JPH0755007Y2 - Ｌｅｄ成形用治具 - Google Patents

Ｌｅｄ成形用治具

Info

Publication number
JPH0755007Y2
JPH0755007Y2 JP1989075070U JP7507089U JPH0755007Y2 JP H0755007 Y2 JPH0755007 Y2 JP H0755007Y2 JP 1989075070 U JP1989075070 U JP 1989075070U JP 7507089 U JP7507089 U JP 7507089U JP H0755007 Y2 JPH0755007 Y2 JP H0755007Y2
Authority
JP
Japan
Prior art keywords
lead frame
molding die
molding
semiconductor chip
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989075070U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0313763U (enrdf_load_stackoverflow
Inventor
彰 馬淵
勝英 真部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP1989075070U priority Critical patent/JPH0755007Y2/ja
Publication of JPH0313763U publication Critical patent/JPH0313763U/ja
Application granted granted Critical
Publication of JPH0755007Y2 publication Critical patent/JPH0755007Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1989075070U 1989-06-27 1989-06-27 Ｌｅｄ成形用治具 Expired - Lifetime JPH0755007Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989075070U JPH0755007Y2 (ja) 1989-06-27 1989-06-27 Ｌｅｄ成形用治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989075070U JPH0755007Y2 (ja) 1989-06-27 1989-06-27 Ｌｅｄ成形用治具

Publications (2)

Publication Number Publication Date
JPH0313763U JPH0313763U (enrdf_load_stackoverflow) 1991-02-12
JPH0755007Y2 true JPH0755007Y2 (ja) 1995-12-18

Family

ID=31615324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989075070U Expired - Lifetime JPH0755007Y2 (ja) 1989-06-27 1989-06-27 Ｌｅｄ成形用治具

Country Status (1)

Country Link
JP (1) JPH0755007Y2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19900592A1 (de) * 1999-01-11 2000-07-13 Takata Europ Gmbh Kniestützvorrichtung
JP2007030733A (ja) * 2005-07-28 2007-02-08 Nippon Plast Co Ltd エアバッグ装置
JP6462529B2 (ja) * 2015-08-24 2019-01-30 京セラ株式会社 パワー半導体モジュールの製造方法及びパワー半導体モジュール

Also Published As

Publication number Publication date
JPH0313763U (enrdf_load_stackoverflow) 1991-02-12

Similar Documents

Publication Publication Date Title
JPH10507847A (ja) オプトコンポーネント上へのカプセル封止材の射出
JPH08118174A (ja) 取付補助部材
JPH0755007Y2 (ja) Ｌｅｄ成形用治具
CN1803438B (zh) 压制成形装置
CN212653101U (zh) 一种用于阀体机加工的定位工装
JP3878295B2 (ja) ワークの固定方法及びワークバイスの固定治具
JPH06236949A (ja) 半導体パッケ−ジのアウタリ−ドの曲げ装置
CN103192344A (zh) 位置调节夹具
CN106583870B (zh) 行位加工治具及线切割加工系统
KR0118549Y1 (ko) 가변형 지그
CN221967425U (zh) 一种可校正的cnc装夹治具
CN215773722U (zh) 一种fpc折弯成型装置
JP2956701B1 (ja) 樹脂封止形半導体装置のリードフォーミング法及びその装置
JP2518368Y2 (ja) インサ−ト成形用金型
JP2552567B2 (ja) 光プリンタ用レンズアレイの取付方法
CN214249483U (zh) 带有易调整定位结构的车灯模组光源系统
JPH05138934A (ja) 光プリントヘツドの製造方法
TW202432344A (zh) 光學零件的製造方法
JP2642266B2 (ja) 磁気ヘッド及びその製造方法
JPS607851Y2 (ja) 位置決め機能を有するプレス機
KR100645590B1 (ko) 주조용 금형의 경사 슬라이드 핀 장치
JP3938673B2 (ja) ワークの位置合わせ機構とその機構を用いた位置合わせ方法
KR100272277B1 (ko) 성형성 개선을 위한 실험용 몰드 다이
JPH04150055A (ja) 半導体パッケージ
CN116682753A (zh) 易碎薄片辅助粘合装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term