JPH075426Y2 - 温度特性試験槽 - Google Patents

温度特性試験槽

Info

Publication number
JPH075426Y2
JPH075426Y2 JP1988011234U JP1123488U JPH075426Y2 JP H075426 Y2 JPH075426 Y2 JP H075426Y2 JP 1988011234 U JP1988011234 U JP 1988011234U JP 1123488 U JP1123488 U JP 1123488U JP H075426 Y2 JPH075426 Y2 JP H075426Y2
Authority
JP
Japan
Prior art keywords
temperature
air
characteristic test
test
temperature characteristic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988011234U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01118379U (enrdf_load_stackoverflow
Inventor
源生 岡本
Original Assignee
株式会社高見沢サイバネティックス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社高見沢サイバネティックス filed Critical 株式会社高見沢サイバネティックス
Priority to JP1988011234U priority Critical patent/JPH075426Y2/ja
Publication of JPH01118379U publication Critical patent/JPH01118379U/ja
Application granted granted Critical
Publication of JPH075426Y2 publication Critical patent/JPH075426Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1988011234U 1988-02-01 1988-02-01 温度特性試験槽 Expired - Lifetime JPH075426Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988011234U JPH075426Y2 (ja) 1988-02-01 1988-02-01 温度特性試験槽

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988011234U JPH075426Y2 (ja) 1988-02-01 1988-02-01 温度特性試験槽

Publications (2)

Publication Number Publication Date
JPH01118379U JPH01118379U (enrdf_load_stackoverflow) 1989-08-10
JPH075426Y2 true JPH075426Y2 (ja) 1995-02-08

Family

ID=31219606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988011234U Expired - Lifetime JPH075426Y2 (ja) 1988-02-01 1988-02-01 温度特性試験槽

Country Status (1)

Country Link
JP (1) JPH075426Y2 (enrdf_load_stackoverflow)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2610373C3 (de) * 1975-04-02 1981-09-17 Tyler Refrigeration Corp., 49120 Niles, Mich. Kühltruhe
JPS58141175U (ja) * 1982-03-17 1983-09-22 株式会社東芝 オ−プンシヨ−ケ−ス
JPS613378U (ja) * 1984-06-13 1986-01-10 日本建鐵株式会社 冷凍冷蔵オ−プンシヨ−ケ−ス
JPH0652147B2 (ja) * 1984-10-26 1994-07-06 三菱電機株式会社 オープンショーケース
JPS61203281U (enrdf_load_stackoverflow) * 1985-06-07 1986-12-20
JPS62169063A (ja) * 1986-01-21 1987-07-25 Kumamoto Nippon Denki Kk 環境試験装置
JPH01196583A (ja) * 1988-02-01 1989-08-08 Takamisawa Cybernetics Co Ltd 温度特性試験槽

Also Published As

Publication number Publication date
JPH01118379U (enrdf_load_stackoverflow) 1989-08-10

Similar Documents

Publication Publication Date Title
US6104204A (en) Semiconductor device testing apparatus
KR20080053768A (ko) 웨이퍼 척, 이를 구비하는 웨이퍼의 전기적 특성을테스트하는 장치 및 테스트하는 방법
TW201942993A (zh) 檢查裝置
Carlson et al. The ETA 10 liquid-nitrogen-cooled supercomputer system
US5838568A (en) Heated circuit assembly tester and method
KR20080031083A (ko) 열 분리기를 구비하는 반도체 소자용 테스트 핸들러 및이를 이용한 반도체 소자 테스트 방법
JP2000241496A (ja) 電子部品試験装置および電子部品の試験方法
KR20220036892A (ko) 챔버 씰링을 위한 반도체 번인 오븐
JPH075426Y2 (ja) 温度特性試験槽
JPS6221083A (ja) 電子機器の温度特性試験器
US6838897B2 (en) Integrated circuit test system and method
JPH0752624Y2 (ja) 温度試験器
JPH0527014Y2 (enrdf_load_stackoverflow)
JPH05333106A (ja) 温度特性試験装置
JP4065059B2 (ja) Ic試験装置
JPH0752625Y2 (ja) 温度特性試験槽
JPH01196583A (ja) 温度特性試験槽
CN115436211A (zh) 复式快速温变冲击试验箱
JPH01196584A (ja) 温度特性試験槽
CN113835009A (zh) 一种分区式晶体管老化系统
JP4859156B2 (ja) 温度特性試験装置
JP4072250B2 (ja) Ic試験装置
CN219590434U (zh) 一种电子产品老化测试设备
JPH08146097A (ja) 半導体ic試験装置用一体型密閉筐体冷却装置
US5317257A (en) Burn-in apparatus and burn-in board removing method using movable cooling enclosure