JPH0758156A - Tape carrier package mounting device - Google Patents

Abstract

PURPOSE:To eliminate the need of changing expensive molds whenever the kind of products is changed so as to omit the need of changing mold exchanging step at the time of changing the kind of products. CONSTITUTION:A tape carrier package mounting device is equipped with a laser cutting section 6 which, cuts off a tape carrier package from a tape with a laser beam, transferring section 2 which mounts the tape carrier package cut off from the tape on a substrate from the section 6, tool 7 which presses the external electrode of the tape carrier package against a substrate pad, and laser joining section 8 which joins the external electrode of the tape carrier package to the substrate pad with the laser beam.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier package mounting device.

[0002]

2. Description of the Related Art A conventional tape carrier package mounting apparatus, as shown in FIG. 4, includes a die section 1 for cutting and molding a tape carrier package from a film, and a tape carrier package after cutting and molding from a die to a substrate. It has a transfer section 2 that conveys it to the holding stage 3, a suction nozzle 5 that vacuum-holds the tape carrier package, and a connection head 4 that connects the external electrodes of the tape carrier package to the pads of the substrate. (For example, Electronics Packaging Technology Vol.8 No5 p60 to p61) A conventional technology will be described with reference to the drawings. The die 1 with the tape carrier package 5 supplied in the form of film tape
The film tape is cut and shaped into the shape shown in FIG. Next, the tape carrier package after cutting and molding is conveyed to the stage 3 by the transfer unit 2. The tape carrier package conveyed onto the stage 3 is vacuum sucked and held by the suction nozzle 5, and the tape carrier package is moved to align and hold the external electrodes of the tape carrier package with the substrate pads. Finally, the external electrode of the tape carrier package was pressed against the substrate pad by the heated connection head 4 to apply pressure and heat to bond.

[0003]

Since the conventional tape carrier package mounting device is cut and molded by a mold, it is necessary to obtain an expensive mold each time the type of tape carrier package is changed. However, there was a problem that it was necessary to change the setup of the mold.

[0004]

The tape carrier package mounting apparatus of the first invention comprises a tool for pressing an unmolded external electrode against a substrate pad, and a heat source for solder-bonding the external electrode of the tape carrier package and the substrate pad. It is configured to include. Tape of the second invention
The carrier package mounting device uses a laser cutting unit as a means for cutting the tape carrier package having the unmolded external electrodes from the film carrier.

[0005]

The present invention will be described below with reference to the drawings.

FIG. 1 is a side view showing a first embodiment of the present invention. The tape carrier package mounting device shown in FIG. 2 comprises a laser cutting section 6 for cutting the tape carrier package from the tape 1 by a laser and a transfer section 2 for mounting the cut tape carrier package on the substrate from the laser cutting section. A tool 7 for pressing the external electrodes of the carrier package against the substrate pad and a laser bonding portion 8 for solder-bonding the external electrode of the tape carrier package and the substrate pad by laser are provided. The tape carrier package 5 supplied in the form of a film tape is melted and cut from the film tape by the laser cutting section 6, and the cut tape carrier package is vacuum-adsorbed and moved by the transfer section 2 to make the external electrodes of the tape carrier package the substrate pad. Align and hold. Finally, while the external electrodes are pressed against the substrate pads one by one, laser is emitted from the laser bonding portion 8 to solder-bond the external electrodes and the pads.

FIG. 2 is a side view showing a second embodiment of the present invention. The tape carrier package mounting device shown in FIG. 2 comprises a laser cutting section 6 for cutting the tape carrier package from the tape 1 by a laser and a transfer section 2 for mounting the cut tape carrier package on the substrate from the laser cutting section. The connection head 6 is configured to press the external electrodes of the carrier package against the substrate pad.

The tape carrier package 5 supplied in the form of a film tape is melted and cut from the film tape by the laser cutting section 6, and the cut tape carrier package is vacuum-adsorbed and moved by the transfer section 2 to be an external electrode of the tape carrier package. Align and hold the to the board pad. Finally, the external electrode of the tape carrier package which has not been molded is pressed onto the substrate pad by the connection head 4 and then heated to solder the external electrode to the substrate pad.

[0009]

As described above, according to the present invention, the laser cutting portion is provided in place of the die, and instead of forming the lead with the die, the lead is pressed by the tool at the time of joining and solder joining is performed in the same shape. There is an effect that it is not necessary to obtain an expensive die each time the product type is changed, and the setup change of the die exchange when the product type is changed can be omitted.

[Brief description of drawings]

FIG. 1 is a side view showing a first embodiment of the present invention.

FIG. 2 is a side view showing a second embodiment of the present invention.

FIG. 3 is a perspective view of laser cutting.

FIG. 4 is a perspective view showing a conventional example.

FIG. 5 is a cross-sectional view of a tape carrier package molded by a mold.

[Explanation of symbols]

 1 Mold 2 Transfer Part 3 Stage 4 Connection Head 5 Adsorption Nozzle 6 Laser Cutting Part 7 Tool 8 Laser Joining Part 9 Substrate 10 Tape Tape Carrier Package 11 Tape Carrier Package External Electrode 12 IC Chip

Claims (2)

[Claims] 1. A device for bonding a tape carrier package to a substrate, comprising a tool for pressing an unmolded external electrode against a substrate pad, and a heat source for solder-bonding the external electrode of the tape carrier package and the substrate pad. Tape carrier package mounting device. 2. A laser cutting section is used as a means for cutting the tape carrier package having the unformed external electrodes from the film carrier.
The tape carrier package mounting device described.