CN108419418B - A kind of production method of heat conductive pad - Google Patents
A kind of production method of heat conductive pad Download PDFInfo
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- CN108419418B CN108419418B CN201810273710.XA CN201810273710A CN108419418B CN 108419418 B CN108419418 B CN 108419418B CN 201810273710 A CN201810273710 A CN 201810273710A CN 108419418 B CN108419418 B CN 108419418B
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- conductive pad
- protective film
- heat conductive
- thermally conductive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention belongs to technical field of heat dissipation, disclose a kind of production method of heat conductive pad.The production method of the heat conductive pad specifically includes: preparing thermally conductive pad body；Prepare protective film；In on the protective film that preparation is completed, the protective film is adsorbed in the surface of the thermally conductive pad body for the thermally conductive pad body punching press that preparation is completed, and forms heat conductive pad finished product.It is set to by the thermally conductive pad body for completing preparation on the protective film that preparation is completed; compared with the three-decker of heat conductive pad in the prior art, heat conductive pad of the invention is reduced to double-layer structure, reduces process; and then the assembling product time is shortened, improve production efficiency.Simultaneously; it is adsorbed in the surface of thermally conductive pad body by the way that protective film is arranged, avoid thermally conductive pad body and the case where protective film is damaged due to adhesion, improves the product with stable quality of heat conductive pad; and then ensure that the product quality of heat conductive pad, to achieve the purpose that reduce fraction defective.
Description
Technical field
The present invention relates to technical field of heat dissipation more particularly to a kind of production methods of heat conductive pad.
Background technique
In the electronic device, in order to save the cost of radiator, general adjacent closer multiple chips will use same
Radiator, to radiate simultaneously to multiple chips.Since the height of the chip in circuit board is different, need chip and radiator it
Between plus heat conductive pad so that the heat in the different chip of height can be transferred to radiator.
Existing heat conductive pad is three-decker, as shown in Figure 1 comprising underlying membrane, upper layer film and be set to underlying membrane and
Thermally conductive pad body 1 between upper layer film.Wherein underlying membrane is high viscous protective film 2, and upper layer film is grid release film 3, thermally conductive advance capital for
1 one side of body is adhesive faces, is on one side non-adhesive side.In the process of production and processing, the adhesive faces of thermally conductive pad body 1 are directly adhered to
Grid release film 3, non-adhesive side need to be bonded fixation with the viscous protective film 2 of height.
It falls off since the low protective film 4 of viscosity will lead to heat conductive pad and be easy to happen, is 500-800g/in usually using viscosity
The height of (gram/inch) glues protective film 2 and comes fixed-type by Punching Technology, and by jig, positioning is bonded grid release film 3 by hand
Machine-shaping.Heat conductive pad finished product is under normal circumstances without abnormal, but heat conductive pad finished product is after long-time transport, placing, high
Viscous protective film 2 can generate focal adhesion with thermally conductive pad body 1, and thermally conductive pad body 1 is caused to damage, and appearance is abnormal bad, bad
Rate is 30% or more.In addition, machining accuracy is low, bad order, causes not to be able to satisfy client couple due to needing multiple process productions
In the requirement of tolerance.
Summary of the invention
The purpose of the present invention is to provide a kind of production methods of heat conductive pad, avoid thermally conductive pad body and protective film due to viscous
The case where being even damaged, and then improve the quality of finished product.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of production method of heat conductive pad, specifically includes the following steps:
Prepare thermally conductive pad body；
Prepare protective film；
In on the protective film that preparation is completed, the protective film is adsorbed in described lead for the thermally conductive pad body punching press that preparation is completed
The surface of heat pad ontology forms heat conductive pad finished product.
Preferably, the step prepare thermally conductive pad body specifically includes the following steps:
Shearing；Heat conductive pad sheet material is cut into several small pieces；
Blanking；Small pieces are punched into several thermally conductive pad bodies.
Preferably, the protective film cuts acquisition by protective film former material, the protective film former material includes processing release paper and sets
Protection film sheet and the processing release paper being placed on the processing release paper, the processing release paper are mutually adsorbed with the protection film sheet.
Preferably, it is described prepare protective film specifically includes the following steps:
Blanking；It is divided into several to protect membrane body protection film sheet；
Make location hole；It is die cut location hole on processing release paper, forms protective film.
Preferably, it is described by preparation complete thermally conductive pad body punching press in preparation complete protective film on, the protection
Film is adsorbed in the surface of the thermally conductive pad body, form heat conductive pad finished product specifically includes the following steps:
Positioning；Protective film is positioned on pneumatic punching machine by location hole；
Feeding；Thermally conductive pad body is placed on the discharge port of pneumatic punching machine；
Pressing；Thermally conductive pad body is pressed on protective film and is ejected；
Demoulding；Processing release paper is removed from protection membrane body, forms heat conductive pad finished product.
Preferably, pneumatic punching machine includes driving mechanism, upper table and the lower table matched with upper table, institute
Stating driving mechanism can drive the upper table to move up and down along the vertical direction relative to the lower table, the upper work
Platform is correspondingly arranged on positioning pin, and the positioning pin can extend into the positioning hole.
Preferably, further comprising the steps of after forming heat conductive pad finished product:
It examines；By the online product inspection of heat conductive pad finished product, qualified product is formed；
Packaging；Qualified product is packed.
Preferably, above-mentioned packaging specifically includes the following steps:
Enter disk；Qualified product is placed in plastic uptake plate；
Vanning；Plastic uptake plate is placed in packing case.
Preferably, annular knurl is provided in the adhesive faces of the thermally conductive pad body, the thermally conductive pad body and the protection
The contact surface of membrane body is horizontal plane.
Preferably, the protection membrane body is the protective film of dual anti-high absorption.
Beneficial effects of the present invention:
1) it is set to by the thermally conductive pad body for completing preparation on the protective film that preparation is completed, and it is thermally conductive in the prior art
The three-decker of pad is compared, and heat conductive pad of the invention is reduced to double-layer structure, when reducing process, and then shortening production and processing
Between, improve production efficiency.
2) surface for being adsorbed in thermally conductive pad body by the way that protective film is arranged avoids thermally conductive pad body and protective film due to viscous
The case where being even damaged, improves the stability of the product of heat conductive pad, and then ensure that the product quality of heat conductive pad, to reach
To the purpose for reducing fraction defective.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the heat conductive pad provided in background technique；
Fig. 2 is the structural schematic diagram of heat conductive pad of the present invention.
Fig. 3 is the flow chart of the production method of the heat conductive pad of the offer of the embodiment of the present invention one；
Fig. 4 is the schematic diagram of heat conductive pad sheet material in the production method of the heat conductive pad of the offer of the embodiment of the present invention two；
Fig. 5 is that heat conductive pad sheet material cuts into showing for small pieces in the production method of the heat conductive pad of the offer of the embodiment of the present invention two
It is intended to；
Fig. 6 is the schematic diagram of protective film in the production method of the heat conductive pad of the offer of the embodiment of the present invention two；
Fig. 7 is that thermally conductive pad body is placed in " Air-Uplift " in the production method of the heat conductive pad of the offer of the embodiment of the present invention two
The schematic diagram of the discharge port of bed；
Fig. 8 is that thermally conductive pad body is pressed on protective film in the production method of the heat conductive pad of the offer of the embodiment of the present invention two
Schematic diagram；
Fig. 9 is that qualified product is placed in plastic uptake plate in the production method of the heat conductive pad of the offer of the embodiment of the present invention two
Schematic diagram；
Figure 10 is the flow chart of the production method of the heat conductive pad of the offer of the embodiment of the present invention two.
In figure:
1, thermally conductive pad body；2, high viscous protective film；3, grid release film；4, protective film；5, location hole；
41, membrane body is protected；42, processing release paper；
6, heat conductive pad sheet material；7, small pieces；8, positioning pin；9, plastic uptake plate.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
Embodiment one
The heat conductive pad production method provided through this embodiment, prepares heat conductive pad finished product.As shown in Fig. 2, the heat conductive pad at
Product include the thermally conductive pad body 1 protecting membrane body 41 and being arranged at intervals on protection membrane body 41, and thermally conductive pad body 1 is adsorbed in
On thermally conductive pad body 1.It is on one side non-adhesive side since thermally conductive pad body is adhesive faces on one side, the sticky face paste of thermally conductive pad body
Together on chip, the non-adhesive side of thermally conductive pad body is adsorbed with thermally conductive 1 phase of pad body.Wherein, protection membrane body 41 is specially double
Anti- high absorption protection membrane body.
The production method of heat conductive pad provided in this embodiment specifically includes: first preparing thermally conductive pad body 1 and preparation protection
Then the thermally conductive pad body 1 that preparation is completed is set on the protective film 4 that preparation is completed by film 4, protective film 4 is adsorbed in heat conductive pad
The surface of ontology 1 forms heat conductive pad finished product.
It is set to by the thermally conductive pad body 1 for completing preparation on the protective film 4 that preparation is completed, and it is thermally conductive in the prior art
The three-decker of pad is compared, and heat conductive pad of the invention is reduced to double-layer structure, when reducing process, and then shortening production and processing
Between, improve production efficiency.Meanwhile the surface of thermally conductive pad body 1 is adsorbed in by setting protective film 4, avoid thermally conductive advance capital for
The case where body 1 and protective film 4 are damaged due to adhesion, improves the product stability of heat conductive pad, and then ensure that thermally conductive
The product quality of pad, to achieve the purpose that reduce fraction defective.
Wherein it is possible to first preferentially prepare thermally conductive pad body 1, protective film 4 is then prepared；Or it first can preferentially prepare protection
Then film 4 prepares thermally conductive pad body 1；Or it prepares thermally conductive pad body 1 and prepares the process of protective film 4 and can carry out simultaneously.Cause
This, the present embodiment is to preparing thermally conductive pad body 1 and prepare the sequence of protective film 4 and be not construed as limiting.
Fig. 3 is the flow chart of the production method for the heat conductive pad that the embodiment of the present invention one provides.
Preferably, as shown in figure 3, this method specific step is as follows:
Prepare thermally conductive pad body 1；
Prepare protective film 4；
The thermally conductive pad body 1 that preparation is completed is set on the protective film 4 that preparation is completed, the protective film 4 is adsorbed in institute
The surface of thermally conductive pad body 1 is stated, heat conductive pad finished product is formed.
Embodiment two
Since the height of the chip in circuit board is different, need to add heat conductive pad between chip and radiator, it is therefore, thermally conductive
The height specification that pad body 1 needs to have different, so that the heat in highly different chips can be transferred to radiator.When leading
1 height of heat pad ontology is 3.0mm, and the specification of thermally conductive 1 length and width of pad body is 200mm*19mm；When thermally conductive 1 height of pad body is
3.5mm, the specification of thermally conductive 1 length and width of pad body are 200mm*32mm；When thermally conductive 1 height of pad body is 4.0mm, thermally conductive pad body 1
The specification of length and width is 200mm*13mm, and the specification of thermally conductive pad body 1 can be adjusted according to actual production.
In addition, protective film 4 cuts acquisition by protective film former material, wherein protective film former material includes processing release paper 42 and is set to de-
Protection film sheet on mould paper 42, and processing release paper 42 is mutually adsorbed with the protection film sheet.
The production method of heat conductive pad provided in this embodiment the following steps are included:
Prepare thermally conductive pad body 1；
Prepare protective film 4；
The thermally conductive pad body 1 that preparation is completed is set on the protective film 4 that preparation is completed, the protective film 4 is adsorbed in institute
The surface of thermally conductive pad body 1 is stated, heat conductive pad finished product is formed.
Wherein, prepare thermally conductive pad body 1 specifically includes the following steps:
S10, shearing erect Novel slicer using mould as illustrated in figures 4-5, the heat-conducting pad for being 200mm*400mm by specification
Material 6 cuts into several small pieces 7；
Small pieces 7 are punched into several thermally conductive pad bodies 1 using accurate punching machine by S11, blanking.
Wherein, prepare protective film 4 specifically includes the following steps:
S20, blanking, as shown in fig. 6, being divided into several to protect membrane body 41 protection film sheet；
S21, production location hole 5 are die cut location hole 5 using precision mould cutting machine on release paper 42, form said protection film
4。
Release paper 42 can be not only used for placing protection membrane body 41, while also act the effect of positioning.In addition, for
Every protective film 4 generally comprises 5-10 protection membrane body 41, and particular number can be adjusted according to needs of production.
It should be strongly noted that thermally conductive pad body 1 first can be prepared preferentially, protective film 4 is then prepared；Or it can be first
Protective film 4 preferentially is prepared, then prepares thermally conductive pad body 1；Or prepare thermally conductive pad body 1 and prepare the process of protective film 4 can
To carry out simultaneously.Therefore, the present embodiment is to preparing thermally conductive pad body 1 and prepare the sequence of protective film 4 and be not construed as limiting.
Wherein, the thermally conductive pad body 1 that preparation is completed is set on the protective film 4 that preparation is completed, protective film 4 is adsorbed in institute
State the surface of thermally conductive pad body 1, form heat conductive pad finished product specifically includes the following steps:
S30, positioning position protective film 4 by location hole 5 on pneumatic punching machine；
S31, feeding, as shown in fig. 7, thermally conductive pad body 1 is placed on the discharge port of pneumatic punching machine；
S32, pressing, as shown in figure 8, thermally conductive pad body 1 to be pressed on protection membrane body 41 and eject；
Processing release paper 42 is removed from protection membrane body 41, forms heat conductive pad finished product by S33, demoulding.
Wherein, protection membrane body 41 is specially dual anti-high absorption protection membrane body.
Above-mentioned pneumatic punching machine includes driving mechanism, upper table and the lower table matched with upper table, driving machine
Structure can drive the upper table to move up and down along the vertical direction relative to the lower table.It is arranged on lower table simultaneously
There is the locating slot for placing protective film 4, upper table is correspondingly arranged on positioning pin 8, and it is described fixed that the positioning pin 8 can extend into
In the hole 5 of position, and then realize positioning of the protective film 4 on pneumatic punching machine.
When driving mechanism drives the upper table to move down relative to the lower table, to reach thermally conductive advance capital for
Body 1 is pressed on the purpose on protective film 4.When upper table continuation is moved down relative to the lower table, by heat conductive pad
Ontology 1 and protection membrane body 41 eject, and then operator removes processing release paper 42 from protection membrane body 41, ultimately form
Heat conductive pad finished product.
It is further comprising the steps of after forming heat conductive pad finished product:
Step S4, it examines, by the online product inspection of heat conductive pad finished product, forms qualified product；
Step S5, it packs, qualified product is packed.
Wherein packaging specifically includes the following steps:
S50, enter disk, as shown in figure 9, qualified product is placed in plastic uptake plate 9；
Plastic uptake plate 9 is placed in packing case by S51, vanning.
Since thermally conductive pad body is adhesive faces on one side, it is on one side non-adhesive side, is arranged in the adhesive faces of thermally conductive pad body
There is annular knurl, convenient for fitting in the adhesive faces of thermally conductive pad body on chip.Meanwhile by the way that thermally conductive pad body and protective film sheet is arranged
The contact surface of body 41 is horizontal plane, and protection membrane body 41 is preferably adsorbed in the non-adhesive side of thermally conductive pad body 1.
Wherein protection membrane body 41 is the protective film of two-sided antistatic high absorption, and the sheet resistance of the protection membrane body 41 is 107Ω-108
Ω is adsorbed in protection membrane body 41 directly on thermally conductive pad body 1, avoids thermally conductive with a thickness of 0.09mm-0.1mm
The case where pad body 1 and protection membrane body 41 are damaged due to adhesion, ensure that the product quality of heat conductive pad, by heat conductive pad
Fraction defective be reduced to 30% or less.
Wherein protection membrane body 41 is the protective film of two-sided antistatic high absorption, when qualified product is placed in the plastic sucking disc period of the day from 11 p.m. to 1 a.m,
Protection membrane body 41 can be positioned in plastic sucking disc, and realize protection membrane body 41 by four positioning protrusion on plastic uptake plate
Fixation, and then realize heat conductive pad and be directly fixed in plastic uptake plate, eliminate in order to the fixed clamping of heat conductive pad, fixation
Device, it is easy to operate, easy to use.
Since the adhesive faces of thermally conductive pad body 1 are directly exposed in air, it is adsorbed in the protection membrane body 41 of qualified product
After on plastic uptake plate, directly qualified product is placed in matched packing case, avoid the adhesive faces of thermally conductive pad body 1 by
There is a situation where adhesion failures after the pollution such as dust, steam.
Specifically preferably, with reference to Figure 10, the flow chart of household appliance control method provided in this embodiment includes:
Heat conductive pad sheet material 6 is cut into several small pieces 7 by S10, shearing；
Small pieces 7 are punched into several thermally conductive pad bodies 1 by S11, blanking.
Protection film sheet is divided into several to protect membrane body 41 by S20, blanking；
S21, production location hole 5, location hole 5 is die cut on release paper 42, forms protective film 4.
S30, positioning position protective film 4 by location hole 5 on pneumatic punching machine；
Thermally conductive pad body 1 is placed on the discharge port of pneumatic punching machine by S31, feeding；
Thermally conductive pad body 1 is pressed on protection membrane body 41 and is ejected by S32, pressing；
Processing release paper 42 is removed from protection membrane body 41, forms heat conductive pad finished product by S33, demoulding；
The online product inspection of heat conductive pad finished product is formed qualified product by S4, inspection；
S50, enter disk, qualified product is placed in plastic uptake plate 9；
Plastic uptake plate 9 is placed in packing case by S51, vanning.
It is set to by the thermally conductive pad body 1 for completing preparation on the protective film 4 that preparation is completed, and it is thermally conductive in the prior art
The three-decker of pad is compared, and heat conductive pad of the invention is reduced to double-layer structure, when reducing process, and then shortening production and processing
Between, improve production efficiency.Meanwhile the surface of thermally conductive pad body 1 is adsorbed in by setting protection membrane body 41, it avoids thermally conductive
The case where pad body 1 and protection membrane body 41 are damaged due to adhesion, improves the stability of the product of heat conductive pad, in turn
It ensure that the product quality of heat conductive pad, to achieve the purpose that reduce fraction defective.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating examples made by the present invention, and being not is pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
Made any modifications, equivalent replacements, and improvements etc., should be included in the claims in the present invention within the spirit and principle of invention
Protection scope within.
Claims (10)
1. a kind of production method of heat conductive pad, which comprises the following steps:
Prepare thermally conductive pad body (1)；
It prepares protective film (4), the protective film (4) is two-sided antistatic high absorption protective film；
In on the protective film (4) that preparation is completed, the protective film (4) is adsorbed in for thermally conductive pad body (1) punching press that preparation is completed
The surface of the thermally conductive pad body (1) forms heat conductive pad finished product.
2. the production method of heat conductive pad according to claim 1, which is characterized in that described to prepare thermally conductive pad body (1) tool
Body the following steps are included:
Shearing: heat conductive pad sheet material (6) is cut into several small pieces (7)；
Blanking: small pieces (7) are punched into several thermally conductive pad bodies (1).
3. the production method of heat conductive pad according to claim 2, which is characterized in that the protective film (4) is by protective film original
Material cuts acquisition, and the protective film former material includes processing release paper (42) and the protection film sheet that is set on the processing release paper (42),
The processing release paper (42) is mutually adsorbed with the protection film sheet.
4. the production method of heat conductive pad according to claim 3, which is characterized in that the protective film (4) for preparing specifically wraps
Include following steps:
Blanking: it is divided into several to protect membrane body (41) protection film sheet；
It makes location hole (5): being die cut location hole (5) on processing release paper, form the protective film (4).
5. the production method of heat conductive pad according to claim 4, which is characterized in that the thermally conductive advance capital for for completing preparation
In on the protective film (4) that preparation is completed, the protective film (4) is adsorbed in the surface of the thermally conductive pad body (1) for body (1) punching press,
Formed heat conductive pad finished product specifically includes the following steps:
Positioning: protective film (4) are positioned on pneumatic punching machine by location hole (5)；
Feeding: thermally conductive pad body (1) is placed on the discharge port of pneumatic punching machine；
Pressing: thermally conductive pad body (1) is pressed in protection membrane body (41) and is ejected；
Demoulding: processing release paper (42) is removed from protection membrane body (41), forms heat conductive pad finished product.
6. the production method of heat conductive pad according to claim 5, which is characterized in that the pneumatic punching machine includes driving machine
Structure, upper table and the lower table matched with upper table, the driving mechanism can drive the upper table opposite
It is moved up and down along the vertical direction in the lower table, the upper table is correspondingly arranged on positioning pin (8), the positioning pin
(8) it can extend into the location hole (5).
7. the production method of heat conductive pad according to claim 5, which is characterized in that also wrapped after forming heat conductive pad finished product
Include following steps:
It examines: by the online product inspection of heat conductive pad finished product, forming qualified product；
Packaging: qualified product is packed.
8. the production method of heat conductive pad according to claim 7, which is characterized in that the packaging specifically includes following step
It is rapid:
Enter disk: qualified product is placed in plastic uptake plate (9)；
Vanning: plastic uptake plate (9) is placed in packing case.
9. the production method of heat conductive pad according to claim 4, which is characterized in that the viscosity of the thermally conductive pad body (1)
Embossing is provided on face, the thermally conductive pad body (1) and the contact surface for protecting membrane body (41) are horizontal plane.
10. the production method of heat conductive pad according to claim 4, which is characterized in that the protection membrane body (41) is double
The antistatic high absorption protective film in face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810273710.XA CN108419418B (en) | 2018-03-29 | 2018-03-29 | A kind of production method of heat conductive pad |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810273710.XA CN108419418B (en) | 2018-03-29 | 2018-03-29 | A kind of production method of heat conductive pad |
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| CN108419418A CN108419418A (en) | 2018-08-17 |
| CN108419418B true CN108419418B (en) | 2019-11-08 |
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| CN201810273710.XA Active CN108419418B (en) | 2018-03-29 | 2018-03-29 | A kind of production method of heat conductive pad |
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| CN111087823B (en) * | 2019-12-24 | 2022-02-11 | 深圳德邦界面材料有限公司 | Heat conduction gasket with good reworkability and preparation method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2442630A1 (en) * | 2010-10-18 | 2012-04-18 | Siemens Aktiengesellschaft | Heat conducting pad |
| CN202587720U (en) * | 2012-03-31 | 2012-12-05 | 常州宏巨电子科技有限公司 | Heat conducting silicon gel pad |
| CN103317804B (en) * | 2013-07-16 | 2015-09-23 | 苏州中垒新材料科技有限公司 | A kind of hot pressing buffer substrate tablet and preparation method thereof |
| CN206406537U (en) * | 2017-01-19 | 2017-08-15 | 东莞市麦瑞斯电子材料有限公司 | A kind of one side is without viscous heat-conducting silica gel sheet |
| CN106833367B (en) * | 2017-02-08 | 2018-04-20 | 昆山市中迪新材料技术有限公司 | A kind of insulated type interface chill bar material and preparation method thereof |
| CN207027908U (en) * | 2017-06-13 | 2018-02-23 | 昆山市飞荣达电子材料有限公司 | A kind of mould tool for the shaping of conductive graphite pad |
| CN107418504A (en) * | 2017-08-30 | 2017-12-01 | 强新正品（苏州）环保材料科技有限公司 | Alternative graphite flake heat conductive silica gel and preparation technology |
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Effective date of registration: 20230804 Address after: 213200 No.139 Huaye Road, Jintan District, Changzhou City, Jiangsu Province Patentee after: Feirongda Technology (Jiangsu) Co.,Ltd. Address before: No. 258 Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215300 Patentee before: KUNSHAN FEIRONGDA ELECTRONIC MATERIAL Co.,Ltd. |