TW202218033A - Chip-bonding device - Google Patents

Abstract

The present invention provides a chip-bonding device that includes a plurality of die-bonding arms spaced apart from each other. Each of the die-bonding arms includes an abutting frame having a light-permeable portion, a force control unit connected to the abutting frame, and a light curing member that corresponds in position to the light-permeable portion. The abutting frame is configured to movably abut against a chip that is disposed on a carrier through an adhesive. When the abutting frame is abutted against the chip, the force control unit can drive the abutting frame to abut against the chip by a predetermined force so as to connect the chip and the carrier through the adhesive, and the light curing member can emit a curing light toward the chip by passing through the light-permeable portion so as to solidify the adhesive.

Description

Die bonding device

The invention relates to a production equipment, in particular to a production equipment and a crystal bonding device which can effectively improve the production efficiency.

The existing production equipment includes a pre-bonding device and a die bonding device located downstream of the pre-bonding device, and the pre-bonding device of the existing production equipment is used to set the colloid and the wafer on a plurality of carriers one by one. The die-bonding device is used to solidify a plurality of the colloids by means of ambient temperature heating (eg, baking). However, there is obviously room for improvement in the operation mechanism or production efficiency of the existing production equipment.

Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to research and application of scientific principles, and finally proposes an invention with reasonable design and effective improvement of the above-mentioned defects.

The embodiments of the present invention provide a production equipment and a die-bonding device, which can effectively improve the defects that may occur in the existing production equipment.

An embodiment of the present invention discloses a die-bonding device, which includes a plurality of die-bonding arms arranged at intervals, and each of the die-bonding arms includes: a pressing support including a light-transmitting part, and the pressing The pressing bracket is used for movably pressing on a wafer; wherein, the wafer is arranged on a carrier through a colloid; a force control unit is connected to the pressing bracket; wherein, when the pressing bracket is pressed on the When the chip is used, the force control unit can drive the pressing support to press the chip with a predetermined force, so that the chip is connected to the carrier through the colloid; and a light curing device corresponding to The light-transmitting part is arranged on the light-transmitting part; wherein, when the pressing support is pressed against the wafer with the predetermined force, the light curing device is used to emit light that can pass through the light-transmitting part and project on the wafer. a curing light to cure the colloid.

The embodiment of the present invention also discloses a production equipment, which includes: a conveying device defining a predetermined path, and the conveying device can be used to move an insulating film provided with a plurality of carriers along the predetermined path; wherein, the The predetermined path includes a pre-bonding area and a die-bonding area located downstream of the pre-bonding area; a pre-bonding device is disposed corresponding to the pre-bonding area of the predetermined path, and includes: a dispensing mechanism, A colloid is formed on each of the carriers used to move through the pre-bonding area; and a crystal placement mechanism is adjacent to the dispensing mechanism, and the crystal placement mechanism is used to move through the pre-bonding area. A wafer is provided on each of the colloids in the bonding area; and a die-bonding device is provided corresponding to the die-bonding region of the predetermined path and includes a plurality of die-bonding arms arranged at intervals; The die-bonding arm includes: a pressing support including a light-transmitting part, and the pressing support is movably pressed against one of the wafers moving through the die-bonding area; a force control unit is connected to the the pressing support; wherein, when the pressing support presses the wafer, the force control unit can drive the pressing support to press the wafer with a predetermined force, so that the wafer passes through the The colloid is connected to the carrier; and a light curing device is disposed corresponding to the light-transmitting part; wherein, when the pressing support is pressed against the wafer, the light curing device is used to emit energy through the The light-transmitting part projects a curing light on the wafer to cure the colloid.

An embodiment of the present invention further discloses a die-bonding device, which includes: a plurality of die-bonding arms arranged at intervals, and each of the die-bonding arms includes: a pressing support including a light-transmitting part, and the The pressing bracket is used for movably pressing on a wafer; wherein, the chip is arranged on a carrier through a colloid; and a force control unit is connected to the pressing bracket; wherein, when the pressing bracket is When pressing the chip, the force control unit can drive the pressing support to press the chip with a predetermined force, so that the chip is connected to the carrier through the colloid; and a light curing device , corresponding to the light-transmitting parts of the plurality of die-bonding arms; wherein, when the pressing support of each die-bonding arm presses the wafer with the predetermined force, the light curing The device is used for emitting a curing light which can pass through each of the light-transmitting parts and project on the wafer, so as to cure the colloid.

To sum up, in the production equipment and the die-bonding device disclosed in the embodiments of the present invention, the corresponding wafer is pressed by any one of the pressing supports, and the colloid is cured by the light curing device, Accordingly, the solidification method of heating the ambient temperature is replaced, thereby effectively improving the operation and production efficiency of the production equipment (or the die-bonding device).

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than make any claims to the protection scope of the present invention. limit.

The following are specific specific examples to illustrate the embodiments of the "production equipment and crystal-bonding device" disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[Example 1]

Please refer to FIG. 1 to FIG. 8 , which are Embodiment 1 of the present invention. As shown in FIG. 1 and FIG. 2 , the present embodiment discloses a production equipment 100 , which can be used to bond a plurality of carriers 200 to a plurality of wafers 400 through a plurality of glues 300 respectively. In this embodiment, the carrier 200 is an antenna (eg, a radio frequency identification antenna), and the colloid 300 is a conductive colloid (eg, anisotropic conductive colloid), but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the carrier 200 may also be a board, and the gel 300 may be a non-conductive gel.

In this embodiment, the production equipment 100 includes a conveying device 1 , a pre-bonding device 2 located corresponding to the conveying device 1 , and a die bonding device 3 located downstream of the pre-bonding device 2 . The conveying device 1 , the pre-bonding device 2 , and the die-bonding device 3 are described in this embodiment by cooperating with each other, but in other embodiments not shown in the present invention, the The die-bonding device 3 (or the pre-bonding device 2 ) can also be used alone (eg, sold) or used in combination with other devices. For example, the pre-bonding device 2 of this embodiment can be matched with an existing die bonding apparatus; or, the die bonding apparatus 3 of this embodiment can be matched with an existing pre-bonding apparatus, but the invention is not limited herein.

The conveying device 1 is described with a plurality of rollers in this embodiment, but the present invention is not limited to this. Wherein, the conveying device 1 defines a predetermined path P, and the conveying device 1 can be used to move an insulating film 500 provided with a plurality of the carriers 200 along the predetermined path P; that is, the The insulating film 500 is driven to move along the predetermined path P by (the plurality of said rollers) of the conveying device 1 . Furthermore, the predetermined path P includes a pre-bonding area P1 and a die bonding area P2 located downstream of the pre-bonding area P1; The pre-bonding region P1 is moved to the die bonding region P2.

The pre-bonding device 2 is disposed corresponding to the pre-bonding region P1 of the predetermined path P; that is, the position of the pre-bonding device 2 can face the insulating film 500 located in the pre-bonding region P1 part for operation or processing. The pre-bonding device 2 includes a glue dispensing mechanism 21 and a crystal placement mechanism 22 adjacent to the glue dispensing mechanism 21 , and the crystal placement mechanism 22 is preferably located on the side of the glue dispensing mechanism 21 . downstream.

The glue dispensing mechanism 21 is used to form one glue 300 on each of the carriers 200 moving through the pre-bonding area P1 . Wherein, the glue dispensing mechanism 21 may form a plurality of the glue bodies 300 on a plurality of the carriers 200 at the same time; or, the glue dispensing mechanism 21 may also be formed on a plurality of the carriers 200 one by one The colloid 300 is not limited in the present invention.

The die placement mechanism 22 is used to set one of the wafers 400 on each of the colloids 300 that move through the pre-bonding region P1, and the die placement mechanism 22 in this embodiment can simultaneously A plurality of the wafers 400 are respectively disposed on the plurality of the colloids 300 for illustration, but the present invention is not limited to this. That is to say, in other embodiments not shown in the present invention, the wafer placement mechanism 22 may also place the wafers 400 on the plurality of the colloids 300 one by one.

As shown in FIG. 3 , the die placement mechanism 22 includes a plurality of extractors 221 for holding a plurality of wafers 400 respectively, a calibration unit 222 for adjusting the relative positions of the plurality of wafers 400 , and A camera 223 of the calibration unit 222 is electrically coupled. Wherein, the extractor 221 is described as a vacuum suction device in this embodiment, and a plurality of the extractors 221 may be arranged in a direction perpendicular to the predetermined path P, but the present invention is not limited to limited to this.

Furthermore, in this embodiment, the camera 223 is disposed corresponding to the pre-bonding area P1 for detecting the positions of the plurality of colloids 300 moving through the pre-bonding area P1. The calibration unit 222 can adjust the relative positions of the plurality of wafers 400 held by the plurality of capture devices 221 through the positions of the plurality of the colloids 300 obtained by the camera 223 . A plurality of the extractors 221 can be used for synchronizing the plurality of the wafers 400 adjusted by the calibration unit 222 on the plurality of the gels 300 moving through the pre-bonding area P1.

Accordingly, in this embodiment, the pre-bonding device 2 adjusts the relative positions of the plurality of wafers 400 through the calibration unit 222 , so that the plurality of wafers 400 adjusted by the calibration unit 222 can The plurality of extractors 221 are respectively disposed on the plurality of the gels 300 synchronously, thereby effectively improving the operation and production efficiency of the production equipment 100 (or the pre-bonding device 2 ).

It should be additionally explained that the die placement mechanism 22 is illustrated by a plurality of the capture devices 221 , the calibration unit 222 , and the camera 223 in cooperation with each other in this embodiment, but the present invention does not limited by this. For example, in other embodiments not shown in the present invention, the die placement mechanism 22 may also omit the calibration unit 222 and/or the camera 223 .

In more detail, the correction unit 222 may have various implementations under the condition that the above conditions are met. For the convenience of understanding the correction unit 222 of this embodiment, only the correction unit 222 will be described below. Three implementation aspects (as shown in FIG. 4 to FIG. 6 ) are described, but the specific structure of the calibration unit 222 can be adjusted and changed according to design requirements, and is not limited to the drawings of this embodiment.

As shown in the embodiment I of the calibration unit 222 shown in FIG. 4 , the calibration unit 222 has a plurality of abutting arms 2223 arranged in a ring shape, and the plurality of the abutting arms 2223 can be used to abut on the A ring side surface 401 of the wafer 400 held by the extractor 221, so that the wafer 400 is adjusted to a specific position (eg, the solid line position in FIG. 4). That is to say, the wafer 400 remains held by the extractor 221, and the plurality of the abutting arms 2223 can slightly push the wafer 400 held by the extractor 221, so as to change the The position of the wafer 400 held by the extractor 221 is adjusted so that the wafer 400 is adjusted to the specific position. Wherein, the specific position corresponds to the position of the colloid 300 to be set on the wafer 400 .

5 and FIG. 6 , the calibration unit 222 has an embodiment II and an embodiment III, the calibration unit 222 has a positioning plate 2221 for carrying any one of the wafers 400 and mounted on the A fine adjustment piece 2222 on the positioning plate 2221, and the fine adjustment piece 2222 (and the positioning plate 2221) can be used to adjust the positions of the gels 300 in the The position of the wafer 400 on the positioning pad 2221.

Further, as shown in the embodiment II of the calibration unit 222 shown in FIG. 5 , the fine adjustment element 2222 includes a plurality of abutting arms 2223 arranged in a ring shape, and the plurality of the abutting arms 2223 can It is used to abut the ring side 401 of the wafer 400 on the positioning plate 2221 at the same time, and the positioning plate 2221 and a plurality of the abutting arms 2223 can move synchronously, so that the wafer 400 can be adjusted to a specific position (eg: the solid line position in Figure 5). Wherein, the specific position corresponds to the position of the colloid 300 to be set on the wafer 400 .

In addition, as shown in Embodiment III of the calibration unit 222 shown in FIG. 6 , the fine adjustment member 2222 includes a plurality of abutting arms 2223 arranged in a ring shape, and the plurality of the abutting arms 2223 can be used for At the same time, the ring side surface 401 of the wafer 400 on the positioning plate 2221 is abutted, so that the wafer 400 is adjusted to a specific position (eg, the solid line position in FIG. 6 ). That is, a plurality of the abutting arms 2223 can move to adjust the position of the wafer 400 relative to the positioning plate 2221, so that the wafer 400 is adjusted to the specific position. Wherein, the specific position corresponds to the position of the colloid 300 to be set on the wafer 400 .

It should be noted that, as shown in FIG. 7 , the production equipment 100 may further include a carrier plate 4 and a turning device 5 corresponding to the die placement mechanism 22 . The carrier plate 4 is used for arranging a plurality of the wafers 400, and each wafer 400 has a welding surface 402 and a surface 403 on opposite sides of the annular side surface 401, and each wafer 400 has a welding surface 402 and a surface 403 respectively. The soldering surface 402 of the wafer 400 faces the side away from the carrier plate 4 ; that is, the surface 403 of each wafer 400 is disposed on the carrier plate 4 .

The inversion device 5 is used to peel a plurality of the wafers 400 from the carrier tray 4 , so that each of the extractors 221 can hold one of the wafers 400 (by the inversion device 5 ). Wherein, the inversion device 5 can be used to invert any one of the wafers 400 peeled from the carrier plate 4, so that the soldering surface 402 thereof is rotated by 180 degrees to face the carrier plate 4 (that is, to make all the wafers 400) The surface 403 of the wafer 400 faces one of the extractors 221).

It should be noted that the inversion device 5 can have various implementation forms under the condition that the above conditions are met. For the convenience of understanding the inversion device 5 of the present embodiment, the following only takes the comparison of the inversion device 5 as an example. The preferred embodiment is described, but the specific structure of the turning device 5 can be adjusted and changed according to design requirements, and is not limited to the drawings of this embodiment.

In this embodiment, the turning device 5 includes a rotating bracket 51 and two ends 52 (eg, suction nozzles) mounted on the rotating bracket 51 , and any of the ends 52 can be removed from the carrying plate. 4. Capture one of the wafers 400, and turn the wafer 400 over by the rotation of the rotating support 51, so that the captured wafer 400 is adjacent to one of the capturers 221. Wherein, when the wafer 400 captured by one of the end portions 52 of the two end portions 52 is adjacent to the extraction device 221 , the other of the end portions 52 The end 52 can be used to pick up one of the wafers 400 from the carrier tray 4 .

Furthermore, the distance between two adjacent extractors 221 corresponds to (eg, is approximately equal to) the distance between the rotating bracket 51 and the correction unit 222, so that when the two ends When the wafer 400 captured by one of the ends 52 of the portion 52 is adjacent to one of the capturers 221, the adjacent other capturer 221 (which has been removed from the inversion device 5 One of the wafers 400 is captured and its position corresponds to the calibration unit 222 .

Accordingly, the distance between the two adjacent extractors 221 of the production equipment 100 corresponds to (eg, is approximately equal to) the distance between the rotation bracket 51 and the correction unit 222 , so that the The two adjacent extractors 221 can be synchronized with the inversion device 5 and the calibration unit 222 , thereby effectively improving the operation efficiency of the production equipment 100 .

As shown in FIG. 1 and FIG. 8 , the die-bonding device 3 is disposed corresponding to the die-bonding region P2 of the predetermined path P, and the die-bonding device 3 can be used to press against and move through the die-bonding region A plurality of the wafers 400 of P2, so that any one of the wafers 400 can be connected to the carrier 200 through the glue 300, and the glue 300 can be cured. In this embodiment, the die-bonding device 3 includes a plurality of die-bonding arms 30a arranged at intervals, and the plurality of the die-bonding arms 30a are preferably arranged in multiple rows of die-bonding arm groups, and the The die-bonding arm group includes at least two of the die-bonding arms 30 a and is arranged along a direction perpendicular to the predetermined path P. As shown in FIG.

It should be noted that, since the structures and operations of the plurality of die-bonding arms 30a in this embodiment are substantially the same, for the convenience of description, the structure and operation of a single die-bonding arm 30a will be described below. Not limited to this. For example, in other embodiments not shown in the present invention, the structures of the plurality of die bonding arms 30a may also be slightly different.

The die-bonding arm 30a includes a pressing support 31 , a force control unit 32 (eg, a hydraulic cylinder or a pneumatic cylinder) connected to the pressing support 31 , and a light curing device 33 (eg, a light emitter) . The pressing support 31 includes a light-transmitting portion 311 and an arm portion 312 connected to the light-transmitting portion 311 , and the light-transmitting portion 311 is transparent in this embodiment. 33 is disposed corresponding to the light-transmitting portion 311 , and the force control unit 32 is mounted on the arm portion 312 . The position of the light curing device 33 in this embodiment is suitable for the curing light emitted by the light curing device 33 to pass through the transparent portion 311 .

More specifically, the pressing support 31 is movably pressed against one of the wafers 400 moving through the die bonding region P2 , and the transparent portion 311 is used for pressing against the wafer 400 . It should be noted that although the pressing bracket 31 is described in this embodiment by pressing the light-transmitting portion 311 against the wafer 400 , in other embodiments not shown in the present invention, the pressing bracket 31 may also be pressed against the wafer 400 by a portion surrounding the light-transmitting portion 311 .

Wherein, when any one of the die bonding arms 30 a presses the corresponding wafer 400 , the pressing support 31 (the light-transmitting portion 311 ) directly presses the corresponding part of the wafer 400 . The surface 403 (eg, the pressing support 31 contacts the central part of the surface 403 of the wafer 400 , but does not contact the peripheral part of the surface 403 of the wafer 400 , so as to prevent the colloid 300 from spreading to the the pressing support 31). Accordingly, there is no need to provide any isolation film between the pressing support 31 (the transparent portion 311 of the light-transmitting portion 311 ) and the corresponding wafer 400 .

Furthermore, when the pressing support 31 presses the wafer 400, the force control unit 32 can drive the pressing support 31 to press the wafer 400 with a predetermined force, so that the wafer 400 can pass through The gel 300 is connected to the carrier 200 , and the light curing device 33 emits a curing light that can pass through the transparent portion 311 and project on the wafer 400 to cure the gel 300 . Further, in this embodiment, the force control unit 32 of the die bonding arm 30a can drive the pressing support 31 to press the wafer 400 with the predetermined force, so as to press the conductive gel The chip 400 and the antenna are electrically coupled.

Accordingly, in this embodiment, the die bonding device 3 is pressed against the corresponding wafer 400 by any one of the pressing brackets 31 , and the colloid 300 is cured by the light curing device 33 . Instead of the curing method of heating the ambient temperature, the operation and production efficiency of the production equipment 100 (or the solid crystal device 3 ) can be effectively improved.

[Example 2]

Please refer to FIG. 9 , which is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, so the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:

In each of the die-bonding arms 30a in this embodiment, the light-transmitting portion 311 of the pressing support 31 is hollow (that is, the light-transmitting portion 311 is a through hole), and the pressing The pressing bracket 31 is pressed against the wafer 400 by a portion surrounding the transparent portion 311 .

[Example 3]

Please refer to FIG. 10 , which is Embodiment 3 of the present invention. This embodiment is similar to the above-mentioned first and second embodiments, so the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first and second embodiments are roughly described as follows:

In this embodiment, each of the die-bonding arms 30a does not include any photo-curing device 33, and the die-bonding device 3 includes a single photo-curing device 30b, which corresponds to a plurality of the die-bonding arms 30a. The light-transmitting portion 311 is provided. Accordingly, when the pressing support 31 (eg, the light-transmitting portion 311 ) of each die bonding arm 30 a is pressed against the wafer 400 with the predetermined force, the light curing device 30 b is used to emit energy A curing light is projected onto the wafer 400 through each of the light-transmitting portions 311 to cure the gel 300 .

[Example 4]

Please refer to FIG. 11 , which is the fourth embodiment of the present invention. This embodiment is similar to the above-mentioned first and second embodiments, so the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first and second embodiments are roughly described as follows:

In this embodiment, the die bonding device 3 further includes an isolation film 30c, and the isolation film 30c is movably disposed between the plurality of the die bonding arms 30a and the corresponding plurality of the wafers 400 . . Wherein, when any one of the die-bonding arms 30a is pressed against the corresponding wafer 400, the isolation film 30c is clamped by the pressing support 31 (the light-transmitting portion 311) and the corresponding between the wafers 400 , and the pressing support 31 (the light-transmitting portion 311 ) is pressed against the entire surface of the corresponding wafer 400 through the isolation film 30 c .

Accordingly, in this embodiment, the die-bonding device 3 is provided with the isolation film 30c that does not affect the photo-curing effect, so as to effectively prevent the light-transmitting portion 311 of the pressing support 31 from being affected by the colloid 300 of adhesion (or contamination).

[Example 5]

Please refer to FIG. 12 , which is Embodiment 5 of the present invention. This embodiment is similar to the foregoing Embodiments 1 to 4, so the similarities of the foregoing multiple embodiments will not be repeated, and the differences between this embodiment and the foregoing Embodiments 1 to 4 are roughly described as follows:

In this embodiment, the calibration unit 222 is a position-adjustable bracket. Wherein, a plurality of the extractors 221 are installed in the calibration unit 222, and the calibration unit 222 can adjust the relative positions of the plurality of the extractors 221, and the plurality of the extractors 221 and the The correction unit 222 can move synchronously. Further, the calibration unit 222 can adjust the relative positions of the plurality of pickers 221 holding the plurality of wafers 400 through the positions of the plurality of the colloids 300 obtained by the camera 223 . Location. That is to say, in this embodiment, the calibration unit 222 controls (or adjusts) the relative positions of the plurality of wafers 400 by adjusting the relative positions of the plurality of extractors 221 .

[Technical effects of the embodiments of the present invention]

To sum up, in the production equipment and the die-bonding device disclosed in the embodiments of the present invention, the corresponding wafer is pressed by any one of the pressing supports, and the colloid is cured by the light curing device, Accordingly, the solidification method of heating the ambient temperature is replaced, thereby effectively improving the operation and production efficiency of the production equipment (or the die-bonding device).

Furthermore, in the production equipment and the pre-bonding device disclosed in the embodiments of the present invention, the relative positions of the plurality of wafers are adjusted by the calibration unit, so that the plurality of wafers adjusted by the calibration unit can be The plurality of extractors are respectively disposed on the plurality of the colloids synchronously, thereby effectively improving the operation and production efficiency of the production equipment (or the pre-bonding device).

Further, the pressing support can be directly pressed against the part of the surface corresponding to the wafer, so as to prevent the colloid from spreading to the pressing support, so that the pressing support and the corresponding There is no need for any isolation film between the wafers.

In addition, the production equipment corresponds to (for example: approximately equal to) the distance between the rotating support and the correction unit through the distance between the two adjacent extractors, so that the two adjacent The extractor can be synchronized with the turning device and the calibration unit, thereby effectively improving the operation efficiency of the production equipment.

The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

100: Production equipment 1: Conveying device 2: Pre-engagement device 21: Dispensing mechanism 22: Crystal placement mechanism 221: Fetcher 222: Correction unit 2221: Positioning disc 2222: Trimming pieces 2223: push arm 223: Camera 3: Solid crystal device 30a: Die bonding arm 31: Press the bracket 311: Translucent part 312: Arm 32: Force Control Unit 33: Light Curing Device 30b: Light Curing Unit 30c: Isolation film 4: Carrier plate 5: Flip device 51: Swivel bracket 52: End P: Predetermined path P1: Pre-bonded area P2: solid crystal region 200: Carrier 300: colloid 400: Wafer 401: Ring Side 402: Welding surface 403: Surface 500: insulating film

FIG. 1 is a schematic diagram of the production equipment according to the first embodiment of the present invention.

FIG. 2 is a schematic diagram of a pre-bonding area of the production equipment according to the first embodiment of the present invention.

3 is a schematic diagram of a crystal placement mechanism of the production equipment according to Embodiment 1 of the present invention.

FIG. 4 is a schematic diagram of Embodiment 1 of the calibration unit of the production equipment according to Embodiment 1 of the present invention.

FIG. 5 is a schematic diagram of implementation II of the calibration unit of the production equipment according to the first embodiment of the present invention.

FIG. 6 is a schematic diagram of Embodiment III of the calibration unit of the production equipment according to the first embodiment of the present invention.

7 is a schematic diagram of a die placement mechanism, a carrier tray, and a turning device of the production equipment according to Embodiment 1 of the present invention.

FIG. 8 is a schematic diagram of a die bonding arm of the production equipment according to the first embodiment of the present invention.

FIG. 9 is a schematic diagram of a die bonding arm of the production equipment according to the second embodiment of the present invention.

FIG. 10 is a schematic diagram of a die-bonding device of the production equipment according to the third embodiment of the present invention.

FIG. 11 is a schematic diagram of a die bonding arm of the production equipment according to the fourth embodiment of the present invention.

12 is a schematic diagram of a crystal placement mechanism of the production equipment according to the fifth embodiment of the present invention.

30a: Die bonding arm

31: Press the bracket

311: Translucent part

312: Arm

32: Force Control Unit

33: Light Curing Device

P2: solid crystal region

200: Carrier

300: colloid

400: Wafer

401: Ring Side

402: Welding surface

403: Surface

500: insulating film

Claims (8)

A crystal-bonding device, comprising: A plurality of die-bonding arms are arranged at intervals, and each of the die-bonding arms comprises: a pressing support including a light-transmitting part, and the pressing support is used for movably pressing a chip; wherein, the chip is arranged on a carrier through a colloid; a force control unit connected to the pressing support; wherein, when the pressing support presses the wafer, the force control unit can drive the pressing support to press the wafer with a predetermined force, to connect the chip to the carrier through the gel; and A light curing device is disposed corresponding to the light-transmitting part; wherein, when the pressing support presses the wafer with the predetermined force, the light-curing device is used for emitting energy passing through the light-transmitting part to A curing light is projected on the wafer to cure the colloid. The die-bonding device according to claim 1, wherein in each of the die-bonding arms, the light-transmitting portion of the pressing support is transparent and used to press the wafer; wherein, the The die-bonding device further includes an isolation film, and the isolation film is movably arranged between a plurality of the die-bonding arms and a plurality of the corresponding wafers; wherein, when any one of the die-bonding arms is pressed against the When corresponding to the wafer, the isolation film is clamped between the light-transmitting part of the pressing support and the corresponding wafer, and the light-transmitting part of the pressing support passes through the The isolation film is pressed against the entire surface of the corresponding wafer. The die-bonding device according to claim 1, wherein, in each of the die-bonding arms, the light-transmitting portion of the pressing support is transparent and used to press the wafer; When the die-bonding arm presses the corresponding wafer, the light-transmitting portion of the pressing support directly presses the partial surface of the corresponding wafer. The die-bonding device according to claim 1, wherein, in each of the die-bonding arms, the light-transmitting portion of the pressing support is transparent and used to press the wafer. The die bonding device according to claim 1, wherein in each of the die bonding arms, the light-transmitting portion of the pressing bracket is hollow, and the pressing bracket is surrounded by the A portion of the light-transmitting portion is pressed against the wafer. The die-bonding device according to claim 1, wherein a plurality of the die-bonding arms are arranged in a plurality of columns of die-bonding arm groups, and each column of the die-bonding arm set includes at least two of the die-bonding arms along the lines of the die-bonding arms. are arranged in a direction perpendicular to the predetermined path. The die bonding device of claim 1, wherein any one of the carriers is further defined as an antenna, and any one of the colloids is further defined as a conductive colloid, and the force of each of the die bonding arms is controlled The unit can drive the pressing support to press the chip with the predetermined force, so that the conductive glue is pressed to electrically couple the chip and the antenna. A crystal-bonding device, comprising: A plurality of die-bonding arms are arranged at intervals, and each of the die-bonding arms comprises: a pressing support including a light-transmitting part, and the pressing support is used for movably pressing a chip; wherein, the chip is disposed on a carrier through a colloid; and a force control unit connected to the pressing support; wherein, when the pressing support presses the wafer, the force control unit can drive the pressing support to press the wafer with a predetermined force, to connect the wafer to the carrier through the gel; and A light curing device is disposed corresponding to the light-transmitting parts of the plurality of die-bonding arms; wherein, when the pressing support of each die-bonding arm presses the wafer with the predetermined force, The light curing device is used for emitting a curing light which can pass through each of the light-transmitting parts and project on the wafer, so as to cure the colloid.

Images