JPH06334342A - Manufacture of multilayered board - Google Patents

Abstract

PURPOSE:To restrain deviation of inner layer members or the like in a lamination bonding process by a maslamination method, and enable coping with the change of thickness of the whole laminate on account of the change of board thickness or lamination condition, by employing one kind of shift-preventing metal plate. CONSTITUTION:In a lamination bonding process by the maslamination method of a multilayered board, an expansion structure 13 is employed for the shift- preventing clamp of a shift-preventing metal plate 1 which prevents the shift of inner layer plates 6 or metal plates 5a, 5b, and a laminate is formed by heating and pressing. The expansion structure 13 expands when pressure is not applied from a lamination press heating platen 3 or the like, and contracts when the pressure is applied.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multi-layer substrate by a mass lamination method.

More specifically, by adding an expansion / contraction mechanism to the displacement-preventing pressing portion of the displacement-preventing metal plate used for preventing displacement of the inner layer plate and the metal plate in the laminating and bonding process, several kinds of total laminate thickness can be obtained. The present invention relates to a method for manufacturing a multi-layered substrate that is compatible with the above.

[0003]

2. Description of the Related Art In a stacking and laminating process of a multi-layer substrate by a mass lamination method, a shift-preventing metal plate 1 having a shift-preventing pressing portion 2 and a tray plate 9 are interposed between upper and lower stacking press heating plates 3 shown in FIG. An inner layer plate 8 having a circuit pattern formed between them, a prepreg 7, an outer layer copper foil 6 or a single-sided copper clad laminate for the outer layer and a metal plate 5a such as a mirror plate,
It is general to carry out lamination molding by sandwiching with 5b and then sandwiching them with the cushioning material 4 and heating and pressing for a certain period of time.

As shown in FIG. 6, the displacement prevention metal plate 1 is formed by forming a pair of displacement prevention pressing portions 2 on each of four sides of a plate body 1a having a rectangular shape in plan view. A part of the main body 1a is bent at a right angle to the plate main body 1a.

In the metal plate 1 for preventing misalignment constructed as described above, the resin content of the prepreg 7 is increased in order to improve the heat resistance of the multi-layer substrate 10, and the prepreg 7 is prevented in order to suppress the occurrence of laminated bonding voids. When the resin flow rate is increased, the molding pressure is increased, or when the number of laminated multilayer substrates 10 is increased to improve the production efficiency, the inner layer plate 8 and the metal plate 5 such as a mirror plate shown in FIG.
It is indispensable when laminating and forming the multilayer substrate 10 by heating and pressurization because it may lead to the deviation of a and 5b and the damage of the laminating press.

Further, in the case of a multilayer substrate 10 having a plurality of inner layer plates 8 on which circuit patterns are formed, the inner layer plate 8 and metal plates 5a and 5b such as mirror plates are prevented from shifting and the positions of the inner layer plates 8 relative to each other. As a matching method, there is a pin laminating method in which guide pins are inserted into respective predetermined guide hole positions of the metal plates 5a and 5b such as mirror plates, the inner layer plate 8 on which the circuit pattern is formed, and the prepreg 7 to perform lamination molding.

[0007]

In order to prevent the displacement of the metal plates 5a, 5b such as the inner layer plate 8 and the mirror surface plate, the above-mentioned displacement preventing metal plate 1 is used in the laminating and bonding process of the multi-layer substrate by the mass lamination method. However, the height of the displacement prevention pressing portion 2 must be at least a height that can be pressed when the laminated product is about to be displaced, and is too high so that the laminating press is pressed at the time of pressing. It's bad that you hit the hot platen 3.

Therefore, when the difference in the plate layers of the multilayer substrate 10 to be laminated and the number of laminated layers is changed and the total laminate thickness is changed, the height of the misalignment pressing portion 2 must be changed. Therefore, when laminating is performed under such conditions, it is necessary to retain and use the shift-preventing metal plates 1 in which the shift-preventing pressing portions 2 have different heights.

If the conventional metal plate 1 for preventing misalignment is used, if the total laminate thickness differs by 10 mm,
As shown in FIG. 5, it is inevitable that the metal plates 5a and 5b having a mirror surface or the like and the inner layer plate 8 that are dislocated from the displacement prevention pressing portion 2 are displaced.

Therefore, the present invention has been made to solve the above-mentioned drawbacks, and an object of the present invention is to provide a method of manufacturing a multi-layered substrate which can cope with several kinds of total laminate thickness with one kind of metal plate for preventing displacement. I am trying.

[0011]

In order to achieve the above-mentioned object, the present invention prevents displacement of an inner layer plate or a metal plate in a lamination bonding step of a multilayer substrate by a mass lamination method. A method for manufacturing a multi-layer substrate, which is characterized in that an expansion mechanism that expands when a pressure received from a laminating press hot platen or the like is not applied to the part and shrinks when a pressure is applied To do.

[0012]

In the manufacturing method of the present invention, the displacement prevention pressing portion of the displacement prevention metal plate extends when the pressure received from the laminated press heating platen is not applied and contracts when the pressure is applied. Therefore, it is of course possible to use the prepreg containing a large amount of resin to improve the heat resistance and to perform the lamination adhesion by the mass lamination method. It will be possible to respond sufficiently.

If the total laminate thickness is within the stroke range of the expansion / contraction mechanism, it is effective in suppressing the displacement of all metal plates such as inner layer plates and mirror plate.

[0014]

EXAMPLES An example of the method for manufacturing a multilayer substrate of the present invention will be described in more detail below. FIG. 1 is an explanatory view of a method for manufacturing a multilayer substrate of the present invention, FIG. 2 is a perspective view of a displacement prevention metal plate used in the method of manufacturing a multilayer substrate of the present invention, and FIG. 3 is a displacement prevention pressing portion of the displacement prevention metal plate. FIG. 4 is an explanatory diagram of a state in which no external force is applied, and FIG. 4 is an explanatory diagram of a state in which an external force is applied to the displacement prevention pressing portion of the displacement prevention metal plate. The same members as those described in the above-mentioned conventional example are designated by the same reference numerals.

The displacement-preventing metal plate 1 used in the method for manufacturing a multi-layer substrate of the present invention has a plurality of displacement-preventing pressing portions 2 each having an expanding / contracting mechanism 13 at the periphery thereof, as shown in FIG. That is, these displacement prevention pressing portions 2 are provided with fixed side pieces 2a provided on the peripheral edge of the metal plate 1, and pins 11 are attached to these fixed side pieces 2a. Further, a long hole 12 which is long in the vertical direction is formed in the movable side piece 2b, and the pin 11 is formed in the long hole 12.
And the movable side piece 2b is attached to the fixed side piece 2a so as to be vertically movable.

The height of the displacement prevention pressing portion 2 can correspond to the total thickness of the laminate, and is movable as shown in FIG. 3 when an external force (pressure received from the laminating press heating platen 3 etc.) is not applied. The side piece portion 2b is in a state of being lowered downward, and is raised upward by an external force.

Next, using this displacement-preventing metal plate 1, the structure shown in FIG. 1 is used to heat and pressurize in a laminating press for laminating and forming. The inner layer plate 8, the prepreg 7, the outer layer copper foil 6 or the outer layer one side. A conventionally known copper-clad laminate is used, and the heating and pressurizing conditions by the hot platen 3 are also set according to the characteristics of the laminate (mainly the prepreg 7).

When the multi-layer substrate 10 was actually manufactured under the above-mentioned conditions, even if the total laminate thickness differs by about 10 mm, one kind of anti-displacement metal plate 1 to which the expansion mechanism 13 is added can satisfactorily cope with it, such as a mirror plate. Metal plates 5a, 5
The displacement of b and the inner layer plate 8 did not occur. Further, even when the prepreg 7 containing a large amount of resin in order to improve the heat resistance of the multilayer substrate 10 was used, the same deviation did not occur.

As shown in FIG. 3, when the external force (pressure received from the laminating press heating platen 3) is not applied to the displacement prevention pressing portion 2, the movable side piece portion 2b is in a lowered state, and the laminating bonding step is performed. When the external force is applied by the pressure from the laminating press heating platen 3, the temperature rises. Furthermore, it is preferable that the strength, size, and arrangement are such that displacement of the laminate during heating and pressing can be prevented and suppressed.

Next, regarding the outer dimensions of the displacement prevention metal plate 1, it depends on the size of the laminate, of course, but from the allowable displacement of the laminate that affects workability and quality,
It is preferable to increase the external dimensions of the metal plates 5a, 5b such as mirror-finished plates by about 10 mm.

[0021]

As described above, according to the present invention, in the step of laminating and adhering the multilayer substrate by the mass lamination method,
Displacement prevention that prevents displacement of inner layer plates and metal plates Heats by using an expansion mechanism that expands when the pressure received from the laminating press heating platen is not applied to the displacement prevention holding part of the metal plate and contracts when pressure is applied. By performing lamination molding by pressurization, it is of course possible to perform lamination adhesion by a mass lamination method using a prepreg having a high resin content for improving heat resistance, One type of metal plate that prevents misalignment can be used to cope with changes.

Further, if the total laminate thickness is within the stroke range of the expansion / contraction mechanism, it is possible to suppress the displacement of all the metal plates such as the inner layer plate and the mirror plate more than the conventionally known technique.

[Brief description of drawings]

FIG. 1 is an explanatory view of a method for manufacturing a multilayer substrate of the present invention.

FIG. 2 is a perspective view of a displacement-preventing metal plate used in the method for manufacturing a multilayer substrate of the present invention.

FIG. 3 is an explanatory diagram of a state in which an external force is not applied to the displacement prevention pressing portion of the displacement prevention metal plate.

FIG. 4 is an explanatory diagram of a state in which an external force is applied to the displacement prevention pressing portion of the displacement prevention metal plate.

FIG. 5 is a cross-sectional view showing a displacement of a laminate such as an inner layer plate in the manufacturing method by the mass lamination method.

FIG. 6 is a perspective view of a displacement prevention metal plate used in a conventional method for manufacturing a multilayer substrate.

[Explanation of symbols]

 1 Metal Plate for Preventing Displacement 2 Pressing Section for Preventing Displacement 2a Fixed Side Piece 2b Movable Side Piece 3 Laminate Press Hot Plate 4 Cushion Material 5a Metal Plate for Jig 5b Metal Plate for Mirror Plate 6 Copper Clad for Outer Layer or Copper Clad for Outer Layer Laminated board 7 Prepreg 8 Inner layer board 9 Tray board 10 Multilayer board 13 Expansion mechanism

Claims (1)

[Claims] 1. A displacement prevention presser for a metal plate, which prevents displacement of an inner layer plate or a metal plate in a lamination bonding process of a multilayer substrate by a mass lamination method,
A method for producing a multi-layer substrate, which comprises laminating and molding by heating and pressing using an expansion mechanism which expands when pressure applied from a laminating press hot platen or the like is not applied and contracts when pressure is applied.