JPH0744340B2 - Method for manufacturing multilayer laminate - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method for producing a multilayer laminate. More specifically, the present invention prevents molding deviation,
Furthermore, the present invention relates to a new method for producing a multi-layer laminate, which enables large-scale press molding.

(Prior Art) With the increasing demand for high-density mounting of printed wiring boards, expectations for multilayer printed wiring boards are increasing.

This multilayer printed wiring board has a structure in which an insulating layer and an outer layer circuit are arranged above and below an inner layer board having an inner layer circuit,
It is manufactured by forming an outer layer circuit on a multilayer laminated board corresponding to this structure.

This multilayer laminated board, which greatly influences the performance of the multilayer printed wiring board, usually has metal plates (a) and (c) interposed between the upper and lower press heating plates (a) as shown in FIG. 4, for example. Then, a combination of an inner layer plate (d), an outer layer prepreg (e), an outermost layer metal foil (f) or an outer layer material having a circuit pattern formed between them is disposed, heated and pressed, and laminated and integrated. It is manufactured by

In such laminated molding, as shown in FIG. 5, for example, in both small press molding and large press molding such as half press molding in which a plurality of inner layer plates (d) can be formed side by side. In addition, a plurality of combinations of the above-mentioned inner layer material (d), outer layer prepreg (e), metal foil (f) and the like molding material (ki) are arranged between the metal plates (a) and (c), and A cushion material (K) is provided on the upper and lower press heating plates (A) surfaces, and a shift prevention frame (K) is provided around them.

This displacement prevention frame (ke) is installed in the multi-layer board molding having the inner layer board (d) in the resin melting state of the prepreg by heating and pressurization, when there is a large amount of molten resin, the pressure balance and the resin flow state. Depending on the inner layer plate (d) during molding
The metal plates (a) and (c) start to move, so-called slipping occurs, and the purpose is to prevent this deviation.

(Problems to be Solved by the Invention) As described above, it is known that it is tentatively effective to dispose the displacement prevention frame (ke) for displacement prevention during the formation of the multilayer laminate to perform the laminate formation. However, at the time of actual molding of the molding material (K) consisting of the outer layer prepreg (E) of the inner layer board (D) and the outer layer metal foil (F), the occurrence of misalignment and the frame for preventing the molten resin from slipping during molding (F) ) Has the drawback that it cannot be avoided. In particular, the adhesion of the molten resin has made it extremely difficult to peel off the resin after the lamination molding because the conventional displacement prevention frame (vi) surrounds the periphery of the molding material (ki). Moreover, when a plurality of inner layer plates (d) are formed side by side on the same plane, as in the case of large-sized press forming such as half size, for example, as shown in FIG. It is unavoidable that (d) is displaced at the abutting portions of each other to cause vertical displacement (A) or overlapping displacement (B). The occurrence of the deviations (A) and (B) is also amplified by the deviations of the metal plates (a) and (c), which has been a cause of impairing the quality and performance of the multilayer laminated plates formed by lamination. The improvement of product yield was also largely restricted in this respect.

This invention has been made in view of the circumstances as described above, eliminates the drawbacks of the conventional lamination molding method, suppresses the occurrence of displacement during molding, it is possible to effectively prevent resin adhesion, It is an object of the present invention to provide a new method for producing a multi-layer laminate, which enables production of high-quality and high-performance multi-layer laminate, and also enables large-scale press molding.

(Means for Solving the Problems) As a solution to the above problems, the present invention provides a method for producing a multi-layer laminated plate in which a slip prevention top plate having a plurality of presser feet for fixing a metal plate is arranged and laminated. The method is characterized in that a plurality of inner layer plates are brought into contact with each other at their side end portions and arranged side by side to be fixed in a single plate shape, and the prepreg and the metal foil or outer layer material are heated and pressed to form a laminate. The present invention provides a method for producing a multilayer laminate.

(Operation) In the manufacturing method of the present invention, the shift-preventing top plate for fixing the metal plate is used as described above, and further, since a plurality of inner layer plates are fixed and laminated to form a single plate, at the time of lamination molding It is possible to effectively suppress the occurrence of misalignment and overlap.

Therefore, molding with a large-sized press by a mass lamination method using a prepreg having a high resin content is facilitated, productivity is improved, and defects can be reduced.

Moreover, the performance is good even for thin 4-layer boards of 0.8 mm or less,
The quality is good, and the heat resistance is greatly improved compared to the conventional method.

(Example) The production method of the present invention will be described in more detail below.

FIG. 1 exemplifies a slip prevention top plate (1) used in the present invention.

A plurality of presser feet (2) for fixing the metal plate are attached to the top plate (1). This presser foot (2)
Is mounted at a corner of the top plate (1) or at any other suitable location with a height corresponding to the size of the metal plate and the total thickness of the laminated molding material and the metal plate.

In addition, in order to prevent the occurrence of misalignment, as shown in FIG. 2, when forming the multilayer laminated plate, a plurality of inner layer plates (11) are arranged side by side so as to have a predetermined area for pressing. , Fix it in the state of a single plate.

The type of the inner layer plate (11) in this case is not particularly limited, and a glass sheet impregnated with an epoxy resin, an unsaturated polyester resin, a polyamide resin, a phenol resin, or the like,
A prepreg made of a base material such as paper or a laminated sheet formed of a resin sheet and a metal foil of copper, aluminum, iron, stainless steel or the like and having a circuit formed thereon is appropriately used.

These inner layer materials are applied, for example, to a half size press (500
× 1000mm) Along with the area of the press, etc., fix the multiple sheets side by side. For example, as shown in FIG. 2, three inner layer plates (11) are arranged with their sides aligned in the XY direction (plane).

Then, the individual inner layer plates (11) are fixed. Various means can be adopted as a fixing method at this time, for example, 1) the inner layer plates (11) adjacent to each other are fixed with a heat resistant tape.

2) Tie with heat resistant thread.

3) The connection is made by a metal wire-like binding device such as staples or a heat-resistant plastic binding device.

4) Fix with hooks.

By such means, the single-layered inner layer plate (11) is subjected to lamination molding.

FIG. 3 illustrates such a laminated molding.

That is, as in the conventional case, the inner layer plate (11), the outer layer prepreg (15) and the metal foil (16) are arranged between the press heating plates (12) via the metal plates (13) and (14), Further, the cushion material (17) is arranged on the surface of the press heating platen (12), and the top plate (1) for preventing the displacement is arranged.

In this case, as the inner layer plate (11), for example, one obtained by converting three plates into one plate as shown in FIG. 3 is used.

A press hot platen (12) heats and presses under predetermined conditions of pressure, temperature, etc., for example, 130 to 180 ° C. and 20 to 80 kg / cm ² to laminate and integrate.

As for the prepreg and the metal foil, appropriate ones including conventionally known ones are used.

In addition, as the top plate (1) for preventing misalignment at the time of molding,
As shown in FIG. 1, a presser foot (2) for fixing a metal plate is used. In the case of the conventional slip prevention frame, the obstacle due to the adhesion of the resin was large, but this adhesion is suppressed by the top plate (1). About this top plate (1), metal plate (13) for molding
Vertical and horizontal sizes are + 5-10mm more than the size of (14)
It is preferable to increase the degree. This makes it possible to minimize the deviation caused by the movement of the metal plates (14) (15) during molding.

In fact, a thin multilayer board with a thickness of 0.8 mm or less was manufactured by the above method, but there was no displacement of the metal plates (13) (14), and the inner layer plate (11) fixed with heat-resistant tape was vertically displaced and overlapped. Occurrence of is suppressed, and a high-quality multilayer laminate can be manufactured even by a half size press (500 × 1000 mm).

In this case, as the inner layer material, a circuit-forming inner layer board molded from an epoxy resin-impregnated glass base material prepreg and a copper foil is used, and a similar epoxy resin-impregnated glass base material prepreg and a copper foil are laminated to form a four-layer circuit. A multilayer laminate was manufactured.

In the case of the conventional method in which the top plate of the present invention is not used and the inner layer plate is not made into a single plate, vertical displacement and overlapping displacement due to the occurrence of displacement are unavoidable.

In the case of the multi-layer laminate according to the present invention, the heat resistance during the reflow treatment during the processing of the printed wiring board and after the mounting of the components was also good, and the deviation did not occur even if the resin content was increased.

(Effects of the Invention) According to the present invention, as described in detail above, even when a prepreg having a high resin content is used, the displacement of the inner layer plate at the time of molding can be suppressed, and molding with a large press becomes possible.

Therefore, both productivity and quality are improved.

Moreover, the heat resistance is good even in the case of a thin multilayer board having a thickness of 0.8 mm or less.

[Brief description of drawings]

FIG. 1 is a perspective view exemplifying a shift-preventing top plate during molding. FIG. 2 is a perspective view illustrating an array state of inner layer plates in the method of the present invention. FIG. 3 is a cross-sectional view illustrating the manufacturing process of the present invention. 4 and 5 are cross-sectional views showing a conventional manufacturing method. 6 (A) and (B) are perspective views showing the displacement of the inner layer plate in the conventional method. 1 …… Slip prevention top plate 2 …… Presser foot 11 …… Inner layer plate 12 …… Press heating plate 13,14 …… Metal plate 15 …… Prepreg 16 …… Metal foil 17 …… Cushion material

Claims (1)

[Claims] 1. A method for manufacturing a multi-layer laminated plate in which a slip prevention top plate, to which a plurality of metal plate fixing foot members are attached, is arranged and laminated, wherein a plurality of inner layer plates abut each other at their side end portions. A method for producing a multi-layer laminate, which comprises arranging and arranging them in parallel to each other and fixing them in a single plate shape, and heating and pressing the prepreg and the metal foil or the outer layer material to form a laminate.