JPH07508613A - 良好なイントリンシックゲッタ作用を有する半導体の製造方法 - Google Patents

良好なイントリンシックゲッタ作用を有する半導体の製造方法

Info

Publication number
JPH07508613A
JPH07508613A JP5516922A JP51692293A JPH07508613A JP H07508613 A JPH07508613 A JP H07508613A JP 5516922 A JP5516922 A JP 5516922A JP 51692293 A JP51692293 A JP 51692293A JP H07508613 A JPH07508613 A JP H07508613A
Authority
JP
Japan
Prior art keywords
oxygen
wafer
wafers
nucleation
precipitation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5516922A
Other languages
English (en)
Japanese (ja)
Inventor
コメオウ、アラン
Original Assignee
ミテル・コーポレーション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミテル・コーポレーション filed Critical ミテル・コーポレーション
Publication of JPH07508613A publication Critical patent/JPH07508613A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • H01L21/3225—Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP5516922A 1992-03-31 1993-03-26 良好なイントリンシックゲッタ作用を有する半導体の製造方法 Pending JPH07508613A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CA2,064,486 1992-03-31
CA002064486A CA2064486C (en) 1992-03-31 1992-03-31 Method of preparing semiconductor wafer with good intrinsic gettering
PCT/CA1993/000123 WO1993020582A1 (en) 1992-03-31 1993-03-26 Method of preparing semiconductor with good intrinsic gettering

Publications (1)

Publication Number Publication Date
JPH07508613A true JPH07508613A (ja) 1995-09-21

Family

ID=4149527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5516922A Pending JPH07508613A (ja) 1992-03-31 1993-03-26 良好なイントリンシックゲッタ作用を有する半導体の製造方法

Country Status (7)

Country Link
US (1) US5587325A (enExample)
JP (1) JPH07508613A (enExample)
KR (1) KR950701138A (enExample)
CA (1) CA2064486C (enExample)
DE (2) DE4391302T1 (enExample)
GB (1) GB2280312B (enExample)
WO (1) WO1993020582A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008136500A1 (ja) * 2007-05-02 2008-11-13 Siltronic Ag シリコンウエハ及びその製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2874834B2 (ja) * 1994-07-29 1999-03-24 三菱マテリアル株式会社 シリコンウェーハのイントリンシックゲッタリング処理法
US5593494A (en) * 1995-03-14 1997-01-14 Memc Electronic Materials, Inc. Precision controlled precipitation of oxygen in silicon
DE19538983A1 (de) * 1995-10-19 1997-04-24 Siemens Ag Verfahren zum Beseitigen von Kristallfehlern in Siliziumscheiben
US6004868A (en) * 1996-01-17 1999-12-21 Micron Technology, Inc. Method for CMOS well drive in a non-inert ambient
WO2003009365A1 (fr) * 2001-07-10 2003-01-30 Shin-Etsu Handotai Co.,Ltd. Procede de fabrication d'une plaquette en silicium, d'une plaquette epitaxiale en silicium, et plaquette epitaxiale en silicium
US6444551B1 (en) * 2001-07-23 2002-09-03 Taiwan Semiconductor Manufacturing Company N-type buried layer drive-in recipe to reduce pits over buried antimony layer
US8258042B2 (en) * 2009-08-28 2012-09-04 Macronix International Co., Ltd. Buried layer of an integrated circuit
KR101231412B1 (ko) * 2009-12-29 2013-02-07 실트로닉 아게 실리콘 웨이퍼 및 그 제조 방법
CN102543675B (zh) * 2010-12-31 2014-11-05 中芯国际集成电路制造(上海)有限公司 玻璃衬底的处理方法
CN102842642A (zh) * 2011-06-23 2012-12-26 吉林庆达新能源电力股份有限公司 一种太阳能电池生产中单晶硅的扩散方法
US11881405B2 (en) 2022-02-04 2024-01-23 Applied Materials, Inc. Methods for forming N-type buried layer in a substrate by performing non-doping implant through oxide layer formed over the substrate
CN118431312B (zh) * 2024-04-16 2024-12-17 隆基绿能科技股份有限公司 一种太阳能电池及光伏组件

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4597804A (en) * 1981-03-11 1986-07-01 Fujitsu Limited Methods of forming denuded zone in wafer by intrinsic gettering and forming bipolar transistor therein
DE3280219D1 (de) * 1981-03-11 1990-08-30 Fujitsu Ltd Verfahren zur herstellung einer halbleiteranordnung mit ausgluehen eines halbleiterkoerpers.
JPS57197827A (en) * 1981-05-29 1982-12-04 Hitachi Ltd Semiconductor substrate
JPS5814538A (ja) * 1981-07-17 1983-01-27 Fujitsu Ltd 半導体装置の製造方法
EP0098406A1 (en) * 1982-07-06 1984-01-18 Texas Instruments Incorporated Ramped nucleation of solid state phase changes
US4548654A (en) * 1983-06-03 1985-10-22 Motorola, Inc. Surface denuding of silicon wafer
JPS60133734A (ja) * 1983-12-21 1985-07-16 Mitsubishi Electric Corp 半導体装置の製造方法
US4622082A (en) * 1984-06-25 1986-11-11 Monsanto Company Conditioned semiconductor substrates
JPS618931A (ja) * 1984-06-25 1986-01-16 Hitachi Ltd 半導体装置の製造方法
JPS6120337A (ja) * 1984-07-09 1986-01-29 Nec Corp 半導体装置の製造方法
DD286460A5 (de) * 1987-03-19 1991-01-24 Akademie Der Wissenschaften Der Ddr,De Verfahren zur herstellung von mos-bauelementen mit sio tief 2/si tief 3n tief 4-isolatorschichten
US4851358A (en) * 1988-02-11 1989-07-25 Dns Electronic Materials, Inc. Semiconductor wafer fabrication with improved control of internal gettering sites using rapid thermal annealing
JPH03185831A (ja) * 1989-12-15 1991-08-13 Komatsu Denshi Kinzoku Kk 半導体装置の製造方法
US5141887A (en) * 1990-07-02 1992-08-25 Motorola, Inc. Low voltage, deep junction device and method
KR960000952B1 (ko) * 1991-03-05 1996-01-15 후지쓰 가부시끼가이샤 반도체 장치의 생산공정
JPH05308076A (ja) * 1992-03-03 1993-11-19 Fujitsu Ltd シリコンウエーハの酸素析出方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008136500A1 (ja) * 2007-05-02 2008-11-13 Siltronic Ag シリコンウエハ及びその製造方法
US8382894B2 (en) 2007-05-02 2013-02-26 Siltronic Ag Process for the preparation of silicon wafer with reduced slip and warpage
JP5256195B2 (ja) * 2007-05-02 2013-08-07 ジルトロニック アクチエンゲゼルシャフト シリコンウエハ及びその製造方法

Also Published As

Publication number Publication date
DE4391302B4 (de) 2007-07-26
CA2064486A1 (en) 1993-10-01
KR100298067B1 (enExample) 2001-12-01
DE4391302T1 (de) 1995-04-13
GB2280312A (en) 1995-01-25
GB2280312B (en) 1996-03-06
WO1993020582A1 (en) 1993-10-14
US5587325A (en) 1996-12-24
GB9419512D0 (en) 1994-11-16
KR950701138A (ko) 1995-02-20
CA2064486C (en) 2001-08-21

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