JPH0749411Y2 - 半導体耐久試験用の液槽式前処理装置 - Google Patents

半導体耐久試験用の液槽式前処理装置

Info

Publication number
JPH0749411Y2
JPH0749411Y2 JP1990103034U JP10303490U JPH0749411Y2 JP H0749411 Y2 JPH0749411 Y2 JP H0749411Y2 JP 1990103034 U JP1990103034 U JP 1990103034U JP 10303490 U JP10303490 U JP 10303490U JP H0749411 Y2 JPH0749411 Y2 JP H0749411Y2
Authority
JP
Japan
Prior art keywords
storage tank
liquid storage
sample
chamber
treatment liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990103034U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459452U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
浩一 赤尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwatani Corp
Original Assignee
Iwatani Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwatani Corp filed Critical Iwatani Corp
Priority to JP1990103034U priority Critical patent/JPH0749411Y2/ja
Publication of JPH0459452U publication Critical patent/JPH0459452U/ja
Application granted granted Critical
Publication of JPH0749411Y2 publication Critical patent/JPH0749411Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1990103034U 1990-09-27 1990-09-27 半導体耐久試験用の液槽式前処理装置 Expired - Lifetime JPH0749411Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990103034U JPH0749411Y2 (ja) 1990-09-27 1990-09-27 半導体耐久試験用の液槽式前処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990103034U JPH0749411Y2 (ja) 1990-09-27 1990-09-27 半導体耐久試験用の液槽式前処理装置

Publications (2)

Publication Number Publication Date
JPH0459452U JPH0459452U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-05-21
JPH0749411Y2 true JPH0749411Y2 (ja) 1995-11-13

Family

ID=31847760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990103034U Expired - Lifetime JPH0749411Y2 (ja) 1990-09-27 1990-09-27 半導体耐久試験用の液槽式前処理装置

Country Status (1)

Country Link
JP (1) JPH0749411Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2690970B2 (ja) * 1988-10-03 1997-12-17 タバイエスペック株式会社 液槽式環境試験装置

Also Published As

Publication number Publication date
JPH0459452U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-05-21

Similar Documents

Publication Publication Date Title
US7802507B2 (en) Automatic sliced piece fabricating apparatus and automatic sliced piece sample fabricating apparatus
JP2010536185A (ja) 半導体基板の運搬および大気中保管のための輸送支持具を処理する方法、ならびにそのような方法を実施するための処理ステーション
TWI883347B (zh) 用於測試半導體積體電路晶片的液冷測試插槽
JP2011511431A (ja) フローはんだ付け装置およびフローはんだ付け方法
JPH0749411Y2 (ja) 半導体耐久試験用の液槽式前処理装置
JPH0714864Y2 (ja) 半導体耐久試験用の液槽式前処理装置
WO2008038610A1 (fr) Appareil de déshydratation/séchage et procédé de déshydratation/séchage
JP2022081420A (ja) 半導体ストリップ切断及び分類設備におけるパッケージ乾燥装置
US5052126A (en) Vapor drier for semiconductor wafers and the like
JP2975797B2 (ja) プローブ装置
JP4859156B2 (ja) 温度特性試験装置
JPH07113841A (ja) 温度サイクル試験方法及びその実施装置
JPS61198045A (ja) 表面汚染度観察方法
JP3734028B2 (ja) 電子部品のスクリーニング方法及び装置
KR970000712B1 (ko) 전기적 프로우빙 시험장치
JP6927827B2 (ja) 洗浄装置
JP2013197525A (ja) 基板処理装置および基板処理方法
JP2023051113A (ja) 検査装置、および露点管理方法
JPH07234262A (ja) Ｉｃソケットの洗浄方法及び洗浄装置
JPH02269982A (ja) 半導体装置の評価方法およびその装置
JPS62245639A (ja) ベ−パ乾燥装置
JP2006071195A (ja) 被洗浄物の乾燥方法及び乾燥装置
JP2024114347A (ja) 検査装置、および、検査方法
JPH03293073A (ja) 部品洗浄後の水切り方法
JP2012122631A (ja) 蒸気乾燥装置および蒸気乾燥方法