WO2017022789A1 - Circuit module - Google Patents

Circuit module Download PDF

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Publication number
WO2017022789A1
WO2017022789A1 PCT/JP2016/072779 JP2016072779W WO2017022789A1 WO 2017022789 A1 WO2017022789 A1 WO 2017022789A1 JP 2016072779 W JP2016072779 W JP 2016072779W WO 2017022789 A1 WO2017022789 A1 WO 2017022789A1
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WO
WIPO (PCT)
Prior art keywords
circuit module
recess
electronic component
heat
parent substrate
Prior art date
Application number
PCT/JP2016/072779
Other languages
French (fr)
Japanese (ja)
Inventor
和茂 佐藤
Original Assignee
株式会社村田製作所
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Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2017022789A1 publication Critical patent/WO2017022789A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
    • H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator

Definitions

  • the present invention relates to a circuit module.
  • Patent Document 1 discloses a circuit module in which circuit elements constituting a transmission / reception IC are mounted on the front surface side of a ceramic multilayer substrate, and a crystal resonator is mounted on the back surface side. The back side of the crystal unit and the ceramic multilayer substrate is soldered to the parent substrate. The crystal resonator is connected to a circuit element through a via formed in the ceramic multilayer substrate.
  • an object of the present invention is to provide a circuit module that can suppress heat conduction between a component that generates heat and a component that is susceptible to heat, and that can achieve downsizing.
  • one aspect of a circuit module according to the present invention is a circuit module mounted on a parent board, wherein the heating module, the circuit board on which the heating module is mounted, and the circuit module A recess formed on a surface facing the parent substrate; at least a portion of the surface located on an edge of the recess; and a heat dissipating member disposed on an inner wall of the recess.
  • the heat-sensitive component by disposing the heat-sensitive component in the recess, the heat generating component and the heat-sensitive component are separated into the circuit board and the recess through the heat dissipation member. Can be placed. For this reason, it becomes possible to suppress the heat conduction between the heat generating component and the component which is easily affected by heat. In addition, it is not necessary to ensure the distance between the two components as compared with the case where the heat generating component and the component susceptible to heat are arranged on the same substrate. Therefore, the circuit module can be reduced in size.
  • the heat generating component may be formed on a surface of the circuit board opposite to the side on which the concave portion is formed.
  • the heat generating component is formed on the surface of the circuit board opposite to the side on which the concave portion is formed, the heat conduction between the electronic component housed in the concave portion and the heat generating component is suppressed. be able to.
  • the electronic component and the heat generating component housed in the recess can be arranged with the circuit board interposed therebetween, the circuit module can be reduced in area.
  • the heat radiating member may be made of a conductive material, and a portion of the heat radiating member formed at an edge of the recess may be joined to a ground electrode formed on the parent substrate.
  • the electronic component housed in the recess can be electrically shielded. Further, heat generated inside the recess or heat generated outside the recess can be efficiently released to the parent substrate via the heat dissipation member. Therefore, the heat conduction between the heat generating component and the component that is easily affected by heat can be further suppressed.
  • an electronic component mounted on the parent substrate may be accommodated in the recess.
  • the electronic component is not mounted on the inner wall of the recess, but is mounted on the parent board. Therefore, the electronic component accommodated in the recess and the component disposed outside the recess are connected via the parent substrate, so that the heat between the electronic component accommodated in the recess and the component disposed outside the recess is Conduction can be suppressed.
  • the electronic component may be disposed inside the recess with a space from the heat radiating member.
  • the electronic component housed in the recess and the component disposed outside the recess do not have a heat conduction path that is connected in the circuit module. Therefore, heat conduction between the electronic component housed in the recess and the component disposed outside the recess can be further suppressed.
  • the electronic component may be an oscillator or an oscillator.
  • the oscillator or the oscillator mounted in the recess can be suppressed from being affected by the heat from the circuit board side, so that the fluctuation of the oscillation frequency of the oscillator or the oscillator due to the temperature change of the circuit module can be suppressed. It can be effectively suppressed. Therefore, wireless communication using the resonator or the oscillator can be stabilized.
  • the electronic component may have a hollow structure.
  • the electronic component may be a heat generating component.
  • heat conduction to other components mounted on the circuit board can be suppressed by housing the heat-generating component in the recess.
  • the heat generating component may have a semiconductor circuit.
  • the circuit module may have a plurality of electrode pads on the outer peripheral portion of the surface, and the concave portion may be formed inside the outer peripheral portion.
  • the concave portion is formed inside the outer peripheral portion where the electrode pad is disposed in the circuit module, it is shielded by the outer peripheral portion where the electrode pad is disposed, and communication can be stabilized. .
  • connection terminal that connects the electronic component mounted on the parent substrate and accommodated in the recess and the circuit module may be disposed inside the outer peripheral portion.
  • the heat generating component may be arranged only in the recess.
  • circuit module that can suppress the heat conduction between a component that generates heat and a component that is easily affected by heat, and can realize a reduction in size.
  • FIG. 1 is a cross-sectional view illustrating a configuration of a circuit module according to a comparative example.
  • FIG. 2 is a cross-sectional view illustrating a configuration of a circuit module according to a comparative example.
  • FIG. 3 is a cross-sectional view illustrating a configuration in which the circuit module and the electronic component according to the first embodiment are mounted on a parent substrate.
  • FIG. 4 is a plan view illustrating the configuration of the circuit module according to the first embodiment.
  • FIG. 5 is a bottom view of the configuration of the circuit module according to the first embodiment.
  • FIG. 6 is a cross-sectional view of the circuit module according to the first embodiment taken along the line VI-VI shown in FIGS. 4 and 5.
  • FIG. 1 is a cross-sectional view illustrating a configuration of a circuit module according to a comparative example.
  • FIG. 2 is a cross-sectional view illustrating a configuration of a circuit module according to a comparative example.
  • FIG. 3 is a
  • FIG. 7 is a plan view showing the configuration of the parent substrate according to the first embodiment.
  • FIG. 8 is a cross-sectional view illustrating a configuration before the circuit module and the electronic component according to the first embodiment are mounted on the parent substrate.
  • FIG. 9 is a cross-sectional view illustrating a configuration in which the circuit module and the electronic component according to the first embodiment are mounted on a parent substrate.
  • FIG. 10 is a cross-sectional view illustrating a configuration in which the circuit module and the electronic component according to the first modification of the first embodiment are mounted on a parent substrate.
  • FIG. 11 is a cross-sectional view illustrating a configuration in which the circuit module and the electronic component according to the second modification of the first embodiment are mounted on a parent substrate.
  • FIG. 12 is a bottom view of the configuration of the circuit module according to the second embodiment.
  • FIG. 13 is a cross-sectional view of the circuit module according to the second embodiment taken along the line XIII-XIII shown in FIG.
  • FIG. 14 is a plan view illustrating a configuration of a parent substrate according to the second embodiment.
  • FIG. 1 and 2 are cross-sectional views showing the configuration of a circuit module according to a comparative example.
  • circuit modules are mounted on both sides of a multilayer substrate with a transceiver IC and peripheral components, resin-sealed, and processed integrally with external connection terminals and electromagnetic shields. Has been.
  • circuit components are mounted on both surfaces of the circuit board 22a.
  • a transmission / reception IC 24 that is a heating element and other electronic components are mounted on the surface of the circuit board 22 a opposite to the surface facing the parent substrate 10.
  • a crystal resonator 26 and other electronic parts that are easily affected by heat are mounted on the surface of the circuit board 22a that faces the parent board 10.
  • the circuit board 22a is sealed with a resin 22b and a resin 22c in a state where the transmission / reception IC 24, the crystal resonator 26, and other circuit components are mounted on the front surface and the back surface.
  • the circuit board 22a, the resin 22b, and the resin 22c are collectively referred to as a base body 22.
  • Such a circuit module 20 operates integrally with the parent substrate 10 by being mounted on the parent substrate 10.
  • the accuracy of the oscillation frequency of the circuit module 20 and the reliability of the crystal unit 26 are adversely affected.
  • the increase in heat during communication may lead to drift of the oscillation frequency of the circuit module 20 and may cause communication to be interrupted.
  • a filter for example, a SAW (Surface Acoustic Wave) filter for RF (Radio Frequency) frequency band limitation
  • loss in the pass band increases, so that reception sensitivity increases. May deteriorate or the transmission output may decrease.
  • the noise figure NF Noise Figure
  • heat dissipation of the transmitting / receiving IC 24 that generates heat is improved, heat conduction between the transmitting / receiving IC 24 and a component that is susceptible to heat is suppressed, and it is susceptible to heat. It is conceivable to suppress the temperature of the component from rising above the ambient temperature such as room temperature.
  • the crystal resonator 26 is mounted on the lower surface side of the circuit module 30, that is, the parent substrate 10, as in the circuit module 30 shown in FIG. Further, a configuration is conceivable in which a lid (lid) placed on the top surface of the crystal resonator 26 is exposed on the lower surface of the circuit module 30 and connected to the parent substrate 10 by soldering. With this configuration, the distance between the crystal unit 26 and the transmission / reception IC 24 that is a heating element can be increased, and the temperature of the package of the crystal unit 26 can be brought close to the temperature of the parent substrate 10.
  • the present invention provides a circuit module capable of suppressing the heat conduction between a component that generates heat and a component that is easily affected by heat, and can be downsized as described below. .
  • Embodiment 1 will be described with reference to FIGS.
  • the circuit module 50 mounted on the parent substrate 40 will be described.
  • FIG. 3 is a cross-sectional view illustrating a configuration in which the circuit module 50 and the electronic component 60 according to the first embodiment are mounted on a parent substrate.
  • the circuit module 50 is a circuit module that is mounted on the parent substrate 40 together with the electronic component 60 and operates integrally with the parent substrate 40.
  • the circuit module 50 is, for example, a wireless communication module, and more specifically a wireless LAN module.
  • the circuit module 50 includes a heat generating component 54, a circuit board 52a, a recess 55 formed in the base 52 including the circuit board 52a, and a heat dissipation member 56.
  • the circuit board 52a, the resin 52b, and the resin 52c are collectively defined as the base 52.
  • the circuit board 52a is composed of, for example, a printed board, a ceramic multilayer board (LTCC: Low Temperature Co-fired Ceramic), or a resin multilayer board.
  • the circuit board 52a has electronic components mounted on both sides.
  • a heat generating component 54 is mounted on the surface of the circuit board 52a opposite to the surface facing the parent substrate 40, and a resin is used to seal the heat generating component 54 and other electronic components mounted on the surface. 52b is formed.
  • a resin 52c is provided on the surface of the circuit board 52a facing the parent substrate 40 so as to seal other electronic components mounted on the surface.
  • a recess 55 is formed in the resin 52c from the surface of the base 52 facing the parent substrate 40 toward the circuit board 52a.
  • a heat radiating member 56 is formed on at least a part of the edge of the recess 55 on the surface of the base 52 facing the parent substrate 40 and the inner wall of the recess 55.
  • FIG. 4 is a plan view showing the configuration of the circuit module 50 according to the first embodiment, and shows the configuration when the circuit module 50 is viewed from the surface opposite to the surface facing the parent substrate 40.
  • the resin 52b formed on the circuit board 52a is not shown.
  • the heat generating component 54 and other electronic components are mounted on the surface of the circuit board 52a opposite to the surface facing the parent substrate 40. Thereby, heat conduction between the electronic component 60 accommodated in the recess 55 and the heat generating component 54 can be suppressed. In addition, since the electronic component 60 and the heat generating component 54 can be arranged with the circuit board 52a interposed therebetween, the area of the circuit module can be reduced.
  • the heat generating component 54 is, for example, an LSI constituting a transmission / reception IC. As shown in FIG. 4, the heat generating component 54 occupies a larger area on the circuit board 52a than other electronic components.
  • FIG. 5 is a bottom view showing the configuration of the circuit module 50 according to the first embodiment, and shows the configuration when the circuit module 50 is viewed from the side facing the parent substrate 40.
  • FIG. 6 is a cross-sectional view of the circuit module 50 according to the first embodiment taken along the line VI-VI shown in FIGS. 4 and 5. In FIG. 5, components mounted on the surface of the circuit board 52a facing the parent board 40 are indicated by broken lines.
  • a concave portion 55 is formed in the resin 52c formed on the surface of the circuit board 52a facing the parent substrate 40.
  • the recess 55 has a shape that is recessed from the surface of the surface of the base 52 facing the parent substrate 40 toward the circuit board 52a.
  • the recess 55 is formed larger than the size of the electronic component 60 in order to accommodate the electronic component 60 described later in detail. For this reason, the electronic component 60 is not mounted on the inner wall of the recess 55 but mounted on the parent substrate 40. Therefore, the electronic component 60 accommodated in the recess 55 and the component disposed outside the recess 55 are not directly connected within the base 52, and therefore heat conduction between the electronic component 60 and the component disposed outside the recess 55. Can be suppressed.
  • the concave portion 55 may be disposed at a position where the concave portion 55 partially overlaps the heat generating component 54 when the circuit board 52a is viewed in plan. That is, as shown in FIG. 6, the recess 55 may be formed at a position that partially overlaps the heat generating component 54 with the circuit board 52 a interposed therebetween.
  • the electronic component 60 and the heat generating component 54 can be arranged at positions overlapping each other with the circuit board 52a interposed therebetween, so that the area of the circuit module 50 can be reduced.
  • a heat radiating member 56 is formed on the edge of the concave portion 55 on the surface of the base 52 facing the parent substrate 40 and the inner wall of the concave portion 55.
  • the heat radiating member 56 is formed of a conductive film such as Cu (copper), SUS (stainless steel), or Cu coated with SUS, for example.
  • the heat radiating member 56 may be Ni, Au, or the like instead of Cu and SUS.
  • the electrode pad 56a which is a portion of the heat dissipation member 56 formed on the edge of the recess 55 on the surface of the base 52 that faces the parent substrate 40, is connected to a ground electrode pad 42b formed on the parent substrate 40 described later. Be joined.
  • the electronic component 60 accommodated in the recessed part 55 can be electrically shielded.
  • the heat generated inside the recess 55 or the heat generated outside the recess 55 can be efficiently released to the parent substrate 40 via the heat dissipation member 56. Therefore, heat conduction between the heat generating component 54 and the electronic component 60 can be further suppressed.
  • the circuit module 50 has a plurality of electrode pads 59 on a resin 52c formed on the surface of the circuit board 52a facing the parent substrate 40. As shown in FIG. 5, the plurality of electrode pads 59 are disposed on the outer periphery of the circuit board 50 with a predetermined width from the outer periphery of the circuit module 50 on the resin 52c. Further, as shown in FIG. 6, a through hole 58 that penetrates the resin 52c from the surface side of the resin 52c facing the parent substrate 40 to the circuit board 52a is formed at a position where the electrode pad 59 of the resin 52c is disposed. ing. The through hole 58 is filled with a conductive material. The electrode pad 59 is connected to the circuit board 52 a through the through hole 58.
  • the electrode pad 59 is bonded to an electrode pad 42a formed on the parent substrate 40 described later.
  • the electrode pad 42a may be a ground electrode.
  • FIG. 7 is a plan view showing the configuration of the parent substrate 40 according to the first embodiment, and shows the configuration when the parent substrate 40 is viewed from the side facing the circuit module 50.
  • the parent substrate 40 is a multilayer substrate in which a first layer 40a and a second layer 40b are laminated as shown in FIG.
  • a through hole 44 penetrating the second layer 40b is formed in the parent substrate 40.
  • the through hole 44 connects the first layer 40a and the ground electrode pad 42b.
  • the parent substrate 40 includes an electrode pad 42 a and a ground electrode pad 42 b that are electrically connected to the circuit module 50, and an electrode pad 42 c that is electrically connected to the electronic component 60.
  • a broken line surrounding a region where the plurality of electrode pads 42 a are arranged indicates a region where the circuit module 50 is mounted on the parent substrate 40.
  • a broken line shown in a region inside the ground electrode pad 42 b indicates a region where the electronic component 60 is mounted on the parent substrate 40.
  • the electrode pad 42a is provided on the outer periphery of the area where the circuit module 50 is mounted.
  • a ground electrode pad 42b connected to the electrode pad 56a formed at the edge of the recess 55 is formed inside the region where the electrode pad 42a is formed. Further, an electrode pad 42c is formed inside the region where the ground electrode pad 42b is formed.
  • the electrode pad 42a is joined to an electrode pad 59 (see FIG. 5) provided on the outer periphery of the circuit module 50.
  • the ground electrode pad 42 b is bonded to the electrode pad 56 a that is a portion formed at the edge of the recess 55.
  • the electrode pad 42 c is bonded to the electrode pad formed on the electronic component 60. For example, solder is used for bonding these electrode pads.
  • the electronic component 60 is, for example, an oscillator or an oscillator, that is, a crystal resonator for a reference oscillation frequency.
  • the crystal resonator can be prevented from being affected by the heat from the circuit board 52a side, so that the characteristic deterioration of the crystal resonator due to the temperature change of the circuit module 50 is effectively suppressed. it can. Therefore, wireless communication using the crystal resonator can be stabilized.
  • an air layer exists between the electronic component 60 and the heat radiating member 56 formed inside the recess 55 of the circuit module 50. That is, the electronic component 60 is disposed inside the recess 55 with a space from the heat dissipation member 56. Thereby, the heat from the heat generating component 54 mounted on the circuit module 50 is transmitted to the ground electrode of the parent substrate 40 without being directly transmitted to the electronic component 60. As a result, the temperature of the electronic component 60 is suppressed to a temperature that is approximately the same as the temperature of the parent substrate 40. Therefore, the heat conduction between the electronic component 60 accommodated in the recess 55 and the component disposed outside the recess 55 can be further suppressed.
  • FIG. 8 is a cross-sectional view illustrating a configuration before the circuit module 50 and the electronic component 60 according to the first embodiment are mounted on the parent substrate 40.
  • FIG. 9 is a cross-sectional view illustrating a configuration in which the circuit module 50 and the electronic component 60 according to the first embodiment are mounted on the parent substrate 40.
  • the parent substrate 40 in FIG. 8 is shown as a cross-sectional view taken along the line VIII-VIII shown in FIG.
  • the circuit module 50 is obtained by mounting electronic components constituting a wireless LAN on both sides of the circuit board 52a.
  • Examples of the electronic components constituting the wireless LAN include the heat generating component 54 and other electronic components.
  • a collective substrate that is an aggregate of a plurality of circuit boards 52a on which a plurality of electronic components of the circuit modules 50 are mounted is formed.
  • the heat generating component 54 and other electronic components are sealed with the resin 52b and the resin 52c in the above-described aggregate substrate on which the heat generating component 54 and other electronic components are mounted. Sealing of the heat generating component 54 and other electronic components with the resin 52b and the resin 52c is performed by a transfer mold method.
  • the transfer mold method is a method in which a circuit board on which components are mounted is placed in a mold, and resin is injected into the mold by applying pressure.
  • the collective substrate on which the heat generating component 54 and other electronic components are mounted is inserted into a mold, and for example, several tens of MPa is applied to the collective substrate while the resin 52b and the resin 52c are injected. Apply pressure.
  • the collective substrate, the resin 52b, and the resin 52c are integrally formed.
  • a recess 55 and a through hole 58 are formed in the resin 52c.
  • the through hole 58 penetrates the resin 52c.
  • the recess 55 and the through hole 58 are formed, for example, by etching after forming a mask on the resin 52c.
  • a metal layer to be the heat radiating member 56 is formed on the inner wall of the recess 55 by partial sputtering.
  • a metal layer to be the heat radiating member 56 is also formed on the edge of the concave portion 55 on the surface facing the parent substrate 40, and the electrode pad 56a is formed.
  • a metal layer (or metal plug) is also formed inside the hole to be the through hole 58.
  • a metal layer to be the electrode pad 59 is formed by partial sputtering so as to cover the through hole 58. Thereby, the collective substrate on which the plurality of circuit modules 50 are formed is completed.
  • the collective substrate on which the plurality of circuit modules 50 are formed is divided into individual module pieces. Thereby, each circuit module 50 is completed.
  • the circuit module 50 and the electronic component 60 completed as described above are mounted on the parent substrate 40.
  • a process of mounting the circuit module 50 and the electronic component 60 on the parent substrate 40 will be described.
  • the electronic component 60 is mounted so that the electrode pad 42 c formed on the parent substrate 40 is connected to the electrode pad 62 of the electronic component 60.
  • the circuit module 50 is mounted on the parent substrate 40 so that the electronic component 60 is accommodated in the recess 55. At this time, the circuit module 50 is mounted so that the electrode pads 42a and the ground electrode pads 42b of the parent substrate 40 are connected to the electrode pads 59 and 56a of the circuit module 50, respectively.
  • the electrode pad 42a, the ground electrode pad 42b and the electrode pad 42c, and the electrode pads 59, 56a and 62 may be connected by, for example, solder.
  • the circuit module 50 mounted on the parent substrate 40 is completed in a state where the electronic component 60 is accommodated in the recess 55.
  • an air layer exists between the electronic component 60 and the heat dissipation member 56 formed inside the recess 55. That is, the electronic component 60 is disposed inside the recess 55 with a space from the heat dissipation member 56.
  • the heat from the heat generating component 54 on the circuit module 50 is not directly transmitted to the electronic component 60 but is transmitted to the GND of the parent substrate 40, and the temperature of the electronic component 60 is substantially the same as the temperature of the parent substrate 40. Can be kept at a temperature of
  • the circuit module 50 it is possible to improve the heat dissipation of the heat generating component 54 and to suppress the heat conduction between the heat generating component 54 and the electronic component 60 that is easily affected by heat. Further, since it is not necessary to increase the distance between the heat generating component 54 and the electronic component 60, the circuit module 50 can be downsized.
  • the influence of the heat generating component 54 such as a transmission / reception IC on the electronic component 60 having a large characteristic change due to a temperature change such as a crystal resonator can be significantly reduced.
  • the temperature of the electronic component 60 can be suppressed to the temperature of the parent substrate 40 by connecting the electronic component 60 to the parent substrate 40. Thereby, short-term characteristic fluctuations such as frequency drift occurring in the circuit module 50 can be suppressed.
  • the radiation member 56 disposed in the recess 55 is connected to the ground electrode of the parent substrate 40, thereby effectively suppressing unnecessary radiation from the electronic component 60 exemplified by the crystal resonator and the oscillation circuit. In particular, harmonic components radiated from these can be effectively shielded. Therefore, the operation of the circuit module 50 is stabilized.
  • the electronic component 60 is a crystal resonator
  • the crystal resonator when it is desired to change the frequency of the crystal resonator, only the crystal resonator can be easily replaced in the same circuit module.
  • the configuration in which electronic components are mounted on both surfaces of the circuit board 52a and the electronic component 60 is accommodated in the concave portion 55 on the parent substrate 40 side is not limited to this.
  • the electronic component may be mounted on one side of the circuit board 52a.
  • the partial sputtering method was used as a method of forming the heat dissipation member 56 disposed on the inner wall of the recess 55 and the metal layer of the through hole 58, the method of forming the metal layer is not limited to this, and plating and vapor deposition are performed. The method may be used.
  • an oscillator such as a crystal resonator or an oscillator is exemplified as the electronic component 60 accommodated in the recess 55.
  • the electronic component 60 may be an electronic component having a hollow structure.
  • a SAW filter may be used.
  • the configurations of the circuit module 50 and the SAW filter 110 according to the present modification will be described focusing on differences from the configurations of the circuit module 50 and the electronic component 60 according to the first embodiment.
  • FIG. 10 is a cross-sectional view showing a configuration in which the circuit module 50 and the SAW filter 110 according to the first modification of the first embodiment are mounted on the parent substrate 40. As shown in FIG. 10, the SAW filter 110 is accommodated in the recess 55 of the circuit module 50.
  • the SAW filter 110 has, for example, a WLP (Wafer Level Package) structure in which a package is constituted by a cover layer 111, a support layer 112, and a piezoelectric substrate 113.
  • the WLP structure is a structure that uses the piezoelectric substrate itself as a part of the package, and the package structure is manufactured at the wafer level, so that the structure is suitable for downsizing and low profile.
  • An IDT (Inter Digital Transducer) electrode is composed of an Al electrode or the like on the main surface of the piezoelectric substrate. That is, the IDT electrode is disposed in the hollow 114 surrounded by the cover layer 111, the support layer 112, and the piezoelectric substrate 113. In particular, in the SAW filter 110 having the WLP structure, the propagation of the surface acoustic wave is ensured by this hollow structure.
  • the SAW filter 110 is mounted on the parent substrate 40. That is, the electrode pad 115 included in the SAW filter 110 is electrically connected to the electrode pad 42 c of the parent substrate 40.
  • an air layer exists between the SAW filter 110 and the heat radiating member 56 formed inside the recess 55 of the circuit module 50. That is, the SAW filter 110 is disposed inside the recess 55 with a space from the heat radiating member 56.
  • the influence of the heat generated by the heat generating component 54 on the SAW filter 110 having a large characteristic change due to a temperature change can be significantly reduced. More specifically, since the temperature of the SAW filter 110 itself is substantially fixed to the temperature of the parent substrate 40, characteristic fluctuations such as insertion loss can be effectively suppressed. Further, the hollow structure of the SAW filter 110 can be prevented from being broken by an external pressure. Therefore, wireless communication using the SAW filter 110 can be stabilized.
  • the SAW filter having a hollow structure may be stressed due to stress applied to the hollow structure due to the resin injection of the transfer mold.
  • the SAW filter 110 is built in the module without being put into the mold by the recess 55 formed in the circuit module 50. High performance can be secured with the same mounting area.
  • the electronic component housed in the recess 55 may not be the SAW filter 110 but may be an electronic component having a hollow package structure such as a MEMS vibrator or a BAW filter.
  • the electronic components housed in the recess 55 can be transferred from the SAW filter to the BAW when the set is mounted without changing the circuit module 50. It is possible to easily change to a filter.
  • an oscillator or an oscillator such as a crystal resonator is exemplified as the electronic component 60 accommodated in the recess 55.
  • the electronic component 60 may be a semiconductor circuit, for example, FEM ( Front End Module).
  • FEM Front End Module
  • FIG. 11 is a cross-sectional view showing a configuration in which the circuit module 50 and the FEM 120 according to the second modification of the first embodiment are mounted on the parent substrate 40. As shown in FIG. 11, the FEM 120 is accommodated in the recess 55 of the circuit module 50.
  • the FEM 120 is a front-end module that includes at least one of, for example, an LNA, a PA (Power Amplifier), and a switch. Since PA is a heating element, when the FEM 120 includes PA, the FEM 120 becomes a heat generating component.
  • LNA Low Noise Noise amplifier
  • PA Power Amplifier
  • the FEM 120 is mounted on the parent substrate 40. That is, the electrode pad 125 included in the FEM 120 is electrically connected to the electrode pad 42 c of the parent substrate 40.
  • An air layer exists between the FEM 120 and the heat radiating member 56 formed inside the recess 55 of the circuit module 50. That is, the FEM 120 is disposed inside the recess 55 with a space from the heat radiating member 56.
  • the influence of the heat generated by the circuit module 50 can significantly reduce the influence on the LNA where NF deteriorates as the temperature rises.
  • the influence of the heat generated by the PA on the circuit module 50 including the crystal resonator can be significantly reduced. That is, by accommodating the heat-generating component in the recess 55, heat conduction to other components mounted on the circuit board 52a can be suppressed.
  • the circuit module 70 according to the present embodiment differs from the circuit module 50 according to the first embodiment in the configuration of electrodes formed in the vicinity of the recess.
  • the configuration of the circuit module 70 according to the present embodiment will not be described for the same points as the configuration of the circuit module 50 according to the first embodiment, and will be described focusing on the different points.
  • FIG. 12 is a bottom view showing the configuration of the circuit module 70 according to the second embodiment, and shows the configuration when the circuit module 70 is viewed from the side facing the parent substrate 40.
  • 13 is a cross-sectional view of the circuit module 70 according to the second embodiment, taken along the line XIII-XIII shown in FIG. In FIG. 12, components mounted on the surface of the circuit board 52a facing the parent board 40 are indicated by broken lines.
  • FIG. 14 is a plan view showing the configuration of the parent substrate 80 according to the second embodiment, and shows the configuration when the parent substrate 80 is viewed from the side facing the circuit module 70.
  • a recess 75 is formed in the resin 52c formed on the side of the circuit board 52a facing the parent substrate 80.
  • the recess 75 has a shape that is recessed from the surface of the base 52 facing the parent substrate 80 toward the circuit board 52a.
  • the recess 75 is formed larger than the size of the electronic component 60 in order to accommodate the electronic component 60 therein.
  • the parent substrate 80 is a multilayer substrate, similar to the parent substrate 40.
  • the parent substrate 80 has electrode pads 82 and 86 electrically connected to the circuit module 70 and electrode pads 83 and 84 electrically connected to the electronic component 60.
  • a broken line surrounding a region where the plurality of electrode pads 42 a are arranged indicates a region where the circuit module 70 is mounted on the parent substrate 80.
  • the electrode pad 42a is provided on the outer periphery of the region where the circuit module 70 is mounted.
  • An electrode pad 82 connected to the electrode pad 76a formed at the edge of the recess 75 is formed inside the region where the electrode pad 42a is formed.
  • An electrode pad 86 connected to the electrode pad 77 is formed inside the region where the electrode pad 42a is formed.
  • electrode pads 83 and 84 that are electrically connected to the electronic component 60 are formed inside the region where the electrode pads 82 are formed. Due to the arrangement of the electrode pads, the electronic component 60 is electrically connected to the circuit module 70 via the electrode pads 84, the wiring 85 connecting the electrode pads 84 and 86, and the electrode pads 86. For example, solder is used for bonding these electrode pads.
  • the circuit module 70 has a plurality of electrode pads 59 on the outer peripheral portion of the surface facing the parent substrate 80, and the concave portion 75 is inside the outer peripheral portion on which the plurality of electrode pads 59 are formed. Is formed. Thereby, since the recess 75 is formed inside the outer peripheral portion where the electrode pad 59 is arranged in the circuit module 70, it is shielded by the outer peripheral portion where the electrode pad 59 is arranged, and the electronic component 60 is used. Communication can be stabilized.
  • an electrode pad 77 which is a connection terminal for electrically connecting the electronic component 60 accommodated in the recess 75 and the circuit module 70 is disposed inside the outer peripheral portion where the plurality of electrode pads 59 are formed. Accordingly, it is not necessary to increase the number of electrode pads 59 arranged on the outer peripheral portion of the surface of the circuit module 70 facing the parent substrate 80, so that downsizing can be realized.
  • a heat radiating member 76 is formed on the edge of the recess 75 on the surface facing the parent substrate 80 of the base 52 and the inner wall of the recess 75.
  • the width of the side closest to the electrode pad 77 of the electrode pad 76a which is the portion formed at the edge of the recess 75 on the surface of the base 52 facing the parent substrate 80 is the other width of the electrode pad 76a. It is narrower than the width of the side.
  • the electrode pad 84 and the electrode pad 77 of the electronic component 60 are electrically connected via the wiring 85 of the parent substrate 80. According to this connection, the wiring 85 intersects the side of the electrode pad 76a closest to the electrode pad 77 in a plan view. A stray capacitance is generated at a portion where the wiring 85 and the electrode pad 76a formed at the edge of the recess 75 intersect. The stray capacitance increases as the crossing area between the wiring 85 and the electrode pad 76a increases.
  • the width of the portion of the electrode pad 76a that intersects the wiring 85 is narrowed, so that the stray capacitance can be made sufficiently small. Therefore, deterioration of the high frequency response characteristics of the electronic component 60 accommodated in the recess 75 can be suppressed.
  • circuit module according to the embodiment of the present invention has been described with reference to the embodiment and the modification.
  • the circuit module according to the present invention is not limited to the embodiment and the modification.
  • the recess 75 of the circuit module 70 according to the second embodiment may be configured to accommodate the SAW filter 110 according to the first modification of the first embodiment or the FEM 120 according to the second modification of the first embodiment.
  • the heat dissipating member disposed in the recesses 55 and 75 is a conductive member in the above-described embodiment, the heat dissipating member is not limited to the conductive member, and may be composed of, for example, carbon.
  • the heat generating component 54 is disposed outside the recesses 55 and 75.
  • the heat generating component 54 and other heat generating components may be disposed only in the recesses 55 and 75. That is, a configuration in which no heat generating component is disposed outside the recess 55 or 75 may be employed.
  • the present invention can be widely used in communication devices such as mobile phones as a wireless communication module equipped with a transmission / reception IC and a crystal resonator.

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Abstract

A circuit module (50) mounted on a parent substrate (40) is provided with a heat-generating component (54), a circuit board (52a) on which the heat-generating component (54) is mounted, a recess (55) formed on the surface of the circuit module (50) facing the parent substrate (40), and a heat dissipation member (56) disposed on the inner wall of the recess (55) and on at least a part of the edge of the recess (55) on said surface.

Description

回路モジュールCircuit module
　本発明は、回路モジュールに関する。 The present invention relates to a circuit module.
　従来、通信回路の小型化のため、送受信ＩＣ（Ｉｎｔｅｇｒａｔｅｄ　Ｃｉｒｃｕｉｔ）とともに水晶振動子などの周辺部品を内蔵した回路モジュールが開発されている。近年では、送受信ＩＣと周辺部品とを多層基板の両面に実装した上で樹脂封止し、外部接続端子や電磁シールドと一体に加工した回路モジュールが開発されている（例えば、特許文献１参照）。 Conventionally, in order to reduce the size of a communication circuit, a circuit module in which peripheral components such as a crystal resonator are built together with a transmission / reception IC (Integrated Circuit) has been developed. In recent years, a circuit module has been developed in which a transmission / reception IC and peripheral components are mounted on both surfaces of a multilayer substrate, resin-sealed, and processed integrally with an external connection terminal and an electromagnetic shield (for example, see Patent Document 1). .
　特許文献１では、セラミック多層基板の表面側に送受信ＩＣを構成する回路素子を実装し、裏面側に水晶振動子を実装した回路モジュールが開示されている。水晶振動子およびセラミック多層基板の裏面側は、親基板に半田付けされている。また、水晶振動子は、セラミック多層基板に形成されたビアを介して回路素子と接続されている。 Patent Document 1 discloses a circuit module in which circuit elements constituting a transmission / reception IC are mounted on the front surface side of a ceramic multilayer substrate, and a crystal resonator is mounted on the back surface side. The back side of the crystal unit and the ceramic multilayer substrate is soldered to the parent substrate. The crystal resonator is connected to a circuit element through a via formed in the ceramic multilayer substrate.
特許第４５５３６２７号公報Japanese Patent No. 4553627
　特許文献１に記載の技術では、水晶振動子は回路素子と接続されているため、送受信ＩＣの内部損失に伴う発熱により、水晶振動子、フィルタおよびＬＮＡ（Ｌｏｗ　Ｎｏｉｓｅ　Ａｍｐｌｉｆｉｅｒ：低雑音増幅器）などの他の回路部品の温度が上昇することとなる。例えば、水晶振動子の温度の上昇は、回路モジュールの発振周波数の精度や、水晶振動子の信頼性の低下に繋がる。特に、通信中に熱が上昇することは発振周波数のドリフトに繋がり、通信が途絶える原因となることもある。 In the technique described in Patent Document 1, since the crystal resonator is connected to a circuit element, a crystal resonator, a filter, an LNA (Low Noise Amplifier), and the like are generated due to heat generated by the internal loss of the transmission / reception IC. The temperature of other circuit components will rise. For example, an increase in the temperature of the crystal unit leads to a decrease in the accuracy of the oscillation frequency of the circuit module and the reliability of the crystal unit. In particular, an increase in heat during communication leads to drift of the oscillation frequency, which may cause communication to be interrupted.
　送受信ＩＣから熱の影響を受けやすい部品への熱伝導を防ぐには、例えば、送受信ＩＣと熱の影響を受けやすい部品との距離を離すことが有効であるが、この場合、回路モジュールに必要な面積が大きくなり、回路モジュールを小型化することができないという問題が生じる。 To prevent heat conduction from the transceiver IC to the heat-sensitive component, for example, it is effective to increase the distance between the transceiver IC and the heat-sensitive component. In this case, it is necessary for the circuit module. As a result, the area becomes large and the circuit module cannot be miniaturized.
　上記課題に鑑み、本発明は、発熱する部品と熱の影響を受けやすい部品との間の熱伝導を抑制すると共に小型化を実現することができる回路モジュールを提供することを目的とする。 In view of the above-described problems, an object of the present invention is to provide a circuit module that can suppress heat conduction between a component that generates heat and a component that is susceptible to heat, and that can achieve downsizing.
　上記目的を達成するために、本発明にかかる回路モジュールの一態様は、親基板に実装される回路モジュールであって、発熱部品と、前記発熱部品が実装された回路基板と、前記回路モジュールの前記親基板と対向する面に形成された凹部と、前記面のうち前記凹部の縁に位置する部分の少なくとも一部、および、前記凹部の内壁に配置された放熱部材とを備える。 In order to achieve the above object, one aspect of a circuit module according to the present invention is a circuit module mounted on a parent board, wherein the heating module, the circuit board on which the heating module is mounted, and the circuit module A recess formed on a surface facing the parent substrate; at least a portion of the surface located on an edge of the recess; and a heat dissipating member disposed on an inner wall of the recess.
　この態様によれば、熱の影響を受けやすい部品を凹部内に配置することで、発熱部品および熱の影響を受けやすい部品を、放熱部材を介して回路基板上と凹部内とに分離して配置できる。このため、発熱部品と、熱の影響を受けやすい部品との間の熱伝導を抑制することが可能となる。また、発熱部品と、熱の影響を受けやすい部品とを同一基板上に配置した場合と比較して、双方の部品間の距離を確保する必要がない。よって、回路モジュールの小型化を実現することができる。 According to this aspect, by disposing the heat-sensitive component in the recess, the heat generating component and the heat-sensitive component are separated into the circuit board and the recess through the heat dissipation member. Can be placed. For this reason, it becomes possible to suppress the heat conduction between the heat generating component and the component which is easily affected by heat. In addition, it is not necessary to ensure the distance between the two components as compared with the case where the heat generating component and the component susceptible to heat are arranged on the same substrate. Therefore, the circuit module can be reduced in size.
　また、前記発熱部品は、前記回路基板の、前記凹部が形成された側と反対側の面に形成されていてもよい。 Further, the heat generating component may be formed on a surface of the circuit board opposite to the side on which the concave portion is formed.
　この構成によれば、発熱部品は、回路基板の凹部が形成された側と反対側の面に形成されているので、凹部に収容される電子部品と発熱部品との間の熱伝導を抑制することができる。また、凹部に収容される電子部品と発熱部品とを、回路基板を挟んで配置できるので、回路モジュールを省面積化することが可能となる。 According to this configuration, since the heat generating component is formed on the surface of the circuit board opposite to the side on which the concave portion is formed, the heat conduction between the electronic component housed in the concave portion and the heat generating component is suppressed. be able to. In addition, since the electronic component and the heat generating component housed in the recess can be arranged with the circuit board interposed therebetween, the circuit module can be reduced in area.
　また、前記放熱部材は、導電性材料で構成され、前記放熱部材のうち、前記凹部の縁に形成された部分は、前記親基板に形成された接地電極と接合されてもよい。 The heat radiating member may be made of a conductive material, and a portion of the heat radiating member formed at an edge of the recess may be joined to a ground electrode formed on the parent substrate.
　この構成によれば、凹部に収容される電子部品を電気的に遮蔽することができる。また、凹部内で発生した熱または凹部外で発生した熱を、それぞれ、放熱部材を経由して親基板へ効率よく逃がすことが可能となる。したがって、発熱部品と、熱の影響を受けやすい部品との間の熱伝導を、より抑制することができる。 According to this configuration, the electronic component housed in the recess can be electrically shielded. Further, heat generated inside the recess or heat generated outside the recess can be efficiently released to the parent substrate via the heat dissipation member. Therefore, the heat conduction between the heat generating component and the component that is easily affected by heat can be further suppressed.
　また、前記凹部の内部に、前記親基板に実装される電子部品を収容してもよい。 Further, an electronic component mounted on the parent substrate may be accommodated in the recess.
　この構成によれば、電子部品は、凹部の内壁に実装されるのではなく、親基板に実装される。よって、凹部に収容される電子部品と凹部外に配置される部品とは、親基板を介して接続されるので、凹部に収容される電子部品と凹部外に配置される部品との間の熱伝導を抑制することができる。 According to this configuration, the electronic component is not mounted on the inner wall of the recess, but is mounted on the parent board. Therefore, the electronic component accommodated in the recess and the component disposed outside the recess are connected via the parent substrate, so that the heat between the electronic component accommodated in the recess and the component disposed outside the recess is Conduction can be suppressed.
　また、前記電子部品は、前記凹部の内部において、前記放熱部材と空間を隔てて配置されていてもよい。 Further, the electronic component may be disposed inside the recess with a space from the heat radiating member.
　この構成によれば、凹部に収容される電子部品と凹部外に配置される部品とは、回路モジュール内で繋がる熱伝導経路を有しない。よって、凹部に収容される電子部品と凹部外に配置される部品との間の熱伝導を、さらに抑制することができる。 According to this configuration, the electronic component housed in the recess and the component disposed outside the recess do not have a heat conduction path that is connected in the circuit module. Therefore, heat conduction between the electronic component housed in the recess and the component disposed outside the recess can be further suppressed.
　また、前記電子部品は、発振子または発振器であってもよい。 The electronic component may be an oscillator or an oscillator.
　この構成によれば、凹部内に実装された発振子または発振器が、回路基板側からの熱の影響を受けることを抑制できるので、回路モジュールの温度変化による発振子または発振器の発振周波数の変動を効果的に抑制できる。よって、当該発振子または発振器を用いた無線通信を安定させることが可能となる。 According to this configuration, the oscillator or the oscillator mounted in the recess can be suppressed from being affected by the heat from the circuit board side, so that the fluctuation of the oscillation frequency of the oscillator or the oscillator due to the temperature change of the circuit module can be suppressed. It can be effectively suppressed. Therefore, wireless communication using the resonator or the oscillator can be stabilized.
　また、前記電子部品は、中空構造を有してもよい。 Further, the electronic component may have a hollow structure.
　この構成によれば、ＭＥＭＳ振動子、ＳＡＷフィルタ、ＢＡＷフィルタ等の中空パッケージ構造を有する電子部品が凹部に収容されるので、圧力により中空構造が破壊されるのを抑制することができる。また、回路モジュールの温度変化による上記電子部品の周波数特性の劣化を効果的に抑制できる。よって、上記電子部品を用いた無線通信を安定させることが可能となる。 According to this configuration, since electronic parts having a hollow package structure such as a MEMS vibrator, a SAW filter, and a BAW filter are accommodated in the concave portion, it is possible to prevent the hollow structure from being broken by pressure. Further, it is possible to effectively suppress the deterioration of the frequency characteristics of the electronic component due to the temperature change of the circuit module. Therefore, wireless communication using the electronic component can be stabilized.
　また、前記電子部品は、発熱部品であってもよい。 Further, the electronic component may be a heat generating component.
　この構成によれば、凹部に発熱部品を収容することで、回路基板に実装された他の部品への熱伝導を抑制することができる。 According to this configuration, heat conduction to other components mounted on the circuit board can be suppressed by housing the heat-generating component in the recess.
　また、前記発熱部品は、半導体回路を有してもよい。 The heat generating component may have a semiconductor circuit.
　この構成によれば、回路モジュールの温度上昇による特性の劣化、特に、雑音指数ＮＦ（Ｎｏｉｓｅ　Ｆｉｇｕｒｅ）の劣化や整合損失の増加を効果的に抑制することができる。したがって、通信を安定させることができる。 According to this configuration, it is possible to effectively suppress the deterioration of characteristics due to the temperature rise of the circuit module, in particular, the deterioration of noise figure NF (Noise Figure) and the increase of matching loss. Therefore, communication can be stabilized.
　また、前記回路モジュールは、前記面の外周部に複数の電極パッドを有し、前記凹部は、前記外周部の内側に形成されていてもよい。 Further, the circuit module may have a plurality of electrode pads on the outer peripheral portion of the surface, and the concave portion may be formed inside the outer peripheral portion.
　この構成によれば、凹部は、回路モジュールにおいて、電極パッドが配置された外周部よりも内側に形成されているので、電極パッドが配置された外周部によりシールドされ、通信を安定させることができる。 According to this configuration, since the concave portion is formed inside the outer peripheral portion where the electrode pad is disposed in the circuit module, it is shielded by the outer peripheral portion where the electrode pad is disposed, and communication can be stabilized. .
　また、前記親基板に実装され前記凹部の内部に収容される電子部品と前記回路モジュールとを接続する接続端子は、前記外周部の内側に配置されていてもよい。 In addition, the connection terminal that connects the electronic component mounted on the parent substrate and accommodated in the recess and the circuit module may be disposed inside the outer peripheral portion.
　この構成によれば、電極パッドの数を増加する必要がないので、小型化を実現することができる。 According to this configuration, it is not necessary to increase the number of electrode pads, so that downsizing can be realized.
　本発明に係る他の一態様としては、発熱部品が凹部内のみに配置されていてもよい。 As another aspect of the present invention, the heat generating component may be arranged only in the recess.
　本発明によれば、発熱する部品と熱の影響を受けやすい部品との間の熱伝導を抑制すると共に小型化を実現することができる回路モジュールを提供することができる。 According to the present invention, it is possible to provide a circuit module that can suppress the heat conduction between a component that generates heat and a component that is easily affected by heat, and can realize a reduction in size.
図１は、比較例に係る回路モジュールの構成を示す断面図である。FIG. 1 is a cross-sectional view illustrating a configuration of a circuit module according to a comparative example. 図２は、比較例に係る回路モジュールの構成を示す断面図である。FIG. 2 is a cross-sectional view illustrating a configuration of a circuit module according to a comparative example. 図３は、実施の形態１にかかる回路モジュールと電子部品とを親基板に搭載した構成を示す断面図である。FIG. 3 is a cross-sectional view illustrating a configuration in which the circuit module and the electronic component according to the first embodiment are mounted on a parent substrate. 図４は、実施の形態１にかかる回路モジュールの構成を示す平面図である。FIG. 4 is a plan view illustrating the configuration of the circuit module according to the first embodiment. 図５は、実施の形態１にかかる回路モジュールの構成を示す底面図である。FIG. 5 is a bottom view of the configuration of the circuit module according to the first embodiment. 図６は、実施の形態１にかかる回路モジュールの、図４および図５に示すＶＩ－ＶＩ線における矢視断面図である。FIG. 6 is a cross-sectional view of the circuit module according to the first embodiment taken along the line VI-VI shown in FIGS. 4 and 5. 図７は、実施の形態１にかかる親基板の構成を示す平面図である。FIG. 7 is a plan view showing the configuration of the parent substrate according to the first embodiment. 図８は、実施の形態１にかかる回路モジュールと電子部品とを親基板に搭載する前の構成を示す断面図である。FIG. 8 is a cross-sectional view illustrating a configuration before the circuit module and the electronic component according to the first embodiment are mounted on the parent substrate. 図９は、実施の形態１にかかる回路モジュールと電子部品とを親基板に搭載した構成を示す断面図である。FIG. 9 is a cross-sectional view illustrating a configuration in which the circuit module and the electronic component according to the first embodiment are mounted on a parent substrate. 図１０は、実施の形態１の変形例１にかかる回路モジュールと電子部品とを親基板に搭載した構成を示す断面図である。FIG. 10 is a cross-sectional view illustrating a configuration in which the circuit module and the electronic component according to the first modification of the first embodiment are mounted on a parent substrate. 図１１は、実施の形態１の変形例２にかかる回路モジュールと電子部品とを親基板に搭載した構成を示す断面図である。FIG. 11 is a cross-sectional view illustrating a configuration in which the circuit module and the electronic component according to the second modification of the first embodiment are mounted on a parent substrate. 図１２は、実施の形態２にかかる回路モジュールの構成を示す底面図である。FIG. 12 is a bottom view of the configuration of the circuit module according to the second embodiment. 図１３は、実施の形態２にかかる回路モジュールの、図１２に示すＸＩＩＩ－ＸＩＩＩ線における矢視断面図である。FIG. 13 is a cross-sectional view of the circuit module according to the second embodiment taken along the line XIII-XIII shown in FIG. 図１４は、実施の形態２にかかる親基板の構成を示す平面図である。FIG. 14 is a plan view illustrating a configuration of a parent substrate according to the second embodiment.
　本発明者は、「背景技術」の欄において記載した回路モジュールに関し、以下のような問題が生じることを見出した。以下、図１および図２を用いて本問題について説明する。 The present inventor has found that the following problems occur with respect to the circuit module described in the “Background Art” column. Hereinafter, this problem will be described with reference to FIGS.
　図１および図２は、比較例に係る回路モジュールの構成を示す断面図である。 1 and 2 are cross-sectional views showing the configuration of a circuit module according to a comparative example.
　前述したように、近年、回路モジュールは、小型化を実現するために、送受信ＩＣと周辺部品とを多層基板の両面に実装した上で樹脂封止し、外部接続端子や電磁シールドと一体に加工されている。 As mentioned above, in recent years, in order to achieve miniaturization, circuit modules are mounted on both sides of a multilayer substrate with a transceiver IC and peripheral components, resin-sealed, and processed integrally with external connection terminals and electromagnetic shields. Has been.
　このような回路モジュールでは、例えば、図１に示す回路モジュール２０のように、回路基板２２ａの両面に回路部品が実装されている。回路基板２２ａの、親基板１０と対向する面と反対側の面には、発熱体である送受信ＩＣ２４およびその他の電子部品が実装されている。また、回路基板２２ａの、親基板１０と対向する面には、熱の影響を受けやすい部品である水晶振動子２６およびその他の電子部品が実装されている。そして、回路基板２２ａは、送受信ＩＣ２４、水晶振動子２６およびその他の回路部品等が表面および裏面に実装された状態で樹脂２２ｂおよび樹脂２２ｃにより封止されている。なお、回路基板２２ａ、樹脂２２ｂおよび樹脂２２ｃを、合わせて基体２２と呼ぶ。このような回路モジュール２０は、親基板１０に実装されることにより、親基板１０と一体となって動作する。 In such a circuit module, for example, like the circuit module 20 shown in FIG. 1, circuit components are mounted on both surfaces of the circuit board 22a. A transmission / reception IC 24 that is a heating element and other electronic components are mounted on the surface of the circuit board 22 a opposite to the surface facing the parent substrate 10. Further, on the surface of the circuit board 22a that faces the parent board 10, a crystal resonator 26 and other electronic parts that are easily affected by heat are mounted. The circuit board 22a is sealed with a resin 22b and a resin 22c in a state where the transmission / reception IC 24, the crystal resonator 26, and other circuit components are mounted on the front surface and the back surface. The circuit board 22a, the resin 22b, and the resin 22c are collectively referred to as a base body 22. Such a circuit module 20 operates integrally with the parent substrate 10 by being mounted on the parent substrate 10.
　近年、ＩＥＥＥ８０２．１１規格に従う無線ＬＡＮ（Ｌｏｃａｌ　Ａｒｅａ　Ｎｅｔｗｏｒｋ）等においては、変調の高度化に伴う伝送速度の伸びは著しく、伝送経路を複数設けることにより通信品質を向上させるＭＩＭＯ（Ｍｕｌｔｉｐｌｅ－Ｉｎｐｕｔ　ａｎｄ　Ｍｕｌｔｉｐｌｅ－Ｏｕｔｐｕｔ）化の技術も進展している。また、送受信ＩＣ２４の製造に用いる半導体プロセスの微細化および高集積化も進んでいる。これらの要因により、回路モジュール２０において、送受信ＩＣ２４の内部損失に伴う発熱量は飛躍的に大きくなっている。また、この熱は、通信モジュールに内蔵されている他の部品、具体的には水晶振動子、フィルタおよびＬＮＡ等に伝わり、これらの部品の温度を上昇させる。 In recent years, in wireless LANs (Local Area Networks) and the like that comply with the IEEE 802.11 standard, transmission speed increases with the advancement of modulation, and MIMO (Multiple-Input and Multiple) improves communication quality by providing multiple transmission paths. -Output) technology is also progressing. Further, miniaturization and high integration of semiconductor processes used for manufacturing the transmission / reception IC 24 are also progressing. Due to these factors, in the circuit module 20, the amount of heat generated due to the internal loss of the transmission / reception IC 24 is dramatically increased. In addition, this heat is transmitted to other components built in the communication module, specifically, a crystal resonator, a filter, an LNA, and the like, and raises the temperature of these components.
　特に、水晶振動子２６の温度が上昇すると、回路モジュール２０の発振周波数の精度および水晶振動子２６の信頼性に悪影響を及ぼす。通信中に熱が上昇することは、回路モジュール２０の発振周波数のドリフトに繋がり、通信が途絶える原因となることもある。また、回路モジュール２０において、フィルタ（例えば、ＲＦ（Ｒａｄｉｏ　Ｆｒｅｑｕｅｎｃｙ）周波数帯域制限のためのＳＡＷ（Ｓｕｒｆａｃｅ　Ａｃｏｕｓｔｉｃ　Ｗａｖｅ）フィルタ等）の温度が上昇すると、通過帯域内の損失が大きくなることから、受信感度が悪化したり、送信出力が低下したりするおそれがある。また、ＬＮＡの温度が上昇すると、雑音指数ＮＦ（Ｎｏｉｓｅ　Ｆｉｇｕｒｅ）が大きくなることから、受信感度が悪化するという不具合が生じるおそれもある。 Particularly, when the temperature of the crystal unit 26 rises, the accuracy of the oscillation frequency of the circuit module 20 and the reliability of the crystal unit 26 are adversely affected. The increase in heat during communication may lead to drift of the oscillation frequency of the circuit module 20 and may cause communication to be interrupted. Further, in the circuit module 20, when the temperature of a filter (for example, a SAW (Surface Acoustic Wave) filter for RF (Radio Frequency) frequency band limitation) rises, loss in the pass band increases, so that reception sensitivity increases. May deteriorate or the transmission output may decrease. Further, when the temperature of the LNA rises, the noise figure NF (Noise Figure) increases, so that there is a possibility that the reception sensitivity deteriorates.
　このような問題を解消するためには、発熱する送受信ＩＣ２４の放熱を良好にすること、送受信ＩＣ２４と熱の影響を受けやすい部品との間の熱伝導を抑制すること、熱の影響を受けやすい部品の温度が室温などの環境温度以上に上昇することを抑制すること、が考えられる。 In order to solve such problems, heat dissipation of the transmitting / receiving IC 24 that generates heat is improved, heat conduction between the transmitting / receiving IC 24 and a component that is susceptible to heat is suppressed, and it is susceptible to heat. It is conceivable to suppress the temperature of the component from rising above the ambient temperature such as room temperature.
　熱の影響を受けやすい部品の温度を上昇することを抑制する構成としては、図２に示す回路モジュール３０のように、水晶振動子２６を回路モジュール３０の下面側、すなわち、親基板１０に実装される側の面へ実装し、さらに、水晶振動子２６の天面に置かれるリッド（蓋）を回路モジュール３０の下面に露出させて親基板１０と半田により接続する構成が考えられる。この構成により、水晶振動子２６と発熱体である送受信ＩＣ２４との距離を離すことができ、水晶振動子２６のパッケージの温度を親基板１０の温度に近づけることができる。 As a configuration for suppressing an increase in the temperature of a component that is easily affected by heat, the crystal resonator 26 is mounted on the lower surface side of the circuit module 30, that is, the parent substrate 10, as in the circuit module 30 shown in FIG. Further, a configuration is conceivable in which a lid (lid) placed on the top surface of the crystal resonator 26 is exposed on the lower surface of the circuit module 30 and connected to the parent substrate 10 by soldering. With this configuration, the distance between the crystal unit 26 and the transmission / reception IC 24 that is a heating element can be increased, and the temperature of the package of the crystal unit 26 can be brought close to the temperature of the parent substrate 10.
　しかし、この構成では、水晶振動子２６は、スルーホール３２ａおよび３２ｂを介して回路基板２２ａに接続される構成であるため、送受信ＩＣ２４からの熱が回路基板２２ａを経由して水晶振動子２６へ伝わることは従来と変わらない。したがって、送受信ＩＣ２４と熱の影響を受けやすい部品との間の熱伝導を十分に抑制することはできない。 However, in this configuration, since the crystal unit 26 is connected to the circuit board 22a via the through holes 32a and 32b, heat from the transmission / reception IC 24 is transmitted to the crystal unit 26 via the circuit board 22a. It is the same as before. Therefore, the heat conduction between the transmission / reception IC 24 and the heat-sensitive component cannot be sufficiently suppressed.
　また、送受信ＩＣ２４から熱の影響を受けやすい部品への熱伝導を防ぐには、送受信ＩＣ２４と熱の影響を受けやすい部品との距離を離すことが有効であるが、この場合、回路モジュールに必要な面積が大きくなり、回路モジュール２０を小型化することができないという問題が生じる。 In order to prevent heat conduction from the transmission / reception IC 24 to the heat-sensitive component, it is effective to increase the distance between the transmission / reception IC 24 and the heat-sensitive component, but in this case, it is necessary for the circuit module. As a result, the area becomes large and the circuit module 20 cannot be miniaturized.
　そこで、本発明は、以下に説明するように、発熱する部品と熱の影響を受けやすい部品との間の熱伝導を抑制すると共に小型化を実現することができる回路モジュールを提供するものである。 Therefore, the present invention provides a circuit module capable of suppressing the heat conduction between a component that generates heat and a component that is easily affected by heat, and can be downsized as described below. .
　以下、本発明の実施の形態について説明する。なお、以下に説明する実施の形態は、いずれも本発明の好ましい一具体例を示すものである。したがって、以下の実施の形態で示される、数値、形状、材料、構成要素、構成要素の配置位置及び接続形態、並びに、工程及び工程の順序などは、一例であって本発明を限定する主旨ではない。よって、以下の実施の形態における構成要素のうち、本発明の最上位概念を示す独立請求項に記載されていない構成要素については、任意の構成要素として説明される。 Hereinafter, embodiments of the present invention will be described. Note that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, numerical values, shapes, materials, components, arrangement positions and connection forms of components, and steps and order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Absent. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.
　また、各図は、模式図であり、必ずしも厳密に図示されたものではない。なお、各図において、実質的に同一の構成に対しては同一の符号を付しており、重複する説明は省略または簡略化する。 Each figure is a schematic diagram and is not necessarily shown strictly. In each figure, substantially the same configuration is denoted by the same reference numeral, and redundant description is omitted or simplified.
　（実施の形態１）
　以下、実施の形態１について、図３～図９を用いて説明する。本実施の形態では、親基板４０に実装される回路モジュール５０について説明する。 (Embodiment 1)
Hereinafter, Embodiment 1 will be described with reference to FIGS. In the present embodiment, the circuit module 50 mounted on the parent substrate 40 will be described.
　［１．回路モジュールの構成］
　図３は、実施の形態１にかかる回路モジュール５０と電子部品６０とを親基板に搭載した構成を示す断面図である。図３に示すように、回路モジュール５０は、電子部品６０と共に親基板４０に実装され、親基板４０と一体となって動作する回路モジュールである。回路モジュール５０は、例えば、無線通信モジュールであり、より具体的には無線ＬＡＮモジュールである。 [1. Configuration of circuit module]
FIG. 3 is a cross-sectional view illustrating a configuration in which the circuit module 50 and the electronic component 60 according to the first embodiment are mounted on a parent substrate. As shown in FIG. 3, the circuit module 50 is a circuit module that is mounted on the parent substrate 40 together with the electronic component 60 and operates integrally with the parent substrate 40. The circuit module 50 is, for example, a wireless communication module, and more specifically a wireless LAN module.
　回路モジュール５０は、図３に示すように、発熱部品５４と、回路基板５２ａと、回路基板５２ａとを含む基体５２に形成された凹部５５と、放熱部材５６とを備えている。なお、回路基板５２ａ、樹脂５２ｂおよび樹脂５２ｃを、合わせて基体５２と定義する。 As shown in FIG. 3, the circuit module 50 includes a heat generating component 54, a circuit board 52a, a recess 55 formed in the base 52 including the circuit board 52a, and a heat dissipation member 56. The circuit board 52a, the resin 52b, and the resin 52c are collectively defined as the base 52.
　回路基板５２ａは、例えば、プリント基板、セラミック多層基板（ＬＴＣＣ：Ｌｏｗ　Ｔｅｍｐｅｒａｔｕｒｅ　Ｃｏ－ｆｉｒｅｄ　Ｃｅｒａｍｉｃ）、または樹脂多層基板等で構成されている。回路基板５２ａは、両面に電子部品が実装されている。回路基板５２ａの、親基板４０と対向する面と反対側の面には、発熱部品５４が実装され、さらに、発熱部品５４および当該面に実装されたその他の電子部品を封止するように樹脂５２ｂが形成されている。 The circuit board 52a is composed of, for example, a printed board, a ceramic multilayer board (LTCC: Low Temperature Co-fired Ceramic), or a resin multilayer board. The circuit board 52a has electronic components mounted on both sides. A heat generating component 54 is mounted on the surface of the circuit board 52a opposite to the surface facing the parent substrate 40, and a resin is used to seal the heat generating component 54 and other electronic components mounted on the surface. 52b is formed.
　また、回路基板５２ａの親基板４０と対向する面には、当該面に実装されたその他の電子部品を封止するように樹脂５２ｃが設けられている。 Also, a resin 52c is provided on the surface of the circuit board 52a facing the parent substrate 40 so as to seal other electronic components mounted on the surface.
　さらに、樹脂５２ｃには、基体５２の親基板４０と対向する面側から回路基板５２ａに向けて凹部５５が形成されている。 Furthermore, a recess 55 is formed in the resin 52c from the surface of the base 52 facing the parent substrate 40 toward the circuit board 52a.
　また、基体５２の親基板４０と対向する面上にある凹部５５の縁の少なくとも一部、および凹部５５の内壁には、放熱部材５６が形成されている。この構成により、電子部品６０を凹部５５内に配置することで、発熱部品５４および電子部品６０を、放熱部材５６を介して回路基板５２ａ上と凹部５５内とに分離して配置できる。このため、発熱部品５４と電子部品６０との間の熱伝導を抑制することが可能となる。また、発熱部品５４と電子部品６０とを同一基板上に配置した場合と比較して、双方の部品間の距離を確保する必要がない。よって、回路モジュールの小型化を実現することができる。 Further, a heat radiating member 56 is formed on at least a part of the edge of the recess 55 on the surface of the base 52 facing the parent substrate 40 and the inner wall of the recess 55. With this configuration, by disposing the electronic component 60 in the recess 55, the heat generating component 54 and the electronic component 60 can be separately disposed on the circuit board 52 a and the recess 55 via the heat dissipation member 56. For this reason, it is possible to suppress heat conduction between the heat generating component 54 and the electronic component 60. Further, as compared with the case where the heat generating component 54 and the electronic component 60 are arranged on the same substrate, it is not necessary to ensure the distance between the two components. Therefore, the circuit module can be reduced in size.
　図４は、実施の形態１にかかる回路モジュール５０の構成を示す平面図であり、回路モジュール５０を、親基板４０と対向する面と反対側の面側からみたときの構成を示している。なお、図４では、回路基板５２ａの上に形成された樹脂５２ｂの図示を省略している。 FIG. 4 is a plan view showing the configuration of the circuit module 50 according to the first embodiment, and shows the configuration when the circuit module 50 is viewed from the surface opposite to the surface facing the parent substrate 40. In FIG. 4, the resin 52b formed on the circuit board 52a is not shown.
　図４に示すように、回路基板５２ａの、親基板４０と対向する面と反対側の面上には、発熱部品５４およびその他の電子部品が実装されている。これにより、凹部５５に収容される電子部品６０と発熱部品５４との間の熱伝導を抑制することができる。また、電子部品６０と発熱部品５４とを、回路基板５２ａを挟んで配置できるので、回路モジュールを省面積化することが可能となる。 As shown in FIG. 4, the heat generating component 54 and other electronic components are mounted on the surface of the circuit board 52a opposite to the surface facing the parent substrate 40. Thereby, heat conduction between the electronic component 60 accommodated in the recess 55 and the heat generating component 54 can be suppressed. In addition, since the electronic component 60 and the heat generating component 54 can be arranged with the circuit board 52a interposed therebetween, the area of the circuit module can be reduced.
　発熱部品５４は、例えば、送受信ＩＣを構成するＬＳＩである。図４に示すように、発熱部品５４は、回路基板５２ａの上において、他の電子部品よりも大きい面積を占めている。 The heat generating component 54 is, for example, an LSI constituting a transmission / reception IC. As shown in FIG. 4, the heat generating component 54 occupies a larger area on the circuit board 52a than other electronic components.
　図５は、実施の形態１にかかる回路モジュール５０の構成を示す底面図であり、回路モジュール５０を、親基板４０と対向する面側からみたときの構成を示している。図６は、実施の形態１にかかる回路モジュール５０の、図４および図５に示すＶＩ－ＶＩ線における矢視断面図である。なお、図５では、回路基板５２ａの親基板４０と対向する面に実装された部品を破線で示している。 FIG. 5 is a bottom view showing the configuration of the circuit module 50 according to the first embodiment, and shows the configuration when the circuit module 50 is viewed from the side facing the parent substrate 40. FIG. 6 is a cross-sectional view of the circuit module 50 according to the first embodiment taken along the line VI-VI shown in FIGS. 4 and 5. In FIG. 5, components mounted on the surface of the circuit board 52a facing the parent board 40 are indicated by broken lines.
　図５に示すように、回路基板５２ａの親基板４０と対向する面側に形成された樹脂５２ｃには、凹部５５が形成されている。図６に示すように、凹部５５は、基体５２の親基板４０と対向する面の表面から回路基板５２ａに向かって窪んだ形状を有している。凹部５５は、後に詳述する電子部品６０を内部に収容するため、電子部品６０の大きさよりも大きく形成されている。このため、電子部品６０は、凹部５５の内壁に実装されるのではなく、親基板４０に実装される。よって、凹部５５に収容される電子部品６０と凹部５５外に配置される部品とは、基体５２内で直接接続されないので、電子部品６０と凹部５５外に配置される部品との間の熱伝導を抑制することができる。 As shown in FIG. 5, a concave portion 55 is formed in the resin 52c formed on the surface of the circuit board 52a facing the parent substrate 40. As shown in FIG. 6, the recess 55 has a shape that is recessed from the surface of the surface of the base 52 facing the parent substrate 40 toward the circuit board 52a. The recess 55 is formed larger than the size of the electronic component 60 in order to accommodate the electronic component 60 described later in detail. For this reason, the electronic component 60 is not mounted on the inner wall of the recess 55 but mounted on the parent substrate 40. Therefore, the electronic component 60 accommodated in the recess 55 and the component disposed outside the recess 55 are not directly connected within the base 52, and therefore heat conduction between the electronic component 60 and the component disposed outside the recess 55. Can be suppressed.
　また、凹部５５は、回路基板５２ａを平面視したときに、発熱部品５４と一部が重なる位置に配置されてもよい。すなわち、図６に示すように、凹部５５は、回路基板５２ａを挟んで発熱部品５４と一部が重なる位置に形成されてもよい。これにより、電子部品６０と発熱部品５４とを、回路基板５２ａを挟んで重なる位置に配置できるので、回路モジュール５０を省面積化することが可能となる。 Further, the concave portion 55 may be disposed at a position where the concave portion 55 partially overlaps the heat generating component 54 when the circuit board 52a is viewed in plan. That is, as shown in FIG. 6, the recess 55 may be formed at a position that partially overlaps the heat generating component 54 with the circuit board 52 a interposed therebetween. As a result, the electronic component 60 and the heat generating component 54 can be arranged at positions overlapping each other with the circuit board 52a interposed therebetween, so that the area of the circuit module 50 can be reduced.
　また、図５および図６に示すように、基体５２の親基板４０と対向する面にある凹部５５の縁、および、凹部５５の内壁には、放熱部材５６が形成されている。放熱部材５６は、例えば、Ｃｕ（銅）、ＳＵＳ（ステンレス鋼）、ＳＵＳをコーティングしたＣｕ等の導電性膜で形成されている。なお、放熱部材５６は、ＣｕおよびＳＵＳに代えて、Ｎｉ、Ａｕ等であってもよい。 Further, as shown in FIGS. 5 and 6, a heat radiating member 56 is formed on the edge of the concave portion 55 on the surface of the base 52 facing the parent substrate 40 and the inner wall of the concave portion 55. The heat radiating member 56 is formed of a conductive film such as Cu (copper), SUS (stainless steel), or Cu coated with SUS, for example. The heat radiating member 56 may be Ni, Au, or the like instead of Cu and SUS.
　また、放熱部材５６のうち、基体５２の親基板４０と対向する面の凹部５５の縁に形成された部分である電極パッド５６ａは、後に説明する親基板４０に形成された接地電極パッド４２ｂと接合される。これにより、凹部５５に収容される電子部品６０を電気的に遮蔽することができる。また、凹部５５内で発生した熱または凹部５５外で発生した熱を、それぞれ、放熱部材５６を経由して親基板４０へ効率よく逃がすことが可能となる。したがって、発熱部品５４と、電子部品６０との間の熱伝導を、より抑制することができる。 In addition, the electrode pad 56a, which is a portion of the heat dissipation member 56 formed on the edge of the recess 55 on the surface of the base 52 that faces the parent substrate 40, is connected to a ground electrode pad 42b formed on the parent substrate 40 described later. Be joined. Thereby, the electronic component 60 accommodated in the recessed part 55 can be electrically shielded. Further, the heat generated inside the recess 55 or the heat generated outside the recess 55 can be efficiently released to the parent substrate 40 via the heat dissipation member 56. Therefore, heat conduction between the heat generating component 54 and the electronic component 60 can be further suppressed.
　また、回路モジュール５０は、回路基板５２ａの親基板４０と対向する面に形成された樹脂５２ｃ上に、複数の電極パッド５９を有している。図５に示すように、複数の電極パッド５９は、樹脂５２ｃの上において、回路モジュール５０の外周から所定の幅で当該外周に沿った領域である外周部に配置されている。また、図６に示すように、樹脂５２ｃの電極パッド５９が配置される位置には、樹脂５２ｃの親基板４０と対向する面側から回路基板５２ａまで樹脂５２ｃを貫通するスルーホール５８が形成されている。スルーホール５８の内部には、導電性材料が充填されている。電極パッド５９は、スルーホール５８を介して回路基板５２ａに接続されている。 The circuit module 50 has a plurality of electrode pads 59 on a resin 52c formed on the surface of the circuit board 52a facing the parent substrate 40. As shown in FIG. 5, the plurality of electrode pads 59 are disposed on the outer periphery of the circuit board 50 with a predetermined width from the outer periphery of the circuit module 50 on the resin 52c. Further, as shown in FIG. 6, a through hole 58 that penetrates the resin 52c from the surface side of the resin 52c facing the parent substrate 40 to the circuit board 52a is formed at a position where the electrode pad 59 of the resin 52c is disposed. ing. The through hole 58 is filled with a conductive material. The electrode pad 59 is connected to the circuit board 52 a through the through hole 58.
　また、電極パッド５９は、後に説明する親基板４０の上に形成された電極パッド４２ａと接合される。なお、電極パッド４２ａは、接地電極としてもよい。 Further, the electrode pad 59 is bonded to an electrode pad 42a formed on the parent substrate 40 described later. The electrode pad 42a may be a ground electrode.
　ここで、親基板４０について説明する。図７は、実施の形態１にかかる親基板４０の構成を示す平面図であり、親基板４０を、回路モジュール５０と対向する面側からみたときの構成を示している。 Here, the parent substrate 40 will be described. FIG. 7 is a plan view showing the configuration of the parent substrate 40 according to the first embodiment, and shows the configuration when the parent substrate 40 is viewed from the side facing the circuit module 50.
　親基板４０は、図３に示すように、第１の層４０ａおよび第２の層４０ｂとが積層された多層基板である。親基板４０において、第２の層４０ｂを貫通するスルーホール４４が形成されている。スルーホール４４は、第１の層４０ａと接地電極パッド４２ｂとを接続する。また、図３および図７に示すように、親基板４０は、回路モジュール５０と電気接続される電極パッド４２ａおよび接地電極パッド４２ｂ、ならびに、電子部品６０と電気接続される電極パッド４２ｃを有している。なお、図７において、複数の電極パッド４２ａが配置された領域を囲む破線は、親基板４０において回路モジュール５０が実装される領域を示している。また、接地電極パッド４２ｂの内側の領域に示す破線は、親基板４０において電子部品６０が実装される領域を示している。 The parent substrate 40 is a multilayer substrate in which a first layer 40a and a second layer 40b are laminated as shown in FIG. In the parent substrate 40, a through hole 44 penetrating the second layer 40b is formed. The through hole 44 connects the first layer 40a and the ground electrode pad 42b. As shown in FIGS. 3 and 7, the parent substrate 40 includes an electrode pad 42 a and a ground electrode pad 42 b that are electrically connected to the circuit module 50, and an electrode pad 42 c that is electrically connected to the electronic component 60. ing. In FIG. 7, a broken line surrounding a region where the plurality of electrode pads 42 a are arranged indicates a region where the circuit module 50 is mounted on the parent substrate 40. In addition, a broken line shown in a region inside the ground electrode pad 42 b indicates a region where the electronic component 60 is mounted on the parent substrate 40.
　図７に示すように、電極パッド４２ａは、回路モジュール５０が実装される領域の外周部に設けられている。また、電極パッド４２ａが形成された領域の内側には、凹部５５の縁に形成された電極パッド５６ａと接続される接地電極パッド４２ｂが形成されている。さらに、接地電極パッド４２ｂが形成された領域の内側には、電極パッド４２ｃが形成されている。 As shown in FIG. 7, the electrode pad 42a is provided on the outer periphery of the area where the circuit module 50 is mounted. A ground electrode pad 42b connected to the electrode pad 56a formed at the edge of the recess 55 is formed inside the region where the electrode pad 42a is formed. Further, an electrode pad 42c is formed inside the region where the ground electrode pad 42b is formed.
　親基板４０において、電極パッド４２ａは、回路モジュール５０の外周部に設けられている電極パッド５９（図５参照）と接合される。接地電極パッド４２ｂは、凹部５５の縁に形成された部分である電極パッド５６ａと接合される。電極パッド４２ｃは、電子部品６０に形成された電極パッドと接合される。なお、これらの電極パッドの接合には、例えば、半田が用いられる。 In the parent substrate 40, the electrode pad 42a is joined to an electrode pad 59 (see FIG. 5) provided on the outer periphery of the circuit module 50. The ground electrode pad 42 b is bonded to the electrode pad 56 a that is a portion formed at the edge of the recess 55. The electrode pad 42 c is bonded to the electrode pad formed on the electronic component 60. For example, solder is used for bonding these electrode pads.
　次に、電子部品６０について説明する。 Next, the electronic component 60 will be described.
　電子部品６０は、例えば、発振子または発振器、すなわち、基準発振周波数用の水晶振動子である。本実施の形態の上記構成によれば、水晶振動子が回路基板５２ａ側からの熱の影響を受けることを抑制できるので、回路モジュール５０の温度変化による水晶振動子の特性劣化を効果的に抑制できる。よって、当該水晶振動子を用いた無線通信を安定させることが可能となる。 The electronic component 60 is, for example, an oscillator or an oscillator, that is, a crystal resonator for a reference oscillation frequency. According to the above configuration of the present embodiment, the crystal resonator can be prevented from being affected by the heat from the circuit board 52a side, so that the characteristic deterioration of the crystal resonator due to the temperature change of the circuit module 50 is effectively suppressed. it can. Therefore, wireless communication using the crystal resonator can be stabilized.
　また、電子部品６０と、回路モジュール５０の凹部５５の内部に形成された放熱部材５６との間には、空気層が存在する。すなわち、電子部品６０は、凹部５５の内部において、放熱部材５６と空間を隔てて配置されている。これにより、回路モジュール５０に実装された発熱部品５４からの熱は電子部品６０に直接伝わることなく、親基板４０の接地電極へ伝えられる。これにより、電子部品６０の温度は、ほぼ親基板４０の温度と同程度の温度に抑えられる。よって、凹部５５に収容される電子部品６０と凹部５５外に配置される部品との間の熱伝導を、さらに抑制することができる。 Further, an air layer exists between the electronic component 60 and the heat radiating member 56 formed inside the recess 55 of the circuit module 50. That is, the electronic component 60 is disposed inside the recess 55 with a space from the heat dissipation member 56. Thereby, the heat from the heat generating component 54 mounted on the circuit module 50 is transmitted to the ground electrode of the parent substrate 40 without being directly transmitted to the electronic component 60. As a result, the temperature of the electronic component 60 is suppressed to a temperature that is approximately the same as the temperature of the parent substrate 40. Therefore, the heat conduction between the electronic component 60 accommodated in the recess 55 and the component disposed outside the recess 55 can be further suppressed.
　［２．回路モジュールの製造方法］
　ここで、回路モジュール５０の製造方法について説明する。図８は、実施の形態１にかかる回路モジュール５０と電子部品６０とを親基板４０に搭載する前の構成を示す断面図である。また、図９は、実施の形態１にかかる回路モジュール５０と電子部品６０とを親基板４０に搭載した構成を示す断面図である。なお、図８における親基板４０は、図７に示したＶＩＩＩ－ＶＩＩＩ線を矢印方向に見た断面図として示している。 [2. Circuit Module Manufacturing Method]
Here, a method for manufacturing the circuit module 50 will be described. FIG. 8 is a cross-sectional view illustrating a configuration before the circuit module 50 and the electronic component 60 according to the first embodiment are mounted on the parent substrate 40. FIG. 9 is a cross-sectional view illustrating a configuration in which the circuit module 50 and the electronic component 60 according to the first embodiment are mounted on the parent substrate 40. The parent substrate 40 in FIG. 8 is shown as a cross-sectional view taken along the line VIII-VIII shown in FIG.
　回路モジュール５０は、回路基板５２ａの両面に無線ＬＡＮを構成する電子部品を実装したものである。上記無線ＬＡＮを構成する電子部品としては、発熱部品５４およびその他の電子部品が挙げられる。なお、ここでは、複数の回路モジュール５０を同時に効率よく形成するために、複数個分の回路モジュール５０の電子部品が実装された、複数の回路基板５２ａの集合体である集合基板を形成する。 The circuit module 50 is obtained by mounting electronic components constituting a wireless LAN on both sides of the circuit board 52a. Examples of the electronic components constituting the wireless LAN include the heat generating component 54 and other electronic components. Here, in order to efficiently form a plurality of circuit modules 50 at the same time, a collective substrate that is an aggregate of a plurality of circuit boards 52a on which a plurality of electronic components of the circuit modules 50 are mounted is formed.
　次に、発熱部品５４およびその他の電子部品が実装された上記集合基板において、樹脂５２ｂおよび樹脂５２ｃにより発熱部品５４およびその他の電子部品を封止する。樹脂５２ｂおよび樹脂５２ｃによる発熱部品５４およびその他の電子部品の封止は、トランスファーモールド工法によって行う。 Next, the heat generating component 54 and other electronic components are sealed with the resin 52b and the resin 52c in the above-described aggregate substrate on which the heat generating component 54 and other electronic components are mounted. Sealing of the heat generating component 54 and other electronic components with the resin 52b and the resin 52c is performed by a transfer mold method.
　トランスファーモールド工法は、部品実装済みの回路基板を金型に配置し、圧力を加えて金型内に樹脂を注入する方法である。本実施の形態にかかる製造方法では、発熱部品５４およびその他の電子部品を実装した上記集合基板を金型に挿入し、樹脂５２ｂ、樹脂５２ｃを注入しながら上記集合基板に対して例えば数１０ＭＰａの圧力を加える。これにより、上記集合基板、樹脂５２ｂおよび樹脂５２ｃが一体に形成される。 The transfer mold method is a method in which a circuit board on which components are mounted is placed in a mold, and resin is injected into the mold by applying pressure. In the manufacturing method according to the present embodiment, the collective substrate on which the heat generating component 54 and other electronic components are mounted is inserted into a mold, and for example, several tens of MPa is applied to the collective substrate while the resin 52b and the resin 52c are injected. Apply pressure. Thus, the collective substrate, the resin 52b, and the resin 52c are integrally formed.
　次に、樹脂５２ｃに、凹部５５およびスルーホール５８を形成する。スルーホール５８は、樹脂５２ｃを貫通している。凹部５５およびスルーホール５８は、たとえば、樹脂５２ｃの上にマスクを形成した後エッチングすることにより形成される。 Next, a recess 55 and a through hole 58 are formed in the resin 52c. The through hole 58 penetrates the resin 52c. The recess 55 and the through hole 58 are formed, for example, by etching after forming a mask on the resin 52c.
　その後、部分スパッタリングによって、凹部５５の内壁に放熱部材５６となる金属層を成膜する。このとき、親基板４０と対向する面の凹部５５の縁にも放熱部材５６となる金属層が成膜され、電極パッド５６ａが形成される。同時に、スルーホール５８となる孔の内部にも金属層（または金属プラグ）を形成する。さらに、部分スパッタリングによって、スルーホール５８を覆うように、電極パッド５９となる金属層を成膜する。これにより、複数の回路モジュール５０が形成された集合基板が完成する。 Thereafter, a metal layer to be the heat radiating member 56 is formed on the inner wall of the recess 55 by partial sputtering. At this time, a metal layer to be the heat radiating member 56 is also formed on the edge of the concave portion 55 on the surface facing the parent substrate 40, and the electrode pad 56a is formed. At the same time, a metal layer (or metal plug) is also formed inside the hole to be the through hole 58. Further, a metal layer to be the electrode pad 59 is formed by partial sputtering so as to cover the through hole 58. Thereby, the collective substrate on which the plurality of circuit modules 50 are formed is completed.
　その後、複数の回路モジュール５０が形成された集合基板を、各モジュール個片へと分割する。これにより、個々の回路モジュール５０が完成する。 Thereafter, the collective substrate on which the plurality of circuit modules 50 are formed is divided into individual module pieces. Thereby, each circuit module 50 is completed.
　なお、回路基板５２ａとスルーホール５８との電気的接続を良好にするため、レーザー光線による付着樹脂の除去や塩酸等を用いた洗浄および酸化物除去を適宜行ってもよい。 In addition, in order to improve the electrical connection between the circuit board 52a and the through hole 58, removal of the adhering resin with a laser beam, washing with hydrochloric acid, and oxide removal may be appropriately performed.
　さらに、図８に示すように、上述のようにして完成した回路モジュール５０と電子部品６０とを親基板４０に実装する。以下、回路モジュール５０および電子部品６０の、親基板４０への実装工程について説明する。 Further, as shown in FIG. 8, the circuit module 50 and the electronic component 60 completed as described above are mounted on the parent substrate 40. Hereinafter, a process of mounting the circuit module 50 and the electronic component 60 on the parent substrate 40 will be described.
　まず、親基板４０に形成された電極パッド４２ｃが、電子部品６０の電極パッド６２と接続するように、電子部品６０を実装する。 First, the electronic component 60 is mounted so that the electrode pad 42 c formed on the parent substrate 40 is connected to the electrode pad 62 of the electronic component 60.
　その後、凹部５５に電子部品６０が収容されるように、回路モジュール５０を親基板４０に実装する。このとき、親基板４０の電極パッド４２ａおよび接地電極パッド４２ｂが、回路モジュール５０の電極パッド５９および５６ａとそれぞれ接続するように、回路モジュール５０を実装する。 Thereafter, the circuit module 50 is mounted on the parent substrate 40 so that the electronic component 60 is accommodated in the recess 55. At this time, the circuit module 50 is mounted so that the electrode pads 42a and the ground electrode pads 42b of the parent substrate 40 are connected to the electrode pads 59 and 56a of the circuit module 50, respectively.
　なお、電極パッド４２ａ、接地電極パッド４２ｂおよび電極パッド４２ｃと、電極パッド５９、５６ａおよび６２とは、例えば、半田により接続してもよい。これにより、図９に示すように、凹部５５に電子部品６０が収容された状態で、親基板４０に実装された回路モジュール５０が完成する。これにより、電子部品６０と凹部５５の内部に形成された放熱部材５６との間には、空気層が存在する。すなわち、電子部品６０は、凹部５５の内部において、放熱部材５６と空間を隔てて配置されている。これにより、回路モジュール５０上の発熱部品５４からの熱は電子部品６０に直接伝わることなく、親基板４０のＧＮＤへ伝えられるとともに、電子部品６０の温度を、ほぼ親基板４０の温度と同程度の温度に保つことができる。 The electrode pad 42a, the ground electrode pad 42b and the electrode pad 42c, and the electrode pads 59, 56a and 62 may be connected by, for example, solder. As a result, as shown in FIG. 9, the circuit module 50 mounted on the parent substrate 40 is completed in a state where the electronic component 60 is accommodated in the recess 55. Thereby, an air layer exists between the electronic component 60 and the heat dissipation member 56 formed inside the recess 55. That is, the electronic component 60 is disposed inside the recess 55 with a space from the heat dissipation member 56. Thereby, the heat from the heat generating component 54 on the circuit module 50 is not directly transmitted to the electronic component 60 but is transmitted to the GND of the parent substrate 40, and the temperature of the electronic component 60 is substantially the same as the temperature of the parent substrate 40. Can be kept at a temperature of
　［３．効果等］
　以上、本実施の形態にかかる回路モジュール５０によれば、発熱部品５４の放熱を良好にし、発熱部品５４と熱の影響を受けやすい電子部品６０との間の熱伝導を抑制することができる。また、発熱部品５４と電子部品６０との距離を離さなくてもよいため、回路モジュール５０の小型化を実現することができる。 [3. Effect]
As described above, according to the circuit module 50 according to the present embodiment, it is possible to improve the heat dissipation of the heat generating component 54 and to suppress the heat conduction between the heat generating component 54 and the electronic component 60 that is easily affected by heat. Further, since it is not necessary to increase the distance between the heat generating component 54 and the electronic component 60, the circuit module 50 can be downsized.
　特に、送受信ＩＣ等の発熱部品５４が、水晶振動子等の温度変化による特性変化が大きい電子部品６０に及ぼす影響を著しく減少することができる。また、電子部品６０を親基板４０に接続することにより、電子部品６０の温度を親基板４０の温度に抑えることができる。これにより、回路モジュール５０において生じる周波数ドリフト等の短期的な特性変動を抑制することができる。 In particular, the influence of the heat generating component 54 such as a transmission / reception IC on the electronic component 60 having a large characteristic change due to a temperature change such as a crystal resonator can be significantly reduced. In addition, the temperature of the electronic component 60 can be suppressed to the temperature of the parent substrate 40 by connecting the electronic component 60 to the parent substrate 40. Thereby, short-term characteristic fluctuations such as frequency drift occurring in the circuit module 50 can be suppressed.
　また、凹部５５に配置された放熱部材５６が親基板４０の接地電極と接続されることにより、水晶振動子および発振回路に例示される電子部品６０からの不要輻射を効果的に抑制することができ、特に、これらから放射される高調波成分を効果的に遮蔽できる。したがって、回路モジュール５０の動作が安定する。 Further, the radiation member 56 disposed in the recess 55 is connected to the ground electrode of the parent substrate 40, thereby effectively suppressing unnecessary radiation from the electronic component 60 exemplified by the crystal resonator and the oscillation circuit. In particular, harmonic components radiated from these can be effectively shielded. Therefore, the operation of the circuit module 50 is stabilized.
　また、電子部品６０が水晶振動子である場合には、水晶振動子の周波数を変更したい場合に、同一の回路モジュールにおいて水晶振動子だけを容易に交換することができる。 In addition, when the electronic component 60 is a crystal resonator, when it is desired to change the frequency of the crystal resonator, only the crystal resonator can be easily replaced in the same circuit module.
　なお、実施の形態１では、回路基板５２ａの両面に電子部品を実装し、電子部品６０を親基板４０側かつ凹部５５内に収容する構成について説明したが、これに限らず、例えば、全ての電子部品を回路基板５２ａの片面に実装する構成であってもよい。 In the first embodiment, the configuration in which electronic components are mounted on both surfaces of the circuit board 52a and the electronic component 60 is accommodated in the concave portion 55 on the parent substrate 40 side is not limited to this. The electronic component may be mounted on one side of the circuit board 52a.
　また、凹部５５の内壁に配置される放熱部材５６、および、スルーホール５８の金属層を形成する方法として、部分スパッタリング法を用いたが、金属層の形成方法はこれに限らず、めっきおよび蒸着法を用いてもよい。 Moreover, although the partial sputtering method was used as a method of forming the heat dissipation member 56 disposed on the inner wall of the recess 55 and the metal layer of the through hole 58, the method of forming the metal layer is not limited to this, and plating and vapor deposition are performed. The method may be used.
　［４．変形例１］
　なお、実施の形態１では、凹部５５内に収容される電子部品６０として、水晶振動子などの発振子または発振器を例示したが、電子部品６０は、中空構造を有する電子部品であってもよく、例えばＳＡＷフィルタであってもよい。以下、本変形例に係る回路モジュール５０およびＳＡＷフィルタ１１０の構成について、実施の形態１にかかる回路モジュール５０および電子部品６０の構成と異なる点を中心に説明する。 [4. Modification 1]
In the first embodiment, an oscillator such as a crystal resonator or an oscillator is exemplified as the electronic component 60 accommodated in the recess 55. However, the electronic component 60 may be an electronic component having a hollow structure. For example, a SAW filter may be used. Hereinafter, the configurations of the circuit module 50 and the SAW filter 110 according to the present modification will be described focusing on differences from the configurations of the circuit module 50 and the electronic component 60 according to the first embodiment.
　図１０は、実施の形態１の変形例１にかかる回路モジュール５０とＳＡＷフィルタ１１０とを親基板４０に搭載した構成を示す断面図である。図１０に示すように、ＳＡＷフィルタ１１０は、回路モジュール５０の凹部５５の内部に収容されている。 FIG. 10 is a cross-sectional view showing a configuration in which the circuit module 50 and the SAW filter 110 according to the first modification of the first embodiment are mounted on the parent substrate 40. As shown in FIG. 10, the SAW filter 110 is accommodated in the recess 55 of the circuit module 50.
　ＳＡＷフィルタ１１０は、例えば、カバー層１１１、支持層１１２および圧電基板１１３でパッケージを構成するＷＬＰ（Ｗａｆｅｒ　Ｌｅｖｅｌ　Ｐａｃｋａｇｅ）構造を有している。ＷＬＰ構造とは、圧電基板自体をパッケージの一部として用いる構造であり、ウェハレベルでパッケージ構造が作製されるので、小型化および低背化に適した構造である。 The SAW filter 110 has, for example, a WLP (Wafer Level Package) structure in which a package is constituted by a cover layer 111, a support layer 112, and a piezoelectric substrate 113. The WLP structure is a structure that uses the piezoelectric substrate itself as a part of the package, and the package structure is manufactured at the wafer level, so that the structure is suitable for downsizing and low profile.
　圧電基板の主面には、Ａｌ電極などによりＩＤＴ（Ｉｎｔｅｒ　Ｄｉｇｉｔａｌ　Ｔｒａｎｓｄｕｃｅｒ）電極が構成されている。つまり、ＩＤＴ電極は、カバー層１１１、支持層１１２および圧電基板１１３で囲まれた中空１１４内に配置されている。特に、ＷＬＰ構造を有するＳＡＷフィルタ１１０では、表面弾性波の伝搬は、この中空構造により確保されている。 An IDT (Inter Digital Transducer) electrode is composed of an Al electrode or the like on the main surface of the piezoelectric substrate. That is, the IDT electrode is disposed in the hollow 114 surrounded by the cover layer 111, the support layer 112, and the piezoelectric substrate 113. In particular, in the SAW filter 110 having the WLP structure, the propagation of the surface acoustic wave is ensured by this hollow structure.
　ＳＡＷフィルタ１１０は、親基板４０上に実装されている。つまり、ＳＡＷフィルタ１１０の有する電極パッド１１５は、親基板４０の電極パッド４２ｃと電気接続されている。 The SAW filter 110 is mounted on the parent substrate 40. That is, the electrode pad 115 included in the SAW filter 110 is electrically connected to the electrode pad 42 c of the parent substrate 40.
　また、ＳＡＷフィルタ１１０と、回路モジュール５０の凹部５５の内部に形成された放熱部材５６との間には、空気層が存在する。すなわち、ＳＡＷフィルタ１１０は、凹部５５の内部において、放熱部材５６と空間を隔てて配置されている。 Further, an air layer exists between the SAW filter 110 and the heat radiating member 56 formed inside the recess 55 of the circuit module 50. That is, the SAW filter 110 is disposed inside the recess 55 with a space from the heat radiating member 56.
　上記構成によれば、発熱部品５４の発熱による影響が、温度変化による特性変化が大きいＳＡＷフィルタ１１０に及ぼす影響を著しく低減できる。より具体的には、ＳＡＷフィルタ１１０自体の温度が、ほぼ親基板４０の温度に固定されるので、挿入損失などの特性変動を効果的に抑えることができる。また、ＳＡＷフィルタ１１０の中空構造が外部圧力により破壊されるのを抑制することができる。よって、ＳＡＷフィルタ１１０を用いた無線通信を安定させることが可能となる。 According to the above configuration, the influence of the heat generated by the heat generating component 54 on the SAW filter 110 having a large characteristic change due to a temperature change can be significantly reduced. More specifically, since the temperature of the SAW filter 110 itself is substantially fixed to the temperature of the parent substrate 40, characteristic fluctuations such as insertion loss can be effectively suppressed. Further, the hollow structure of the SAW filter 110 can be prevented from being broken by an external pressure. Therefore, wireless communication using the SAW filter 110 can be stabilized.
　従来の回路モジュールでは、中空構造を有するＳＡＷフィルタは、トランスファーモールドの樹脂圧入で中空構造にストレスがかかってしまい、信頼性が損なわれることがあった。これに対して、本変形例に係る回路モジュール５０およびＳＡＷフィルタ１１０の配置構成によれば、回路モジュール５０に形成された凹部５５により、ＳＡＷフィルタ１１０をモールドの中に入れることなく、モジュールに内蔵した時と同じ程度の実装面積で、高性能を確保することができる。 In a conventional circuit module, the SAW filter having a hollow structure may be stressed due to stress applied to the hollow structure due to the resin injection of the transfer mold. On the other hand, according to the arrangement configuration of the circuit module 50 and the SAW filter 110 according to the present modification, the SAW filter 110 is built in the module without being put into the mold by the recess 55 formed in the circuit module 50. High performance can be secured with the same mounting area.
　なお、本変形例にかかる凹部５５に収容される電子部品は、ＳＡＷフィルタ１１０でなくてもよく、ＭＥＭＳ振動子、ＢＡＷフィルタ等の中空パッケージ構造を持つ電子部品であってもよい。 Note that the electronic component housed in the recess 55 according to the present modification may not be the SAW filter 110 but may be an electronic component having a hollow package structure such as a MEMS vibrator or a BAW filter.
　例えば、仕向地やセットによって、ＳＡＷフィルタよりもＢＡＷフィルタを選択する場合などであっても、回路モジュール５０を変更せずに、セット搭載時に、凹部５５に収容される電子部品をＳＡＷフィルタからＢＡＷフィルタへと容易に変更することが可能となる。 For example, even when the BAW filter is selected over the SAW filter depending on the destination or the set, the electronic components housed in the recess 55 can be transferred from the SAW filter to the BAW when the set is mounted without changing the circuit module 50. It is possible to easily change to a filter.
　［５．変形例２］
　なお、実施の形態１では、凹部５５内に収容される電子部品６０として、水晶振動子などの発振子または発振器を例示したが、電子部品６０は、半導体回路であってもよく、例えばＦＥＭ（Ｆｒｏｎｔ　Ｅｎｄ　Ｍｏｄｕｌｅ）であってもよい。以下、本変形例に係る回路モジュール５０およびＦＥＭ１２０の構成について、実施の形態１にかかる回路モジュール５０および電子部品６０の構成と異なる点を中心に説明する。 [5. Modification 2]
In the first embodiment, an oscillator or an oscillator such as a crystal resonator is exemplified as the electronic component 60 accommodated in the recess 55. However, the electronic component 60 may be a semiconductor circuit, for example, FEM ( Front End Module). Hereinafter, the configurations of the circuit module 50 and the FEM 120 according to the present modification will be described focusing on differences from the configurations of the circuit module 50 and the electronic component 60 according to the first embodiment.
　図１１は、実施の形態１の変形例２にかかる回路モジュール５０とＦＥＭ１２０とを親基板４０に搭載した構成を示す断面図である。図１１に示すように、ＦＥＭ１２０は、回路モジュール５０の凹部５５の内部に収容されている。 FIG. 11 is a cross-sectional view showing a configuration in which the circuit module 50 and the FEM 120 according to the second modification of the first embodiment are mounted on the parent substrate 40. As shown in FIG. 11, the FEM 120 is accommodated in the recess 55 of the circuit module 50.
　ＦＥＭ１２０は、例えば、ＬＮＡ、ＰＡ（Ｐｏｗｅｒ　Ａｍｐｌｉｆｉｅｒ）、およびスイッチも少なくともいずれかを含むフロントエンドモジュールである。なお、ＰＡは、発熱体であるため、ＦＥＭ１２０がＰＡを含む場合には、ＦＥＭ１２０は発熱部品となる。 The FEM 120 is a front-end module that includes at least one of, for example, an LNA, a PA (Power Amplifier), and a switch. Since PA is a heating element, when the FEM 120 includes PA, the FEM 120 becomes a heat generating component.
　ＦＥＭ１２０は、親基板４０上に実装されている。つまり、ＦＥＭ１２０の有する電極パッド１２５は、親基板４０の電極パッド４２ｃと電気接続されている。また、ＦＥＭ１２０と、回路モジュール５０の凹部５５の内部に形成された放熱部材５６との間には、空気層が存在する。すなわち、ＦＥＭ１２０は、凹部５５の内部において、放熱部材５６と空間を隔てて配置されている。 The FEM 120 is mounted on the parent substrate 40. That is, the electrode pad 125 included in the FEM 120 is electrically connected to the electrode pad 42 c of the parent substrate 40. An air layer exists between the FEM 120 and the heat radiating member 56 formed inside the recess 55 of the circuit module 50. That is, the FEM 120 is disposed inside the recess 55 with a space from the heat radiating member 56.
　上記構成によれば、回路モジュール５０、特に発熱部品５４の発熱による影響が、温度上昇とともにＮＦが劣化するＬＮＡに及ぼす影響を著しく低減することができる。また、ＦＥＭ１２０がＰＡを含む場合には、ＰＡの発熱による影響が、水晶振動子などを含む回路モジュール５０に及ぼす影響も著しく低減することができる。つまり、凹部５５に発熱部品を収容することで、回路基板５２ａに実装された他の部品への熱伝導を抑制することができる。 According to the above configuration, the influence of the heat generated by the circuit module 50, particularly the heat generating component 54, can significantly reduce the influence on the LNA where NF deteriorates as the temperature rises. Further, when the FEM 120 includes PA, the influence of the heat generated by the PA on the circuit module 50 including the crystal resonator can be significantly reduced. That is, by accommodating the heat-generating component in the recess 55, heat conduction to other components mounted on the circuit board 52a can be suppressed.
　また、仕向地やセットによって、特性の異なるＦＥＭを選択する場合であっても、回路モジュール５０を変更せずに、ＦＥＭ１２０だけを変更することが可能となる。 Further, even when an FEM having different characteristics is selected depending on a destination or a set, only the FEM 120 can be changed without changing the circuit module 50.
　（実施の形態２）
　本実施の形態にかかる回路モジュール７０は、実施の形態１にかかる回路モジュール５０と比較して、凹部近傍に形成される電極の構成が異なる。以下、本実施の形態に係る回路モジュール７０の構成について、実施の形態１にかかる回路モジュール５０の構成と同じ点は説明を省略し、異なる点を中心に説明する。 (Embodiment 2)
The circuit module 70 according to the present embodiment differs from the circuit module 50 according to the first embodiment in the configuration of electrodes formed in the vicinity of the recess. Hereinafter, the configuration of the circuit module 70 according to the present embodiment will not be described for the same points as the configuration of the circuit module 50 according to the first embodiment, and will be described focusing on the different points.
　図１２は、実施の形態２にかかる回路モジュール７０の構成を示す底面図であり、回路モジュール７０を、親基板４０と対向する面側からみたときの構成を示している。図１３は、実施の形態２にかかる回路モジュール７０の、図１２に示すＸＩＩＩ－ＸＩＩＩ線における矢視断面図である。なお、図１２では、回路基板５２ａの親基板４０と対向する面に実装された部品を破線で示している。また、図１４は、実施の形態２にかかる親基板８０の構成を示す平面図であり、親基板８０を、回路モジュール７０と対向する面側からみたときの構成を示している。 FIG. 12 is a bottom view showing the configuration of the circuit module 70 according to the second embodiment, and shows the configuration when the circuit module 70 is viewed from the side facing the parent substrate 40. 13 is a cross-sectional view of the circuit module 70 according to the second embodiment, taken along the line XIII-XIII shown in FIG. In FIG. 12, components mounted on the surface of the circuit board 52a facing the parent board 40 are indicated by broken lines. FIG. 14 is a plan view showing the configuration of the parent substrate 80 according to the second embodiment, and shows the configuration when the parent substrate 80 is viewed from the side facing the circuit module 70.
　図１３に示すように、回路基板５２ａの親基板８０と対向する面側に形成された樹脂５２ｃには、凹部７５が形成されている。凹部７５は、基体５２の親基板８０と対向する面の表面から回路基板５２ａに向かって窪んだ形状を有している。凹部７５は、電子部品６０を内部に収容するため、電子部品６０の大きさよりも大きく形成されている。 As shown in FIG. 13, a recess 75 is formed in the resin 52c formed on the side of the circuit board 52a facing the parent substrate 80. The recess 75 has a shape that is recessed from the surface of the base 52 facing the parent substrate 80 toward the circuit board 52a. The recess 75 is formed larger than the size of the electronic component 60 in order to accommodate the electronic component 60 therein.
　親基板８０は、親基板４０と同様に、多層基板である。親基板８０は、回路モジュール７０と電気接続される電極パッド８２および８６、ならびに、電子部品６０と電気接続される電極パッド８３および８４を有している。なお、図１４において、複数の電極パッド４２ａが配置された領域を囲む破線は、親基板８０において回路モジュール７０が実装される領域を示している。 The parent substrate 80 is a multilayer substrate, similar to the parent substrate 40. The parent substrate 80 has electrode pads 82 and 86 electrically connected to the circuit module 70 and electrode pads 83 and 84 electrically connected to the electronic component 60. In FIG. 14, a broken line surrounding a region where the plurality of electrode pads 42 a are arranged indicates a region where the circuit module 70 is mounted on the parent substrate 80.
　図１４に示すように、電極パッド４２ａは、回路モジュール７０が実装される領域外周部に設けられている。また、電極パッド４２ａが形成された領域の内側には、凹部７５の縁に形成された電極パッド７６ａと接続される電極パッド８２が形成されている。また、電極パッド４２ａが形成された領域の内側には、電極パッド７７と接続される電極パッド８６が形成されている。さらに、電極パッド８２が形成された領域の内側には、電子部品６０と電気接続される電極パッド８３および８４が形成されている。上記電極パッドの配置構成により、電子部品６０は、電極パッド８４、電極パッド８４および８６を接続する配線８５、ならびに電極パッド８６を介して回路モジュール７０と電気接続される。なお、これらの電極パッドの接合には、例えば、半田が用いられる。 As shown in FIG. 14, the electrode pad 42a is provided on the outer periphery of the region where the circuit module 70 is mounted. An electrode pad 82 connected to the electrode pad 76a formed at the edge of the recess 75 is formed inside the region where the electrode pad 42a is formed. An electrode pad 86 connected to the electrode pad 77 is formed inside the region where the electrode pad 42a is formed. Furthermore, electrode pads 83 and 84 that are electrically connected to the electronic component 60 are formed inside the region where the electrode pads 82 are formed. Due to the arrangement of the electrode pads, the electronic component 60 is electrically connected to the circuit module 70 via the electrode pads 84, the wiring 85 connecting the electrode pads 84 and 86, and the electrode pads 86. For example, solder is used for bonding these electrode pads.
　図１２に示すように、回路モジュール７０は、親基板８０と対向する面の外周部に複数の電極パッド５９を有し、凹部７５は、複数の電極パッド５９が形成された外周部の内側に形成されている。これにより、凹部７５は、回路モジュール７０において、電極パッド５９が配置された外周部よりも内側に形成されているので、電極パッド５９が配置された外周部によりシールドされ、電子部品６０を用いた通信を安定させることができる。 As shown in FIG. 12, the circuit module 70 has a plurality of electrode pads 59 on the outer peripheral portion of the surface facing the parent substrate 80, and the concave portion 75 is inside the outer peripheral portion on which the plurality of electrode pads 59 are formed. Is formed. Thereby, since the recess 75 is formed inside the outer peripheral portion where the electrode pad 59 is arranged in the circuit module 70, it is shielded by the outer peripheral portion where the electrode pad 59 is arranged, and the electronic component 60 is used. Communication can be stabilized.
　また、凹部７５に収容される電子部品６０と回路モジュール７０とを電気接続するための接続端子である電極パッド７７が、複数の電極パッド５９が形成された外周部の内側に配置されている。これにより、回路モジュール７０の親基板８０と対向する面の外周部に配置される電極パッド５９の数を増加する必要がないので、小型化を実現することができる。 Further, an electrode pad 77 which is a connection terminal for electrically connecting the electronic component 60 accommodated in the recess 75 and the circuit module 70 is disposed inside the outer peripheral portion where the plurality of electrode pads 59 are formed. Accordingly, it is not necessary to increase the number of electrode pads 59 arranged on the outer peripheral portion of the surface of the circuit module 70 facing the parent substrate 80, so that downsizing can be realized.
　また、図１２および図１３に示すように、基体５２の親基板８０と対向する面の凹部７５の縁、および、凹部７５の内壁には、放熱部材７６が形成されている。ここで、基体５２の親基板８０と対向する面の凹部７５の縁に形成された部分である電極パッド７６ａのうち、電極パッド７７に最近接している辺の幅は、電極パッド７６ａの他の辺の幅よりも狭くなっている。 Further, as shown in FIGS. 12 and 13, a heat radiating member 76 is formed on the edge of the recess 75 on the surface facing the parent substrate 80 of the base 52 and the inner wall of the recess 75. Here, the width of the side closest to the electrode pad 77 of the electrode pad 76a which is the portion formed at the edge of the recess 75 on the surface of the base 52 facing the parent substrate 80 is the other width of the electrode pad 76a. It is narrower than the width of the side.
　電子部品６０の電極パッド８４と電極パッド７７とは、親基板８０の配線８５を介して電気接続されている。この接続によれば、配線８５は、電極パッド７６ａのうちの電極パッド７７に最近接している辺と、平面視において交叉する。配線８５と、凹部７５の縁に形成された電極パッド７６ａとが交叉する部分には浮遊容量が発生し、この浮遊容量は配線８５と電極パッド７６ａとの交叉面積が大きいほど増加する。 The electrode pad 84 and the electrode pad 77 of the electronic component 60 are electrically connected via the wiring 85 of the parent substrate 80. According to this connection, the wiring 85 intersects the side of the electrode pad 76a closest to the electrode pad 77 in a plan view. A stray capacitance is generated at a portion where the wiring 85 and the electrode pad 76a formed at the edge of the recess 75 intersect. The stray capacitance increases as the crossing area between the wiring 85 and the electrode pad 76a increases.
　これに対して、本実施の形態では、電極パッド７６ａのうち、配線８５と交叉する部分の幅を狭くしているので、上記浮遊容量を十分小さくできる。よって、凹部７５に収容される電子部品６０の高周波応答特性の劣化を抑制することができる。 In contrast, in the present embodiment, the width of the portion of the electrode pad 76a that intersects the wiring 85 is narrowed, so that the stray capacitance can be made sufficiently small. Therefore, deterioration of the high frequency response characteristics of the electronic component 60 accommodated in the recess 75 can be suppressed.
　（その他の変形例など）
　以上、本発明の実施の形態に係る回路モジュールついて、実施の形態および変形例を挙げて説明したが、本発明の回路モジュールは、上記実施の形態および変形例に限定されるものではない。上記実施の形態および変形例における任意の構成要素を組み合わせて実現される別の実施の形態や、上記実施の形態および変形例に対して本発明の主旨を逸脱しない範囲で当業者が思いつく各種変形を施して得られる変形例や、本発明の回路モジュールを内蔵した各種機器も本発明に含まれる。 (Other variations)
The circuit module according to the embodiment of the present invention has been described with reference to the embodiment and the modification. However, the circuit module according to the present invention is not limited to the embodiment and the modification. Other embodiments realized by combining arbitrary components in the above embodiments and modifications, and various modifications conceivable by those skilled in the art without departing from the gist of the present invention with respect to the above embodiments and modifications. Modifications obtained by applying the above and various devices incorporating the circuit module of the present invention are also included in the present invention.
　例えば、実施の形態２にかかる回路モジュール７０の凹部７５に、実施の形態１の変形例１にかかるＳＡＷフィルタ１１０または実施の形態１の変形例２にかかるＦＥＭ１２０を収容する構成をとってもよい。 For example, the recess 75 of the circuit module 70 according to the second embodiment may be configured to accommodate the SAW filter 110 according to the first modification of the first embodiment or the FEM 120 according to the second modification of the first embodiment.
　これによれば、容量性素子であるＳＡＷフィルタ１１０の通過特性が浮遊容量により劣化することを抑制でき、また、ＦＥＭ１２０のスイッチング応答特性が浮遊容量により劣化することを抑制できる。 According to this, it is possible to suppress the passage characteristics of the SAW filter 110, which is a capacitive element, from being deteriorated by stray capacitance, and it is possible to suppress the switching response characteristics of the FEM 120 from being deteriorated by stray capacitance.
　また、凹部５５および７５に配置される放熱部材は、上述した実施の形態では導電性部材としたが、導電性部材に限らず、例えば、カーボン等で構成されてもよい。 Further, although the heat dissipating member disposed in the recesses 55 and 75 is a conductive member in the above-described embodiment, the heat dissipating member is not limited to the conductive member, and may be composed of, for example, carbon.
　また、上述した実施の形態では、発熱部品５４は、凹部５５および７５の外部に配置されたが、発熱部品５４および他の発熱部品は、凹部５５および７５内のみに配置されていてもよい。つまり、凹部５５または７５の外部には、発熱部品が配置されない構成をとってもよい。 In the above-described embodiment, the heat generating component 54 is disposed outside the recesses 55 and 75. However, the heat generating component 54 and other heat generating components may be disposed only in the recesses 55 and 75. That is, a configuration in which no heat generating component is disposed outside the recess 55 or 75 may be employed.
　本発明は、送受信ＩＣおよび水晶振動子などを搭載した無線通信モジュールとして、携帯電話などの通信機器に広く利用できる。 The present invention can be widely used in communication devices such as mobile phones as a wireless communication module equipped with a transmission / reception IC and a crystal resonator.
　１０、４０、８０　　親基板
　２０、３０、５０、７０　　回路モジュール
　２２、５２　　基体
　２２ａ、５２ａ　　回路基板
　２２ｂ、２２ｃ、５２ｂ、５２ｃ　　樹脂
　２４　　送受信ＩＣ
　２６　　水晶振動子
　３２ａ、３２ｂ、４４、５８　　スルーホール
　４０ａ　　第１の層
　４０ｂ　　第２の層
　４２ａ、４２ｃ、５６ａ、５９、６２、７６ａ、７７、８２、８３、８４、８６、１１５、１２５　　電極パッド
　４２ｂ　　接地電極パッド
　５４　　発熱部品
　５５、７５　　凹部
　５６、７６　　放熱部材
　６０　　電子部品
　８５　　配線
　１１０　　ＳＡＷフィルタ
　１１１　　カバー層
　１１２　　支持層
　１１３　　圧電基板
　１１４　　中空
　１２０　　ＦＥＭ 10, 40, 80 Parent board 20, 30, 50, 70 Circuit module 22, 52 Base 22a, 52a Circuit board 22b, 22c, 52b, 52c Resin 24 Transceiver IC
26 Crystal resonator 32a, 32b, 44, 58 Through hole 40a First layer 40b Second layer 42a, 42c, 56a, 59, 62, 76a, 77, 82, 83, 84, 86, 115, 125 Electrode pad 42b Ground electrode pad 54 Heat generating component 55, 75 Recessed portion 56, 76 Heat radiation member 60 Electronic component 85 Wiring 110 SAW filter 111 Cover layer 112 Support layer 113 Piezoelectric substrate 114 Hollow 120 FEM

Claims (11)

  1. 　親基板に実装される回路モジュールであって、
    　発熱部品と、
    　前記発熱部品が実装された回路基板と、
    　前記回路モジュールの前記親基板と対向する面に形成された凹部と、
    　前記面のうち前記凹部の縁に位置する部分の少なくとも一部、および、前記凹部の内壁に配置された放熱部材とを備える
    　回路モジュール。     A circuit module mounted on a parent board,
    Heat-generating parts,
    A circuit board on which the heat generating component is mounted;
    A recess formed on a surface of the circuit module facing the parent substrate;
    A circuit module comprising: at least a part of a portion of the surface located at an edge of the recess, and a heat dissipation member disposed on an inner wall of the recess.
  2. 　前記発熱部品は、前記回路基板の、前記凹部が形成された側と反対側の面に形成されている
    　請求項１に記載の回路モジュール。     The circuit module according to claim 1, wherein the heat generating component is formed on a surface of the circuit board opposite to a side where the concave portion is formed.
  3. 　前記放熱部材は、導電性材料で構成され、
    　前記放熱部材のうち、前記凹部の縁に形成された部分は、前記親基板に形成された接地電極と接合される
    　請求項１または２に記載の回路モジュール。     The heat dissipation member is made of a conductive material,
    The circuit module according to claim 1, wherein a portion of the heat radiating member that is formed at an edge of the recess is joined to a ground electrode formed on the parent substrate.
  4. 　前記凹部の内部に、前記親基板に実装される電子部品を収容する
    　請求項１～３のいずれか１項に記載の回路モジュール。     The circuit module according to any one of claims 1 to 3, wherein an electronic component mounted on the parent substrate is accommodated in the recess.
  5. 　前記電子部品は、前記凹部の内部において、前記放熱部材と空間を隔てて配置されている
    　請求項４に記載の回路モジュール。     The circuit module according to claim 4, wherein the electronic component is disposed inside the recess with a space from the heat dissipation member.
  6. 　前記電子部品は、発振子または発振器である
    　請求項４または５に記載の回路モジュール。     The circuit module according to claim 4, wherein the electronic component is an oscillator or an oscillator.
  7. 　前記電子部品は、中空構造を有する
    　請求項４～６のいずれか１項に記載の回路モジュール。     The circuit module according to any one of claims 4 to 6, wherein the electronic component has a hollow structure.
  8. 　前記電子部品は、発熱部品である
    　請求項４または５に記載の回路モジュール。     The circuit module according to claim 4, wherein the electronic component is a heat generating component.
  9. 　前記発熱部品は、半導体回路を有する
    　請求項８に記載の回路モジュール。     The circuit module according to claim 8, wherein the heat generating component includes a semiconductor circuit.
  10. 　前記回路モジュールは、前記面の外周部に複数の電極パッドを有し、
    　前記凹部は、前記外周部の内側に形成されている
    　請求項１～９のいずれか１項に記載の回路モジュール。     The circuit module has a plurality of electrode pads on the outer periphery of the surface,
    The circuit module according to any one of claims 1 to 9, wherein the concave portion is formed inside the outer peripheral portion.
  11. 　前記親基板に実装され前記凹部の内部に収容される電子部品と前記回路モジュールとを接続する接続端子は、前記外周部の内側に配置されている
    　請求項１０に記載の回路モジュール。     The circuit module according to claim 10, wherein a connection terminal that connects the electronic component mounted on the parent substrate and accommodated in the recess and the circuit module is disposed inside the outer peripheral portion.
PCT/JP2016/072779 2015-08-06 2016-08-03 Circuit module WO2017022789A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021054334A1 (en) * 2019-09-19 2021-03-25 株式会社村田製作所 Module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058741A (en) * 1998-08-12 2000-02-25 Taiyo Yuden Co Ltd Hybrid module
JP2003086755A (en) * 2001-09-11 2003-03-20 Sony Corp Hybrid module
JP2006216674A (en) * 2005-02-02 2006-08-17 Sharp Corp Printed circuit with improved heat dissipation performance and circuit module comprising the same
JP2011182017A (en) * 2010-02-26 2011-09-15 Kyocera Kinseki Corp Module
JP2012114334A (en) * 2010-11-26 2012-06-14 Nec Casio Mobile Communications Ltd Semiconductor module having cavity substrate, failure analysis method for the same, and method of manufacturing the semiconductor module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058741A (en) * 1998-08-12 2000-02-25 Taiyo Yuden Co Ltd Hybrid module
JP2003086755A (en) * 2001-09-11 2003-03-20 Sony Corp Hybrid module
JP2006216674A (en) * 2005-02-02 2006-08-17 Sharp Corp Printed circuit with improved heat dissipation performance and circuit module comprising the same
JP2011182017A (en) * 2010-02-26 2011-09-15 Kyocera Kinseki Corp Module
JP2012114334A (en) * 2010-11-26 2012-06-14 Nec Casio Mobile Communications Ltd Semiconductor module having cavity substrate, failure analysis method for the same, and method of manufacturing the semiconductor module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021054334A1 (en) * 2019-09-19 2021-03-25 株式会社村田製作所 Module

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