に接続するサーマルビアと、少なくとも２個
の凸部と１個の凹部を設けた機能部品とを備え、 この機能部品は、その１個の凸部がサーマルビアに接続
するように半田等によって配線基板の他方の面に固定す
ることにより、この機能部品の凹部に対応する配線基板
上に受動部品の搭載を可能にすることを特徴とするＩＣ
パッケージの構造。1. A wiring board having an IC mounting portion for mounting an IC with high heat generation formed on one surface, and a wiring board which penetrates the wiring board.
The thermal via is connected to the IC mounting portion, and the functional component is provided with at least two convex portions and one concave portion. The functional component is soldered so that the one convex portion is connected to the thermal via. An IC characterized in that a passive component can be mounted on the wiring substrate corresponding to the concave portion of the functional component by fixing the passive component to the other surface of the wiring substrate by means of the like.
Package structure.
方の面に形成した配線基板と、この配線基板を貫通し、
ＩＣ搭載部に接続するサーマルビアと、少なくとも２個
の凸部と１個の凹部を設けた機能部品と、この機能部品
の凹部内に設けた高熱伝導性配線基板とを備え、この高
熱伝導性配線基板はその一方の面が半田等によってサー
マルビアに接続するように配線基板に固定し、その他方
の面が半田等によって機能部品の凹部の内壁に固定する
ことにより、この機能部品の凹部に位置する配線基板上
および高熱伝導性配線基板上に、それぞれ受動部品の搭
載を可能にすることを特徴とするＩＣパッケージの構
造。2. A wiring board having an IC mounting portion for mounting a high heat generation IC formed on one surface thereof, and penetrating the wiring board,
The thermal via which is connected to the IC mounting portion, the functional component having at least two convex portions and one concave portion, and the high thermal conductive wiring board provided in the concave portion of the functional component are provided. The wiring board is fixed to the wiring board so that one surface of the wiring board is connected to the thermal via with solder, etc., and the other surface is fixed to the inner wall of the concave part of the functional component with solder etc. A structure of an IC package characterized in that passive components can be mounted on a wiring board and a high thermal conductivity wiring board, respectively.
などによって配線基板に固定したことを特徴とする請求
項１および請求項２記載のＩＣパッケージの構造。3. The structure of the IC package according to claim 1, wherein the functional component has the other convex portion fixed to the wiring board by soldering or the like.
基板の間に、間隙を形成することを特徴とする請求項１
記載のＩＣパッケージの構造。4. The functional component has a gap formed between the other convex portion and the wiring board.
Structure of the described IC package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19968193A JP2828385B2 (en) | 1993-08-11 | 1993-08-11 | IC package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19968193A JP2828385B2 (en) | 1993-08-11 | 1993-08-11 | IC package structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0758253A true JPH0758253A (en) | 1995-03-03 |
| JP2828385B2 JP2828385B2 (en) | 1998-11-25 |
Family
ID=16411847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19968193A Expired - Fee Related JP2828385B2 (en) | 1993-08-11 | 1993-08-11 | IC package structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2828385B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5990550A (en) * | 1997-03-28 | 1999-11-23 | Nec Corporation | Integrated circuit device cooling structure |
| JP2002158318A (en) * | 2000-11-22 | 2002-05-31 | Mitsubishi Electric Corp | Semiconductor device |
| JP2004537849A (en) * | 2001-06-28 | 2004-12-16 | スカイワークス ソリューションズ，インコーポレイテッド | Structure of leadless multi-die carrier and method for its preparation |
-
1993
- 1993-08-11 JP JP19968193A patent/JP2828385B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5990550A (en) * | 1997-03-28 | 1999-11-23 | Nec Corporation | Integrated circuit device cooling structure |
| JP2002158318A (en) * | 2000-11-22 | 2002-05-31 | Mitsubishi Electric Corp | Semiconductor device |
| JP2004537849A (en) * | 2001-06-28 | 2004-12-16 | スカイワークス ソリューションズ，インコーポレイテッド | Structure of leadless multi-die carrier and method for its preparation |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2828385B2 (en) | 1998-11-25 |
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|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980825 |
|
| LAPS | Cancellation because of no payment of annual fees |