JPH04106997A - Manufacture of multi-layer printed wiring board - Google Patents

Abstract

PURPOSE:To prevent the generation of molding slippage at the time of laminate molding and resin adhesion owing to resin flow effectively, by providing a plurality of angle pieces on a top plate as slippage preventing means, and by performing molding using this as a slippage preventing top cover. CONSTITUTION:A plurality of slippage preventing angle pieces 3 are fitted onto the corner sections (A), (B), (C), (D) of a top plate 2, and besides onto its intermediate section (E), (F) if necessary, as a slippage preventing top cover 1 used at the time of molding, with the top sections of these pieces 3 facing a position where multi-layer printed wiring board molding materials 4 are placed, that is, facing inside. Four-layer multi-layer printed wiring boards composed of inner layer boards, epoxy-resin impregnated glass base material prepregs, and copper foil are laminated and molded using the cover 1. This prevents resin adhesion owing to resin flow wholly, and reduces the molding cost greatly.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a multilayer printed wiring board. More specifically, the present invention relates to an improved method for manufacturing a multilayer printed wiring board that can prevent molding misalignment and problems caused by resin adhesion during molding.

(Prior Art) A multilayer printed wiring board has a structure in which an insulating layer and a metal circuit layer are arranged above and below an inner layer board. For example, as shown in FIG. 3, between the upper and lower presses (A), A mold plate (A) and an intermediate mold plate (T) are interposed, and a plurality of combinations of an inner layer plate (1) with a circuit pattern formed thereon, an outer layer prepreg (E), and an outermost layer metal foil (R) are arranged. Manufactured by laminated molding using pressure and heating.

The example shown in FIG. 3 also shows an example of manufacturing a multilayer printed wiring board having a four-layer structure.

For example, in the lamination molding of such multilayer printed wiring boards, conventionally the printed wiring board molding material (K) shown in Fig. 3 is placed on the carrier plate (RI), and the misalignment is A stopper frame (k) is placed around the molding material (k) with a slight gap between them, and laminated molding is performed.

(Problem to be Solved by the Invention) In this conventional manufacturing method, the anti-slip frame (k) is placed for the purpose of preventing the printed wiring board molding material (g) from slipping during molding, but in reality, When molding the molding material (G) consisting of the inner layer plate (1), the outer prepreg layer (E), and the outer layer metal foil (G), there is a risk of misalignment or adhesion of molten resin to the anti-slip frame (E) during molding. The disadvantage is that it cannot be avoided. In particular, the adhesion of this molten resin should be avoided on the anti-slip frame (
(e) Also because it is flat, it is extremely difficult to peel off the resin after lamination molding.

This invention was made in order to eliminate the drawbacks of the conventional method as described above, and effectively prevents molding misalignment during lamination molding of a multilayer printed wiring board and resin adhesion due to resin flow. It is an object of the present invention to provide an improved method for manufacturing a multilayer printed wiring board.

(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention provides a top plate with a plurality of anti-slip angle pieces erected at the corners of the top plate and, if necessary, in the middle thereof. Provided is a method for manufacturing a multilayer printed wiring board, characterized in that a cover is provided and laminated molding is performed.

That is, in this invention, unlike the conventional method of providing a slip prevention frame on a carrier plate on which a multilayer printed wiring board molding material is arranged, a plurality of angle pieces are provided on the top plate as a slip prevention means, It is characterized by being molded using this as a slip-preventing top cover.

(Function) In this invention, the conventional frame method is changed from the conventional frame method to a one-cover method as a means for preventing molding misalignment, and the top cover to prevent misalignment is provided with an angled piece, which prevents resin from adhering due to resin flow. can be completely prevented, and also the occurrence of molding misalignment can be effectively prevented.

(Example) Hereinafter, the method for manufacturing a multilayer printed wiring board of the present invention will be described in more detail with reference to the drawings.

FIG. 1 illustrates the bottom surface of the anti-slip top cover (1) used in the manufacturing method of the present invention. For example, as shown in FIG. 1, in the manufacturing method of the present invention, the slip-preventing top cover (1) used during molding is
As shown in FIG.
), and if necessary intermediate parts (E) (F)
The angle piece (3) is erected such that the top of the angle piece (3) faces in the direction in which the multilayer printed wiring board molding material (4) is arranged, that is, inward.

FIG. 2 shows an enlarged view of this standing arrangement.

This figure is an enlarged view of section A in FIG. 1. For example, as shown in FIG. 2, the anti-slip top cover (1) is composed of a top plate (2) and an angle piece (3) disposed thereon. There are no particular limitations on the material or size of the top plate (2) and the angle piece (3), but for example, a steel plate, 5S41, may be used as the top plate (2), and the thickness of the plate may vary depending on the size. , plate thickness 2.3-6 mm
can be taken as a degree. Its size can be determined by the size of the molding material (4).

For the anti-slip angle piece (3), use an angle of about 40 x 40 mm or 50 x 50 mm made of equilateral angle steel, and attach it to the corners (A), (B), (C), (D) of the top plate (2), and as necessary. Accordingly, it can be attached by welding to the intermediate parts (E) and (F). The actual mounting position is determined by imposition during mass lamination.

Of course, it goes without saying that the structure of the anti-slip top cover (1) can be modified in various ways with respect to its material, size, mounting position of the angle piece (3), etc.

When molding a multilayer printed wiring board, the anti-slip top cover (1) as described above has its surface, that is, the surface (X) shown in Figure 2, in contact with the press hot plate, and its lower surface (Y) in contact with the molding material. Use by placing them so that they touch each other.

In fact, when a four-layer multilayer printed wiring board consisting of an inner layer board, epoxy resin-impregnated glass base prepreg, and copper foil was laminated using this anti-slip top cover (1), there was no resin adhesion due to resin flow. , molding costs have been significantly reduced compared to conventional methods.

In addition, since the top of the angle piece (3) faces inward, even if the copper foil is larger than the molding size, the top of the angle piece (3) is in contact with the molding material. Complete prevention of slippage was achieved.

(Effects of the Invention) As explained in detail above, according to the present invention, no molding displacement occurs during lamination molding of a multilayer printed wiring board, and no adhesion of molten resin to the anti-slip top cover occurs. Molding costs are also greatly reduced.

[Brief explanation of drawings]

FIG. 1 is a plan view illustrating the lower surface of the anti-slip top cover used in the manufacturing method of the present invention, and FIG. 2 is a partial perspective view of the corner A portion thereof. FIG. 3 is a sectional view showing the manufacture of a multilayer printed wiring board, and FIG. 4 is a perspective view showing a conventional slip-stopping frame. ...Slip prevention top cover...Top plate...Slip prevention angle piece...Molding material

Claims (1)

[Claims] (1) Manufacture of a multilayer printed wiring board characterized in that a plurality of anti-slip angle pieces are laminated and formed by arranging an anti-slip top cover erected at the corners of the top plate and, if necessary, in the middle thereof. Method