JPH0751761Y2 - 抵抗・温度ヒューズ複合体の回路基板への取付構造 - Google Patents
抵抗・温度ヒューズ複合体の回路基板への取付構造Info
- Publication number
- JPH0751761Y2 JPH0751761Y2 JP1990032623U JP3262390U JPH0751761Y2 JP H0751761 Y2 JPH0751761 Y2 JP H0751761Y2 JP 1990032623 U JP1990032623 U JP 1990032623U JP 3262390 U JP3262390 U JP 3262390U JP H0751761 Y2 JPH0751761 Y2 JP H0751761Y2
- Authority
- JP
- Japan
- Prior art keywords
- resistance
- circuit board
- length
- soldering
- thermal fuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title claims description 22
- 238000005476 soldering Methods 0.000 claims description 32
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 27
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000006378 damage Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990032623U JPH0751761Y2 (ja) | 1990-03-27 | 1990-03-27 | 抵抗・温度ヒューズ複合体の回路基板への取付構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990032623U JPH0751761Y2 (ja) | 1990-03-27 | 1990-03-27 | 抵抗・温度ヒューズ複合体の回路基板への取付構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03122510U JPH03122510U (enrdf_load_stackoverflow) | 1991-12-13 |
| JPH0751761Y2 true JPH0751761Y2 (ja) | 1995-11-22 |
Family
ID=31535694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990032623U Expired - Fee Related JPH0751761Y2 (ja) | 1990-03-27 | 1990-03-27 | 抵抗・温度ヒューズ複合体の回路基板への取付構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751761Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008097943A (ja) * | 2006-10-11 | 2008-04-24 | Uchihashi Estec Co Ltd | 温度ヒューズ内蔵抵抗器 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5275764U (enrdf_load_stackoverflow) * | 1975-12-05 | 1977-06-06 |
-
1990
- 1990-03-27 JP JP1990032623U patent/JPH0751761Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03122510U (enrdf_load_stackoverflow) | 1991-12-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |