JP2011182017A - Module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a module for reducing the area where the module is mounted on electronic equipment and preventing a component element from being influenced by an electromagnetic wave from the outside. <P>SOLUTION: The module mainly comprises: a module composed of a cover with a recessed space provided on one principal plane and a component element mounting pad provided on the other principal plane, a shield film made of metal provided integrally with the bottom face and side faces of the recessed space, and a component element with the component element mounting pad mounted thereon; a wiring substrate; and a component element for wiring substrate mounted on the wiring substrate. The component element for wiring substrate mounted on the wiring substrate is housed in the recessed space. The shield film is electrically connected to one predetermined wiring substrate connection terminal. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a module that is used in an electronic device or the like and on which a plurality of component elements are mounted.

As an example of a module on which a plurality of component elements are mounted, there is a communication module that constitutes an electronic device such as a portable communication device or an electronic computer.
Generally, such a communication module has a structure in which a plurality of component elements are mounted on one main surface of a wiring board.

Here, for example, such a communication module includes two component elements, one of which is an oscillation circuit unit having a function of an oscillation circuit, and the other of which is a transducer unit having a function of an oscillator. It is.
Such a communication module mainly includes, for example, a wiring board, an oscillation circuit unit mounted on the wiring board, and a vibrator unit electrically connected to the oscillation circuit unit.

For example, an insulating material is used for the wiring board, and the wiring board is provided in a rectangular flat plate shape.
The wiring board includes, for example, an oscillation circuit unit mounting pad for mounting an oscillation circuit unit described later and a vibrator unit mounting pad for mounting a transducer unit described later on one main surface of the wiring substrate. Is provided. Further, the wiring board is provided with a wiring board connection terminal serving as an external connection terminal of the communication module on the other main surface of the wiring board.
The wiring board is provided with a plurality of wirings that electrically connect the wiring board connection terminals, the oscillation circuit unit mounting pads, and the vibrator unit mounting pads.

The oscillation circuit unit is composed of a plurality of electronic components such as transistors and resistors, for example, and fulfills the function of the oscillation circuit.
Note that although the case where the oscillation circuit unit is composed of a plurality of electronic components is described here, an integrated circuit element may be used as long as the function of the oscillation circuit can be achieved.

Here, the vibrator unit is, for example, a piezoelectric vibrator mainly composed of a piezoelectric vibration element, an element mounting member for mounting the piezoelectric vibration element, and a lid member for hermetically sealing the piezoelectric vibration element. .
The piezoelectric vibration element is mainly composed of, for example, a piezoelectric piece, an excitation electrode, and a routing electrode.
The piezoelectric piece is made of, for example, a piezoelectric material and is provided in a rectangular flat plate shape.
For example, two excitation electrodes are paired. One excitation electrode is provided on one main surface of the piezoelectric piece. The other excitation electrode is provided on the other main surface of the piezoelectric piece at a position facing the one excitation electrode.
For example, two routing electrodes are paired. One routing electrode has one end connected to one excitation electrode and the other end positioned on one short side of the other main surface of the piezoelectric piece. The other routing electrode has one end connected to the other excitation electrode, and the other end located on one short side of one main surface of the piezoelectric piece.

As the element mounting member, for example, ceramics which is an insulating material is used.
The element mounting member is provided with a concave space for piezoelectric vibration elements on one main surface, and a plurality of piezoelectric vibration element mounting pads are provided on the bottom surface of the concave space for piezoelectric vibration elements. In addition, the element mounting member is provided with a recess space for an oscillation circuit section and a plurality of element mounting member connection terminals on the other main surface.
The concave space for the piezoelectric vibration element has such a size that the piezoelectric vibration element can be accommodated therein.
The piezoelectric vibration element mounting pads are, for example, a pair of two, and are provided side by side along one short side of the bottom surface of the piezoelectric vibration element recess space. Further, the piezoelectric vibration element mounting pad is provided at a position facing the routing electrode provided in the piezoelectric vibration element, and is electrically connected.
The recess space for the oscillation circuit section has a size that allows the oscillation circuit section to be accommodated therein.
The element mounting member connection terminal serves as an external connection terminal of the piezoelectric vibrator. The element mounting member connection terminal is provided and electrically connected to a position facing the element mounting member mounting pad provided on the wiring board.
Here, for example, four element mounting member connection terminals are provided, one on each other main surface of the element mounting member. The two predetermined element mounting member connection terminals are electrically connected to the piezoelectric vibration element mounting pad.
That is, in the element mounting member, the piezoelectric vibration element mounting pad and the lead electrode provided in the piezoelectric vibration element are electrically connected, and the piezoelectric vibration element is provided in the concave space for the piezoelectric vibration element and mounted on the element mounting member. I am letting. Therefore, since the element mounting member is electrically connected to the predetermined piezoelectric vibration element mounting pad and the two predetermined element mounting member connection terminals, the excitation electrode and the predetermined two element mounting member connection terminals are connected to each other. It is in an electrically connected state.
In addition, since the element mounting member is provided on the wiring board with the opening of the concave portion for the oscillation circuit portion facing the wiring substrate side, the oscillation circuit portion is accommodated in the concave space for the oscillation circuit portion.

The lid member is made of, for example, metal and is provided in a rectangular flat plate shape.
The lid member is bonded to one main surface of the element mounting member provided with the concave space for the piezoelectric vibration element, and hermetically seals the piezoelectric vibration element mounted on the element mounting member.

  Such a communication module three-dimensionally mounts an oscillation circuit section and a vibration section on a wiring board by providing concave spaces on both main surfaces of the element mounting member of the piezoelectric vibrator (for example, Patent Document 1). reference).

In addition, in a communication module mainly composed of a wiring board, an oscillation circuit section, and a vibrator section, for example, the vibrator section is not a piezoelectric vibrator, and a piezoelectric vibration element is directly mounted on the wiring board. In some cases, the piezoelectric vibrating element is hermetically sealed by a lid member.
In such a communication module, an oscillation circuit unit is mounted on one main surface of the wiring board.
Here, the oscillation circuit unit is, for example, an integrated circuit element having a function of an oscillation circuit.
In the communication module, the transducer mounting pad provided on the wiring board and the routing electrode provided on the piezoelectric vibration element are electrically connected, and the piezoelectric vibration element is mounted on one main surface of the wiring board. The
Further, in such a communication module, the lid member having the concave space for the piezoelectric vibration element on one main surface is made of a metal that is a conductive material, and the opening of the concave space for the piezoelectric vibration element is formed on the wiring board side. The piezoelectric vibration element is hermetically sealed in the concave space for the piezoelectric vibration element.

In some cases, such a communication module is formed by providing an oscillation circuit portion and a vibrator portion on a wiring board and then covering the surface with an insulating resin to form a conductive resin on the surface thereof.
In such a communication module, by setting this conductive resin to the same potential as the ground, the amount of electromagnetic waves from the outside of the communication module reaching the oscillation circuit unit can be suppressed, and malfunction of the oscillation circuit unit due to electromagnetic waves (For example, refer to Patent Document 2).

JP 2004-56733 A JP 2007-124591 A

However, the conventional module is mounted on one main surface of a wiring board in which a plurality of component elements are provided in a rectangular flat plate shape. That is, in the conventional module, a plurality of component elements are provided in a plane on one main surface of the wiring board.
For this reason, when mounting on an electronic device, since the conventional module needs to be larger than the mounting area of each component element to be mounted, it may not be possible to cope with the downsizing of the electronic device.

In addition, in the conventional module, a plurality of component elements mounted on one main surface of the wiring board are covered with an insulating resin, and a conductive resin is provided on the surface thereof. By setting the same potential, the amount of electromagnetic waves reaching the component element from one main surface side of the wiring board is suppressed.
However, when mounted on an electronic device, the conventional module is mounted on the electronic device with the other main surface facing the mounting portion of the electronic device, so wiring that is not covered with insulating resin or conductive resin There is a risk that electromagnetic waves from the other main surface of the substrate, in other words, from the mounting portion side of the electronic device may pass through the wiring member and reach the component element.
For this reason, when mounted on an electronic device, the conventional module is easily affected by electromagnetic waves from the mounting portion side of the electronic device, and may malfunction due to the influence of electromagnetic waves from the electronic device.

In a conventional module, an element mounting member having concave spaces on both main surfaces uses an insulating material such as ceramic. Further, in the conventional module, component elements are provided in the respective recessed spaces.
That is, since the conventional module is provided in the recessed space provided in the element mounting member made of an insulating material, the component element accommodated in the recessed space is exposed to electromagnetic waves from the outside. Can be regarded as Therefore, in the conventional module, an electronic component provided in the recess space is easily affected by external electromagnetic waves, and may malfunction due to the external electromagnetic waves.

  Therefore, an object of the present invention is to provide a module that can reduce the mounting area when mounted on an electronic device, and the mounted component element can suppress the influence of electromagnetic waves from the outside.

  In order to solve the above problems, a cover in which a concave space is provided on one main surface and a component element mounting pad is provided on the other main surface, and a metal integrally provided on the bottom and side surfaces of the concave space And a component element mounted on the component element mounting pad.

  In order to solve the above problems, the module is composed mainly of a module, a wiring board, and a wiring board component element mounted on the wiring board, and the wiring board is mounted on the wiring board. A component element is housed in the recess space, and the shield film is electrically connected to a predetermined wiring board connection terminal.

Such a module is mounted on a component element mounting pad provided on a cover in which a concave space is provided on one main surface and a component element mounting pad is provided on the other main surface, and on the other main surface of the cover. Component parts.
Therefore, when mounted on an electronic device, such a module is mounted in the recessed space by mounting the opening of the recessed space provided on one main surface of the cover toward the mounting portion side of the electronic device. The components provided on the mounting portion side of the electronic device can be accommodated.
In other words, such a module can be mounted three-dimensionally by providing the component elements on the main surface of the cover where no recess space is provided. Can be suppressed.

Also, in such a module, a shield film made of metal is provided in a recessed space provided on one main surface of the cover.
In other words, when mounted on an electronic device, such a module can be used from the opening side of the recessed space where the shield film is provided by setting the shield film to the same potential as the ground, that is, from one main surface side of the cover. The amount of electromagnetic waves that can reach can be suppressed as compared with a conventional module. In other words, when mounted on an electronic device, such a module can suppress the amount of electromagnetic waves from the electronic device reaching compared to a conventional module, and can suppress the influence of the electromagnetic waves from the electronic device. .

Such a module includes not only the cover, the shield film, and the component elements, but also a wiring board and a wiring board component element mounted on the wiring board. In addition, in such a module, a wiring board component element is accommodated in the recess space.
That is, in such a module, the shield film is provided in the recessed space provided in the cover, and the wiring board component element mounted on the wiring board is accommodated in the recessed space. ing. In other words, such a module can be regarded as a state in which the wiring board component elements mounted on the wiring board are surrounded by the shield film.
Therefore, when mounted on an electronic device, such a module can suppress the amount of electromagnetic waves reaching the wiring board component elements mounted on the wiring board by setting the shield film to the same potential as the ground. .

It is sectional drawing which shows an example of the module which concerns on 1st embodiment of this invention. It is sectional drawing which shows an example of the module which concerns on 2nd embodiment of this invention.

  Next, the best mode for carrying out the present invention will be described. In each drawing, the state of each component is exaggerated for easy understanding.

(First embodiment)
The module according to the first embodiment of the present invention will be described.

A module according to an embodiment of the present invention will be described.
Here, the module is a communication module constituting an electronic device such as a portable communication device or an electronic computer.
Here, the communication module has a function of a vibrator, for example.
As shown in FIG. 1, the module 100 according to the first embodiment of the present invention mainly includes a cover 130, a shield film 140, and a component element 150.

As shown in FIG. 1, the cover 130 is mainly composed of a cover substrate part 130a and a cover frame part 130b, and a concave space 133 is formed on one main surface.
As shown in FIG. 1, the cover 130 has cover connecting terminals 131a. A component element mounting pad 132 is provided on the other main surface.

The cover substrate part 130a is provided in a rectangular flat plate shape, for example.
The cover frame part 130b is provided in a rectangular frame shape, for example. The cover frame part 130b is provided along one main surface of the cover substrate part 130a.
That is, the cover 130 is provided with the frame-shaped cover frame portion 130b on one main surface of the cover substrate portion 130a, and the recessed space 133 is formed.

Here, one main surface of the cover 130 is a main surface in which the recessed space 133 is formed, that is, a surface of the cover frame portion 130b facing the surface where the cover substrate portion 130a and the cover frame portion 130b are in contact. is there.
The other main surface of the cover 130 is the cover substrate portion 130a facing the surface of the cover substrate portion 130a facing the bottom surface of the recessed space 133, that is, the surface where the cover substrate portion 130a and the cover frame portion 130b are in contact. This is the face.

A plurality of cover connection terminals 131a and 131b are provided and function as external terminals.
Here, for example, four cover connection terminals 131 a and 131 b are provided, and one is provided at each of the four corners of one main surface of the cover 130.
For example, as shown in FIG. 1, one predetermined cover connection terminal 131a is provided so as to be in contact with a shield film 140 described later. Therefore, the predetermined one cover connection terminal 131 a can be set to the same potential as the shield film 140.

As shown in FIG. 1, a plurality of component element mounting pads 132 are provided on the other main surface of the cover 130, that is, on the surface facing the bottom surface of the recessed space 133. In other words, the component element mounting pad 132 is provided on the other main surface of the cover substrate portion 130a.
Further, as shown in FIG. 1, the component element mounting pad 132 is provided at a position facing a component element connection terminal 151 provided in a component element 150 described later, and is electrically connected by, for example, a conductive material D. ing.
Here, for example, four component element mounting pads 132 are provided, one at each of the four corners of the other main surface of the cover 130.

In the cover 130, the component element mounting pad 132 and the component element connection terminal 151 provided on the component element are electrically connected by a conductive material such as solder, so that the component element 150 is connected to the other side of the cover 130. It is mounted on the main surface.
Here, such a cover 130 mainly uses, for example, an insulating resin and a metal lead.
Such a cover 130 has a predetermined shape and is provided with leads provided at predetermined positions fixed by an insulating resin.
Further, such a cover 130 is in a state in which a part of one end of the lead and a part of the other end are exposed, and a part of the one end of the exposed lead is exposed. Cover connection terminals 131a and 131b are formed, and a part of the other end of the exposed lead is a second component element mounting pad 132.

The shield film 140 is made of metal.
Further, as shown in FIG. 1, the shield film 140 is integrally provided on the bottom surface and the side surface in the recessed space 133. That is, the shield film 140 is provided on the inner wall portion of the cover frame portion 130b and one main surface of the cover substrate portion 130a.
Further, for example, as shown in FIG. 1, the shield film 140 is in contact with one predetermined cover connection terminal 131a. Therefore, the shield film 140 can be set to the same potential as the ground by setting one predetermined cover connection terminal 131a to the same potential as the ground.
Here, the shield film 140 is provided at a predetermined position of the cover 130 by, for example, a plating method.

Here, the component element 150 is, for example, a piezoelectric vibrator in which a piezoelectric vibration element mounted on an element mounting member is hermetically sealed with an element mounting member and a lid member.
For example, as shown in FIG. 1, the component element 150 is provided with a plurality of component element connection terminals 151 on one main surface.
As shown in FIG. 1, the component element connection terminal 151 is provided at a position facing the component element mounting pad 132 provided on the cover 130. For example, the component element connection terminal 151 is electrically connected by a conductive material D such as solder. Has been.
Here, for example, four component element connection terminals 151 are provided, and one component element connection terminal 151 is provided at each of the four corners of one main surface of the component element 150. One predetermined component element connection terminal 151 functions as a ground terminal connected to the ground.
The component element 150 is mounted on the cover 130 by electrically connecting the component element connection terminal 151 to the component element mounting pad 132 provided on the other main surface of the cover 130 via the conductive material D. Yes.

As shown in FIG. 1, such a module 100 has a concave space 133 formed on one main surface side and a component element 150 mounted on the other main surface side.
In addition, as shown in FIG. 1, such a module 100 is provided with a shield film 140 made of metal in a recessed space 133 provided on one main surface side. The potential can be the same.
Also, in such a module 100, cover connection terminals 131a and 132b that function as external terminals are provided on one main surface of the cover 130. That is, when mounted on an electronic device, such a module 100 is mounted with the opening of the recessed space 133 facing the mounting portion side of the electronic device. In other words, such a module 100 is in a state in which the recessed space 133 and the shield film are provided between the component element 150 and the mounting portion of the electronic device.

The module 100 according to the first embodiment of the present invention has a cover 130 in which a concave space 133 is provided on one main surface and a component element mounting pad 132 is provided on the other main surface, and the other of the cover 130. And a component element 150 mounted on a component element mounting pad 132 provided on the main surface.
Therefore, when mounted on an electronic device, the module 100 according to the first embodiment as described above has the opening of the recessed space 133 provided on one main surface of the cover 130 facing the mounting portion side of the electronic device. Thus, the component elements provided on the mounting portion side of the electronic device can be accommodated in the recess space 133.
That is, in the module 100 according to the first embodiment of the present invention, the component elements 150 are three-dimensionally mounted by providing the component elements on the main surface of the cover 130 in which the recessed space 133 is not provided. Therefore, the mounting area can be reduced as compared with the conventional module.

In the module 100 according to the first embodiment of the present invention, the shield film 140 made of metal is provided in the recessed space 133 provided on one main surface of the cover 130.
That is, when mounted on an electronic device, the module 100 according to the first embodiment of the present invention has the concave space 133 in which the shield film 140 is provided by setting the shield film 140 to the same potential as the ground. The amount of electromagnetic waves reaching from the opening side, that is, the one main surface side of the cover 130 can be suppressed as compared with the conventional module. In other words, when mounted on an electronic device, the module 100 according to the first embodiment of the present invention can suppress the amount of electromagnetic waves from the electronic device to reach as compared with a conventional module. The influence of electromagnetic waves from the equipment can be suppressed.

(Second embodiment)
Next, a module 300 according to the second embodiment of the present invention will be described.
As shown in FIG. 2, the module 300 according to the second embodiment of the present invention is different from the first embodiment in that it includes a wiring board 210 and a wiring board component element 220.

For example, the wiring substrate 210 is made of an insulating material and is provided in a rectangular flat plate shape.
As shown in FIG. 2, the wiring board 210 has a plurality of cover mounting pads 212a and a plurality of wiring board component element mounting pads 212b on one main surface, and a plurality of wiring board component element mounting pads 212b on the other main surface. A wiring board connection terminal 211 is provided.
Further, the wiring substrate 210 is provided with a plurality of wirings (not shown).

As shown in FIG. 2, the wiring board connection terminal 211 is provided on the other main surface of the wiring board 210. Further, the wiring board connection terminal 211 functions as an external terminal of the module 300 according to the second embodiment of the present invention.
Here, for example, four wiring board connection terminals 211 are provided, one at each of the four corners of the other main surface of the wiring board 210. One predetermined wiring board connection terminal 211 serves as a ground terminal connected to the ground.

A plurality of cover mounting pads 212 a are provided on one main surface of the wiring board 210.
Further, as shown in FIG. 2, the cover mounting pad 212 a is provided at a position facing the cover connection terminals 131 a and 131 b provided on the cover 130.
Further, as shown in FIG. 2, the cover mounting pad 212a is electrically connected to the cover connection terminals 131a and 131b by a conductive material D such as solder, for example.
Here, for example, four cover mounting pads 212a are provided, one at each of the four corners of one main surface of the wiring board 210, and electrically connected to the cover connection terminals 131a and 131b by the conductive material D. It is connected.

A plurality of wiring board component element mounting pads 212 b are provided on one main surface of the wiring board 210.
Further, as shown in FIG. 2, the wiring board component element mounting pad 212b is one main surface of the wiring board 210, and a position facing a wiring board connection terminal 221 of the wiring board component element 220 described later. Is provided. Further, the wiring board component element mounting pad 212b is electrically connected to the first component element connection terminal 121 by a conductive material D, for example, as shown in FIG.
Here, for example, eight wiring board component element mounting pads 212b are provided, and are provided on one main surface of the wiring board 210 in a matrix of 2 rows × 4 columns.

  A plurality of wirings are provided on the wiring board 210, and the wiring board connecting terminals 211, the cover mounting terminals 212a, and the wiring board component element mounting pads 212b provided on the wiring board 210 are electrically connected.

Here, the wiring board component element 220 is, for example, an integrated circuit element having a function of an oscillation circuit.
As shown in FIG. 2, the wiring board component element 220 is provided with a plurality of wiring board component element connection terminals 221 on one main surface.
The wiring board component element connection terminal 221 is provided at a position facing the wiring board component element mounting pad 212b provided on the wiring board 210. For example, the wiring board component element connection pad 212b is electrically connected to the wiring board component element mounting pad 212b by the conductive material D. Connected.
Here, for example, eight wiring board component element connection terminals 221 are provided, four along one long side of the wiring board 210 and four along the other long side of the wiring board 210. One is provided. That is, the wiring board component element connection terminals 221 are provided in a matrix of 2 rows × 4 columns.
The wiring board component element 220 is electrically connected to the wiring board component element mounting pad 212b provided on the wiring board 210 via the conductive material D, as shown in FIG. As a result, the wiring board 210 is mounted.

In the module 300 according to the second embodiment of the present invention, the wiring board component element 220 is mounted on the wiring board 210.
Further, in the module 300 according to the second embodiment of the present invention, the cover mounting pad 212a and the cover connection terminals 131a and 132b provided on the cover 130 are made of the conductive material D as shown in FIG. The module 100 according to the first embodiment of the present invention is mounted on the wiring board 210 by being electrically connected.
In addition, the module 300 according to the second embodiment of the present invention stores the wiring board component element 220 mounted on the wiring board 210 in the recess space 133 as shown in FIG. .
In the module 300 according to the second embodiment of the present invention, the wiring board 210 and the wiring board component element 220 can be regarded as the module 200. That is, the module 300 according to the second embodiment of the present invention is related to the module 200 mainly composed of the wiring board 210 and the wiring board component element 220 according to the first embodiment of the present invention. It can be considered that the module 100 is mounted.

  In the module 300 according to the second embodiment of the present invention, the shield film 140 is provided in the recessed space 133 provided on one main surface of the cover 130, and the component element 150 is provided on the other main surface of the cover 130. Is provided. That is, the module 300 according to the second embodiment of the present invention has the same effect as the module 100 according to the first embodiment of the present invention.

The module 300 according to the second embodiment of the present invention includes not only the cover 130, the shield film 140, and the component element 150, but also the wiring board 210 and the wiring board mounted on the wiring board 210. A component element 220 is also provided. In the module 300 according to the second embodiment of the present invention, the wiring board component element 220 is accommodated in the recessed space 133.
That is, in the module 300 according to the second embodiment of the present invention, the shield film 140 is provided in the recessed space 133 provided in the cover 130, and the wiring substrate 210 is provided in the recessed space 133. The mounted wiring board component element 220 is housed. In other words, the module 300 according to the second embodiment of the present invention can be regarded as a state in which the wiring board component element 220 mounted on the wiring board 210 is surrounded by the shield film 140. it can.
Accordingly, when mounted on an electronic device, the module 300 according to the second embodiment of the present invention is for the wiring board mounted on the wiring board 210 by setting the shield film 140 to the same potential as the ground. The amount of electromagnetic waves reaching the component element 220 can be suppressed.

  In addition, although the case where the recessed space is provided on only one main surface of the cover is described here, the recessed space may be provided on both main surfaces of the cover, for example. At this time, the component element mounting pad is provided on the bottom surface of the recessed space provided on the other main surface of the cover.

  Here, the case where the shield film is electrically connected to one predetermined cover connection terminal that functions as a ground terminal has been described. For example, a ground terminal may be provided on the wiring board without being connected to a predetermined one cover connection terminal to be electrically connected.

  Although the case where the wiring board component element is an integrated circuit element is described here, for example, it may be composed of a plurality of electronic components.

  Although the case where the component element is a vibrator has been described here, for example, an oscillator, a resistor, a capacitor, or the like may be used instead of the vibrator. Moreover, the component element may be composed of a plurality of electronic components.

  Here, although the shield film is provided using a plating method, sputtering or vapor deposition may be used, for example, as long as it can be provided at a predetermined position.

100, 200, 300 Module 130 Cover 130a Cover substrate portion 130b Cover frame portion 131a, 131b Cover connection terminal 132 Component element mounting pad 133 Recessed space 140 Shield film 150 Component element 151 Component element connection terminal 210 Wiring substrate 211 Wiring substrate connection terminal 212a Cover mounting pad 212b Wiring board component element mounting pad 220 Wiring board component element 221 Wiring board component element connection terminal D Conductive material

Claims (2)

A cover in which a concave space is provided on one main surface and a component element mounting pad is provided on the other main surface;
A shield film made of metal integrally provided on the bottom and side surfaces of the recess space;
A component element mounted on the component element mounting pad;
A module characterized by comprising. A module according to claim 1;
A wiring board;
A wiring board component element mounted on the wiring board;
Mainly consists of
The wiring board component element mounted on the wiring board is housed in the recess space,
The module, wherein the shield film is electrically connected to one predetermined wiring board connection terminal.

Images