JPH0749934B2 - Appearance inspection system for semiconductor devices - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a visual inspection apparatus for a semiconductor device that illuminates a semiconductor device, simultaneously captures an image, and performs visual inspection based on the image.

[Conventional technology]

Conventionally, a semiconductor device appearance inspection apparatus of this type has a configuration as schematically shown in FIG. This will be briefly described. In the figure, reference numeral 1 is a semiconductor device as an inspection object, and 2 is a guide rail inclined so that the semiconductor device 1 is sequentially slid and conveyed, and from the upstream side of the guide rail 2. Inspecting units 3 to 6 for inspecting the appearance of the semiconductor device 1 were arranged at predetermined intervals at four locations extending to the downstream side. That is, the semiconductor device 1 is used as the inspection target portion when performing the appearance inspection of this type of semiconductor device.
There is a mark surface on the upper side, lead side surfaces on both the left and right sides of the device and lead tips (rear surface of the lead) from the lower part of the device, and inspection parts 3 to 6 for visual inspection from these four sides are provided along the guide rail 2. It was configured to be arranged.

Here, each of the inspection units 3 to 6 as described above includes the guide rail 2
Sensors 7a, 7b for detecting the presence or absence of the semiconductor device 1 above,
An illumination device 8 for flash-illuminating the semiconductor device 1 by the detection signal, and a TV camera 9 for taking an image of each inspection portion of the semiconductor device 1 simultaneously with the illumination by the illumination device 8 are provided. It should be noted that the illumination devices 8 (8a, 8b) in the lead back surface inspection section 5 among the above-described inspection sections are arranged at two locations on both sides of the guide rail 2. Further, in this conventional example, a case where one lead side surface inspection section 3, the other lead side surface inspection section 4, the lead back surface inspection section 5, and the mark surface inspection section 6 are arranged in this order from the upstream of the guide rail 2 is illustrated. ing.

Then, according to the conventional visual inspection apparatus having such a configuration, the semiconductor devices 1 are conveyed one by one on the guide rails 2, so that each inspection portion of the semiconductor device 1 is
By sequentially photographing with the TV camera 9 in each of the above-mentioned inspection units 3 to 6 and inspecting the photographed images with an image inspection processing unit (not shown), visual inspection such as non-defective product or defective product can be performed. Met. A classification processing mechanism (not shown) for classifying the semiconductor device 1 into a non-defective product and a defective product based on the above-described inspection result is provided on the downstream side of the guide rail 2, and one semiconductor device 1 is provided. It was classified and accumulated one by one.

[Problems to be solved by the invention]

However, according to the conventional appearance inspection device having the above-described structure, the lead side surface inspection portions 3 and 4, the lead back surface inspection portion 5, and the mark surface inspection portion 6 are provided at four locations along the guide rail 2.
It is necessary to arrange each of these inspection parts 3
~ 6 In order to avoid the influence of illumination between each other, each inspection unit must be arranged to some extent,
As a result, there is a problem that a large arrangement space is required and the size of the entire apparatus is increased. Of course, it is conceivable that a light-shielding plate is provided between the inspection units 3 to 6 to narrow the gap, but there is a limit, and each inspection unit is used to detect the presence or absence of a semiconductor device. I need a sensor,
This was a problem due to the number of parts and the configuration.

Further, in such a side-by-side structure of a plurality of inspection units, since the distance from the semiconductor device delivery mechanism on the upstream side of the guide rail 2 to the final inspection unit 6 is large, it takes a long time to carry it.
In order to perform an efficient inspection process, it is desirable to sequentially send out the next semiconductor device 1 before the inspection of the preceding semiconductor device 1 is completed. In such a case, a jam is generated on the conveyance path. However, there is a problem in that it takes time to restore such a situation, and it is necessary to take some measures in consideration of these points.

The present invention has been made in view of the above-mentioned circumstances, and is a space-saving type capable of simultaneously and easily inspecting the left and right lead side surfaces, the lead back surface, and the mark surface of a semiconductor device at one place on a guide rail. It is an object of the present invention to obtain a semiconductor device appearance inspection device having high device reliability.

[Means for Solving the Problems] The appearance inspection apparatus for a semiconductor device according to the present invention includes: an illumination device for inspecting the left, right lead side surface, lead back surface and mark surface of the semiconductor device; The light guide plate is arranged at the same position on the guide rail so as to surround it, and a light shielding plate is provided so that the illumination in each of these inspection units does not affect the TV cameras in other detection units.

[Action]

According to the present invention, because of the presence of the light-shielding plate provided for shielding between the inspection units, the light is shielded so that the influence of the illumination in each inspection unit does not reach the TV cameras in the other inspection units. Images of the left and right lead side surfaces, the lead back surface, and the mark surface of the semiconductor device can be simultaneously photographed at one place on the guide rail by flash illumination of each illuminating device by a detection signal from one sensor.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the drawings.

1 and 2 show an embodiment of the appearance inspection apparatus for semiconductor devices according to the present invention. In these figures, the same or corresponding parts as those in FIG. The description thereof will be omitted.

According to the present invention, a sensor (not shown) for detecting the presence / absence of the semiconductor device 1 on the guide rail 2 is attached at one location, and the left, right lead side surface, lead rear surface, and Lighting device for inspecting mark surface 8; 8
a, 8b and the inspection units 3 to 6 by the TV camera 9 are arranged so as to surround the periphery at the same position on the guide rail 2 in the transport direction, and the illumination in the inspection units 3 to 6 is performed. Is characterized in that the light-shielding plates 10 to 13 are provided so as not to affect the TV camera 9 in other inspection parts. In addition,
In the figure, reference numeral 14 denotes an upper rail arranged on the guide rail 2 so as to cover the transport path of the semiconductor device 1.

This will be described in detail. The above-mentioned light-shielding plates 10 to 13 are provided around the guide rail 2, that is, between the inspection units 3 to 6 arranged on the upper, lower, left and right sides of the guide rail 2 from the illumination devices 8; The light should not be directly incident on the TV camera 9 of the other inspection unit, and the left and right lead side surfaces, the lead back surface, and the mark surface of the semiconductor device 1 should not be shaded so as to face the semiconductor device 1 at an angle. It is arranged to be inclined. Further, in the portion of the upper rail 14 facing the TV camera 9 of the mark surface inspecting section 6, as shown in FIG.
Has been drilled. The cutout window 14a prevents the illumination device of the inspection unit 6 from being shaded on the mark surface of the semiconductor device 1 and prevents the illumination light from entering the TV cameras 9 of the other inspection units 3, 4, and 5. It is formed with a size smaller than the mold surface of the semiconductor device 1.

Numerals 15a and 15b in FIG. 1 are light-shielding portions projecting from both sides of the guide surface of the guide rail 2, and when the semiconductor device 1 is floated and conveyed, the left and right lead side surface inspection portions 3, 4 TV
The semiconductor device 1 of the upper rail 14 is provided so that the camera 9 is not affected by the illumination device 8 on the other side.
It is set so that the height from the sliding surface of rail 2 is higher than the gap between and. In addition, reference numerals 16a and 16b in the figure denote light-shielding portions that are provided to face the light-shielding portions 15a and 15b of the guide rail 2 and project toward the upper rail 14 side having the same function.

According to such a configuration, the semiconductor device 1 conveyed on the guide rail 2 is detected by one sensor (not shown), and the inspection signals 3 to 6 are detected by the detection signal.
The inspection devices are illuminated by flashing the illumination devices 8; 8a and 8b. At this time, the inspection units 3 to 6 are shielded by the light shielding plates 10 to 13 and the light from the respective illumination devices 8 does not enter the TV cameras 9 in the other inspection units.
The TV camera 9 photographs the left and right lead side surfaces, the lead back surface, and the mark surface of the semiconductor device 1 illuminated by the respective illumination devices as images. Then, the photographed image is inspected by an image inspection processing unit (not shown), so that the inspection result can be classified into a non-defective product and a defective product.

Therefore, according to the present invention having such a configuration, the inspection space required for performing the appearance inspection of the semiconductor device 1 can be significantly reduced as compared with the conventional one, and the entire device can be downsized and the like. It can be freely combined with the carrier system, the appearance inspection processing time of the semiconductor device 1 can be greatly shortened compared to the conventional one, and its efficiency can be improved. Furthermore, the presence or absence of the semiconductor device 1 on the guide rail 2 can be detected. There is an advantage that only one sensor is required.

It should be noted that the present invention is not limited to the structure of the embodiment described above, and the shape, structure, etc. of each portion can be freely modified or changed. For example, in the above-described embodiment, the case where the semiconductor device 1 is conveyed on the inclined guide rails 2 to perform the visual inspection has been described. Of course, you can do that.

〔The invention's effect〕

As described above, in the appearance inspection apparatus for a semiconductor device according to the present invention, the left and right lead side surfaces of the semiconductor device, the illuminating device for inspecting the lead back surface and the mark surface, and the inspection parts by the TV camera are the same on the guide rail. It is arranged so that it surrounds its surroundings at each location, and a light-shielding plate is provided so that the illumination at each of these inspection units does not affect the TV cameras in other inspection units. In spite of this, the inspection space required for visual inspection of semiconductor devices can be greatly reduced compared to the past, and the overall size of the device can be reduced, and it can be freely combined with the transport system. In addition, the appearance inspection processing time of the semiconductor device can be significantly shortened compared to the conventional one, and its efficiency can be improved.
Further, there are various excellent effects such that one sensor for detecting the presence or absence of the semiconductor device on the guide rail may be sufficient.

In particular, according to the present invention, the presence of the light shielding plate shields the light so that the influence of the illumination in each inspection unit does not affect the TV cameras in other inspection units. Therefore, the semiconductor device is provided at one place on the guide rail. The images of the left and right lead side surfaces, the lead back surface, and the mark surface can be simultaneously photographed by flash illumination of each illuminating device by a detection signal from one sensor.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing one embodiment of a semiconductor device appearance inspection apparatus according to the present invention, FIG.
The figure is a schematic perspective view showing a conventional example. 1 ... Semiconductor device, 2 ... Guide rail, 3,4 ... left,
Right side lead side inspection part, 5 …… Lead back surface (tip end) inspection part, 6 …… mark face inspection part, 8; 8a, 8b …… illuminating device, 9 …… TV camera, 10 to 13 …… Shading Plate, 14 ... Upper rail, 14a ... Notched window, 15a, 15b; 16a, 16b.

Claims (1)

[Claims] 1. An illuminating device for inspecting the left and right lead side surfaces, a lead back surface and a mark surface in a semiconductor device, and inspection parts by a TV camera are provided at the same position on a guide rail for carrying a semiconductor device in the carrying direction. A light-shielding plate, which is disposed so as to surround the periphery and prevents the illumination light from each of the inspection units from entering the TV camera of the other inspection unit, faces the semiconductor device at a predetermined angle between the inspection units. An appearance inspection apparatus for semiconductor devices, characterized in that it is arranged so as to be inclined.