JPH0492461A - Hybrid ic - Google Patents

Abstract

PURPOSE:To reduce possibility of break of bonding wire due to strain of outer power of a cap by extending part of a radiation block on which a semiconductor chip is mounted from a semiconductor chip mounting face to the inside of the cap. CONSTITUTION:A hybrid IC is such that both end parts of a radiation block 10 are provided with the parts (extension parts) raised in the vertical direction, and then the block 10 has a U-shaped section. Even if an external force is applied form a cap 8 to strain the cap 8 to the side of a substrate 1, the force is conducted to the radiation block 10 due to the existing extention part 10a of the radiation block 10 to be received here so as to extremely lessen stress to a coating 7 and in its turn to a bonding wire 6 thus to reduce a fear of break of the bonding wire 6. Further, the coating 7 does not spread in the direction of the extension parts 10a of the radiation block so as to enable electronic parts to be arranged near the radiation block 10.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit, and particularly to an improvement in a heat dissipation block to which a semiconductor chip thereof is attached.

[Conventional technology]

FIG. 3 is a perspective view of a semiconductor chip assembled on a heat dissipation block of a conventional hybrid integrated circuit, and FIG.
A sectional view including the cap taken along line BB' in the figure is shown,
In the figure, 1 has a circuit pattern on its top surface and a ground pattern on its bottom surface, and is the basis of the configuration of the hybrid integrated circuit, 2 is a circuit pattern on the top surface of the substrate 1, and 3 is a ground pattern on the bottom surface of the substrate 1. 4 is a heat dissipation block mounted on the circuit pattern 2, 5 is a semiconductor chip mounted on the heat dissipation block 4, 6 is a bonding wire that electrically connects the semiconductor chip 5 and the circuit pattern 2, and 7 is a A coating protects the semiconductor chip 5 and bonding wires 6, a cap 8 protects the entire circuit pattern side of the substrate 1, and a heat radiation fin 9 attached to the ground pattern 3.

Next, the operation will be explained. The semiconductor chip 5 is connected to the circuit pattern 2 by bonding wires 6 and operates. The heat generated at this time has a cross-sectional area for heat conduction expanded by the heat radiation block 4, and is radiated through the substrate 1 and the heat radiation fins 9, thereby obtaining low thermal resistance.

The coating 7 is for protecting the semiconductor chip 5 and the bonding wires 6 and maintaining the precision of the device, and the cap 8 is for protecting the circuit pattern 2 and the semiconductor chip 5 and other electronic components mounted on the circuit pattern 2. It plays the role of protecting the equipment from external shocks, etc.

[Problem to be solved by the invention]

Since the conventional hybrid integrated circuit is configured as described above, when the distance between the coating 7 and the inner surface of the cap 8 is small, when an external force is applied to the cap 8, the cap 8 is distorted.
There is a risk that the bonding wire 6 will come into contact with the coating 7 and the force will be applied to the bonding wire 6, causing the bonding wire 6 to break.In order to prevent this, the strength of the camp 80 is increased or the distance between the coating 7 and the inner surface of the cap 8 is increased. This makes it difficult to downsize the device.

Also, since the coating 7 spreads laterally, the circuit pattern 2
If the coating 7 is contacted when other electronic components such as resistors and capacitors are mounted on it, the contact force may cause the bonding wire 6 to break as in the above case, and therefore the circuit on the board 1 may be damaged. It is necessary to provide a sufficient space around the coating 7 on the pattern 2 side, which is an obstacle to miniaturization as described above.

This invention was made to solve the above-mentioned problems, and does not increase the distance between the coating and the inner surface of the cap, and does not increase the strength of the cap. It is an object of the present invention to obtain a hybrid integrated circuit which reduces the possibility of breakage and which does not require providing a place around the coating part to prevent contact with other electronic parts.

[Means to solve the problem]

In the hybrid integrated circuit according to the present invention, a part of the heat dissipation block on which the semiconductor chip is mounted is extended from the surface where the semiconductor chip is mounted to the inside of the cap.

[Effect]

In this invention, a part of the heat dissipation block on which the semiconductor chip is mounted is extended from the semiconductor chip mounting surface to the inside of the cap, so that the external force from the cap is transmitted to the heat dissipation block and the force is directly applied to the coating part. As a result, the strength of the cap can be increased and there is no need to increase the distance between the cap and the coating part.

Further, since a part of the heat radiation block is raised, the coating does not spread in the direction of the height, and electronic components can be provided near the heat radiation block.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a part where a semiconductor chip is assembled on a heat dissipation block of a hybrid integrated circuit according to an embodiment of the present invention, and FIG. It is a sectional view, and the same reference numerals as in FIGS. 3 and 4 indicate the same or corresponding parts, and 10 is a heat dissipation block, with vertically elevated portions 10a (extension portions) provided at both ends thereof,
It has a U-shaped cross section. Since the electrical operation and heat radiation are the same as in the conventional example, their explanation will be omitted here, and the effects of the extension portion 10a of the heat radiation block 10 will be explained.

Even if an external force is applied from the cap 8 and the cap 8 is distorted toward the substrate l, the extended portion 10a of the heat radiation block 10 causes the force to be transmitted to the heat radiation block 10, where the receiving force is stopped, and the coating 7 and the bonding wire 6 The stress on the bonding wire 6 becomes extremely small.
There is less worry about it breaking. Furthermore, the coating 7 does not spread in the direction of the extension 10a of the heat radiation block, making it possible to arrange electronic components near the heat radiation block 10.

According to this embodiment, both ends of the heat dissipation block 10 on which the semiconductor chip 5 is mounted are extended in the vertical direction to form a U-shaped cross section, so that when the cap 8 is distorted due to external stress, the external force is reduced. The receiving part is stopped by the extension part 10a of the heat dissipation block 10 and does not act directly on the coating 7 or the bonding wire 6. Therefore, there is no need to provide a large gap between the cap 8 and the coating 7 to prevent contact. Due to the structure of the heat dissipation block 10 having a U-shaped cross section, the coating 7 does not spread in the direction of the extension portion 4a, and other electronic components can be provided near the heat dissipation block 10, thereby reducing the size of the hybrid integrated circuit. I can do it.

Note that in the above embodiment, the heat dissipation block 10 was explained using a U-shaped heat dissipation block 10, but when the heat dissipation block is installed at the edge of the circuit board, the spread of the coating only needs to be considered in the direction toward the center of the board; In this case, set the heat dissipation block to L.
By using the letter shape, the same effects as in the above embodiment can be achieved.

Further, as the structure of the extension part of the heat dissipation block 10, in addition to the above embodiments, for example, as shown in FIG. 5(a), an extension part 10b having a width wider than the width of the semiconductor chip mounting surface may be used. As shown in FIG. 3B, an extension 10c having a width narrower than the width of the semiconductor chip mounting surface may be used, and the same effect as described above can be obtained.

〔Effect of the invention〕

As described above, according to the hybrid integrated circuit device of the present invention, the part of the heat dissipation block on which the semiconductor chip is mounted is extended from the semiconductor chip mounting surface to the inside of the cap, so that external stress is not directly applied to the coating or the heat dissipation block. It does not touch the bonding wire, so there is no need to worry about the bonding wire breaking, there is no need to provide a large gap between the coating and the cap to prevent contact, and the coating does not spread around the heat dissipation block. This has the effect that other electronic components can be placed nearby, and that the device can be downsized.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a semiconductor chip assembled on a heat dissipation block of a hybrid integrated circuit according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line A-A'' in FIG. 1, including a camp. , FIG. 3 is a perspective view of a semiconductor chip assembled into a heat dissipation block of a conventional hybrid integrated circuit, FIG. 4 is a cross-sectional view taken along line B-B' in FIG. 3, including the cap, and FIG. 1 is a diagram showing a heat dissipation block of a hybrid integrated circuit according to another embodiment of the present invention. 1 is a substrate, 2 is a circuit pattern, 3 is a ground pattern, 5 is a semiconductor chip, 6 is a bonding wire, 7 is a coating, 8 1 is a cap, 9 is a heat radiation fin, 10 is a heat radiation block, and 10a and 10b are raised parts (extension parts) of the heat radiation block 10. Note that the same reference numerals in the figures indicate the same or equivalent parts. 〃 2,'Q!2;,'/'9-n10: 47r fo,,:) 5 Knee 1-#J Meno-7゛6 Friend's 7yu, 2', 7.)/;・

Claims (1)

[Claims] (1) A board having a circuit pattern on its top surface and a ground pattern on its back surface, a heat dissipation block mounted on the circuit pattern, a semiconductor chip mounted on the heat dissipation block, and a circuit pattern side of the board A hybrid integrated circuit comprising: a covering cap; wherein a part of the heat dissipation block extends from the semiconductor chip mounting surface to the inside of the cap.