JPH01286455A - Integrated circuit case equipped with heat sink - Google Patents
Integrated circuit case equipped with heat sinkInfo
- Publication number
- JPH01286455A JPH01286455A JP63116213A JP11621388A JPH01286455A JP H01286455 A JPH01286455 A JP H01286455A JP 63116213 A JP63116213 A JP 63116213A JP 11621388 A JP11621388 A JP 11621388A JP H01286455 A JPH01286455 A JP H01286455A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- insulating substrate
- heat
- integrated circuit
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 230000005855 radiation Effects 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ヒートシンク付集積回路ケース、特に論理回
路ＩＣ等を搭載するためのヒートシンク付集積回路ケー
スに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an integrated circuit case with a heat sink, and particularly to an integrated circuit case with a heat sink for mounting a logic circuit IC or the like.
従来、ＩＣチップを搭載した集積回路ケースはプリント
配線板等に複数実装して使用される。この集積回路ケー
スに搭載されているＩＣチップは通電により発熱するが
、集積回路ケースの放熱のみでは、ジャンクション温度
を抑えられないとき、集積回路ケースの上面等の熱放散
用ヒートシンクを取付けるが、この取付謔臂状接着剤を
固化させる等により接着固定していた。BACKGROUND ART Conventionally, a plurality of integrated circuit cases mounted with IC chips are mounted on a printed wiring board or the like. The IC chip installed in this integrated circuit case generates heat when energized, but when the junction temperature cannot be suppressed by heat dissipation from the integrated circuit case alone, a heat sink for heat dissipation is installed on the top surface of the integrated circuit case. The mounting arm was fixed by hardening the adhesive.
このため、従来の集積回路ケースは、接着剤が固化する
間振動を加えることなく固定保持する必要があるととも
に、−度接着した集積回路ケースとヒートシンクはいづ
れか一方を交換または再使用等をしたくても固着接着さ
れているため不可能であり、いずれも廃棄せざるを得な
いという欠点があった。For this reason, conventional integrated circuit cases need to be held fixed without vibration while the adhesive hardens, and it is difficult to replace or reuse either the integrated circuit case or the heat sink that has been glued together. However, this is impossible because they are firmly glued together, and both have the disadvantage of having to be discarded.
本発明のヒートシンク付集積回路ケースは、絶縁基板と
、この絶縁基板に固着された熱伝体と、裏面を前記熱伝
体に固着して前記絶縁基板に搭載されたＩＣチップと、
このＩＣチップに電気的に接続され前記絶縁基板に取り
付けられた接続端子と、前記熱伝体に設けられた案内機
構に案内されて前記絶縁基板と平行な方向に移動して着
脱が可能で放熱フィンを有するヒートシンクと、このヒ
ートシンクと前記絶縁基板間でそれぞれに抑圧する力を
与え前記ヒートシンクを前記絶縁４基板に固定する加圧
バネおよび回転球とを含んで構成される。The integrated circuit case with a heat sink of the present invention includes an insulating substrate, a heat conductor fixed to the insulating substrate, and an IC chip mounted on the insulating substrate with its back surface fixed to the heat conductor.
A connection terminal that is electrically connected to this IC chip and attached to the insulating substrate, and a guide mechanism provided on the heat conductor, can be moved in a direction parallel to the insulating substrate to be attached and detached, and heat can be dissipated. The heat sink includes a heat sink having fins, a pressure spring and a rotating ball that respectively apply a pressing force between the heat sink and the insulating substrate to fix the heat sink to the insulating four substrates.
次に、本発明の実施例について図面を参照して詳細に説
明する。Next, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は本発明の一実施例を示す断面図でＩＣチップの
置かれている状態が明示できるように断面図で示されて
いる。FIG. 1 is a cross-sectional view showing one embodiment of the present invention, and is shown in cross-sectional view so that the state in which the IC chip is placed can be clearly seen.
本実施例のヒートシンク付集積回路ケースは、論理回路
等の集積回路より成るＩＣチップ１が所定の動作温度以
内とな９正常動作を保つため放熱フィン２を備えたヒー
トシンク３を有している。The integrated circuit case with a heat sink of this embodiment has a heat sink 3 equipped with heat dissipation fins 2 in order to maintain normal operation of an IC chip 1 comprising an integrated circuit such as a logic circuit within a predetermined operating temperature.
絶縁基板５の下面中央部に設けた凹部にＩＣチップ１を
設ける。外部との信号の送受を行うための接続端子４は
絶縁基板５の周囲に必要数備え付けてあり、この接続端
子に接続されている導体パターン６の一端は前記ＩＣチ
ップに備え付けであるチップ接続端子７に接続線８によ
り接続される。The IC chip 1 is provided in a recess provided in the center of the lower surface of the insulating substrate 5. A necessary number of connection terminals 4 for transmitting and receiving signals with the outside are provided around the insulating substrate 5, and one end of the conductor pattern 6 connected to the connection terminals is a chip connection terminal provided on the IC chip. 7 by a connecting line 8.
また、通電によりＩＣチップｌが、動作状態となると、
高速論理回路等により構成されるＩＣチップの場合は特
に消費電力も太きいため、集積回路ケースのみからの熱
放散だけでは」Ｃテップ１のジャンクション温度を抑え
られず、高温度となり、正常動作不能となるばかりか、
破壊に至ることになる。これを防止し正常動作を保つた
め、放熱フィン２を有するヒートシンク３を必要とする
。Also, when the IC chip l becomes operational by energizing,
Since IC chips consisting of high-speed logic circuits consume particularly large amounts of power, dissipating heat from the integrated circuit case alone cannot suppress the junction temperature of C step 1, resulting in a high temperature that prevents normal operation. Not only that, but
It will lead to destruction. In order to prevent this and maintain normal operation, a heat sink 3 having radiation fins 2 is required.
突条付熱伝体１１が絶縁基板５の中央部分に固定され、
ＩＣチップ１の裏面と接融し熱伝導材料より ｒａ ｖ
、両側面に突条９を備えている。ヒートシンク３の下面
には突条９の形状に合致した形状でかつ摺動可能な蟻溝
１０を設け、突条付熱伝体１１の突条９に蟻溝１０を嵌
合するととＫよってヒートシンク３を突条付熱伝体１１
に必要に応じて取付け、交換を可能としている。突条９
と蟻溝１０の嵌合のみでは、ヒートシンク３は摺動によ
り移動してしまうため、ヒートシンク３を摺動から防止
して固定するために、ヒートシンク３に設けた穴の中に
加圧バネ１３と回転球１４を備え、回転球１４を絶縁基
板５に押し付けている。The heat conductor 11 with protrusions is fixed to the center portion of the insulating substrate 5,
From the heat conductive material welded to the back side of IC chip 1 ra v
, is provided with protrusions 9 on both sides. The lower surface of the heat sink 3 is provided with a slidable dovetail groove 10 having a shape that matches the shape of the protrusion 9, and when the dovetail groove 10 is fitted to the protrusion 9 of the heat conductor 11 with protrusions, the heat sink 3 is a heat conductor with protrusions 11
It can be installed and replaced as necessary. Projection 9
If the heat sink 3 is only fitted with the dovetail grooves 10 and 10, the heat sink 3 will slide and move. Therefore, in order to prevent the heat sink 3 from sliding and fix it, a pressure spring 13 is inserted into the hole provided in the heat sink 3. A rotating ball 14 is provided, and the rotating ball 14 is pressed against the insulating substrate 5.
さらに、ＩＣチップ１と接続線８等の保護のため、保護
キャップ１２が絶縁基板５の下面に取付けられている。Furthermore, a protective cap 12 is attached to the lower surface of the insulating substrate 5 to protect the IC chip 1, the connecting wires 8, and the like.
本発明のヒートシンク付集積回路ケースは、ＩＣチップ
の裏面と固着した熱伝体に備えた案内機構によりヒート
シンクを絶縁基板に着脱可能に取シ付け、加圧バネおよ
び回転球によりヒートシンクを絶縁基板に固定すること
で、集積回路ケースに放熱用ヒートシンクを容易に取り
付けることができるため取り付は工数等を大幅に削減で
きるとともに、集積回路ケース、ヒートシンクのいずれ
か一方を交換したい時でも、これらをむだなく使用でき
るという効果がある。In the integrated circuit case with a heat sink of the present invention, the heat sink is removably attached to the insulating substrate by a guide mechanism provided on the heat conductor fixed to the back surface of the IC chip, and the heat sink is attached to the insulating substrate by a pressure spring and a rotating ball. By fixing the heat sink to the integrated circuit case, you can easily attach the heat sink to the integrated circuit case, which greatly reduces the number of installation steps. It has the effect of being able to be used without any problems.
第１図は本発明の一実施例を示す断面図である。
１・・・・・・ＩＣチップ、２・・・・・・放熱フィン
、３・・・・・・ヒートシンク、４・・・・・・接続端
子、５・・・・・・絶縁基板、６・・・・・・導体パタ
ーン、７・・・・・・チップ接続端子、８・・・・・・
接続線、９・・・・・・突条、１ｏ・・・・・・蟻溝、
１１・・・・・・突条付熱伝体、１２・・・・・・保護
キャップ、１３・・・１０．加圧バネ、１４・・・・・
°回転球。
代理人 ラＰ理士 内 原 音FIG. 1 is a sectional view showing one embodiment of the present invention. 1...IC chip, 2...Radiation fin, 3...Heat sink, 4...Connection terminal, 5...Insulating substrate, 6 ...Conductor pattern, 7...Chip connection terminal, 8...
Connection line, 9... Protrusion, 1o... Dovetail groove,
11...Heat conductor with protrusions, 12...Protection cap, 13...10. Pressure spring, 14...
°Rotating sphere. Agent LAP Physician Oto Uchihara
Claims (1)
面を前記熱伝体に固着して前記絶縁基板に搭載されたＩ
Ｃチップと、このＩＣチップに電気的に接続され前記絶
縁基板に取り付けられた接続端子と、前記熱伝体に設け
られた案内機構に案内されて前記絶縁基板と平行な方向
に移動して着脱が可能で放熱フィンを有するヒートシン
クと、このヒートシンクと前記絶縁基板間でそれぞれに
押圧する力を与え前記ヒートシンクを前記絶縁基板に固
定する加圧バネおよび回転球とを含むことを特徴とする
ヒートシンク付集積回路ケース。an insulating substrate, a heat conductor fixed to the insulating substrate, and an I mounted on the insulating substrate with its back surface fixed to the heat conductor.
A C chip, a connecting terminal electrically connected to the IC chip and attached to the insulating substrate, and a guide mechanism provided on the heat conductor to move in a direction parallel to the insulating substrate to attach and detach. A heat sink equipped with a heat sink characterized in that it includes a heat sink that is capable of radiating heat and has radiation fins, and a pressure spring and a rotating ball that apply a pressing force between the heat sink and the insulating substrate and fix the heat sink to the insulating substrate. integrated circuit case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63116213A JPH01286455A (en) | 1988-05-13 | 1988-05-13 | Integrated circuit case equipped with heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63116213A JPH01286455A (en) | 1988-05-13 | 1988-05-13 | Integrated circuit case equipped with heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01286455A true JPH01286455A (en) | 1989-11-17 |
Family
ID=14681637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63116213A Pending JPH01286455A (en) | 1988-05-13 | 1988-05-13 | Integrated circuit case equipped with heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01286455A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5386144A (en) * | 1993-06-18 | 1995-01-31 | Lsi Logic Corporation | Snap on heat sink attachment |
| US5898571A (en) * | 1997-04-28 | 1999-04-27 | Lsi Logic Corporation | Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages |
| US5977622A (en) * | 1997-04-25 | 1999-11-02 | Lsi Logic Corporation | Stiffener with slots for clip-on heat sink attachment |
| US7311140B2 (en) * | 2000-02-01 | 2007-12-25 | Cool Options, Inc. | Heat sink assembly with overmolded carbon matrix |
-
1988
- 1988-05-13 JP JP63116213A patent/JPH01286455A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5386144A (en) * | 1993-06-18 | 1995-01-31 | Lsi Logic Corporation | Snap on heat sink attachment |
| US5977622A (en) * | 1997-04-25 | 1999-11-02 | Lsi Logic Corporation | Stiffener with slots for clip-on heat sink attachment |
| US5898571A (en) * | 1997-04-28 | 1999-04-27 | Lsi Logic Corporation | Apparatus and method for clip-on attachment of heat sinks to encapsulated semiconductor packages |
| US7311140B2 (en) * | 2000-02-01 | 2007-12-25 | Cool Options, Inc. | Heat sink assembly with overmolded carbon matrix |
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