JP3855733B2 - Electronic component visual inspection apparatus and visual inspection method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an appearance inspection apparatus and an appearance inspection method for an electronic component such as a multilayer chip capacitor.
[0002]
[Prior art]
Conventional visual inspection apparatuses illuminate only from the direction of the camera to capture images. In this case, as shown in FIG. 16, the outermost contour 22 of the electronic component could not be accurately imaged due to the roundness of the edge of the electronic component. Therefore, the electronic component is imaged smaller than the original size, and the appearance inspection cannot be performed accurately. In addition, illumination is used as a backlight from the opposite side of the electronic component only when the electronic component is imaged as a silhouette.
[0003]
Japanese Patent Laid-Open No. 6-054226 discloses a transparent glass disk that is held so as to rotate at a constant speed, a guide plate for feeding parts, an alignment roller that rotates at the same speed as the glass disk, and an upper surface of the glass disk. In addition, there is disclosed a chip component visual inspection apparatus having a shutter camera that is placed facing the lower surface and shifted in position.
[0004]
When the illumination is used as a backlight, the backlight is at a position facing the camera with the electronic component in between. For this reason, it is impossible to install a new camera on the opposite side of the electronic component of the camera. Therefore, in the appearance inspection apparatus, in order to take an image of both surfaces of the electronic component, the cameras are installed so as not to face each other (not to face each other).
[0005]
[Problems to be solved by the invention]
However, when the two cameras are installed so as not to face each other as in the prior art, it is necessary to secure the installation location of the cameras in the horizontal direction (electronic component transport direction) in the appearance inspection apparatus. For this reason, it is difficult to reduce the equipment size (space saving) in the appearance inspection apparatus. In the case of synchronous imaging (strobe imaging) or the like, two strobe light sources are required, and further a light source installation space is required. Therefore, space saving is difficult.
[0006]
Furthermore, in order to measure both the surface and the external dimensions of the electronic component, two lights, that is, a backlight and a light from the camera direction are required for each camera. When the backlight is used, the background of the image becomes white (bright). However, when a metal such as an electrode has an outer shape in the electronic component, the edge portion of the electrode is illuminated white by the backlight. For this reason, the boundary between the background and the electrode part cannot be accurately detected, and the outermost contour of the electronic component cannot be measured accurately.
[0007]
The present invention has been made in view of the above-described problems, and an object of the present invention is to reduce the equipment size (save space) and to inspect the outermost shape of an electronic component more accurately (inspection). An object of the present invention is to provide an appearance inspection apparatus and an appearance inspection method for an electronic component that can improve accuracy.
[0008]
[Means for Solving the Problems]
In order to solve the above problems, an appearance inspection apparatus of the present invention performs imaging of a supply unit that supplies an electronic component, a conveyance unit that conveys the electronic component from the supply unit, and the electronic component that is being conveyed. An appearance inspection apparatus comprising: an imaging unit; and a sorting mechanism that sorts electronic components based on quality of electronic components determined from image data captured by the imaging unit, wherein the imaging unit is transported Two cameras with optical axes facing each other across each electronic component, and an illumination unit that illuminates the electronic component installed in a position where illumination light does not enter the field of view of each camera. It is characterized by having.
[0009]
According to said structure, it can image simultaneously, for example each side surface of an electronic component in an imaging part. That is, since two images can be taken simultaneously at one place, the number of installation locations of the camera can be reduced in the horizontal direction with respect to the conveyance direction of the electronic component. Therefore, space saving of the imaging unit can be achieved. Furthermore, since the illumination unit is installed at a position where illumination light does not enter the field of view of each camera, the illumination unit for each camera can be opposed to each other. For this reason, the illumination unit that faces the camera across the electronic component functions as a backlight for each camera. Therefore, it is possible to shine the edge of the electronic component under a dark background without newly installing a backlight for measuring the outermost shape, and to measure the outermost shape of the electronic component more accurately. Thereby, the test | inspection precision of an electronic component can be improved. At the same time, the surface of the electronic component can be inspected by the illumination unit installed on the camera side.
[0010]
It is preferable that each of the illumination units is provided with a driving unit that emits light in synchronization. Thus, for example, two side surfaces can be easily imaged simultaneously.
[0011]
Moreover, it is preferable that the conveyance part has a light transmission part which permeate | transmits light in the mounting position of an electronic component.
[0012]
Thereby, according to said structure, the surface mounted in the conveyance part of an electronic component can be imaged. That is, the upper and lower surfaces of the electronic component can be imaged. For example, a transparent disk is used for a conveyance part, and an electronic component can be conveyed by rotating this transparent disk. Thereby, it is possible to inspect four surfaces (upper and lower surfaces and side surfaces) of the electronic component without transferring the electronic component to another reversing mechanism or the like.
[0013]
It is preferable that the supply unit includes a vibration feeder that supplies electronic components, and a non-vibration unit that is spatially independent from the vibration feeder between the vibration unit feeder and the transport unit.
[0014]
By mounting the non-vibrating portion, the propulsive force applied to the chip-like electronic component is only the back push force, and the supply variation and the position variation after transfer to the transport unit can be reduced. Moreover, complicated processing is not required at the tip of the vibration feeder. Therefore, cost reduction can be achieved in the appearance inspection apparatus.
[0015]
Moreover, it is preferable that the said selection mechanism is equipped with the selection part which sprays compressed air on an electronic component and moves an electronic component to a desired position.
[0016]
According to said structure, the sorting part by compressed air can reduce the damage of an electronic component, and can prevent generation | occurrence | production of the damage in a conveyance part.
[0017]
The appearance inspection method of the present invention is an appearance inspection method of an electronic component that performs an inspection based on image data of an electronic component imaged by a camera, and irradiates illumination light from positions facing each other across the electronic component, The two illuminated surfaces of the electronic component are respectively imaged simultaneously by cameras having viewing angles deviated from the illumination light irradiation direction.
[0018]
According to the above method, it is possible to simultaneously image, for example, two front and back surfaces of an electronic component. At the time of imaging, since the camera has a viewing angle deviated from the illumination light irradiation direction, the illumination unit simultaneously functions as a backlight. Therefore, at the same time that the surface of the electronic component is imaged, the outermost contour of the electronic component can be imaged, and the surface of the electronic component can be inspected and the outermost contour of the electronic component can be inspected simultaneously. In addition, since the edge of the electronic component can be illuminated with a dark background by the illumination unit, the outermost shape of the electronic component can be more accurately inspected.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
An electronic component appearance inspection apparatus (present apparatus) according to an embodiment of the present invention will be described with reference to FIGS. This apparatus is an apparatus for inspecting the appearance and external shape of a chip component (electronic component) such as a multilayer chip capacitor. As shown in FIG. 2, a chip component (electronic component) 11 to be inspected by this apparatus has a substantially rectangular parallelepiped shape, a unit portion 12 made of ceramic, and an electrode portion 13 formed at an end portion of the unit portion 12. Consists of. In the present apparatus, for example, cracks / chips generated in the unit part 12, scratches / defects generated in the electrode part 13, and the external dimensions of the chip part 11 itself are inspected and measured by image processing. Then, based on the inspection / measurement results, the chip parts 11 are classified (sorted) into non-defective products and defective products.
[0020]
As shown in FIG. 3, an electronic component appearance inspection apparatus (this apparatus) according to the present embodiment includes a feeder (supply unit) 1, a transparent disk (transport table, transport unit) 2, a non-vibration unit 3, and a guide. 4, a sensor 5, an upper and lower imaging block (imaging unit) 6, a side imaging block (imaging unit) 7, a sorting discharge nozzle 8, a sorting box 9, and a dust removal nozzle (dust removal unit) 10. .
[0021]
The feeder 1 supplies the chip component 11 along the outer periphery on the outer peripheral portion of the transparent disk 2. As the feeder 1, for example, a vibration feeder using a piezoelectric body or an electromagnetic coil as a driving source can be used.
[0022]
The transparent disc 2 is made of a transparent (transmitting) material such as glass or an acrylic plate. The transparent disk 2 is provided with a drive source such as a motor for continuously rotating the transparent disk 2 in the horizontal plane in the vicinity of the center, and is continuously rotated.
[0023]
In this apparatus, a chip component (electronic component) 11 is supplied (transferred) from the feeder 1 to the transparent disk 2 via the non-vibrating portion 3. As shown in FIG. 4, the non-vibrating portion 3 is for transferring the chip component 11 from the feeder 1 to the transparent disk 2. The non-vibrating part 3 is installed independently from the feeder 1 so that the vibration of the feeder 1 is not transmitted. Then, the chip component 11 is transferred from the non-vibration portion 3 to the transparent disk 2 by being pushed by the subsequent chip component supplied from the feeder 1.
[0024]
Conventionally, in order to transfer a chip part directly from a feeder to a transparent disk, it has been necessary to perform complicated processing on the tip shape of the feeder. For this reason, for example, processing costs such as cutting through the bottom surface of the feeder are required, which has been a problem for cost reduction. In addition, when this conventional feeder is used, the transfer force is directly transferred from the vibrating body. Therefore, the propulsive force applied to the chip parts is the force by the vibrating body and the force pressed by the subsequent chip parts (back push force). Was due to both forces. For this reason, the propulsive force varies, and the variation in the supply pitch of the chip parts and the position variation after the transfer are large. Therefore, the distance between the chip components 11 may be shortened (short pitch), or the chip components 11 may flow together (carry).
[0025]
When the non-vibrating part 3 of the present invention is provided, the chip component 11 is transferred to the transparent disk 2 via the non-vibrating part 3, so that it is not necessary to process the shape of the tip of the feeder 1. Therefore, since the non-vibrating part 3 is mounted, complicated processing to the feeder 1 is not required, so that the cost can be reduced. Further, the propulsive force applied to the chip component 11 supplied from the feeder 1 to the disc substrate 2 is only the back push force. Thereby, the variation in the supply pitch and position variation of the chip component 11 can be reduced. Therefore, the occurrence of short pitch and sticking of the chip component 11 can be greatly reduced, and the inspection reliability can be improved.
[0026]
When the chip part 11 is very small (for example, 0.5 × 0.5 × 1.0 mm size, 0.3 × 0.3 × 0.6 mm size), the bottom 21 of the non-vibrating portion is thin ( For example, it is preferably about 0.1 mm). Thereby, the gap with the transparent disk 2 can be made small, and the position variation at the time of supplying (transferring) the chip component 11 from the non-vibration part 3 to the transparent disk 2 can be reduced.
[0027]
Moreover, it is preferable to set the rotation linear velocity of the transparent disk 2 to 2 to 10 times the supply speed of the chip component 11 from the feeder 1 and the non-vibrating part 2. As a result, the chip components 11 can be separated and transported one by one on the transparent disk 2.
[0028]
The chip component 11 is conveyed as the transparent disk 2 rotates. As shown in FIG. 5, the chip parts 11 are arranged in a line along the tangential direction on the outer periphery of the transparent disk 2 by the guide 4. The surface of the guide 4 is preferably surface-treated with a material having excellent sliding characteristics such as a fluorine compound. By this surface treatment, the chip component 11 can be smoothly aligned by the guide 4, so that the alignment of the chip component 11 can be stabilized. Further, since the guide 4 is a fixed type, the chip component 11 does not bite between the transparent disk 2 and the guide 4. Therefore, breakage (cracking, chipping) of the chip component 11, breakage (scratch) of the transparent disk 2, etc. do not occur.
[0029]
Further, depending on the size and shape of the chip component 11, a guide 4a having a curve along the arc of the transparent disk 2 may be used as shown in FIG. Thereby, the alignability of the chip component 11 can be further improved.
[0030]
Further, when the alignment of the chip components 11 is poor, an inner guide 4b may be provided on the transparent disk 2 as shown in FIG. The inner guide 4b may be provided so that the chip component 11 passes between the guide 4 and the inner guide 4b immediately before the position where the chip component 11 is separated from the guide 4. The chip component 11 passes between the guide 4 and the inner guide 4b, so that the alignment is further stabilized.
[0031]
The chip components 11 aligned in a row by the guide 4 are further transported by the transparent disk 2, and the position on the transparent disk 2 is detected by the sensor 5. As shown in FIG. 8, this sensor 5 is a chip component on the transparent disk 2 by a transmission type sensor comprising a sensor head light receiving part 14 and a sensor head light projecting part 15 facing each other with the transparent disk 2 interposed therebetween. 11 is detected.
[0032]
Further, as shown in FIG. 9, the sensor head light receiving unit 14 and the sensor head light projecting unit 15 are provided along the surface of the transparent disk 2 on which the chip component 11 is placed, and are detected from the side surface direction of the chip component 11. You may make it do.
[0033]
Further, as shown in FIG. 10, the position of the chip component 11 may be detected by a reflective sensor head 16 instead of the transmissive sensor.
[0034]
The chip component 11 whose position is detected by the sensor 5 is further conveyed by the transparent disk 2, and instantaneous images (images) of the upper and lower surfaces of the chip component 11 are captured by the upper and lower surface imaging block 6. This imaging is performed when the chip component 11 reaches the imaging position calculated from the position of the chip component 11 detected by the sensor 5.
[0035]
As shown in FIG. 1, the upper and lower surface imaging block 6 includes cameras 17 a and 17 b and ring-shaped illumination units 18 a and 18 b facing each other with the transparent disk 2 interposed therebetween. That is, the cameras 17a and 17b are arranged at positions facing each other with the upper and lower surfaces of the chip part 11 reaching the imaging position. The optical axes of the cameras 17a and 17b are coaxial with each other, and further pass through the rings in the ring-shaped illumination portions 18a and 18b. The optical axes of the cameras 17a and 17b are preferably perpendicular to the imaging surface of the chip component 11.
[0036]
The illumination unit 18a is installed at a position where the illumination light is irradiated on the surface of the chip part 11 imaged by the camera 17a and the illumination light from the illumination unit 18a does not enter the field of view of the camera 17b. The illumination unit 18b illuminates the surface of the chip part 11 imaged by the camera 17b with illumination light, and is installed at a position where illumination light from the illumination unit 18b does not enter the visual field of the camera 17a. That is, the optical axis (irradiation direction) of the illumination light from the illumination units 18a and 18b is different (displaced) from the viewing angle of the cameras 17a and 17b. The illuminators 18a and 18b are installed so as to face each other (opposite) with the upper and lower surfaces of the chip part 11 interposed therebetween.
[0037]
And the chip component 11 conveyed by the transparent disk 2 is imaged simultaneously with the cameras 17a and 17b. At the time of this imaging, irradiation light is simultaneously irradiated from the illumination units 18a and 18b. Further, the upper and lower surface imaging block 6 may change the arrangement of the cameras 17a and 17b using a prism mirror or the like, as in a side surface imaging block 7 (see FIG. 11) described later. Since the chip component 11 is held on the transparent disk 2, imaging from above and below is possible.
[0038]
Further, the chip component 11 is further conveyed by the transparent disk 2, and the side surface of the chip component 11 is imaged by the side surface imaging block 7. This imaging is performed when the chip component 11 reaches the imaging position calculated from the position of the chip component 11 detected by the sensor 5, as in the upper and lower imaging block 6.
[0039]
As shown in FIG. 11, the side surface imaging block 7 is configured to image the side surface of the chip part 11 that has reached the imaging position by the camera 17a and the camera 17b through the prism mirrors 19 and 19. By the prism mirrors 19 and 19, the optical axes of the cameras 17a and 17b are opposed to each other.
[0040]
The illumination unit 18a is installed at a position where the illumination light is irradiated on the surface of the chip part 11 imaged by the camera 17a and the illumination light from the illumination unit 18a does not enter the field of view of the camera 17b. The illumination unit 18b illuminates the surface of the chip part 11 imaged by the camera 17b with illumination light, and is installed at a position where illumination light from the illumination unit 18b does not enter the visual field of the camera 17a. The illumination units 18a and 18a are configured to irradiate the chip component 11 with irradiation light from an oblique direction of the chip component 11 with the transparent disc 2 interposed therebetween. Similarly, the illumination units 18b and 18b are configured to irradiate the chip component 11 with irradiation light from an oblique direction of the chip component 11 with the transparent disk 2 interposed therebetween. That is, the optical axis of the illumination light from the illumination units 18a and 18b is different from the viewing angle of the cameras 17a and 17b. The illumination units 18a and 18b are installed so as to face each other across the side surface of the chip part 11.
[0041]
The instantaneous image may be obtained by the same method as that for the upper and lower surface imaging block 6. Further, when there is a space for installing the camera 17a on the transparent disk 2, the cameras 17a and 17b are opposed to each other with respect to the side surface of the chip part 11 that has reached the imaging position in the same manner as the upper and lower imaging block 6. You may install as you do.
[0042]
Conventionally, in the imaging unit, a camera / lighting is installed so as to capture an image of one surface of the chip part. Therefore, the apparatus size has become large. In the present invention, two images can be taken simultaneously on the upper and lower surfaces and the side surfaces. For this reason, it is possible to save the space of the camera and contribute to improvement of area productivity.
[0043]
Furthermore, in order to measure both the surface and outer dimensions of the chip component, two illuminations are required for each camera: a backlight and illumination from the camera direction. In addition, when the backlight is used, the background of the image becomes white (bright), but when a metal such as an electrode is used for the outermost shape, the edge portion of the electrode is illuminated white by the backlight, The boundary between electrode parts cannot be detected accurately. For this reason, it is impossible to accurately measure the outermost shape of the chip component.
[0044]
As described above, in the upper and lower surface imaging block 6, when imaging two surfaces of the chip component 11, the cameras 17 a and 17 b are installed facing the front and back surfaces of the chip component 11. Furthermore, the illumination units 18a and 18b are arranged so as to face the cameras 17a and 17b, and the irradiation direction of the irradiation light from the illumination units 18a and 18b is deviated from the viewing angle of the cameras 17a and 17b. Therefore, the illumination units 18a and 18b function as backlights for the cameras 17b and 17a, respectively. Therefore, without installing a backlight for measuring the outermost contour, the background is darkened as shown in FIG. 12 by the illuminating portions 18b and 18a from the opposite side to the chip part 11 of the cameras 17a and 17b. Thus, the edge of the chip component 11 can be illuminated, and the outermost shape 20 of the chip component 11 can be measured more accurately. Thereby, inspection accuracy can be improved. At the same time, the surface of the chip component 11 can be inspected by the illumination units 18a and 18b installed on the camera 17a and 17b side.
[0045]
Below, the range which remove | deviates from the viewing angle of the preferable camera of the illumination direction of an illumination part is demonstrated. Therefore, the relationship between the camera 17a, the illumination unit 18b, and the chip component 11 in FIG. 1 will be described specifically with reference to FIG. It is assumed that the optical axis of the camera 17a passes through the center of the ring of the illumination unit 18b.
[0046]
The viewing angle of the camera 17a is a value determined by the characteristics (lens effective diameter, lens focal length, etc.) of the lens 171a of the camera 17a. The field of view is determined by the viewing angle and the distance (objective distance) between the lens 171a and the chip component 11. When the chip component 11 is imaged, the chip component 11 falls within the field of view.
[0047]
Moreover, the illumination part 18b illuminates the chip component 11. The distance (illumination distance) between the illumination unit 18b and the chip component 11 is shorter than the distance from the illumination unit 18b to the focal point of the illumination light. The optical axis (illumination direction) of the illumination light of the illumination unit 18b and the direction perpendicular to the optical axis of the camera 17a form an illumination angle θ (0 <θ <90 °).
[0048]
In the above configuration, the condition that the illumination light of the illumination unit 18b deviates from the viewing angle of the camera 17a is that the end of the lens 171a and the end of the chip component 11 are connected and the direction perpendicular to the optical axis of the camera 17a. The minimum value of the angle α (0 <α <90 °) is smaller than the illumination angle θ.
[0049]
In other words, it can be said that the camera 17a is set to have a viewing angle deviated from the illumination direction of the illumination light.
[0050]
Furthermore, when a sufficient pitch between the chip components 11 on the transparent disk 2 can be secured, the apparatus may include an end face imaging block as shown in FIG. In this end face imaging block, the cameras 17a and 17b are installed obliquely with respect to the end face of the chip component 11, and an instantaneous image of the end face portion of the chip part 11 is taken. The illumination unit 18a sandwiches the transparent disk 2 with respect to the end surface of the chip component 11 captured by the camera 17a, and the illumination unit 18b sandwiches the transparent disk 2 with respect to the end surface of the chip component 11 captured by the camera 17b. Illumination light is irradiated from the opposite side of 17a and 17b. In addition to the upper and lower surface imaging blocks and the side surface imaging blocks, all six surfaces of the chip component 11 can be inspected by including this end surface imaging block.
[0051]
The instantaneous images are preferably captured using strobe lighting on the illumination units 18a and 18b. The illumination units 18a and 18b are preferably provided with a drive unit that emits light in synchronization. Thereby, it is possible to easily image, for example, both the upper and lower surfaces and the side surfaces at the same time. Alternatively, the illumination parts 18a and 18b may be continuously irradiated with the chip component 11 using a halogen light source. When a halogen light source is used, it is preferable to use a shutter camera for the cameras 17a and 17b, and to take an image at a high shutter speed of, for example, 1/1000 second.
[0052]
Moreover, it is preferable to use one strobe light source for the illumination units 18a and 18b.
[0053]
As an example of using the one strobe light source, for example, as shown in FIG. 18, a configuration in which the illumination units 18 a and 18 b and the strobe light source 30 are connected by a two-branch light guide 31 is preferable. The bifurcated light guide 31 is preferably formed of an optical fiber. When the strobe light source 30 emits light, the generated light is transmitted to the illumination units 18a and 18b through the two-branch light guide. The transmitted light is simultaneously irradiated from the illumination units 18a and 18b.
[0054]
Thus, two surfaces of the chip component 11 can be simultaneously imaged by simultaneously irradiating light with the illumination units 18a and 18b using one strobe light source 30.
Thus, by using one light source, further space saving and cost reduction can be achieved.
[0055]
In addition, the apparatus includes a sorting mechanism (sorting unit) that sorts non-defective products and defective products of the chip component 11 based on the image of the chip component 11 captured by the imaging units 6 and 7. The sorting section is composed of a sorting discharge nozzle 8 and a sorting box 9. More specifically, as shown in FIG. 14, the sorting discharge nozzle 8 comprises a defective product sorting nozzle 8a and a non-defective product sorting nozzle 8b, and the sorting box 9 comprises a defective product sorting box 9a and a non-defective product sorting box 9b. Become. In this sorting section, the chip parts 11 conveyed by the transparent disk 2 are stored in the defective product sorting box 9a by the defective product sorting nozzle 8a and in the good product sorting box 9b by the good product sorting nozzle 8b. ing. The defective product selection nozzle 8a and the non-defective product selection nozzle 8b are configured to store the chip parts 11 in the defective product selection box 9a or the non-defective product selection box 9b, respectively, by compressed air discharged from their tips. Since the sorting section performs sorting using compressed air, damage to the chip component 11 or damage to the transparent disk 2 can be prevented.
[0056]
Conventionally, selection of non-defective products and defective products has been performed by a mechanical mechanism using a swing guide or the like. Therefore, damage (scratches, chipping, etc.) has occurred in the chip component due to the contact between the swing guide and the chip component. In addition, the chip component may be bitten between the swing guide and the transparent disk, and the transparent disk may be scratched. Due to this scratch, it may be erroneously recognized during the outer shape inspection or may not be aligned on the alignment guide. In the present invention, since selection is performed using compressed air, damage to chip parts and scratches on the transparent disk can be reduced. Since the transparent disk is not damaged, there is no excessive selection due to erroneous recognition in the outer shape inspection, and the non-defective product determination rate can be improved.
[0057]
Furthermore, the apparatus includes a dust removal nozzle (dust removal unit) 10 as shown in FIG. The dust removal nozzle 10 is preferably provided on the upper and lower surfaces of the transparent disk 2 and continues to blow compressed air onto the transparent disk 2. Thereby, the dust adhering to the chip component 11 and the dust in the air can be prevented from adhering to the transparent disk 2. When this apparatus is installed in a place such as a clean room where there is little dust floating, the dust removing unit 10 may not be provided if dust does not adhere to the surface of the chip component 11.
[0058]
【The invention's effect】
As described above, the appearance inspection apparatus of the present invention includes a supply unit that supplies an electronic component, a conveyance unit that conveys the electronic component from the supply unit, an imaging unit that captures an image of the electronic component being conveyed, An appearance inspection apparatus including a sorting mechanism that sorts electronic components based on the quality of the electronic components determined from the image data captured by the imaging unit, wherein the imaging unit Two cameras whose optical axes are opposed to each other with components interposed therebetween, and a configuration in which each camera is equipped with an illumination unit that illuminates the electronic component by being installed at a position where illumination light does not enter the field of view of each camera It is.
[0059]
According to the above configuration, two images (for example, side surfaces) of the electronic component can be simultaneously captured at one location, so that the number of camera installation locations can be reduced, and space saving of the imaging unit can be achieved. Furthermore, since the illumination part with respect to each camera can be faced, the edge of an electronic component can be shone and the outermost shape of an electronic component can be measured more correctly. Thereby, the test | inspection precision of an electronic component can be improved. At the same time, the surface of the electronic component can be inspected.
[0060]
Since each of the illumination units is provided with a driving unit that emits light in synchronization, it is possible to easily image, for example, two of the side surfaces simultaneously.
[0061]
Moreover, the conveyance part can image the upper and lower surfaces of the electronic component by having a light transmission part that transmits light in the thickness direction at the mounting position of the electronic component.
[0062]
Further, by mounting the non-vibrating portion in the transport unit, the propulsive force applied to the chip-shaped electronic component is only the back push force, and it is possible to reduce supply variation and position variation after transfer to the transport unit. Further, since complicated processing is not required at the tip of the vibration feeder, the cost can be reduced in the appearance inspection apparatus.
[0063]
In addition, since the sorting mechanism includes a sorting unit using compressed air, it is possible to reduce damage to electronic components and to prevent the transparent disk from being damaged.
[0064]
The appearance inspection method of the present invention is an appearance inspection method of an electronic component that performs an inspection based on image data of an electronic component imaged by a camera, and irradiates illumination light from positions facing each other across the electronic component, In this configuration, two illuminated surfaces of the electronic component are simultaneously imaged at a viewing angle of the camera different from the optical axis of the illumination light.
[0065]
According to the above method, it is possible to simultaneously image, for example, two front and back surfaces of an electronic component. At the time of imaging, the illumination unit performs the function of a backlight at the same time, so it is possible to image the surface of the electronic component at the same time as the imaging of the surface of the electronic component. Can be inspected. In addition, since the edge of the electronic component can be illuminated with a dark background by the illumination unit, the outermost shape of the electronic component can be more accurately inspected.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of upper and lower surface imaging blocks in an appearance inspection apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view of a chip component to be inspected by the appearance inspection apparatus of the present invention.
FIG. 3 is a plan view of an appearance inspection apparatus according to an embodiment of the present invention.
4 is a cross-sectional view of a non-vibrating portion of the appearance inspection apparatus in FIG. 3;
FIG. 5 is a plan view of an example of a guide in the appearance inspection apparatus of FIG. 3;
6 is a plan view of another example of the guide in the appearance inspection apparatus of FIG. 3. FIG.
7 is a plan view of still another example of a guide in the appearance inspection apparatus of FIG. 3. FIG.
8 is a cross-sectional view of an example of a sensor in the appearance inspection apparatus of FIG.
9 is a cross-sectional view of another example of the sensor in the appearance inspection apparatus of FIG. 3. FIG.
10 is a cross-sectional view of still another example of a sensor in the appearance inspection apparatus in FIG. 3;
11 is a sectional view of a side imaging block in the appearance inspection apparatus in FIG. 3;
12 is an explanatory diagram relating to a captured image of a chip part in the appearance inspection apparatus in FIG. 3;
FIG. 13 is a cross-sectional view of an end face imaging block in the appearance inspection apparatus of the present invention.
14 is a plan view of a selection block in the appearance inspection apparatus of FIG. 3. FIG.
15 is a cross-sectional view of a dust removal unit in the appearance inspection apparatus of FIG.
FIG. 16 is an explanatory diagram relating to a captured image of a chip part in a conventional appearance inspection apparatus.
17 is an explanatory diagram illustrating a range in which the illumination direction of the illumination unit in the appearance inspection apparatus in FIG. 3 deviates from a preferable camera viewing angle.
18 is a side view showing an example in which one light source is used in the illumination unit in the appearance inspection apparatus in FIG. 3;
[Explanation of symbols]
1 Feeder
2 Transparent disk (conveyance table, conveyance unit)
3 No vibration part
4 Guide
6 Upper and lower imaging blocks (imaging unit)
7 Side imaging block (imaging unit)
8 Sorting discharge nozzle
9 Sorting box
10 Dust removal nozzle (Dust removal part)
17a camera
17b camera
18a Lighting unit
18b Lighting unit

Claims (6)

A supply unit for supplying electronic components;
A transport unit for transporting the electronic component from the supply unit;
An imaging unit for imaging an electronic component being conveyed;
An appearance inspection apparatus including a sorting mechanism that sorts electronic components based on the quality of the electronic components determined from the image data captured by the imaging unit,
The imaging unit includes two cameras whose optical axes face each other across the conveyed electronic components, and an illumination unit that illuminates the electronic components installed at a position where illumination light does not enter the field of view of each camera Is provided for each camera. The appearance inspection apparatus according to claim 1, wherein each of the illumination units is provided with a drive unit that emits light in synchronization. The appearance inspection apparatus according to claim 1, wherein the transport unit includes a light transmission unit that transmits light at a placement position of the electronic component. The said supply part has a vibration feeder which supplies an electronic component, and a non-vibration part spatially independent from a vibration feeder between a vibration part feeder and a conveyance stand. The appearance inspection apparatus according to any one of 1 to 3. 5. The appearance inspection apparatus according to claim 1, wherein the sorting mechanism includes a sorting unit that blows compressed air to the electronic component to move the electronic component to a desired position. 6. . An electronic component appearance inspection method for performing inspection based on image data of an electronic component imaged by a camera,
Irradiate illumination light from positions facing each other across the electronic component,
An appearance inspection method characterized in that two illuminated surfaces of an electronic component are simultaneously imaged by a camera having a viewing angle deviated from the illumination light irradiation direction.

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