JPH0739942B2 - Appearance inspection device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a visual inspection apparatus for inspecting the external contour of a sample such as a rectangular plate chip fixed resistor, a laminated ceramic chip capacitor, etc. and the external appearance of the front, back and side surfaces. Regarding

[0002]

2. Description of the Related Art If a chip-shaped electronic component such as a rectangular plate-shaped chip-fixed resistor is not operating normally, problems will occur when it is mounted on a printed circuit board. In order to prevent such troubles, it is necessary to inspect the external appearance of the chip-shaped electronic component, that is, the external contour and the state of the front surface, the back surface, and the side surface. Conventionally, in order to inspect the appearance of a chip-shaped electronic component, the chip-shaped electronic component is encapsulated in a tape for taping and wound on a reel, and when this taping tape is rewound onto another reel, The appearance and defects of the appearance are visually judged from the cover tape.

Further, conventionally, in order to automatically inspect the external appearance of a sample, a structure is known in which the sample is illuminated by a light source and the external appearance of the illuminated sample is grasped by an image processing technique. ing.

[0004]

By the way, in recent years, electronic components are becoming more and more miniaturized, and, for example, a square plate chip fixed resistor is becoming a size of several mm square to 1 mm square. With the naked eye inspection method like the example,
It cannot cope with miniaturization of electronic parts. Further, recently, a high inspection speed of about 1000 pieces per minute has been demanded, but such an inspection speed cannot be achieved at all by a naked eye inspection method. In addition, the naked eye inspection method may cause an inspection error due to fatigue, increase the inspection cost, and increase the cost of the chip-shaped electronic component.

On the other hand, in the image processing method of the above-mentioned conventional example, only the outer contour and the surface state of the sample are imaged, and the state of the back surface or the side surface cannot be imaged.

In recent years, an apparatus for inspecting an electronic component in a taping state by using an optical sensor or a capacitance sensor has been put into practical use, but this apparatus can only perform a simple inspection for the presence or absence of an electronic component. Can not.

The present invention solves the above-mentioned conventional problems. In addition to an image of the outer contour and surface state of a sample such as a chip-shaped electronic component conveyed by using an image pickup device, the back surface state and It is possible to obtain an image of the lateral state, and therefore, it is possible to respond to the miniaturization of the sample and the increase in the inspection speed, and it is possible to inspect whether the entire sample is normal or not. An object is to provide a visual inspection device.

[0008]

The technical means of the present invention for achieving the above object is to provide a mirror which is a traveling guide,
Conveying means for conveying the specimen on the mirror, illuminating means for illuminating the outer contour of the conveyed specimen from the surface side, and an imaging device for imaging the outer contour, and illuminating the surface of the conveyed specimen. An illuminating means and an imaging device for imaging the surface state, an illuminating means for illuminating the back surface of the transported sample by using the reflection of the mirror, and an imaging device for imaging the back surface state, and a transport direction of the transported sample. An illuminating means for illuminating the side surface in a direction perpendicular to the side surface and an imaging device for imaging the side surface state, and an illuminating means and a side surface state for illuminating the side surface parallel to the transport direction of the sample to be transported. And an image pickup device for picking up an image.

Another technical means of the present invention for attaining the above object is to provide a mirror which is a traveling guide, a transportation means for transporting a sample on the mirror, and an outer contour of the transported sample from the surface side. For illuminating and the imaging device for imaging the outer contour, the illuminating device for illuminating the surface of the transported sample and the imaging device for imaging the surface condition, and the rear surface of the transported sample for the mirror. An illuminating means for illuminating using reflection and an imaging device for imaging the backside state, and an illuminating means for illuminating the side surface of the transported sample in the direction perpendicular to the transport direction using the reflection of the mirror and the side surface state. And an image pickup device for picking up an image of the state of the side face of the sample to be transported, the illumination means for illuminating the side face in the direction parallel to the transport direction by utilizing the reflection of the mirror. A.

Another technical means of the present invention for achieving the above object is to provide a half mirror which is a traveling guide, a transporting means for transporting a sample on the half mirror, and a surface side of the transported sample. An illuminating means for illuminating for the outer contour and an imaging device for imaging the outer contour, an illuminating means for illuminating the surface of the transported sample, and an imaging device for imaging the surface condition, and the back surface of the transported sample for the back surface. Illuminating means for illuminating through a half mirror and an imaging device for imaging the back surface state, and illuminating means for illuminating the side surface of the sample to be transported in the direction perpendicular to the transport direction by utilizing the reflection of the half mirror and the side surface state An imaging device for imaging
It is provided with an illuminating means for illuminating a side surface of the transported sample in a direction parallel to the transport direction and an imaging device for capturing an image of the side surface state.

Another technical means of the present invention for achieving the above object is to provide a half mirror which is a traveling guide, a transporting means for transporting a sample on the half mirror, and a surface side of the transported sample. An illuminating means for illuminating for the outer contour and an imaging device for imaging the outer contour, an illuminating means for illuminating the surface of the transported sample, and an imaging device for imaging the surface condition, and the back surface of the transported sample for the back surface. Illuminating means for illuminating through a half mirror and an imaging device for imaging the back surface state, and illuminating means for illuminating the side surface of the sample to be transported in the direction perpendicular to the transport direction by utilizing the reflection of the half mirror and the side surface state An imaging device for imaging
It is provided with an illuminating means for illuminating the side surface of the transported sample in the direction parallel to the transport direction by utilizing the reflection of the half mirror, and an imaging device for imaging the state of the side surface.

Still another technical means of the present invention for achieving the above-mentioned object is to use the external contour illuminating means and the image pickup device and the surface state illuminating means and the image pickup device in each of the above technical means. It is a thing.

A belt made of a non-magnetic material, which is provided so as to be able to travel along the back surface of the mirror, is attached to the belt at a desired interval as a conveying means in each of the technical means using the mirror. A magnet for adsorbing the sample on the surface of the mirror can be provided. Also,
As a transporting means in each of the above technical means using a mirror, or a half mirror, a transparent plastic tape that is provided movably on the mirror and in which concave portions for sample storage are arranged can be provided, Alternatively, it may be provided with a transparent plastic tape movably provided on the mirror and provided with rows of sample storage holes.

Further, the sample can be continuously transported or intermittently transported. Examples of the specimen include electronic components such as a square plate chip fixed resistor and a chip capacitor, and solid substances such as tablets.

[0015]

Therefore, according to the present invention, while the sample is being transported on the mirror or the half mirror, the surface of the sample is illuminated, the outer contour of the sample and the state of the surface are imaged, and the rear surface of the sample is mirrored. Illuminate using reflection or transmit through a half mirror, image the state of the back surface, illuminate each side of the sample using the reflection of a mirror or half mirror, or with the transport direction of the sample. The side surface in the parallel direction is illuminated, and the side surface perpendicular to the transport direction of the sample is illuminated by using the reflection of the mirror or the half mirror, and the state of the side surface is imaged. Thus, by using the imaging device, it is possible to obtain images of the back surface state and the side surface state in addition to the image of the outer contour and the surface state of the transported sample.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to the drawings. 1 to 8 show a first embodiment of the present invention.
1 shows a partially broken front view, and FIG. 2 shows an illuminating means and an imaging device on the back surface of the sample, and an illuminating means and an imaging device on the side surface perpendicular to the transport direction of the sample. 3 and 4 show the conveying device, respectively, and a partially cutaway side view, and a partially enlarged view of FIGS. 1 and 2, and FIG.
Is an explanatory view of the appearance inspection operation of the side surface perpendicular to the transport direction of the sample, FIG. 6 is an explanatory view of the appearance inspection operation of the front surface of the sample, FIG. 7 is an explanatory view of the appearance inspection operation of the back surface of the sample, and FIG. 8 is the transport direction of the sample. FIG. 6 is an explanatory diagram showing an appearance inspection operation of a side surface in a direction parallel to.

In the present embodiment, as is apparent from the explanatory view of the appearance inspection surface of the chip-shaped electronic component (the rectangular plate-shaped chip fixed resistor in the illustrated example) which is the sample shown in FIG. The outline 1A of the chip component 1), the state of the front surface 1B, the state of the back surface 1C, and the states of the four side surfaces 1D to 1G are imaged.

As shown in FIGS. 1 to 4, a mirror 11 as a traveling guide is provided in the horizontal direction. A conveyor belt 12 is provided so as to be able to travel along the back surface of the mirror 11. Conveying belt 12 has non-magnetic material belt 13 having recessed portions 14 arranged in rows at desired intervals, magnets 15 are attached to each recessed portion 14, and magnets 15 serve as mirrors 1.
1 can be run along the back surface. Then, the conductive parts such as the electrodes of the chip component 1 supplied onto the mirror 11 are attracted by the magnet 11 of the conveyor belt 12, and the chip component 1 can be conveyed on the mirror 11 as the conveyor belt 12 travels. .

Illuminating means 16, 18, 20, 22, 24, 26, 28 and image pickup devices 17, 19, 21, 23, 25, 27, 29 are sequentially provided along the carrying direction of the chip component 1. The illuminating means 16 illuminates the rear side surface 1D in a direction perpendicular to the conveying direction of the chip component 1, and the imaging device 17
Captures the state of the side surface 1D illuminated by the illumination means 16. The illuminating means 18 illuminates for imaging the outer contour 1A of the chip component 1, and the imaging device 19 images the outer contour 1A illuminated by the illuminating means 18. The illumination unit 20 illuminates the surface 1B of the chip component 1, and the imaging device 20 images the state of the surface 1B illuminated by the illumination unit 20. The illumination unit 22 illuminates the back surface 1C of the chip component, and the imaging device 23 images the state of the back surface 1C illuminated by the illumination unit 22. The illuminating means 24 illuminates the front side surface 1E in a direction perpendicular to the conveying direction of the chip component 1, and the imaging device 25 images the state of the side surface 1E illuminated by the illuminating means 24.
The illuminating means 26 illuminates one side surface 1F in a direction parallel to the conveying direction of the chip component 1, and the imaging device 27 images the state of the side surface 1F illuminated by the illuminating means 26. Lighting means 2
Reference numeral 8 is a direction parallel to the conveying direction of the chip component 1 and the other side surface 1
G is illuminated, and the imaging device 29 images the state of the side surface 1G illuminated by the illumination means 28. Each lighting means 16, 1
8, 20, 22, 24, 26, 28 and each imaging device 1
7, 19, 21, 23, 25, 27 and 29 have the same configuration. Each lighting means 16, 18, 20, 2
Reference numerals 2, 24, 26 and 28 each include a light source (not shown) such as a halogen lamp and an optical fiber 30 that guides the light emitted from the light source. A mirror 32 is provided. Each of the image pickup devices 17, 19, 21, 23, 25, 27, 29 has an image pickup camera (CCD camera) 34 in a case 33. Each lighting means 16, 18, 20, 22, 24, 2
A pair of emission parts 31 of 6, 28 are provided, and the imaging devices 17, 19, 21, 23, 25, 2 are provided between the pair of emission parts 31.
7 and 29 image pickup cameras 34 are arranged.

Illuminating means 16 on side surface 1D and image pickup apparatus 1
7 uses the reflection of the mirror 11 to illuminate the side surface 1D,
It is obliquely arranged above the mirror 11 so that the state of the side surface 1D can be imaged by utilizing the reflection of the mirror 11 (see FIG. 5). Illumination means 18 with outer contour 1A
The image pickup device 19 directly illuminates the front surface 1B side so that the outer contour 1A can be directly imaged.
Is vertically arranged above (see FIG. 6). The illumination means 20 and the imaging device 21 on the surface 1B are vertically arranged above the mirror 11 so that the surface 1B can be directly illuminated and the state of the surface 1B can be directly imaged (see FIG. 6). The illuminating means 22 and the image pickup device 23 on the rear surface 1C illuminate the rear surface 1C by utilizing the reflection of the mirror 11, and above the mirror 11 so that the state of the rear surface 1C can be imaged by utilizing the reflection of the mirror 11. And are arranged diagonally (see FIG. 7). Lighting means 24 on the side surface 1E
And the imaging device 25 uses the reflection of the mirror 11 to illuminate the side surface 1E, and uses the reflection of the mirror 11 to generate the side surface 1E.
It is obliquely arranged above the mirror 11 so that the above state can be imaged (see FIG. 5). The illuminating means 26 and the imaging device 27 on the side surface 1F are horizontally arranged laterally of the mirror 11 so that the side surface 1F can be directly illuminated and the state of the side surface 1F can be directly imaged. The illuminating means 28 and the imaging device 29 have a side surface 1G.
Is arranged horizontally in the lateral direction of the mirror 11 so that the state of the side surface 1G can be directly imaged (see FIG. 8). As described above, each lighting means 16, 18,
20, 22, 24, 26, 28 are the image pickup devices 17, 1
Although arranged on both sides of 9, 21, 23, 25, 27, 29, by illuminating from two directions on both sides by the reflection mirror 32, the entire surface of each chip component 1 is illuminated with uniform brightness. be able to.

The operation of the above configuration will be described below. Chip parts 1 supplied on the mirror 11
As the conveyor belt 12 travels, the magnets 15 attract the magnets 15 to successively convey the toner onto the mirror 11. In the middle of this transportation, as shown in FIGS. 1, 2 and 5, the reflection part of the mirror 11 is used by the emitting part 31 of the illumination means 16 to reflect the rear side surface 1D in the direction perpendicular to the transportation direction of the chip component 1. The imaging camera 34 of the imaging device 27 illuminates and reflects the reflected light.
And image the state of the side surface 1D. At this time, since the image pickup camera 34 is obliquely arranged, the image pickup area becomes smaller than the actual side surface 1D area, so the image pickup area is converted to be equal to the actual side surface 1D size.
Subsequently, as shown in FIGS. 1, 2, and 6, the emitting portion 31 of the illuminating means 18 directly illuminates the front surface 1B side of the chip component 1, and the reflected light is guided to the image capturing camera 34 of the image capturing device 19, and the chip The outer contour 1A of the component 1 is imaged. Subsequently, the emitting portion 31 of the illuminating means 20 causes the surface 1B of the chip component 1
Is directly illuminated, and the reflected light is guided to the image pickup camera 34 of the image pickup device 21 to image the state of the surface 1B. Continuing with Figure 1,
As shown in FIGS. 2 and 7, the emission unit 31 of the illumination unit 22 illuminates the back surface 1C of the chip component 1 by using the reflection of the mirror 11, and the reflected light is captured by the image pickup camera 3 of the image pickup device 23.
4 and image the state of the back surface 1C. At this time, since the imaging area is smaller than the actual area of the back surface 1C as in the case of imaging the side surface 1D, the conversion is performed so that the areas are equal in size. Subsequently, as shown in FIGS. 1, 2, and 5, the front side surface 1E in the direction perpendicular to the conveying direction of the chip component 1 is moved to the front side surface 1E by the emitting portion 31 of the illuminating means 24, as in the case of the side surface 1D. Illumination is performed by using reflection, and the reflected light is guided to the image pickup camera 34 of the image pickup device 25, and the state of the side surface 1E is imaged. Subsequently, as shown in FIGS. 1, 2 and 8, one side face 1F is directly illuminated by the emission part 31 of the illumination means 26 in the direction parallel to the conveying direction of the chip component 1, and the reflected light is imaged by the imaging device 27. The camera is guided to the camera 34 and the state of the side surface 1F is imaged. Subsequently, the emitting portion of the illuminating means 28 directly illuminates the other side surface 1G in the direction parallel to the conveying direction of the chip component 1, guides the reflected light to the image pickup camera 34 of the image pickup device 29, and images the state of the side surface 1G.

As an example of the method of detecting the chip component 1,
The images obtained by the image pickup devices 17, 19, 21, 23, 25, 27, 29 are subjected to image processing, and the data of the non-defective product and the allowable error from this data are registered in the memory in advance. Compare images on memory. In addition, a detection method such as determining the linearity of the outer contour of the chip component 1 can be adopted.

When the chip component 1 is a fixed resistor, as shown in FIG. 20 (a), if the external contour, surface, etc. of the chip resistor 1 are normal, the appearance inspection result is normal. Therefore, the chip resistor 1 is continuously conveyed by the traveling of the conveyor belt 12, and the visual inspection work is continued. Examples of defects that can be detected by the present invention include a state in which the outer edge portion of the chip resistor 1 is missing, a state in which the chip resistor 1 is cracked, a defective state in the electrodes of the chip resistor 1, and a chip resistor 1
Is a defective state in which the coat layer is lacking, a defective state in which the resistance value of the chip resistor 1 is displayed, and the like. Also, when the chip component 1 is a capacitor, as an example of defects that can be detected,
It is the same as the case of the chip resistor, except that the display of the resistance value is defective. When such various kinds of defects are detected, the conveyance belt 12 is stopped to move, the conveyance of the chip component 1 is stopped, and the defective chip component 1 is removed from the mirror 11.

The second embodiment of the present invention will be described below with reference to the drawings. 9 to 13 show an appearance inspection apparatus according to a second embodiment of the present invention, FIG. 9 is a partially cutaway front view, and FIG. 10 omits an illuminating means and an image pickup apparatus on a side surface in a direction perpendicular to a sample transport direction. Partially broken side view,
11 and 12 show the transport device, respectively, and FIG. 9 and FIG.
FIG. 13 is a partially enlarged view of No. 0, and FIG. 13 is an explanatory view of the appearance inspection operation of the back surface of the sample.

In this embodiment, as shown in FIGS. 9 to 12, a half mirror 35 as a running guide is provided in the horizontal direction, and a transparent plastic tape 36 runs along the surface of the half mirror 35. To be done. Tape 3
6 are provided with recesses 37, and the chip parts 1 are housed in the recesses 37. Therefore, as the tape 36 runs, the chip components 1 housed in the respective recessed portions 37 are conveyed on the half mirror 35. A pop-out prevention plate 38 made of transparent glass is provided in the horizontal direction on the upper portion of the tape 36, and when the chip component 1 is conveyed as the tape 36 travels,
The chip component 1 is prevented from popping out from the recess 37. The illuminating means 22 and the imaging device 23 on the back surface 1C of the chip component 1 are transmitted through the half mirror 35 and the back surface 1C.
It is arranged below the half mirror 35 in the vertical direction so that C can be illuminated and the state of the back surface 1C can be imaged through the half mirror 35. Then, the emission unit 31 of the illumination unit 22 illuminates the back surface 1C of the chip component 1 through the half mirror 35, guides the reflected light to the image pickup camera 34 of the image pickup device 23, and images the state of the back surface 1C. ing. Since the other structure is the same as that of the first embodiment, the same parts as those of the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

The third embodiment of the present invention will be described below with reference to the drawings. 14 and 15 show the third embodiment of the present invention.
14 is a partially cutaway front view similar to FIG. 11, and FIG. 15 is a partially cutaway side view similar to FIG.

In this embodiment, FIG. 14 and FIG.
As shown in FIG. 3, holes 40 are arranged in a row in the transparent plastic tape 39, and the chip parts 1 are housed in the respective holes 40.
The chip component 1 is conveyed on the half mirror 35 by the tape 39 running between the half mirror 35 and the pop-out prevention plate 38 made of transparent glass. Other configurations are the same as those in the second embodiment.

A fourth embodiment of the present invention will be described below with reference to the drawings. FIG. 16 shows the appearance inspection apparatus in the fourth embodiment of the present invention, and is an explanatory view of the appearance inspection operation of the side surface in the direction parallel to the sample transport direction.

In the present embodiment, as shown in FIG. 16, a side surface 1F (1
G) is illuminated by the emitting unit 31 of the illumination means 24 (26) by using the reflection of the mirror 11 or the half mirror 35, and the reflected light is captured by the imaging camera 3 of the imaging device 27 (29).
4 and the state of the side surface 1F (1G) is imaged. For other configurations, the above first and second
It is similar to the embodiment of.

FIG. 17 shows a modification of the illumination method for the outer contour 1A or the illumination method for the surface 1B of the chip part 1 in the first and second embodiments. In this example, as shown in FIG. 17, the illumination means 18 or 20
The light emitted from the light emitting portion 31 is guided to the surface 1B of the chip component 1 via the reflection mirror 41 and illuminated. The illumination system of this example is based on the back surface 1C of the chip component 1,
It can also be applied to the illumination of the side surfaces 1D to 1G.

FIG. 18 shows a modification of the image pickup method of the back surface 1C of the chip part 1 in the first embodiment. In this example, as shown in FIG. 18, when imaging is performed by using the reflection of the mirror 11 of the back surface 1C of the chip component 1 or the half mirror 35, the reflection is further reflected by the reflection mirror 42 and the actual back surface 1C is obtained. Image pickup device 2
The image is picked up according to 3. In the imaging method of this example, the side surfaces 1D to 1E of the chip component 1 are mirror 1
The present invention can also be applied to the case where an image is captured by using the reflection of 1 or the half mirror 35.

In the second and third embodiments as well, the half mirror 35 may be replaced with a mirror, and the back surface 1C of the chip component 1 can be illuminated and imaged from above the mirror using a reflection method. Further, as a conveying means of the chip component 1, a pallet-like mirror is connected by a connecting member so that the chip component 1 travels, and the chip component 1 supplied on the front surface of each mirror is attracted by a magnet attached to the back surface of each mirror. You may hold and convey by this. Further, any one of the external contour illuminating means 18 and the image pickup device 19 and the surface illuminating means 20 and the image pickup device 21 can be used. Further, the chip component 1 may be conveyed continuously or intermittently. In addition to the above, the present invention can be modified in various ways without departing from the basic technical idea thereof.

[0033]

As described above, according to the present invention, the surface of the sample is illuminated while the sample is being transported on the mirror or the half mirror, and the outer contour and surface condition of the sample are imaged. The back surface of the sample is illuminated by using the reflection of a mirror, or is transmitted through a half mirror, and the state of the back surface is imaged, and each side of the sample is illuminated by using the reflection of a mirror or a half mirror, or The side surface parallel to the sample transport direction is illuminated, and the side surface perpendicular to the sample transport direction is illuminated using the reflection of a mirror or a half mirror to image the state of the side surface. Thus, by using the imaging device, it is possible to obtain images of the back surface state and the side surface state in addition to the image of the outer contour and the surface state of the transported sample. Therefore, it is possible to cope with the miniaturization of the sample and the increase in the inspection speed, and it is possible to inspect whether or not the entire sample is normal.

[Brief description of drawings]

FIG. 1 is a partially cutaway front view showing an appearance inspection apparatus according to a first embodiment of the present invention.

FIG. 2 is a partially cutaway side view showing the appearance inspection apparatus, omitting an illuminating unit and an imaging device on a back surface of the sample and an illuminating unit and an imaging device on a side surface in a direction perpendicular to the transport direction of the sample.

FIG. 3 shows a transfer device used in the appearance inspection apparatus, and FIG.
Partly enlarged view of

FIG. 4 is a view showing a transfer device used in the appearance inspection apparatus, and FIG.
Partly enlarged view of

FIG. 5 is a diagram showing the appearance inspection apparatus, showing the appearance inspection operation of a side surface perpendicular to the sample transport direction.

FIG. 6 is a diagram showing the appearance inspection apparatus, illustrating the appearance inspection operation on the back surface of the sample.

FIG. 7 is a diagram showing the appearance inspection apparatus, illustrating the appearance inspection operation on the back surface of the sample.

FIG. 8 is an explanatory diagram showing the appearance inspection operation of the side surface in the direction parallel to the sample transport direction, showing the appearance inspection apparatus.

FIG. 9 is a partially cutaway front view showing an appearance inspection device according to a second embodiment of the present invention.

FIG. 10 is a partially cutaway side view showing the appearance inspection apparatus, omitting an illuminating unit and an imaging device on a side surface in a direction perpendicular to a sample transport direction.

11 is a partially enlarged view of FIG. 9 showing a carrying device used in the appearance inspection device.

FIG. 12 is a partially enlarged view of FIG. 10 showing a carrying device used in the appearance inspection device.

FIG. 13 is a diagram showing the appearance inspection apparatus, which is an explanatory view of the appearance inspection operation on the back surface of the sample.

FIG. 14 is a partially cutaway front view similar to FIG. 11, showing a carrying device used in the visual inspection device according to the third embodiment of the present invention.

FIG. 15 is a partially cutaway side view showing the same conveying device as in FIG.

FIG. 16 is an explanatory diagram showing the appearance inspection operation of the side surface in the direction parallel to the sample transport direction, showing the appearance inspection device according to the fourth embodiment of the present invention.

FIG. 17 is an explanatory diagram showing a modified example of the outer contour of the sample and the illumination system of the surface in the first and second embodiments.

FIG. 18 is an explanatory diagram showing a modification of the imaging method for the back surface of the sample in the first embodiment.

FIG. 19 is an explanatory diagram of an appearance inspection surface of a chip-shaped electronic component which is an inspection target of the appearance inspection device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip-shaped electronic component (sample) 1A Outer contour 1B Front surface 1C Back surface 1D Side surface 1E Side surface 1F Side surface 1G Side surface 11 Mirror 12 Conveyor belt 15 Magnet 16 Side surface 1D illumination means 17 Side surface 1D imaging device 18 Exterior contour 1A illumination means 19 Imaging device 1A of external contour 20 Illuminating means of surface 1B 21 Imaging device of surface 1B 22 Illuminating means of back surface 1C 23 Illuminating device of back surface 1C 24 Illuminating means of side surface 1E 25 Imaging device of side surface 1E 26 Illuminating means of side surface 1F 27 Side surface 1F image pickup device 28 Side face 1G illumination means 29 Side face 1G image pickup device 35 Half mirror 36 Tape 37 Recessed portion 39 Tape 40 hole

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-64-26104 (JP, A) JP-A-3-137502 (JP, A) JP-A 62-119404 (JP, A) JP-A 63- 61105 (JP, A)

Claims (8)

[Claims] 1. A mirror which is a traveling guide, a transport means for transporting a sample on the mirror, an illuminating means for illuminating from the surface side of the transported sample for an outer contour, and an imaging device for imaging the outer contour. An imaging device for illuminating the surface of the transported sample and an imaging device for imaging the surface state; and an illuminating device for illuminating the back surface of the sample for transportation by using the reflection of the mirror and the back surface condition. An imaging device, an illuminating means for illuminating a side surface of the transported sample in a direction perpendicular to the transportation direction by using reflection of the mirror, and an imaging device for imaging a side surface state, and a direction parallel to the transportation direction of the transported sample. A visual inspection apparatus comprising: an illumination unit that illuminates a side surface in a direction and an imaging device that images a side surface state. 2. A mirror which is a traveling guide, a transport means for transporting a sample on the mirror, an illuminating means for illuminating from the surface side of the transported sample for an outer contour, and an imaging device for imaging the outer contour. An imaging device for illuminating the surface of the transported sample and an imaging device for imaging the surface state; and an illuminating device for illuminating the back surface of the sample for transportation by using the reflection of the mirror and the back surface condition. An imaging device, an illuminating means for illuminating a side surface of the transported sample in a direction perpendicular to the transportation direction by using reflection of the mirror, and an imaging device for imaging a side surface state, and a direction parallel to the transportation direction of the transported sample. A visual inspection apparatus comprising: an illuminating means for illuminating a side surface in a direction by utilizing the reflection of the mirror; and an imaging device for imaging a side surface state. 3. A half mirror which is a traveling guide, a transporting means for transporting a sample on the half mirror, an illuminating means for illuminating from the surface side of the transported sample for an outer contour and an outer contour. Imaging device, illuminating means for illuminating the surface of the transported sample, and an imaging device for imaging the surface state, and illuminating means for illuminating the back surface of the transported sample for illuminating the half mirror and imaging the back surface state Image pickup device, an illuminating means for illuminating the side surface of the conveyed sample in the direction perpendicular to the conveying direction by using the reflection of the half mirror, and an image pickup device for photographing the side surface state, and the conveying direction of the conveyed sample. And an imaging device for illuminating a side surface in a parallel direction and an imaging device for imaging a side surface state. 4. A half mirror which is a traveling guide, a transport means for transporting a sample on the half mirror, an illuminating means for illuminating from the surface side of the transported sample for an outer contour, and an outer contour imaged. Imaging device, illuminating means for illuminating the surface of the transported sample, and an imaging device for imaging the surface state, and illuminating means for illuminating the back surface of the transported sample for illuminating the half mirror and imaging the back surface state Image pickup device, an illuminating means for illuminating the side surface of the conveyed sample in the direction perpendicular to the conveying direction by using the reflection of the half mirror, and an image pickup device for photographing the side surface state, and the conveying direction of the conveyed sample. And an image pickup device for picking up an image of the state of the side surface, and an illuminating means for illuminating the side surface parallel to the side surface by using the reflection of the half mirror. 5. An outer contour illuminating means and an imaging device,
The visual inspection apparatus according to any one of claims 1 to 4, wherein the surface state illuminating unit is also used as an imaging device. 6. A belt made of a non-magnetic material, wherein the transporting means is provided so as to be able to travel along the back surface of the mirror, and a magnet attached to the belt at a desired interval to attract a sample on the front surface of the mirror. The visual inspection device according to claim 1, 2 or 5, which is provided. 7. The appearance inspection according to claim 1, further comprising a transparent plastic tape in which the transport means is movably provided on the mirror and in which concave portions for storing a sample are arranged. apparatus. 8. The appearance inspection apparatus according to claim 1, further comprising a transparent plastic tape in which the transporting means is movably provided on the mirror and in which holes for storing the specimen are arranged. .