JP2000058741A - Hybrid module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small hybrid module with good heat-radiation and high reliability. SOLUTION: A heat-radiation internal electrode 17a wherein, connected to a ground terminal of a circuit part 13 having heat-accumulation characteristics which is mounted in a recessed part 14 formed at a circuit board 11, a part is exposed outside the surface of the circuit board 11 is formed, and the internal electrode 17A is connected to a heat-radiation external electrode 17C, etc., through a thermal via hole 17B. The heat generated at the circuit part 13 is transferred to the heat-radiation internal electrode 17A through an insulating resin 16, and then radiated to the outside space from the exposed part of the internal electrode 17A and the external electrode 17C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid module in which chip components such as multilayer capacitors and multilayer inductors and semiconductor components are mounted on a circuit board on which a circuit pattern is formed to form a circuit. The present invention relates to a hybrid module mounted with a heat-generating circuit component such as a field-effect transistor or a power semiconductor.

[0002]

2. Description of the Related Art Conventionally, in a hybrid module in which a heat-generating circuit component such as a field-effect transistor or a power semiconductor is mounted on a circuit board, a special heat radiating means is provided in order to radiate heat from the circuit component. is there. For example, in a hybrid module disclosed in Japanese Patent Application Laid-Open No. Hei 5-13627, a heat radiation fin 22 is provided on a circuit board 21 and a heat-generating circuit component 23 mounted on the circuit board 21 is provided as shown in FIG. , Leaf spring-shaped heat conducting member 2
4 are connected to the heat radiation fins 22. In this hybrid module 20, the heat generated by the circuit components 23 is released to the atmosphere via the heat radiation fins 22.

FIG. 3 shows another conventional hybrid module having a circuit board having heat-generating circuit components mounted thereon. In this hybrid module 20 ′, an aluminum nitride ceramic is used as the circuit board 25, the chip-shaped electronic component 27 is mounted on the land electrode 26 on the circuit board 25, and the solder bumps 28 are mounted on the land electrode 26. A circuit component 29 such as a semiconductor element having a heat generating property is mounted via the device.

The circuit board 25 is mounted on the parent circuit board 30, and the terminal electrodes 25a of the circuit board 25 are
It is connected to a land electrode 31 formed on the parent circuit board 30 by solder.

[0005] Further, the opposing surfaces of the circuit board 25 and the parent circuit board 30 are joined via a conductor film 32 having good thermal conductivity formed on the parent circuit board 30.

[0006] Aluminum nitride-based ceramics have attracted attention as insulating materials having good thermal conductivity. In the above-described hybrid module, heat generated from the circuit components 29 mounted on the circuit board 25 is transferred to the parent circuit board 30 via the circuit board 25 made of aluminum nitride ceramic and having good thermal conductivity and the conductor film 32. Conducted and dissipated.

[0007]

However, the former hybrid module 20 in the above-mentioned conventional example is required.
Is for releasing the heat generated in the circuit component 23 to the atmosphere via the radiating fins 22. In order to enhance the heat radiation efficiency, it is necessary to increase the surface area of the radiating fins 22 inevitably. For this reason, there is a problem that the volume occupied by the radiation fins 22 in the hybrid module 20 is large, and it is difficult to reduce the size.

Further, in the latter hybrid module 20 'in the above-described conventional example, since the heat generated in the circuit components 29 is radiated to the parent circuit board 30 via the circuit board 25, no radiating fin is required. Since the circuit board 25 also serves as a heat radiating means, there is no increase in volume.Although aluminum nitride-based ceramics have good thermal conductivity, they are extremely expensive at present compared to general board materials such as alumina. There was a problem that the cost was increased.

SUMMARY OF THE INVENTION An object of the present invention is to provide a small and highly reliable hybrid module with good heat dissipation.

[0010]

In order to achieve the above object, the present invention provides a circuit board, a heat-generating circuit component mounted in a recess formed in the circuit board, and A hybrid module, comprising: a sealing resin filled between the circuit component and the inner wall surface of the recess; and a radiator plate in contact with the circuit component, the hybrid module being mounted on a parent circuit board and used. Further, a hybrid module having a heat-radiating inner conductor connected to the heat-radiating plate and at least partially exposed to the outer surface of the circuit board is proposed.

According to the hybrid module, the heat-radiating inner conductor is connected to the heat-radiating plate in contact with the circuit component, and at least a part of the heat-radiating internal conductor is exposed on the outer surface of the circuit board. . Thus, the heat generated from the circuit component is conducted to the heat-radiating inner conductor, and is radiated from the exposed portion of the heat-radiating inner conductor to the external space.

According to a second aspect of the present invention, a circuit board, a heat-generating circuit component mounted in a recess formed in the circuit board, and a space between the circuit component and the inner wall surface of the recess are provided. A hybrid module comprising a sealing resin and a radiator plate in contact with the circuit component, the hybrid module being mounted on a parent circuit board for use, wherein the hybrid module is connected to the radiator plate and the circuit component and has at least one A hybrid module including a heat dissipating inner conductor formed by exposing a portion to an outer surface of the circuit board is proposed.

According to the hybrid module, an internal conductor for heat dissipation is connected to the circuit component and the heat sink.
Further, at least a part of the heat-radiating inner conductor is exposed on the outer surface of the circuit board. Thereby, the heat generated from the circuit component is conducted to the heat-radiating internal conductor, and is radiated to the external space from the exposed portion of the heat-radiating internal conductor and the heat-radiating plate.

According to a third aspect of the present invention, a circuit board and a circuit component having heat generation mounted in a recess formed in the circuit board are filled between the circuit component and an inner wall surface of the recess. A hybrid module including a sealing resin and a radiator plate abutting on the circuit component, wherein the hybrid module is mounted on a parent circuit board and used, at least a part of an inner wall surface of at least a part of the recess. The present invention proposes a hybrid module which is covered with a conductive material exposed on the outer surface of the circuit board and connects the conductive material and a heat sink.

According to the hybrid module, heat generated from the circuit component is transferred to the conductive material on the inner wall surface of the concave portion, and is radiated from the exposed portion of the conductive material on the outer surface of the circuit board to the external space. At the same time, heat is transferred to the heat radiating plate via the conductive material, and the heat is radiated from the heat radiating plate to an external space.

According to a fourth aspect of the present invention, in the hybrid module according to the first or second aspect, a circuit board and a circuit component having heat generation mounted in a recess formed in the circuit board; A hybrid module that includes a sealing resin filled between an inner wall surface of a concave portion and a heat radiating plate abutting on the circuit component, and is used by being mounted on a parent circuit board. A hybrid module is proposed in which at least a part of the inner wall surface is covered with a conductive material at least partially exposed to the outer surface of the circuit board, and the conductive material is connected to a heat sink.

According to the hybrid module, the heat generated from the circuit components is conducted to the heat dissipating inner conductor, and the heat is exposed from the exposed portion of the heat dissipating inner conductor or the heat dissipating plate or the exposed portion of the conductive material to the outside. Heat is dissipated into the space.

According to a fifth aspect of the present invention, there is provided the hybrid module according to the first, second or fourth aspect, wherein the heat-radiating inner conductor is connected to an external electrode formed on an outer surface of the circuit board. .

According to the hybrid module, the heat generated from the circuit component is conducted to the heat dissipating inner conductor, and is conducted from the heat dissipating inner conductor to the external electrode. Accordingly, heat is radiated from the external electrodes to an external space, and when the external electrodes are connected to the wiring conductors of the parent circuit board, the heat is conducted to the parent circuit board via the wiring conductors, and Heat is also radiated from the board to the external space.

According to a sixth aspect of the present invention, in the hybrid module according to the first, second, or fourth aspect, a metal case mounted on the circuit board is provided, and the heat-radiating inner conductor is connected to the metal case. Proposed hybrid module.

According to the hybrid module, the heat generated from the circuit component is conducted to the heat dissipating inner conductor, and is conducted from the heat dissipating inner conductor to the metal case. Thereby, heat is radiated from the metal case to the external space.

According to a seventh aspect of the present invention, there is provided the hybrid module according to the first, second, third or fourth aspect, wherein the heat radiating plate is fixed to the circuit board using high-temperature solder.

According to the hybrid module, since the heat sink is fixed to the circuit board by the high-temperature solder, which is a high-temperature stable material, the stress generated on the heat sink and the circuit board due to heat can be reduced, and the thermal resistance is stable. I do.

According to an eighth aspect of the present invention, in the hybrid module of the first, second, third or fourth aspect, a high thermal conductive resin having a thermal conductivity of 10 W / mk or more is provided between the circuit component and the radiator plate. A fixed hybrid module is proposed.

According to the hybrid module, since the heat radiating plate is fixed to the circuit component by the high thermal conductive resin, the high thermal conductive resin can absorb stress generated in the heat radiating plate by heat, and And the thermal resistance can be stabilized.

According to a ninth aspect of the present invention, there is provided the hybrid module according to the first, second, third or fourth aspect, wherein a surface of the heat sink is subjected to a chemical treatment using a silane coupler.

According to the hybrid module, the surface of the heat radiating plate in contact with the resin is modified, and the bonding strength with the resin is improved, so that the interface state is stabilized and the thermal resistance is further stabilized.

According to claim 10, claims 1, 2, 3
In the hybrid module according to the fourth aspect, a hybrid module in which the circuit component and the heat sink are fixed with an Au-Sn alloy is proposed.

According to the hybrid module, since the heat radiating plate is fixed to the circuit component using Au-Sn, the bonding between them is strengthened and the heat radiation efficiency is improved.

According to claim 11, claims 1, 2, 3
In the hybrid module according to the fourth aspect, a hybrid module is proposed in which the circuit component and the heat radiating plate are fixed with metal bumps and resin.

According to the hybrid module, since the heat radiating plate is fixed to the circuit component by the metal bump and the resin, the bonding between them is strengthened and the heat radiation efficiency is improved.

According to claim 12, claims 1, 2, 3
Alternatively, in the hybrid module described in Item 4, a hybrid module is provided in which the heat sink has a through-hole communicating the inside of the recess and the outside of the recess.

According to the hybrid module, since the through-hole is formed in the radiator plate, even if the concave portion in which the circuit component is mounted is sealed by the radiator plate, the inside and the outer portion of the concave portion are not separated. Since the communication is established by the through hole, the pressure in the concave portion does not change before and after the mounting of the heat sink.

According to claim 13, claims 1, 2, 3
5. The hybrid module according to claim 4, wherein the radiator plate has a shape in which a peripheral edge overlaps an opening edge of the concave portion and a part of the peripheral edge is located inside the opening edge of the concave portion. .

According to the hybrid module, the radiator plate has a shape in which a part of its peripheral edge is located inside the opening edge of the concave portion, and the heat radiating plate is placed on the concave portion where the circuit component is mounted. Even when the heat sink is attached, the inside of the recess communicates with the outside, so that the pressure in the recess does not change before and after the heat sink is attached.

According to claim 14, claims 1, 2, 3
Or the hybrid module according to 4, wherein the circuit board has a rectangular parallelepiped shape, and a recess is formed in the main surface between the pair of opposing sides except for the vicinity of the pair of opposing sides. A hybrid module in which the heat sink is fitted is proposed.

According to the hybrid module, on the main surface, a concave portion is formed in almost all portions except for a region near the pair of opposing sides necessary for forming external terminal electrodes, and a heat sink is provided in the concave portion. Mated. Thereby, the area of the heat radiating plate can be set to the maximum in the main surface, and the heat radiation efficiency is improved.

[0038]

FIG. 1 is a side sectional view showing a hybrid module according to an embodiment of the present invention. In the figure, reference numeral 10 denotes a hybrid module, and a plurality of chip-shaped electronic components 1 are mounted on a circuit board 11 on which a circuit pattern is formed.
2, and a circuit component 13 such as a semiconductor element having heat generation is mounted.

The circuit board 11 is made of a ceramic multilayer board mainly composed of rectangular parallelepiped alumina and having a water absorption of 0.1% or less, and is opposed to the bottom face, that is, the main circuit board when mounted on the main circuit board 30. A concave portion 14 for mounting the heat-generating circuit component 13 is formed on the main surface 11a.

The recess 14 is formed in two stages,
A first recess 14A is formed on the side a, and a slightly smaller second recess 14B is formed in the first recess 14A.

The second concave portion 14B is formed to be slightly larger than its vertical and horizontal thickness in accordance with the shape of the circuit component 13 mounted therein.

Further, a land electrode 15 is formed on the bottom surface of the second concave portion 14B, and a terminal electrode of a circuit element 13 such as a semiconductor element having heat generation and an FET mounted in the second concave portion 14B is provided. It is connected to the land electrode 15. These land electrodes 15 are connected to the chip component 12 or external terminal electrodes (not shown) via via holes and internal electrodes. In addition, adjacent land electrodes 15
An insulating resin (encapsulating resin) 16 having thermal conductivity for sealing is filled in between.

In this state, the back surface of the circuit component 13 is
Is substantially the same as the bottom surface of the concave portion 14A.

A plurality of heat radiation internal electrodes 17 A are formed in the circuit board 11, and a part thereof is connected to a ground (ground) electrode of the circuit component 13. Further, the heat dissipation internal electrode 1 is located at a required position on the bottom edge of the first recess 14A.
7A are exposed, and these heat dissipating internal electrodes 17A are exposed.
Is connected to an insulating resin (sealing resin) 16 via a heat radiation via hole 17B (hereinafter referred to as a thermal via hole) and another heat radiation internal electrode 17A. In addition, it is connected to a heat radiation external electrode 17C formed at a predetermined position on the main surface 11a via another thermal via hole 17B.

Further, the first and second recesses 14A, 14
A heat radiation wall electrode 17D is formed at a required position on the inner wall surface of B, and this heat radiation wall electrode 17D is a heat radiation internal electrode 17A.
And the external electrode 17C.

On the other hand, in the first recess 14A, the first
Heat sink 1 having a size slightly smaller than the opening of the concave portion 14A.
8A is mounted, and is fixed between the heat radiating plate 18A and the back surface of the circuit component 13 by a low Young's modulus silicone resin 18B having a thermal conductivity of 10 W / mk or more. Further, the heat radiating plate 18A is attached to the low-temperature glass 18C with respect to the heat radiating internal electrode 17A exposed at the peripheral edge of the bottom surface of the first recess 14A.
It is fixed by using.

In this state, the surface of the heat radiating plate 18A is substantially the same as the main surface 11a of the circuit board 11.

On the other hand, a land electrode 15 is formed on a surface facing the main surface 11a of the circuit board 11, that is, on an upper surface of the circuit board 11 in the drawing, and the chip-shaped electronic component 12 is soldered to the land electrode 15. The chip-shaped electronic component 12 is a metal case 19 fitted on the upper surface of the circuit board 11.
Covered by

Further, on the side surface of the circuit board 11, a plurality of external terminal electrodes (not shown) connected to a circuit pattern formed by the internal conductors are formed.

Further, as described above, the circuit board 11 has a multilayer structure, in which a circuit pattern is formed, and each land electrode 15 is connected to this circuit pattern. This effectively utilizes the volume of the circuit board,
The module is being miniaturized.

According to the hybrid module 10 having the above-described configuration, the heat generated from the circuit component 13 is radiated through the silicon resin 18B and the heat radiating plate 18A. Further, the heat generated from the circuit component 13 is conducted to the heat dissipating internal electrode 17A, and is dissipated from the exposed portion of the heat dissipating internal electrode 17A on the side surface of the circuit board 11, and the thermal via hole 17B and the heat dissipating wall electrode 17D. Since the heat is radiated from the external electrode 18C for heat radiation to the external space through the heat sink, the shape can be reduced and the heat can be efficiently radiated.

Further, since the heat radiating plate 18A is fixed to the circuit board by the silicon resin 18B having a low Young's modulus,
Since the Young's modulus of the silicon resin 18B is small even when the ambient temperature changes, the stress applied to the circuit component 13 from the heat radiating plate 18A by heat can be absorbed, and the circuit component 13 can be prevented from being damaged by heat generation. In addition, the heat resistance can be stabilized and efficient heat radiation can be performed.

Further, the heat radiating plate 18A is made of a low-temperature glass 18C.
The low-temperature glass 18C has a small Young's modulus even when the ambient temperature changes, so that stress on the heat radiating plate 18A and the circuit board 11 due to heat can be reduced, and the thermal resistance is further stabilized. can do.

The heat generated by the circuit component 13 is transmitted to the heat radiating plate 18A via the insulating resin 16, the internal electrode 17A for heat radiating, the thermal via hole 17B, and the low-temperature glass 18C and is radiated from the heat radiating plate 18A. , Circuit parts 1
The heat can be dissipated from both the upper part and the lower part.

Accordingly, it is possible to manufacture a hybrid module which is small in size and can efficiently radiate heat at a low cost.

Further, at the time of mounting on the parent circuit board, as shown in FIG.
By fixing C to the land 31 and the conductive film 32 of the parent circuit board 30 with a heat conductive material 33 such as solder, heat can be conducted from the heat radiating plate 18A and the heat radiating external electrode 18C to the parent circuit board 30, Since heat can also be dissipated through the parent circuit board 30, the area for dissipating heat can be enlarged, and the heat dissipation efficiency can be increased.

At this time, as shown in FIG. 5, for example, both ends of the rectangular heat radiating plate 18A in the longitudinal direction are fixed to the circuit board 11 and the parent circuit board 30, and the heat radiating plate 18A and the circuit board in the longitudinal direction of the heat radiating plate 18A are fixed. Area S of the portion fixed to 11
a> Sb, preferably where Sb is 90% of Sa, where S is the area of the fixing portion between the heat radiating plate 18A and the parent circuit board 30.
% (0.9 × Sa ≧ Sb), the parent circuit board 30
Can absorb the stress from

The fixing material of the heat radiating plate 18A to the circuit component 13 is not limited to the silicon resin, but a resin having a low Young's modulus and a high thermal conductivity, for example, having a thermal conductivity of 10 W /
Similar effects can be obtained by using other resins as long as the resin is mk or more.

Also, substantially the same effect was obtained by using high-temperature solder instead of low-temperature glass 18C.

Further, if the surface of the heat radiating plate 18A is subjected to chemical treatment with a silane coupler to modify the surface of the heat radiating plate 18A in contact with the silicon resin 18B, the adhesive strength with the silicon resin 18B is improved. The interface state is stabilized, and the thermal resistance can be further stabilized.

Also, by physically processing the surface of the heat sink 18A in contact with the resin to form fine irregularities or the like, the contact strength with the silicon resin 18B is improved.
The interface state is stabilized, and the thermal resistance can be further stabilized.

In order to increase the heat radiation efficiency from the heat radiating plate 18A, it is preferable that the heat radiating plate has a thermal conductivity of 100 W / mk or more and a linear expansion coefficient of 10 ppm / ° C. or less. Further, as the material of the heat radiating plate 18A, Mo, A
1N, W, CuW, CuMo, C and the like are preferable. Further, the thickness of the heat radiating plate 18A is preferably about 50 to 250 μm in consideration of the balance between the heat radiation and the stress.

If an organic material multilayer substrate such as glass epoxy is used as the circuit board 11, it is possible to reduce costs and reduce weight while obtaining the same effects.

Next, a second embodiment of the present invention will be described.

FIG. 6 is a side sectional view showing a hybrid module 10B according to the second embodiment. In the figure, the same parts as those in the above-described first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Further, the difference between the first embodiment and the second embodiment is that one end is made of an insulating resin 16.
Alternatively, it is connected to the ground (ground) electrode of the circuit component 13,
A thermal via hole 41 consisting of a continuous via hole whose other end is exposed on the upper surface of the circuit board 11 is formed,
The heat radiation external electrode 17C is connected to the metal case 42.

That is, in the second embodiment, the heat dissipation internal electrode 17A connected to the insulating resin 16 in the first embodiment is removed, and the thermal via hole 4
1, the heat generated from the circuit component 13 is transmitted to the thermal via hole 41 via the insulating resin 16 and is radiated from the other end of the thermal via hole 41 exposed on the upper surface of the circuit board 11.

Further, the heat radiation external electrode 17C is formed on the side surface of the circuit board 11 and is connected to the metal case 42 so that the heat transmitted to the heat radiation external electrode 17C is transmitted to the metal case 42, Heat is radiated from 42 to the external space.

In the above configuration, the heat generated from the circuit component 13 is transferred to the heat radiating plate 18 through the silicone resin 18B.
The heat is radiated from A and also radiated from the metal case 42 to the external space. Further, the heat generated from the circuit component 13 is conducted to the thermal via hole 41 via the insulating resin 16 and is radiated from the exposed portion of the thermal via hole 41 on the upper surface of the circuit board 11, so that the shape is reduced and the efficiency is improved. Heat can be dissipated.

Next, a third embodiment of the present invention will be described.

FIG. 7 is a side sectional view showing a hybrid module 10C according to the third embodiment. In the figure, the same parts as those in the above-described first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Further, the difference between the first embodiment and the second embodiment is that a heat radiating plate 43 having a through hole 43a is provided instead of the heat radiating plate 18A.

That is, as shown in FIG. 8, a circular through hole 43a is formed at one corner of the heat sink 43 having a rectangular shape. The formation position of the through hole 43a is
3 is set in a position that is located in the opening of the second concave portion 14 </ b> B when it is mounted on the circuit board 11 and does not overlap the circuit component 13.

The heat radiating plate 4 having the through holes 43a as described above
By using No. 3, even if the solder or the flux is clogged between the circuit board 11 and the heat radiating plate 43 after the reflow, and the concave portion 14 on which the circuit component 13 is mounted is sealed by the heat radiating plate 43, the inside and the Means through hole 43a
The pressure in the concave portion 14 is
It does not change before and after the mounting of the, and it is possible to suppress the occurrence of the fluctuation of the internal pressure in the concave portion 14, and it is possible to prevent the heat radiation efficiency from being lowered by the fluctuation of the internal pressure.

Note that, without providing the through-hole 43a,
It is needless to say that the same effect can be obtained even if the inside of the concave portion 14 and the outside communicate with each other by changing the shape of. For example, as shown in FIG.
Even if a heat radiating plate 44 having a notch 44a of a predetermined width with a length reaching the opening of the recess 14B is used, the inside of the recess 14 and the external space are always communicated by the notch 44a. The effect of can be obtained.

Next, a fourth embodiment of the present invention will be described.

FIG. 10 is a side sectional view showing a hybrid module 10D according to the fourth embodiment. In the figure, the same parts as those in the above-described first embodiment are denoted by the same reference numerals, and description thereof will be omitted. The difference between the first embodiment and the fourth embodiment is that the circuit component 13 and the heat radiating plate 18A are fixed using a gold-tin (Au-Sn) alloy 45 having excellent thermal conductivity. It is in.

As described above, by joining the circuit component 13 and the heat sink 18A using the Au—Sn alloy 45,
Since the joining strength can be increased and a low and stable thermal resistance can be obtained, the heat radiation efficiency can be improved.

Note that, instead of the Au—Sn alloy 45, another member having excellent thermal conductivity may be used. For example, the same effect can be obtained by using a high-temperature solder or a high heat conductive resin.

Next, a fifth embodiment of the present invention will be described.

FIG. 11 is a side sectional view showing a hybrid module 10E according to the fifth embodiment. In the figure, the same parts as those in the above-described first embodiment are denoted by the same reference numerals, and description thereof will be omitted. The difference between the first embodiment and the fifth embodiment is that the circuit component 13 and the radiator plate 18 </ b> A are
B.

Thus, stable thermal resistance can be obtained by using the metal bumps 46 having excellent thermal conductivity. Further, by filling the silicon resin 18B between the plurality of metal bumps 46 and fixing the circuit component 13 and the heat radiating plate 18A also with the silicon resin 18B, the bonding strength can be increased and the thermal stress can be reduced. The load on the component 13 can be reduced.

Next, a sixth embodiment of the present invention will be described.

FIG. 12 is an external perspective view of the hybrid module 10F according to the sixth embodiment from the main surface side, FIG. 13 is a sectional view taken along the line AA in FIG. 12, and FIG. It is sectional drawing of the BB line arrow direction. In the figure, the same parts as those in the above-described first embodiment are denoted by the same reference numerals, and description thereof will be omitted. Also,
The difference between the first embodiment and the sixth embodiment is that, in the sixth embodiment, the shape of the second recess 14B is not changed in the recess 14 provided on the main surface 11a of the circuit board 11. In addition, a first concave portion 14C extending to a pair of opposing substrate side surfaces is formed, and a heat radiating plate 48 shaped to fit into the first concave portion 14C is provided.

That is, the first concave portion is formed on the main surface 11a between the other pair of opposing sides except for the area necessary for forming the external terminal electrode 47 (the area near the pair of opposing sides). 14C, and the heat sink 4 is formed in the first recess 14C.
8 are fitted, and a pair of side surfaces of the heat radiating plate 48 are exposed on side surfaces of the circuit board. Further, the end of the internal electrode 17A for heat radiation is also exposed on this side surface.

According to the above configuration, on the main surface 11a,
Since the first concave portion 14C is formed in almost all of the portion except for the region necessary for forming the external terminal electrode 47 and the heat sink 48 is fitted, the area of the heat sink 48 is maximized in the main surface 11a. Can be set, and the heat radiation efficiency can be further increased.

Each of the above embodiments is a specific example of the present invention, and the present invention is not limited thereto.
For example, the heat radiation internal electrode 17A, the thermal via hole 1
7B and the heat radiation external electrode 17C may be formed independently for heat radiation, or the same effect can be obtained even when they are also used as a ground (GND) electrode.

Further, in the above embodiment, the module in which one heat-generating circuit component 13 is mounted is configured, but a module in which a plurality of heat-generating circuit components are mounted may be used.
In this case, the same effect can be obtained.

[0087]

As described above, according to the first aspect of the present invention, the heat generated from the circuit components is radiated through the heat radiating plate and is also conducted to the heat radiating inner conductor. Since the heat is radiated from the exposed portion of the internal conductor to the external space, it is possible to reduce the size and efficiently radiate the heat.

According to the second aspect, the heat generated from the circuit component is radiated through the heat radiating plate and is also conducted to the heat radiating inner conductor, and the exposed portion of the heat radiating inner conductor and the heat radiating plate Since the heat is radiated to the external space, the heat can be efficiently radiated by reducing the size.

According to the third aspect, the heat generated from the circuit component is transferred to the conductive material on the inner wall surface of the concave portion, and is radiated to the external space from the exposed portion of the outer surface of the circuit board of the conductive material. Since heat is transferred to the heat radiating plate via the conductive material and is radiated from the heat radiating plate to the external space, the heat radiating plate can be reduced in size and efficiently radiated.

According to the fourth aspect, in addition to the effect of the first or second aspect, the heat generated from the circuit component is transferred to the conductive material on the inner wall surface of the recess, and the circuit board made of the conductive material is used. The heat is radiated from the exposed portion of the outer surface to the external space, and is also transmitted to the heat radiating plate via the conductive material and radiated from the heat radiating plate to the external space, so that the heat radiating efficiency can be further improved.

According to the fifth aspect, in addition to the above effects, the heat generated from the circuit component is radiated from the external electrode to the external space, and the external electrode is connected to the wiring conductor of the parent circuit board. When connected, heat is conducted to the parent circuit board via the wiring conductors, and the heat is also radiated from the parent circuit board to the external space, so that the area for radiating heat is enlarged and the heat radiation efficiency is further improved. Can be.

According to the present invention, in addition to the above effects, in addition to the above effects, the heat generated from the circuit component is conducted to the heat dissipating inner conductor, and is also conducted from the heat dissipating inner conductor to the metal case. Thus, heat is radiated from the metal case to the external space, so that the area for radiating heat is enlarged, and the heat radiation efficiency can be further improved.

According to the seventh aspect, in addition to the above-described effects, since the heat sink is fixed to the circuit board by high-temperature solder, the Young's modulus of the high-temperature solder is small even when the ambient temperature changes. Therefore, it is possible to reduce the stress on the radiator plate and the circuit board due to heat, and to stabilize the thermal resistance.

According to the eighth aspect, in addition to the above-described effects, since the radiator plate is fixed to the circuit component by the high heat conductive resin, even if the ambient temperature changes, the heat radiating plate can be used. Since the Young's modulus is small, it is possible to absorb the stress applied to the circuit components from the heat sink by heat, prevent damage to the circuit components due to heat generation, and stabilize the thermal resistance for efficient heat dissipation. Can be.

According to the ninth aspect, in addition to the above effects, the surface of the radiator plate is chemically treated with a silane coupler to modify the surface of the radiator plate in contact with the resin. Since the adhesive strength with the resin is improved, the interface state is stabilized, and the thermal resistance can be stabilized.

According to the tenth aspect, in addition to the above-described effects, since the heat sink is fixed to the circuit component using an Au-Sn alloy, the bonding between them is strengthened. And the heat radiation efficiency can be improved.

According to the eleventh aspect, in addition to the above-described effects, the heat radiating plate is fixed to the circuit component by using a metal bump and a resin. And the heat radiation efficiency can be improved.

According to the twelfth aspect of the present invention, in addition to the above-described effects, since the through holes are formed in the heat sink, the inside of the concave portion where the circuit component is mounted and the outside are always provided by the through holes. Since the communication is established, the pressure in the concave portion does not change before and after the mounting of the heat radiating plate, the occurrence of internal pressure fluctuation in the concave portion can be suppressed, and a decrease in heat radiation efficiency due to the internal pressure fluctuation can be prevented. Can be.

According to the thirteenth aspect, in addition to the above-described effects, the heat sink has a shape communicating the inside of the recess and the outside, so that the inside of the recess where the circuit component is mounted is connected to the outside. Are constantly communicated with each other, so that the pressure in the concave portion does not change before and after the heat radiating plate is attached, and it is possible to suppress the occurrence of the internal pressure fluctuation in the concave portion, and to prevent a decrease in heat radiation efficiency due to the internal pressure fluctuation. can do.

According to the fourteenth aspect, in addition to the effect described above, a recess is formed in substantially the entire surface of the main surface of the circuit board except for a region necessary for forming external terminal electrodes. Since the heat radiating plate is fitted to the radiating plate, the area of the heat radiating plate can be set to the maximum within the main surface, so that the heat radiating area is increased and the heat radiation efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a hybrid module according to a first embodiment of the present invention.

FIG. 2 is a side sectional view showing a conventional hybrid module.

FIG. 3 is a side sectional view showing another conventional hybrid module.

FIG. 4 is a diagram illustrating an example of a mounting form on a parent circuit board according to the first embodiment of the present invention;

FIG. 5 is a diagram illustrating an example of fixing the heat sink to the circuit board and the parent circuit board according to the first embodiment of the present invention.

FIG. 6 is a side sectional view showing a hybrid module according to a second embodiment of the present invention.

FIG. 7 is a side sectional view showing a hybrid module according to a third embodiment of the present invention.

FIG. 8 is a plan view showing a heat sink according to a third embodiment of the present invention.

FIG. 9 is a plan view showing another example of the shape of the heat sink according to the third embodiment of the present invention.

FIG. 10 is a side sectional view showing a hybrid module according to a fourth embodiment of the present invention.

FIG. 11 is a side sectional view showing a hybrid module according to a fifth embodiment of the present invention.

FIG. 12 is an external perspective view of a hybrid module 10 according to a sixth embodiment of the present invention, as viewed from a main surface side.

13 is a sectional view taken along line AA in FIG.

14 is a sectional view taken along line BB in FIG.

[Explanation of symbols]

10, 10B to 10F: Hybrid module, 11
... Circuit board, 11a ... Main surface, 12 ... Chip-shaped electronic component,
13 circuit parts, 14 recesses, 14A first recess, 1
4B: second concave portion, 15: land electrode, 16: insulating resin (sealing resin), 17A: internal electrode for heat dissipation, 17B: thermal via hole, 17C: external electrode for heat dissipation, 18A ...
Heat sink, 18B: Silicon resin, 18C: Low temperature glass,
19: Metal case, 30: Parent circuit board, 31: Land electrode, 32: Conductive film, 33: Thermal conductive material, 41: Thermal via hole, 42: Metal case, 43: Heat sink, 43
a ... through-hole, 44 ... heat sink, 44a ... cutout part, 45
... Au-Sn alloy, 46 ... metal bumps, 47 ... external terminal electrodes, 48 ... heat sink.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yasushi Inoue 6-16-20 Ueno, Taito-ku, Tokyo Inside Taiyo Denki Co., Ltd. (72) Inventor Shoichiro Hiraku 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Akiyuki Hattori 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Yoshiaki Ueyama 6-16-20 Ueno, Taito-ku, Tokyo Taiyo (72) Inventor Hiroyuki Mogi 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Induction Co., Ltd. (72) Kenichi Ota 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Inside (72) Inventor Hisashi Shigeya 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. (72) Inventor Tomonori Fujii 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Stock Company F-term (reference) 5E346 AA11 AA12 AA15 AA43 AA60 BB01 BB16 BB20 CC31 CC33 CC38 CC40 CC41 CC51 FF45 HH17 HH22

Claims (14)

[Claims] 1. A circuit board, a circuit component having heat generation mounted in a recess formed in the circuit board, and a sealing resin filled between the circuit component and an inner wall surface of the recess. ,
A hybrid module comprising a heat radiating plate abutting on the circuit component, and mounted and used on a parent circuit board, wherein the hybrid module is connected to the heat radiating plate and at least a part is exposed to an outer surface of the circuit board. A hybrid module comprising a heat-radiating inner conductor formed as described above. 2. A circuit board, a circuit component having heat generation mounted in a recess formed in the circuit board, and a sealing resin filled between the circuit component and an inner wall surface of the recess. ,
A hybrid module comprising a heat radiating plate in contact with the circuit component, and mounted and used on a parent circuit board, wherein at least a part of the circuit board is connected to the heat radiating plate and the circuit component. A hybrid module comprising a heat dissipating inner conductor formed to be exposed on an outer surface. 3. A circuit board, a heat-generating circuit component mounted in a recess formed in the circuit board, a sealing resin filled between the circuit component and an inner wall surface of the recess, A hybrid module comprising a heat sink in contact with the circuit component, the hybrid module being mounted on a parent circuit board for use, wherein at least a part of an inner wall surface of at least a part of the recess is outside the circuit board. A hybrid module, wherein the hybrid module is covered with a conductive material exposed on the surface, and the conductive material is connected to a heat sink. 4. A circuit board, a circuit component having heat generation mounted in a recess formed in the circuit board, a sealing resin filled between the circuit component and an inner wall surface of the recess, A hybrid module comprising a heat sink in contact with the circuit component, the hybrid module being used by being mounted on a parent circuit board, wherein at least a part of an inner wall surface of at least a part of the recess is outside the circuit board. The hybrid module according to claim 1, wherein the hybrid module is covered with a conductive material formed by being exposed on the surface, and the conductive material is connected to a heat sink. 5. The hybrid module according to claim 1, wherein said internal conductor for heat dissipation is connected to an external electrode formed on an outer surface of said circuit board. 6. The electronic device according to claim 1, further comprising a metal case mounted on the circuit board, wherein the heat-radiating inner conductor is connected to the metal case.
The hybrid module as described. 7. The heat sink according to claim 1, wherein the heat sink is fixed to the circuit board using high-temperature solder.
5. The hybrid module according to 2, 3, or 4. 8. The method according to claim 1, wherein the circuit component and the heat sink are fixed by a high thermal conductive resin having a thermal conductivity of 10 W / mK or more. Hybrid module. 9. The method according to claim 1, wherein a surface of the heat radiating plate is subjected to a chemical treatment using a silane coupler.
5. The hybrid module according to 2, 3, or 4. 10. A space between the circuit component and the heat sink is A.
5. The hybrid module according to claim 1, wherein the hybrid module is fixed by a u-Sn alloy. 11. The hybrid module according to claim 1, wherein a gap between said circuit component and said heat sink is fixed by a metal bump and a resin. 12. The hybrid module according to claim 1, wherein the heat sink has a through hole communicating between the inside of the recess and the outside of the recess. 13. The heat dissipation plate according to claim 1, wherein a peripheral edge of the heat sink is overlapped with an opening edge of the concave portion, and a part of the peripheral edge is located inside the opening edge of the concave portion. 5. The hybrid module according to claim 2, 3, 3 or 4. 14. The circuit board has a rectangular parallelepiped shape, and a concave portion is formed in the main surface between the pair of opposing sides except for the vicinity of the pair of opposing sides. 3. The method according to claim 1, wherein the plates are fitted.
5. The hybrid module according to 3 or 4.