JP4044743B2 - Resin sealing method for semiconductor device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is called QFN (Quad Flat Non-Leaded Package), SON (Small Outline Non-Leaded Package), a semiconductor in which the upper surface of the package is sealed with resin and the external leads are exposed on the lower surface edge The present invention relates to a resin sealing method for an apparatus.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a QFN type semiconductor device is known in which an outer lead protruding to the side of a package is eliminated, and instead, an external lead 101 for electrical connection with a mother board is exposed on the lower surface edge of the package. (FIGS. 5A and B). However, FIGS. 5A and 5B show a state before the semiconductor devices are separated.
[0003]
The resin sealing of the semiconductor device is performed by, for example, die bonding a semiconductor chip 103 to a die pad 102 of a lead frame 100 (FIG. 6A) and wire bonding the semiconductor chip 103 and the external lead 101 of the lead frame 100 with a wire 104. (FIG. 6B) The lead frame 100 is clamped by upper and lower molds 107 and 108 to form a cavity 109 (FIG. 6C), and resin is injected into the cavity 109.
[0004]
However, the external lead 101 and the die pad 102 are easily lifted by the resin pressure at the time of resin injection. For this reason, for example, since the resin wraps around the lower surface of the external lead 101 and the lower surface of the external lead 101 is covered with the resin, there is a problem that it cannot be electrically connected to the mother board.
[0005]
7A and 7B, the film 6 is detachably attached to the lower surface of the lead frame 100, and then the lead frame 100 and the film 6 are attached to the upper and lower molds in the same manner as described above. It has been proposed to clamp the resin and seal with resin.
[0006]
[Problems to be solved by the invention]
However, in the resin sealing method described above, as shown in FIG. 7A, only the region 33 indicated by hatching can be clamped by the upper and lower molds. For this reason, the area indicated by the wavy line in FIG. 7B, that is, the lower surface of the external lead 101 and the lower surface of the die pad 102 do not completely adhere to the film 6. As a result, the injected resin may wrap around and cover the lower surface of the external lead 101, or may solidify while the resin wraps around the lower surface of the die pad 102, resulting in unevenness on the lower surface of the final product. .
[0007]
In view of the above problems, an object of the present invention is to provide a resin sealing method for a semiconductor device that can completely prevent a resin from wrapping around during resin sealing.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a resin sealing method for a semiconductor device according to the present invention is a method in which a film is peelably attached to a lower surface of a substrate in which a mounted semiconductor chip and an external lead are connected by a wire, and then the semiconductor In a resin sealing method of a semiconductor device in which a chip and the wire are resin-sealed and the entire lower surface of the film is exposed, the film and the substrate are sequentially stacked on an upper surface of a lower clamp block, the lower clamp block, and a lower surface The film and the substrate are clamped with an upper clamp block having a recess that does not interfere with the semiconductor chip and the wire, and the substrate and the film are injected by injecting gas into the recess of the upper clamp block. And the process of adhering.
The substrate not only includes a lead frame made of a single metal, but may be a resin substrate made of a resin material, for example, a so-called high-definition organic package substrate.
[0009]
Therefore, according to the present invention, the film and the substrate can be pressed against the lower clamp block at atmospheric pressure without damaging the semiconductor chip and the wire by pressing the gas into the concave portion of the upper clamp block. For this reason, a film and a board | substrate closely_contact | adhere and are firmly stuck and integrated. As a result, the resin does not go around the lower surface of the substrate, and there is an effect that a semiconductor device with good resin sealing can be obtained.
[0010]
Further, in another resin sealing method of a semiconductor device according to the invention, the film and the substrate are sequentially stacked on the upper surface of the lower clamp block, and the lower clamp block and the concave portion that does not interfere with the semiconductor chip and the wire on the lower surface. The method includes a step of clamping the film and the substrate with an upper clamp block, and bringing the substrate and the film into close contact with each other by sucking and depressurizing a gas in a recess of the upper clamp block.
According to the present invention, the substrate and the film can be brought into close contact under reduced pressure. For this reason, like the above-mentioned invention, resin does not wrap around the lower surface of the substrate, and a semiconductor device with good resin sealing can be obtained.
[0011]
Furthermore, in another resin sealing method of a semiconductor device according to the invention, the film and the substrate are sequentially stacked on the upper surface of the heatable lower clamp block, and the lower clamp block and the lower surface interfere with the semiconductor chip and the wire. Clamping and heating the film and the substrate with an upper clamp block having a recess that does not, and injecting and pressurizing gas into the recess of the upper clamp block, thereby bringing the substrate and the film into close contact with each other Consists of.
Further, the film and the substrate are sequentially stacked on the upper surface of the heatable lower clamp block, and the lower clamp block and the upper clamp block having a recess on the lower surface that does not interfere with the semiconductor chip, the wire, and the like. May be a step of bringing the substrate and the film into close contact with each other by clamping and heating, and sucking and decompressing the gas in the recess of the upper clamp block .
According to the present invention, by heating both the film and the substrate, the adhesive force of the film is increased, and the substrate and the film can be firmly adhered to each other. For this reason, as in the above-described invention, the resin does not wrap around the lower surface of the substrate, and a semiconductor device with good resin sealing can be obtained.
[0012]
In another method for sealing a resin of a semiconductor device according to the present invention, the film and the substrate are sequentially stacked on the upper surface of a lower clamp block, and the lower clamp block has a recess that does not interfere with the semiconductor chip, the wire, and the like on the lower surface. The film and the substrate are clamped with the upper clamp block, and the substrate and the film are brought into close contact with each other by injecting gas into the concave portion of the upper clamp block and pressurizing, and then the upper surface of the heating block. It may be a step of placing the film and the substrate and heating the heating block so that the substrate and the film are more closely attached.
[0013]
Further, the film and the substrate are sequentially stacked on the upper surface of the lower clamp block, and the film and the substrate are clamped by the lower clamp block and an upper clamp block having a concave portion that does not interfere with the semiconductor chip and the wire on the lower surface. The film and the substrate are placed on the upper surface of the heating block after the substrate and the film are brought into close contact with each other by sucking and depressurizing the gas in the concave portion of the upper clamp block. It may be a resin sealing method of a semiconductor device including a step of further heating and bringing the substrate and the film into closer contact.
[0014]
According to the above-described invention, since the adhesive force of the film is increased by using the pressurization or decompression by gas and heating, the film and the substrate are bonded and integrated more firmly.
[0015]
Resin sealing method of another semiconductor device according to the present invention, in the resin sealing method of the aforementioned semiconductor device, in a manner that removes unnecessary resin portion from the substrate resin-sealed, further stripping the film from the substrate There may be.
According to the present invention, since the external leads are exposed by peeling the film, it can be electrically connected to the mother board.
[0016]
The full I Lum, at least in one end edge portion, or may be extended a release tongue piece having a shape protruding from the outer peripheral edge of the substrate.
According to the present invention, since the film can be peeled off through the peeling tongue piece, there is an advantage that it is convenient and automation is facilitated.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments according to the present invention will be described with reference to the accompanying drawings of FIGS.
The resin sealing method according to the first embodiment will be described based on the semiconductor resin sealing device shown in FIG.
[0018]
That is, as shown in FIG. 1, a magazine 2 containing a large number of lead frames 1 is supplied to an input magazine buffer unit 3. The lead frame 1 has completed the die-bonding process and the wire-bonding process, and the semiconductor chip and the external leads have already been connected with wires.
[0019]
First, the magazine 2 is transported to the magazine elevator unit 4. Then, the lead frames 1 are supplied one by one from the magazine 2 to the lower clamp block 5a of the film sticker unit 5 in which the film 6 is positioned, and the lead frames 1 are stacked on the film 6 and bonded and integrated.
The film 6 may be cut into the size of the lead frame 6 or may be used by simply placing a film cut in advance.
[0020]
For example, as shown in FIG. 2A, after the film 6 is supplied to the lower clamp block 5a, the lead frame 1 is stacked on the film 6 as a method for integrally attaching the film. Next, the upper clamp block 5b is positioned on the lower clamp block 5a and lowered to clamp the film 6 and the lead frame 1 with the upper and lower clamp blocks 5a and 5b. And gas is inject | poured in the recessed part 5c of the said upper clamp block 5b, the said film 6 and the said lead frame 1 are pressed against the lower clamp block 5a with atmospheric pressure, and both are stuck. Next, the gas is released by releasing the pressure applied to the upper clamp block 5b.
[0021]
Another method of attaching and integrating the film 6 is not limited to the above-described embodiment. For example, the film 6 and the lead frame 1 are mutually connected by sucking and decompressing the inside of the recess 5c of the upper clamp block 5b. May be sucked into close contact.
[0022]
Further, as another method of attaching and integrating the film 6, as shown in FIG. 3, after the film 6 is supplied to the heating block 30, the lead frame 1 is placed and positioned. Next, the heating block 30 may be heated to increase the adhesive force of the film 6 so that the film 6 and the lead frame 1 may be sucked and adhered to each other.
[0023]
The lead frame 7 to which the film 6 is adhered is conveyed to a lead frame transfer unit 8. The lead frame transfer unit 8 moves to the pick and place unit 9 and delivers the lead frame 7.
[0024]
The pick and place unit 9 conveys the delivered lead frame 7 to the preheater unit 10. The preheater unit 10 heats the lead frame 7 for a predetermined time.
[0025]
Then, the inloader unit 11 receives the heated lead frame 7 and the tablet (solid resin material) 13 conveyed by the tablet carrier 12 and conveys it to the lower mold 15 set in the press unit 14 to read the lead. The frame 7 and the tablet 13 are set at a predetermined position of the lower mold 15.
[0026]
The lower mold 15 is raised and pressed against an upper mold (not shown), the lead frame 7 is clamped to form a cavity, the tablet 13 is heated and melted by a transfer unit (not shown), and the cavity is injected and filled. The semiconductor chip 16, the wire 17 and the like are resin-sealed.
[0027]
After lowering the lower mold 15 to open the mold, the unloader unit 18 takes out the resin-sealed lead frame 19 from the lower mold 15 and transports it to the degaiter unit 20. The digger unit 20 separates the product 21 and the unnecessary portion 22 made of only resin from the resin-sealed lead frame 19 that has been conveyed, and discards the unnecessary portion 22.
[0028]
The pick-up unit 23 conveys the product 21 on the digger unit 20 to the film stripper unit 24. The film stripper unit 24 peels off the film 6 adhered to the lower surface of the lead frame portion of the product 21. Examples of the peeling operation of the film 6 include a method of gripping a tongue piece extending from one end of the film 6 with a film chuck handle (not shown) and peeling it from the lower surface of the product 21.
[0029]
Then, the pickup unit 23 conveys the product 21 from which the film 6 has been peeled off to the output buffer unit 25 and accumulates it.
[0030]
As shown in FIG. 4, the second embodiment according to the present invention is substantially the same as the first embodiment described above. The difference is that the heating block 30 is arranged in the next process of the film sticker unit 5. For this reason, the film 6 and the lead frame 1 that are brought into close contact with each other by being supplied or sucked into the recess 5c of the film sticker unit 5 are placed on the heating block 30 and heated, whereby the adhesive strength of the film 6 is increased. May be increased.
According to the second embodiment, there is an advantage that the film 6 and the lead frame 1 can be adhered more firmly.
[0031]
In the above-described embodiment, a method of bringing the film and the lead frame into close contact with each other in a pressurized state by supplying air, a method of bringing the film and the lead frame into close contact with each other by sucking air, and sequentially stacking and heating the film and the lead frame on a heating block. The method of adhering the film and the lead frame alone, and the method of adhering the film and the lead frame more firmly by heating after adhering with air supply and intake air and increasing the adhesive strength of the film were described. .
[0032]
Of the clamped upper and lower clamp blocks, the upper clamp block may be heated while supplying air to the upper clamp block, and both may be bonded and integrated in a pressurized state, or while being heated with the lower clamp block, The inside of the upper clamp block may be sucked and both may be bonded and integrated in a reduced pressure state. According to this method, there is an advantage that the film and the lead frame can be bonded and integrated in an efficient and space-saving manner.
[0033]
【The invention's effect】
According to the present invention, the film and the lead frame can be pressed against the lower clamp block at atmospheric pressure without damaging the semiconductor chip and the wire by pressing the gas into the recess of the upper clamp block. For this reason, the film and the lead frame are in close contact with each other and firmly bonded and integrated. As a result, the resin does not go around the lower surface of the lead frame, and there is an effect that a semiconductor device with good resin sealing can be obtained.
[Brief description of the drawings]
FIG. 1 is a plan view of a resin sealing apparatus according to a first embodiment used in a resin sealing method for a semiconductor device according to the present invention.
FIGS. 2A, 2B and 2C are explanatory views of a film sticking process of the first embodiment according to the present invention.
FIGS. 3A and 3B are explanatory diagrams of another film sticking process. FIGS.
FIG. 4 is a plan view of a resin sealing device according to a second embodiment used in the resin sealing method of a semiconductor device according to the present invention.
5A is a plan view of a QFN type semiconductor device for explaining a resin sealing method according to a conventional example, and FIG. 5B is a cross-sectional view taken along line BB of FIG. 5A.
6A, 6B and 6C are explanatory views showing a resin sealing process of the semiconductor device of the embodiment according to the conventional example.
7A is a plan view of a lead frame in which a region that can be clamped by upper and lower molds is hatched, and FIG. 7B is a partially enlarged view of FIG. 7A viewed from the B direction.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Lead frame, 2 ... Magazine, 3 ... Input magazine buffer unit, 4 ... Magazine elevator unit, 5 ... Film sticker unit, 5a ... Lower clamp block, 5b ... Upper clamp block, 5c ... Recessed part, 6 ... Film, 7 ... Lead frame in close contact with the film, 8 ... lead frame transfer unit, 9 ... pick and place unit, 10 ... preheater unit, 11 ... inloader unit, 12 ... tablet carrier, 13 ... tablet (solid resin material), 14 ... press Unit: 15 ... Lower mold, 18 ... Unloader unit, 19 ... Resin sealed lead frame, 20 ... Digger unit, 21 ... Product, 22 ... Resin unnecessary part, 23 ... Pickup unit, 24 ... Film stripper unit, 25 Output buffer unit, 30 ... heating block.

Claims (8)

A semiconductor in which the semiconductor chip and the wire are resin-sealed and the entire lower surface of the film is exposed after the film is detachably attached to the lower surface of the substrate in which the mounted semiconductor chip and the external lead are connected by a wire In the resin sealing method of the device,
The film and the substrate are sequentially stacked on the upper surface of the lower clamp block, and the film and the substrate are clamped by the lower clamp block and an upper clamp block having a recess that does not interfere with the semiconductor chip and the wire on the lower surface, A resin sealing method for a semiconductor device, wherein the substrate and the film are brought into close contact with each other by injecting gas into a recess of the upper clamp block and applying pressure. A semiconductor in which the semiconductor chip and the wire are resin-sealed and the entire lower surface of the film is exposed after the film is detachably attached to the lower surface of the substrate in which the mounted semiconductor chip and the external lead are connected by a wire In the resin sealing method of the device,
The film and the substrate are sequentially stacked on the upper surface of the lower clamp block, and the film and the substrate are clamped by the lower clamp block and an upper clamp block having a recess that does not interfere with the semiconductor chip and the wire on the lower surface, A resin sealing method for a semiconductor device, wherein the substrate and the film are brought into close contact with each other by sucking and depressurizing a gas in a recess of the upper clamp block. A semiconductor in which the semiconductor chip and the wire are resin-sealed and the entire lower surface of the film is exposed after the film is detachably attached to the lower surface of the substrate in which the mounted semiconductor chip and the external lead are connected by a wire In the resin sealing method of the device,
The film and the substrate are sequentially stacked on the upper surface of a heatable lower clamp block, and the film and the substrate are clamped by the lower clamp block and an upper clamp block having a concave portion that does not interfere with the semiconductor chip and the wire on the lower surface. A method of sealing a resin of a semiconductor device , wherein the substrate and the film are brought into close contact with each other by heating and heating and injecting gas into the concave portion of the upper clamp block . A semiconductor in which the semiconductor chip and the wire are resin-sealed and the entire lower surface of the film is exposed after the film is detachably attached to the lower surface of the substrate in which the mounted semiconductor chip and the external lead are connected by a wire In the resin sealing method of the device,
The film and the substrate are sequentially stacked on the upper surface of a heatable lower clamp block, and the film and the substrate are clamped by the lower clamp block and an upper clamp block having a concave portion that does not interfere with the semiconductor chip and the wire on the lower surface. A method for sealing a resin of a semiconductor device , wherein the substrate and the film are brought into close contact with each other by heating and heating, and sucking and reducing the gas in the recess of the upper clamp block . A semiconductor in which the semiconductor chip and the wire are resin-sealed and the entire lower surface of the film is exposed after the film is detachably attached to the lower surface of the substrate in which the mounted semiconductor chip and the external lead are connected by a wire In the resin sealing method of the device,
The film and the substrate are sequentially stacked on the upper surface of the lower clamp block, and the film and the substrate are clamped by the lower clamp block and an upper clamp block having a recess that does not interfere with the semiconductor chip and the wire on the lower surface, The substrate and the film are brought into close contact with each other by injecting gas into the concave portion of the upper clamp block and pressurizing, and then the film and the substrate are placed on the upper surface of the heating block, and the heating block is heated. A method for sealing a resin of a semiconductor device, wherein the substrate and the film are further brought into close contact with each other. A semiconductor in which the semiconductor chip and the wire are resin-sealed and the entire lower surface of the film is exposed after the film is detachably attached to the lower surface of the substrate in which the mounted semiconductor chip and the external lead are connected by a wire In the resin sealing method of the device,
The film and the substrate are sequentially stacked on the upper surface of the lower clamp block, and the film and the substrate are clamped by the lower clamp block and an upper clamp block having a recess that does not interfere with the semiconductor chip and the wire on the lower surface, The substrate and the film are brought into close contact with each other by sucking the gas in the recess of the upper clamp block and reducing the pressure, and then the film and the substrate are placed on the upper surface of the heating block, and the heating block is heated. A method for sealing a resin of a semiconductor device, wherein the substrate and the film are further brought into close contact with each other. In the resin sealing method of the semiconductor device of any one of Claim 1 thru | or 6,
A resin sealing method for a semiconductor device , wherein an unnecessary resin portion is removed from a resin-sealed substrate, and the film is peeled off from the substrate. Off I Lum is, at least in one end edge portion of the semiconductor device according to any one of claims 1 to 7, characterized in that extending the release tongue piece having a shape protruding from the outer peripheral edge of the substrate Resin sealing method.

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