JP2003139516A - Visual inspection device and visual inspection method for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a visual inspection device and a visual inspection method for electronic component capable of reducing the size (saving space) of a facility and inspecting the outline of an electronic component more accurately. SOLUTION: The visual inspection device is provided with a feeder feeding chip components 11, a transparent disc 2 conveying the chip components 11 from the feeder, an image pickup part 6 picking up images of the conveyed chip components 11, and a sorting mechanism sorting the chip components 11 on the basis of quality grades of the chip components 11 determined from pieces of image data picked up by the image pickup part 6. In the image pickup part 6, two cameras 17a and 17b with optical axes facing each other are provided on both sides of each conveyed chip component 11, and illuminating parts 18a and 18b arranged in positions where illuminating light does not enter a visual field of each camera 17a and 17b and illuminating the chip components 11 are provided in regard to each camera 17a and 17b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a visual inspection apparatus and a visual inspection method for electronic parts such as multilayer chip capacitors.

[0002]

2. Description of the Related Art Conventionally, in a visual inspection apparatus, an image is obtained by illuminating only from the camera direction. In this case, as shown in FIG. 16, the outer edge 22 of the electronic component could not be accurately imaged due to the rounded edges of the electronic component. Therefore,
The electronic parts were imaged smaller than their original size, and the appearance could not be accurately inspected. Further, the illumination is used as a backlight from the opposite side of the electronic component only when the electronic component is imaged as a silhouette.

Japanese Unexamined Patent Publication No. 6-054226 discloses a transparent glass disk which is held so as to be rotatable at a constant speed, a guide plate for feeding parts, an alignment roller which rotates at a constant speed with the glass disk, and a glass circle. Disclosed is a chip component visual inspection apparatus having shutter cameras that are installed so as to face the upper surface and the lower surface of a plate and are displaced from each other.

When the illumination is used as a backlight, the backlight is located at a position facing the camera with the electronic parts sandwiched therebetween. Therefore, it is impossible to install a new camera on the opposite side of the electronic parts of the camera. Therefore, in the above appearance inspection apparatus, the cameras are installed so as not to face each other (not to face each other) in order to image both sides of the electronic component.

[0005]

However, when the two cameras are installed so as not to face each other as in the prior art, the cameras are installed in the horizontal direction (the electronic component carrying direction) in the visual inspection apparatus. It is necessary to secure. For this reason, it is difficult to reduce the equipment size (space saving) in the visual inspection apparatus. Further, in the case of synchronous imaging (stroboscopic imaging) or the like, two strobe light sources are required, and a light source installation space is further required.
Therefore, it is difficult to save space.

Furthermore, in order to measure both the surface and the external dimensions of electronic components, two illuminations, a backlight and an illumination from the camera direction, are required for each camera. Further, when a backlight is used, the background of the image becomes white (bright), but when a metal such as an electrode has an outer shape in an electronic component, the edge portion of the electrode is illuminated white by the backlight. Therefore, the boundary between the background and the electrode portion cannot be accurately detected, and the accurate outermost shape of the electronic component cannot be measured.

The present invention has been made in view of the above problems, and an object thereof is to reduce the size of equipment (space saving) and to more accurately inspect the outermost shape of an electronic component. It is to provide a visual inspection device and a visual inspection method for an electronic component, which can perform (improve the inspection accuracy).

[0008]

In order to solve the above problems, an appearance inspection apparatus of the present invention comprises a supply section for supplying electronic parts, a transfer section for transferring the electronic parts from the supply section, and a transfer section. The appearance inspection apparatus includes an image pickup unit that picks up an image of an electronic component that is being recorded, and a sorting mechanism that sorts the electronic component based on the quality of the electronic component that is determined from the image data picked up by the image pickup unit. The image pickup unit is installed at two cameras whose optical axes are opposed to each other with each conveyed electronic component interposed therebetween, and is installed at a position where illumination light does not enter the visual field of each camera to illuminate the electronic component. It is characterized in that a lighting unit is provided for each camera.

With the above arrangement, the image pickup section can simultaneously pick up images of, for example, each side surface of the electronic component. That is, since two images can be taken at the same time at one place, the installation location of the camera can be reduced in the horizontal direction with respect to the transport direction of the electronic component. Therefore, it is possible to save the space of the imaging unit. Furthermore, since the illumination unit is installed at a position where the illumination light does not enter the field of view of each camera, the illumination unit for each camera can face each other. Therefore, the illumination unit that faces the camera with the electronic component interposed therebetween functions as the backlight of each camera. Therefore, even if a backlight for measuring the outermost shape is not newly installed, the edge of the electronic component can be illuminated under a dark background, and the outermost shape of the electronic component can be measured more accurately. This allows
The inspection accuracy of electronic components can be improved. Also,
At the same time, the surface of the electronic component can be inspected by the illumination unit installed on the camera side.

It is preferable that each of the illumination units is provided with a drive unit that emits light in synchronization. Thereby, for example, two side surfaces can be easily imaged at the same time.

Further, it is preferable that the carrying section has a light transmitting section for transmitting light at a mounting position of the electronic component.

Thus, according to the above arrangement, the surface of the electronic component placed on the carrying section can be imaged. That is, the upper and lower surfaces of the electronic component can be imaged. Also,
For example, a transparent disc is used for the transport unit, and the electronic component can be transported by rotating the transparent disc. As a result, it is possible to inspect the four surfaces (upper surface and side surface) of the electronic component without transferring the electronic component to another reversing mechanism or the like.

It is preferable that the supply section has a vibrating feeder for supplying electronic components and a non-vibrating section spatially independent of the vibrating feeder between the vibrating section feeder and the conveying section.

By mounting the above-mentioned vibration-free portion, the propulsive force applied to the chip-shaped electronic component becomes only the back-pushing force, and it is possible to reduce the variation in the supply and the variation in the position after the transfer to the transport section. In addition, no complicated processing is required at the tip of the vibrating feeder. Therefore, the cost can be reduced in the visual inspection device.

Further, it is preferable that the sorting mechanism includes a sorting section for blowing compressed air to the electronic component to move the electronic component to a desired position.

According to the above construction, damage to the electronic parts can be reduced by the sorting section using compressed air, and damage to the transport section can be prevented.

The appearance inspection method of the present invention is an appearance inspection method of an electronic component for inspecting it based on image data of the electronic component picked up by a camera. It is characterized in that the two illuminated surfaces of the electronic component are simultaneously imaged by a camera having a viewing angle deviated from the illumination direction of the illumination light.

According to the above method, it is possible to simultaneously image, for example, two front and back surfaces of the electronic component. Since the camera has a viewing angle deviated from the irradiation direction of the illumination light at the time of imaging, the illumination section simultaneously functions as a backlight. Therefore, at the same time as the surface of the electronic component is imaged, the outermost shape of the electronic component can be imaged, and the surface of the electronic component can be inspected and the outermost shape of the electronic component can be inspected at the same time.
Further, since the edge of the electronic component can be illuminated under the dark background by the illumination unit, the outermost shape of the electronic component can be inspected more accurately.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A visual inspection apparatus for electronic parts (present apparatus) according to an embodiment of the present invention will be described with reference to FIGS.
It will be described based on. This device is a device for inspecting the external appearance and outer shape of a chip component (electronic component) such as a multilayer chip capacitor. As shown in FIG. 2, a chip component (electronic component) 11 to be inspected by the present apparatus has a substantially rectangular parallelepiped shape, and has a unit portion 12 made of ceramic and an electrode portion 13 formed at an end portion of the unit portion 12. Consists of.
In this device, for example, cracks generated in the unit portion 12
The chipping, the scratches and peeling generated on the electrode portion 13, and the external dimensions of the chip component 11 itself are inspected and measured by image processing. Then, based on the inspection / measurement results, the chip component 1
1 is sorted (sorted) into good products and defective products.

As shown in FIG. 3, the appearance inspection apparatus for electronic parts (this apparatus) according to the present embodiment has a feeder (supply section) 1, a transparent disc (conveyance table, conveyance section) 2, a vibration-free section. 3, a guide 4, a sensor 5, an upper and lower surface imaging block (imaging unit) 6, a side imaging block (imaging unit) 7, a sorting discharge nozzle 8, a sorting box 9, and a dust removing nozzle (dust removing unit) 10. It is a composition.

The feeder 1 supplies the chip components 11 on the outer peripheral portion of the transparent disc 2 along the outer periphery. As the feeder 1, for example, a vibration feeder driven by a piezoelectric body or an electromagnetic coil can be used.

The transparent disc 2 is made of a transparent (transparent) material such as glass or an acrylic plate. This transparent disk 2
Is equipped with a drive source such as a motor for continuously rotating the transparent disc 2 in the horizontal plane in the vicinity of the center so that the transparent disc 2 can continuously rotate.

In this apparatus, the feeder 1 to the vibration-free portion 3
A chip component (electronic component) 11 is supplied (transferred) to the transparent disc 2 via. As shown in FIG. 4, the non-vibration part 3 includes the chip part 11 from the feeder 1 to the transparent disc 2.
It is intended for transfer to. The vibration-free portion 3 is installed independently of the feeder 1 so that the vibration of the feeder 1 is not transmitted. Then, the chip component 11 is transferred from the vibration-free portion 3 to the transparent disc 2 by being pressed by the subsequent chip component supplied from the feeder 1.

Conventionally, since the chip parts are directly transferred from the feeder to the transparent disk, it is necessary to perform complicated processing on the tip shape of the feeder. Therefore, for example, a processing cost for boring the bottom of the feeder is required, which is a problem for cost reduction. Also, when this conventional feeder is used, it is transferred directly from the vibrating body, so the propulsive force applied to the chip component is the force of the vibrating body and the force (back-push force) pushed by the subsequent chip component. Was due to both forces. Therefore, the propulsive force has variations, and the variations in the supply pitch of the chip components and the variations in the position after transfer have become large. Therefore, the distance between the chip components 11 may become short (short pitch), or the chip components 11 may stick to each other and flow (be carried).

When the vibration-free portion 3 of the present invention is provided, the chip component 11 is transferred onto the transparent disc 2 through the vibration-free portion 3, so that it is not necessary to process the shape of the tip of the feeder 1. Therefore, since the vibration-free portion 3 is mounted, complicated processing of the feeder 1 is not required, and the cost can be reduced. Further, the propulsive force applied to the chip component 11 supplied from the feeder 1 to the disc substrate 2 is only the back push force. As a result, variations in the supply pitch and positional variations of the chip components 11 can be reduced. Therefore, the short pitch of the chip components 11 and the occurrence of sticking can be significantly reduced, and the reliability of the inspection can be improved.

When the chip component 11 is minute (for example, 0.5 × 0.5 × 1.0 mm size, 0.3 × 0.
For a size of 3 × 0.6 mm), it is preferable to make the bottom portion 21 of the non-vibration portion thin (for example, about 0.1 mm). As a result, the gap with the transparent disc 2 can be reduced, and the chip component 11 is supplied (transferred) from the vibration-free portion 3 to the transparent disc 2.
It is possible to reduce the positional variation when performing.

Further, it is preferable that the rotational linear velocity of the transparent disc 2 is set to 2 to 10 times the feed velocity of the chip component 11 from the feeder 1 and the vibration-free portion 2. As a result, it becomes possible to separately convey the chip components 11 one by one on the transparent disc 2.

The chip component 11 is conveyed by rotating the transparent disc 2. As shown in FIG. 5, the chip parts 11 are arranged in a line by the guide 4 along the tangential direction on the outer circumference of the transparent disk 2.
It is preferable that the surface of the guide 4 is surface-treated with a material having excellent sliding properties such as a fluorine compound. By this surface treatment, the chip components 11 can be smoothly aligned by the guide 4, so that the alignment property of the chip components 11 can be stabilized. Further, since the guide 4 is of a fixed type, the chip component 11 does not get caught between the transparent disc 2 and the guide 4. Therefore, the chip component 11
No damage (cracking, chipping) or damage (scratch) to the transparent disc 2 occurs.

Depending on the size and shape of the chip component 11, a guide 4a having a curved line along the arc of the transparent disc 2 may be used as shown in FIG. Thereby, the alignment of the chip components 11 can be further improved.

Further, when the chip parts 11 are not properly aligned, as shown in FIG. 7, the inner guide 4b is provided on the transparent disk 2.
May be provided. The inner guide 4b is used for the chip component 11
Just before the position where is separated from the guide 4, the chip component 11 may be provided so as to pass between the guide 4 and the inner guide 4b. The chip component 11 passes between the guide 4 and the inner guide 4b, whereby the alignment is further stabilized.

The chip components 11 arranged in a line by the guide 4 are further conveyed by the transparent disc 2 and the position on the transparent disc 2 is detected by the sensor 5. As shown in FIG. 8, this sensor 5 is a chip component on the transparent disk 2 by a transmissive sensor composed of a sensor head light receiving section 14 and a sensor head light projecting section 15 which face each other with the transparent disk 2 sandwiched therebetween. 11 is detected.

Further, as shown in FIG. 9, the sensor head light receiving portion 14 and the sensor head light emitting portion 15 are provided along the surface of the transparent disc 2 on which the chip component 11 is mounted, and the side surface of the chip component 11 is provided. You may make it detect from a direction.

Further, as shown in FIG. 10, the position of the chip component 11 may be detected by a reflective sensor head 16 instead of the transmissive sensor.

The chip component 11 whose position has been detected by the sensor 5 is further conveyed by the transparent disc 2, and the upper and lower surface imaging blocks 6 capture instantaneous images (images) of the upper and lower surfaces of the chip component 11. It This imaging is performed when the chip component 11 reaches the imaging position calculated from the position of the chip component 11 detected by the sensor 5.

As shown in FIG. 1, the upper and lower image pickup blocks 6 include cameras 17a, which face each other with the transparent disc 2 interposed therebetween.
17b and ring-shaped illumination units 18a and 18b. That is, the cameras 17a and 17b are arranged at positions facing each other across the upper and lower surfaces of the chip component 11 that has reached the imaging position. The optical axes of the cameras 17a and 17b are coaxial with each other, and further, the cameras 17a and 17b are configured to pass through the rings of the ring-shaped illumination units 18a and 18b. The optical axes of the cameras 17a and 17b are the chip parts 1
It is preferably perpendicular to one imaging surface.

Further, the illuminating section 18a irradiates the surface of the chip part 11 imaged by the camera 17a with illuminating light, so that the camera 1
It is installed at a position where the illumination light from the illumination unit 18a does not enter the visual field of 7b. The illumination unit 18b irradiates the surface of the chip component 11 imaged by the camera 17b with illumination light, and the camera 1
It is installed at a position where the illumination light from the illumination unit 18b does not enter the visual field of 7a. That is, the optical axis (irradiation direction) of the illumination light from the illumination units 18a and 18b is set to the cameras 17a and 17b.
The viewing angle is different from that of. Lighting unit 18
The a and 18b are installed so as to face (oppose) each other with the upper and lower surfaces of the chip component 11 sandwiched therebetween.

Then, the chip parts 11 conveyed by the transparent disk 2 are simultaneously imaged by the cameras 17a and 17b. At the time of this imaging, irradiation light is simultaneously emitted from the illumination units 18a and 18b. In addition, the upper and lower surface imaging block 6
May use a prism mirror or the like to change the arrangement of the cameras 17a and 17b, as in a side image capturing block 7 (see FIG. 11) described later. Since the chip component 11 is held on the transparent disc 2, it is possible to pick up images from above and below.

The chip component 11 is further conveyed by the transparent disk 2, and the side surface imaging block 7 images the side surface of the chip component 11. This image pickup is performed at the image pickup position calculated from the position of the chip component 11 detected by the sensor 5, similarly to the upper and lower surface image pickup block 6.
It is performed when 1 is reached.

As shown in FIG. 11, the side image pickup block 7 includes a camera 17 through prism mirrors 19 and 19.
The side surface of the chip component 11 that has reached the image capturing position is imaged by a and by the camera 17b. With the prism mirrors 19 and 19, the camera 1
The optical axes of 7a and 17b are arranged to face each other.

Further, the illuminating section 18a irradiates the surface of the chip part 11 imaged by the camera 17a with illuminating light to make the camera 1
It is installed at a position where the illumination light from the illumination unit 18a does not enter the visual field of 7b. The illumination unit 18b irradiates the surface of the chip component 11 imaged by the camera 17b with illumination light, and the camera 1
It is installed at a position where the illumination light from the illumination unit 18b does not enter the visual field of 7a. The illuminators 18a, 18a sandwich the transparent disc 2 from the diagonal direction of the chip component 11
1 is irradiated with irradiation light. Lighting unit 18b
Similarly, 18b also includes the chip component 11 with the transparent disc 2 interposed therebetween.
The chip component 11 is irradiated with the irradiation light from the oblique direction. That is, the optical axis of the illumination light from the illumination units 18a and 18b is different from the viewing angle of the cameras 17a and 17b. The illumination parts 18a and 18b are installed so as to face each other with the side surface of the chip component 11 interposed therebetween.

Then, the instantaneous image may be obtained by the same method as the upper and lower surface image pickup block 6. Further, when there is a space for installing the camera 17a on the transparent disk 2, the cameras 17a and 17b are opposed to each other with respect to the side surface of the chip component 11 which has reached the above-mentioned image pickup position, similarly to the above-mentioned upper and lower image pickup block 6. It may be installed as described above.

Conventionally, in the image pickup section, a camera / illumination has been installed so as to pick up an image of each surface of the chip component. Therefore, the size of the device is large. In the present invention, it is possible to image two upper and lower surfaces and two side surfaces at the same time. Therefore, it is possible to save the space of the camera and contribute to the improvement of the area productivity.

Further, in order to measure both the surface and the external dimension of the chip component, two lights, that is, a back light and a light from the camera direction are required per camera. Also, when a backlight is used, the background of the image becomes white (bright), but when a metal such as an electrode is used for the outermost shape, the edge of the electrode is illuminated by the backlight and becomes white. The boundary between the electrode parts cannot be detected accurately. Therefore, it is impossible to accurately measure the outermost shape of the chip component.

As described above, in the upper and lower surface imaging block 6,
When imaging the two surfaces of the chip component 11, the camera 17a
17b is installed facing the front and back surfaces of the chip component 11. Further, the illumination units 18a and 18b are faced to the cameras 17a and 17b, and the illumination direction of the illumination light from the illumination units 18a and 18b is set to the camera 1.
It is installed so as to deviate from the viewing angles of 7a and 17b. Therefore, the illumination units 18a and 18b function as the backlights of the cameras 17b and 17a, respectively. Therefore, even if the backlight for measuring the outermost shape is not installed, the illumination parts 18b and 18a from the opposite side to the chip parts 11 of the cameras 17a and 17b are used to darken the background as shown in FIG. Thus, the edge of the chip component 11 can be illuminated and the outermost shape 20 of the chip component 11 can be measured more accurately. Thereby, the inspection accuracy can be improved. At the same time, the surface of the chip component 11 can be inspected by the respective illumination units 18a and 18b installed on the cameras 17a and 17b side.

The range outside the preferable viewing angle of the camera in the illumination direction of the illumination section will be described below. Therefore,
The relationship among the camera 17a, the illumination unit 18b, and the chip component 11 in FIG. 1 will be described as an example with reference to FIG. It is assumed that the optical axis of the camera 17a passes through the center of the ring of the illumination section 18b.

The viewing angle of the camera 17a is as follows.
It is a value determined by the characteristics of the lens 171a of a (lens effective diameter, lens focal length, etc.). Then, the field of view is determined by this viewing angle and the distance (objective distance) between the lens 171a and the chip component 11. When the chip component 11 is imaged, the chip component 11 is placed in the field of view.

The illuminating section 18b illuminates the chip component 11. The distance (illumination distance) between the illumination unit 18b and the chip component 11 is shorter than the distance from the illumination unit 18b to the focal point of the illumination light. The optical axis (illumination direction) of the illumination light of the illumination unit 18b and the camera 1
The direction perpendicular to the optical axis of 7a is the illumination angle θ (0 <θ <9
0 °).

In the above configuration, the condition that the illumination light of the illumination section 18b deviates from the viewing angle of the camera 17a is that the lens 1
An angle α formed by the direction connecting the end of 71a and the end of the chip component 11 and the direction perpendicular to the optical axis of the camera 17a.
The minimum value of (0 <α <90 °) is smaller than the illumination angle θ.

In other words, it can be said that the camera 17a is set to have a viewing angle deviated from the irradiation direction of the illumination light.

Further, when the pitch between the chip parts 11 on the transparent disk 2 can be sufficiently secured, the present apparatus may include an end face imaging block as shown in FIG. In this end face imaging block, the cameras 17a and 17b are installed in an oblique direction with respect to the end face of the chip component 11, and an instantaneous image of the end face portion of the chip component 11 is captured. In addition, the illumination unit 18a includes the chip component 11 captured by the camera 17a.
Of the chip part 11 imaged by the camera 17b, and the illuminating section 18b irradiates the illuminating light from the opposite side of the cameras 17a and 17b with the transparent disc 2 interposed therebetween. ing. Upper and lower imaging block,
By providing this end surface imaging block in addition to the side surface imaging block, all six surfaces of the chip component 11 can be inspected.

The above-mentioned instantaneous images are displayed on the illumination units 18a and 18b.
It is preferable to use a stroboscopic illumination for imaging. Further, it is preferable that the illumination units 18a and 18b be provided with a driving unit that emits light in synchronization. This makes it possible to easily image, for example, the upper and lower surfaces and the side surfaces simultaneously. Further, the chip parts 11 may be continuously irradiated by using a halogen light source for the illumination units 18a and 18b. When a halogen light source is used, it is preferable to use shutter cameras for the cameras 17a and 17b, and set the shutter time to a high speed of 1/1000 second, for example.

Further, it is preferable to use one strobe light source for the illumination units 18a and 18b.

As an example of using the one strobe light source, for example, as shown in FIG.
b and the strobe light source 30, a two-branch light guide 31
A configuration in which they are connected by is preferable. The bifurcated light guide 31 is preferably formed of an optical fiber. When the strobe light source 30 emits light, the generated light is transmitted to the illumination units 18a and 18b via the two-branch light guide. The transmitted light is simultaneously emitted from the illumination units 18a and 18b.

As described above, by using one strobe light source 30 and simultaneously irradiating the illumination units 18a and 18b with light, two surfaces of the chip component 11 can be simultaneously imaged. By using only one light source in this way, it is possible to further save space and reduce costs.

Further, the present apparatus has a sorting mechanism (sorting section) for sorting the good parts and the bad parts of the chip parts 11 based on the images of the chip parts 11 picked up by the image pickup parts 6 and 7. . The sorting unit includes a sorting discharge nozzle 8 and a sorting box 9. More specifically, as shown in FIG.
The discharge nozzle 8 for selection includes a defective product selection nozzle 8a and a non-defective product selection nozzle 8b, and the selection box 9 includes a defective product selection box 9a and a non-defective product selection box 9b. In this sorting unit, the chip parts 11 conveyed by the transparent disc 2 are stored in the defective product sorting box 9a by the defective product sorting nozzle 8a and in the good product sorting box 9b by the good product sorting nozzle 8b, respectively. ing. The defective product selection nozzle 8a and the non-defective product selection nozzle 8
In b, the chip parts 11 are housed in the defective product selection box 9a or the non-defective product selection box 9b, respectively, by compressed air discharged from their tips. Since the sorting unit performs sorting with compressed air, it is possible to prevent damage to the chip component 11 or damage to the transparent disc 2.

Conventionally, a mechanical mechanism using a swing guide or the like has been used to select a good product from a defective product. Therefore, damage (scratch, chipping, etc.) has occurred in the chip component due to the contact between the swing guide and the chip component. Further, a chip component may be caught between the rocking guide and the transparent disc to scratch the transparent disc. Due to these scratches, they may be erroneously recognized during the outer shape inspection, or may not be aligned on the alignment guide. In the present invention, since compressed air is used for sorting, damage to chip components,
It is possible to reduce scratches on the transparent disc. Since the transparent disc is not scratched, over-selection due to erroneous recognition in the outer shape inspection is eliminated, and the non-defective product determination rate can be improved.

Furthermore, this apparatus, as shown in FIG.
A dust removing nozzle (dust removing portion) 10 is provided. The dust removing nozzle 10 is preferably provided on the upper surface and the lower surface of the transparent disc 2, and the compressed air is continuously blown on the transparent disc 2. As a result, it is possible to prevent dust, dust, etc. in the air attached to the chip component 11 from adhering to the transparent disc 2. The dust removing unit 10 may not be provided when the present apparatus is installed in a place such as a clean room where dust does not float, or when dust does not adhere to the surface of the chip component 11.

[0058]

As described above, the appearance inspection apparatus of the present invention provides a supply section for supplying electronic parts, a transfer section for transferring the electronic parts from the supply section, and an image of the transferred electronic parts. An appearance inspection apparatus comprising: an image pickup unit that performs the image pickup; and a sorting mechanism that sorts the electronic components based on the quality of the electronic components determined from the image data picked up by the image pickup unit. Two cameras whose optical axes are opposed to each other across each electronic component, and an illumination unit that illuminates the electronic component by installing it in a position where illumination light does not enter the field of view of each camera for each camera It is a configuration equipped with.

According to the above configuration, two images (for example, side surfaces) of the electronic component can be picked up at the same time at one place, so that the installation place of the camera can be reduced and the space of the image pickup unit can be saved. . Further, since the illumination units for the cameras can be faced to each other, the edge of the electronic component can be illuminated and the outermost shape of the electronic component can be measured more accurately. As a result, the inspection accuracy of the electronic component can be improved. At the same time, the surface of the electronic component can be inspected.

Since each of the illuminating sections is provided with a driving section that emits light in synchronization with each other, it is possible to easily image, for example, two side surfaces at the same time.

Further, since the carrying section has the light transmitting section for transmitting light in the thickness direction at the mounting position of the electronic component, the upper and lower surfaces of the electronic component can be imaged.

Further, by mounting the non-vibration section on the transfer section, the propulsive force applied to the chip-shaped electronic component is only the back-pushing force, and it is possible to reduce supply variations and positional variations after transfer to the transfer section. . Further, since no complicated processing is required on the tip portion of the vibrating feeder, the cost can be reduced in the appearance inspection device.

Further, since the above-mentioned sorting mechanism is provided with a sorting section using compressed air, damage to electronic parts can be reduced,
Further, it is possible to prevent the transparent disc from being damaged.

The appearance inspection method of the present invention is an appearance inspection method for an electronic component that performs inspection based on image data of the electronic component captured by a camera, and illuminates light from positions facing each other across the electronic component. Irradiating the two illuminated surfaces of the electronic component at the same time and different from the optical axis of the illumination light,
The configuration is such that each image is taken at the viewing angle of the camera.

According to the above method, it is possible to simultaneously image, for example, two surfaces of the electronic component, the front and back surfaces. At the time of imaging, the illumination unit simultaneously performs the function of a backlight, so that the surface of the electronic component can be imaged at the same time, the outermost shape of the electronic component can be imaged, and the outer surface of the electronic component can be inspected at the same time. Can be inspected. Further, since the edge of the electronic component can be illuminated under the dark background by the illumination unit, the outermost shape of the electronic component can be inspected more accurately.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of upper and lower surface imaging blocks in a visual inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a chip component inspected by the appearance inspection device of the present invention.

FIG. 3 is a plan view of the appearance inspection apparatus according to the embodiment of the present invention.

4 is a cross-sectional view of a vibration-free portion of the appearance inspection device of FIG.

5 is a plan view of an example of a guide in the visual inspection apparatus of FIG.

6 is a plan view of another example of the guide in the visual inspection apparatus of FIG.

7 is a plan view of still another example of the guide in the visual inspection apparatus of FIG.

8 is a cross-sectional view of an example of a sensor in the visual inspection device of FIG.

9 is a cross-sectional view of another example of the sensor in the visual inspection apparatus of FIG.

10 is a cross-sectional view of still another example of the sensor in the visual inspection apparatus of FIG.

11 is a cross-sectional view of a side surface imaging block in the visual inspection apparatus of FIG.

12 is an explanatory diagram related to a captured image of a chip component in the appearance inspection device of FIG.

FIG. 13 is a sectional view of an end face imaging block in the visual inspection apparatus of the present invention.

14 is a plan view of a selection block in the visual inspection apparatus of FIG.

15 is a cross-sectional view of a dust removing unit in the visual inspection apparatus of FIG.

FIG. 16 is an explanatory diagram regarding a captured image of a chip component in a conventional visual inspection apparatus.

FIG. 17 is an explanatory diagram illustrating a range in which the illumination direction of the illumination unit in the appearance inspection apparatus of FIG. 3 deviates from the preferable viewing angle of the camera.

FIG. 18 is a side view showing an example in which one light source is used in the illumination unit in the visual inspection apparatus of FIG.

[Explanation of symbols]

1 feeder 2 Transparent disk (conveyance stand, conveyance section) 3 Vibration free part 4 guides 6 Upper and lower surface imaging block (imaging unit) 7 Side imaging block (imaging unit) 8 Sorting required discharge nozzle 9 sorting box 10 Dust removal nozzle (dust removal part) 17a camera 17b camera 18a Illumination part 18b Illumination section

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2F065 AA21 AA49 AA61 BB05 CC25                       DD02 FF04 FF42 GG03 GG08                       GG17 HH02 HH13 JJ03 JJ05                       JJ09 JJ26 PP13 QQ31 SS04                 2G051 AA01 AA61 AB08 BC02 CA04                       CA08 CB01 CB02 DA01 DA06                       DA13 DA17

Claims (6)

[Claims] 1. A supply unit that supplies electronic components, a transport unit that transports the electronic components from the supply unit, an image capturing unit that captures an image of the transported electronic components, and an image captured by the image capturing unit. A visual inspection apparatus comprising a sorting mechanism that sorts electronic components based on the quality of the electronic components determined from the data, wherein the imaging unit has optical axes that sandwich the transported electronic components from each other. A visual inspection apparatus, comprising: two cameras facing each other; and an illuminating unit that is installed at a position where illumination light does not enter the field of view of each camera and illuminates the electronic component for each camera. 2. The appearance inspection apparatus according to claim 1, wherein each of the illumination units is provided with a drive unit that emits light in synchronization. 3. The transport section has a light transmitting section for transmitting light at a mounting position of the electronic component.
Alternatively, the appearance inspection apparatus according to item 2. 4. The supply section has a vibrating feeder for supplying electronic components, and a vibration-free section spatially independent of the vibrating feeder between the vibrating section feeder and the carrier. The appearance inspection apparatus according to any one of claims 1 to 3, which is characterized. 5. The sorting mechanism according to claim 1, further comprising a sorting unit that blows compressed air to the electronic component to move the electronic component to a desired position. Appearance inspection device described. 6. A method for inspecting appearance of an electronic component, which comprises inspecting the image based on image data of the electronic component captured by a camera, comprising irradiating illumination light from positions facing each other with the electronic component interposed therebetween. A visual inspection method, wherein the two illuminated surfaces are imaged at the same time with a camera having a viewing angle deviated from the irradiation direction of the illumination light.