JPH0634567A - Work chip detector - Google Patents

Work chip detector

Info

Publication number
JPH0634567A
JPH0634567A JP4190698A JP19069892A JPH0634567A JP H0634567 A JPH0634567 A JP H0634567A JP 4190698 A JP4190698 A JP 4190698A JP 19069892 A JP19069892 A JP 19069892A JP H0634567 A JPH0634567 A JP H0634567A
Authority
JP
Japan
Prior art keywords
work
defect
illumination
image
illumination light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4190698A
Other languages
Japanese (ja)
Inventor
Koji Mino
浩嗣 三野
Kenzou Enbara
健三 菴原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP4190698A priority Critical patent/JPH0634567A/en
Publication of JPH0634567A publication Critical patent/JPH0634567A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a work chip detector which enables the detection of work chips in any shape. CONSTITUTION:A work chip detector is provided with image pickup means 4 and 13 which are arranged above work W to take an image of the work W, side lighting means 3 and 19 to light the work W from the side thereof. The side lighting means 19 is preferably provided with a lighting body 16 to irradiate illumination light toward the work W from above the work W and a reflector section 12 which is arranged outside the side of the work W to reflect the illumination light of the lighting body 16 to the side of the work W.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えばセラミックスワ
ークの欠損を検出するときに用いられれワーク欠損検出
装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work defect detecting device used for detecting a defect of a ceramic work, for example.

【0002】[0002]

【従来の技術】従来のこの種のワーク欠損検出装置とし
ては、VTRカメラと照明ランプと、画像演算処理部と
を具備し、所定の位置に配備されたワークを照明ランプ
で照明するとともに、そのワークを上方から見た画像を
VTRカメラで撮像し、その撮像に係る画像データを画
像演算処理部で、例えば欠損が生じた場合のワーク外形
線の変化を演算処理するなどして、欠損が無い場合のワ
ーク外形線と欠損がある場合のワーク外形線とを比較照
合してワークの欠損を検出するようにしたものがある。
2. Description of the Related Art A conventional work defect detecting device of this type includes a VTR camera, an illuminating lamp, and an image calculation processing section, and illuminates a work arranged at a predetermined position with the illuminating lamp. An image of the work viewed from above is picked up by a VTR camera, and image data relating to the picked-up image is processed by an image calculation processing unit, for example, a change in the work outline is calculated when a defect occurs, so that there is no loss. In some cases, the work outline is compared with the work outline when there is a defect to detect the defect of the work.

【0003】[0003]

【発明が解決しようとする課題】ところで、上記のよう
なワーク欠損検出装置にあっては、ワークの欠損をその
外形線の変化から検出するものであるために、その欠損
の状態によっては検出ができないものも生じてしまうと
いう問題があった。
By the way, in the work defect detecting apparatus as described above, since the defect of the work is detected from the change of the outline, the defect may be detected depending on the state of the defect. There was a problem that some things could not be done.

【0004】この問題を図4および図5を参照して具体
的に説明すると、例えば図4に示すように平板状のワー
クWにその表裏面を貫通するような欠損30の場合であ
れば、ワークWの上方からVTRカメラて撮像すると、
その欠損30はワークWの外形線の変化として撮像され
るから、その欠損30の検出は容易である。
This problem will be described in detail with reference to FIGS. 4 and 5. For example, in the case of a defect 30 that penetrates the front and back surfaces of a flat work W as shown in FIG. When the image is taken from above the work W with the VTR camera,
Since the defect 30 is imaged as a change in the outline of the work W, it is easy to detect the defect 30.

【0005】しかしながら、ワークWに発生する欠損と
しては図4に示すような欠損30だけではなく、例えば
図5に示すようなその表裏面の一方の端部にのみ発生す
る表面部欠損31も存在する場合がある。
However, not only the defect 30 shown in FIG. 4 but also the surface defect 31 generated only at one end of the front and back surfaces thereof as shown in FIG. There is a case.

【0006】このような表面部欠損31にあっては、V
TRカメラでワークWを上方から撮像すると、その表面
部欠損31が画像として認識できず、その結果、このよ
うな表面部欠損31のワークWについてはVTRカメラ
で撮像してもその表面部欠損31が外形線変化として画
像データに表れてこなくなり、結果、この図5のワーク
Wでは欠損のないワークWとして処理されてしまうとい
う問題があったのである。
In such a surface defect 31, V
When the work W is imaged from above by the TR camera, the surface defect 31 cannot be recognized as an image, and as a result, the work W having such a surface defect 31 is imaged by the VTR camera, the surface defect 31. Is not displayed in the image data as a change in outline, and as a result, the work W in FIG. 5 is processed as a work W having no defect.

【0007】本発明はこのような課題に鑑みて為された
ものであって、どのような形状の欠損であっても、検出
することができるワーク欠損検出装置の提供を目的とし
ている。
The present invention has been made in view of the above problems, and an object thereof is to provide a work defect detecting device capable of detecting a defect of any shape.

【0008】[0008]

【課題を解決するための手段】本発明は、上記目的を達
成するために、ワークの上方に配置されて該ワークの画
像を撮像する撮像手段と、ワークをその側方から照明す
る側方照明手段とを備えたワーク欠損検出装置を構成し
た。なお、前記側方照明手段は、ワークの上方からワー
クに向けて照明光を照射する照明体と、ワーク側面の外
側に配置されて前記照明体の照明光をワークの側面に向
けて反射する反射鏡部とを備えているのが好ましい。
In order to achieve the above-mentioned object, the present invention provides an image pickup means which is arranged above a work and picks up an image of the work, and a side illumination which illuminates the work from its side. And a work defect detecting device having means. The side illumination means includes an illuminating body that emits illumination light from above the work toward the work, and a reflection that is disposed outside the side surface of the work and reflects the illumination light of the illuminating body toward the side surface of the work. And a mirror portion.

【0009】[0009]

【作用】請求項1の構成によれば、ワークをその側方か
ら照明するので、ワーク側面に生じた欠損が明瞭に照ら
し出されることになる。
According to the structure of the first aspect, since the work is illuminated from the side, the defect generated on the side surface of the work can be clearly illuminated.

【0010】また、請求項2の構成によれば、ワーク側
方照明をワーク上方から行うことができるので、平面上
に複数並列配置したワークにも側方照明を行うことがで
きるようになる。
Further, according to the structure of the second aspect, since the side illumination of the work can be performed from above the work, it is possible to perform the side illumination for the works arranged in parallel on the plane.

【0011】[0011]

【実施例】以下、本発明を図面に示す実施例に基づいて
詳細に説明する。図1は本発明の実施例1のワーク欠損
検出装置の斜視図である。このワーク欠損検出装置1は
ワーク載置面2上に配置された側方照明部3と、ワーク
載置面2上方に配置されたVTRカメラ4と、ワーク載
置面2を上方から照明する上方照明部5と、画像演算処
理部6とを備えている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the drawings. 1 is a perspective view of a work defect detecting device according to a first embodiment of the present invention. The work defect detecting device 1 includes a side illumination unit 3 arranged on the work mounting surface 2, a VTR camera 4 arranged above the work mounting surface 2, and an upper portion for illuminating the work mounting surface 2 from above. The lighting unit 5 and the image calculation processing unit 6 are provided.

【0012】側方照明部3は、4個の照明箱3aからな
り、これら照明箱3aにはファイバーケーブル7により
図示しない照明源から照明光が供給されるようになって
いる。これら照明箱3aはワーク載置面2中央を囲んで
その四方に配置されており、各照明箱3aの中央側側面
には照明光放出スリット8が形成されている。上方照明
部5は、リング型照明体(例えばリング蛍光灯)からな
っており、VTRカメラ4を囲んでワーク載置面2上方
に配置されている。画像演算処理部6はVTRカメラ4
が撮像したワークWの画像データを画像処理してその欠
損を検出するものである。
The side illumination unit 3 comprises four illumination boxes 3a, and illumination light is supplied to these illumination boxes 3a from an illumination source (not shown) by a fiber cable 7. These illumination boxes 3a surround the center of the work mounting surface 2 and are arranged on four sides thereof, and an illumination light emission slit 8 is formed on the side surface of each illumination box 3a on the center side. The upper illumination section 5 is composed of a ring type illumination body (for example, a ring fluorescent lamp), and is arranged above the work placement surface 2 so as to surround the VTR camera 4. The image processing unit 6 is the VTR camera 4
The image data of the work W captured by is image-processed and the defect is detected.

【0013】このワーク欠損検出装置1によるワークW
(例えばセラミックスワーク)の欠損検出作業は次のよ
うにしてなされる。すなわち、ワーク載置面2上にワー
クWを載置する。載置されたワークWの側面それぞれに
は各照明箱3aの照明光放出スリット8から照明光が照
射される。また、ワークWの上面には上方照射部5から
照明光が照射される。各照明部3,5によって照らし出
されたワークWの画像はVTRカメラ4で撮像され、そ
の画像データは画像演算処理部6に入力される。
Work W by this work defect detecting device 1
The defect detection work (for example, a ceramic work) is performed as follows. That is, the work W is placed on the work placement surface 2. Illumination light is emitted from the illumination light emission slits 8 of the respective illumination boxes 3a to the respective side surfaces of the placed work W. Further, the upper irradiation part 5 irradiates the upper surface of the work W with illumination light. The image of the work W illuminated by each of the illumination units 3 and 5 is captured by the VTR camera 4, and the image data thereof is input to the image calculation processing unit 6.

【0014】画像演算処理部6に入力された画像データ
は、ここでその画像外形線(輪郭)および、画像内明度
差が算出され、その算出結果によって欠損の有無が検出
される。つまり、ワークWに図4に示したような貫通欠
損30が存在する場合、上方のVTRカメラ4によって
得られた画像はその外形線に不連続な形状が発生する。
この不連続形状を画像演算処理部6によって検出して貫
通欠損30の有無を認知する。また、ワークWに図5に
示すような表面部欠損31が存在する場合、得られた画
像データにおいては、表面部欠損31とその周囲では明
度差が生じる。これは、表面部欠損31の生じたワーク
Wの側面部とその周囲の正常な側面部とでは、側方照明
部3の照明光がVTRカメラ4側に反射する角度に違い
が生じ、この反射角の違いが明度差として現れるためで
ある。そして、このような明度差を画像演算処理部6に
よって検出して表面部欠損31の有無を認知する。
With respect to the image data input to the image calculation processing section 6, the image outline (outline) and the in-image brightness difference are calculated, and the presence or absence of a defect is detected by the calculation result. That is, when the work W has the penetrating defect 30 as shown in FIG. 4, the outline obtained from the image obtained by the upper VTR camera 4 is discontinuous.
The discontinuous shape is detected by the image calculation processing unit 6 to recognize the presence or absence of the penetrating defect 30. When the work W has a surface defect 31 as shown in FIG. 5, a difference in lightness occurs between the surface defect 31 and its surroundings in the obtained image data. This is because there is a difference in the angle at which the illumination light of the lateral illumination section 3 is reflected toward the VTR camera 4 between the side surface of the work W in which the surface defect 31 has occurred and the normal side surface around it. This is because the difference in angle appears as a difference in brightness. Then, the image calculation processing unit 6 detects such a difference in brightness to recognize the presence or absence of the surface defect 31.

【0015】上記実施例1では欠損をワークW単品毎に
検出していたが、次述する実施例2では複数のワークW
の欠損の有無を連続的に検出するようにしている。すな
わち、このワーク欠損検出装置10はワーク載置板11
を備えている。ワーク載置板11は複数のワークWを載
置できる大きさを有しており、反射鏡部12により各ワ
ークWの載置領域A毎に碁盤の目状に区画されている。
反射鏡部12は外面を鏡面加工した三角柱体からなり、
各ワーク載置領域Aの四方を囲んで配設されている。ワ
ーク載置板11は図示しない移動機構により図中イ方向
に搬送されるようになっている。
In the first embodiment, a defect is detected for each individual work W, but in the second embodiment described below, a plurality of works W are detected.
The presence or absence of the defect is continuously detected. That is, the work defect detecting device 10 is provided with the work placing plate 11
Is equipped with. The work mounting plate 11 has a size capable of mounting a plurality of works W, and is divided by the reflecting mirror portion 12 into mounting areas A of the respective works W in a grid pattern.
The reflecting mirror portion 12 is made of a triangular prism whose outer surface is mirror-finished,
It is arranged so as to surround four sides of each work placement area A. The work placing plate 11 is conveyed in the direction a in the figure by a moving mechanism (not shown).

【0016】ワーク載置面11の上方にはVTRカメラ
13が配設されている。VTRカメラ13はXY移動ロ
ボット14に一体に取り付けられており、ワーク載置板
11の平面方向に沿って移動可能に配置されている。V
TRカメラ13には、リング型照明体からなる上方照明
部15が一体に取り付けられている。上方照明部15は
VTRカメラ13のレンズ部を囲んで配置されている。
また、VTRカメラ13には側方照明体16が一体に取
り付けられている。側方照明体16はVTRカメラ13
とワーク載置面11との間に配置されている。側方照明
体16は計4個の照明箱16aからなっており、VTR
カメラ13のレンズ中心線方向を中心としてその四方に
配置されている。これら照明箱16aによって囲まれた
領域は各ワーク載置領域Aと同等の大きさになってお
り、各照明箱16aは反射鏡部12上方に位置する。各
照明箱16aにはファイバーケーブル17により図示し
ない照明源から照明光が供給されるようになっている。
各照明箱16aの底面には照明光放出スリット18が形
成されている。この側方照明体16と反射鏡部12とか
ら側方照明部19は構成されている。そして、VTRカ
メラ13が撮像した画像データを処理する画像演算処理
部20が設けられている。
A VTR camera 13 is arranged above the work mounting surface 11. The VTR camera 13 is integrally attached to the XY mobile robot 14, and is arranged so as to be movable along the plane direction of the work placement plate 11. V
The TR camera 13 is integrally attached with an upper illuminating section 15 which is a ring-type illuminating body. The upper illumination unit 15 is arranged so as to surround the lens unit of the VTR camera 13.
A side illumination body 16 is integrally attached to the VTR camera 13. The side illumination body 16 is the VTR camera 13
And the work placement surface 11. The side illuminator 16 is composed of a total of four illuminator boxes 16a.
The cameras 13 are arranged on all four sides with respect to the lens center line direction. The area surrounded by these illumination boxes 16a has the same size as each work placement area A, and each illumination box 16a is located above the reflecting mirror section 12. Illumination light is supplied from an illumination source (not shown) to each illumination box 16a by a fiber cable 17.
An illumination light emission slit 18 is formed on the bottom surface of each illumination box 16a. The side illumination unit 19 is configured by the side illumination body 16 and the reflecting mirror unit 12. An image calculation processing unit 20 that processes the image data captured by the VTR camera 13 is provided.

【0017】このように構成されたワーク欠損検出装置
10は、上述したように側方照明体16をワーク載置板
11とは分離してその上方に配置し、さらには、側方照
明部19を、複数のワークWを収納できるワーク載置板
11およびXY移動ロボット14に組み合わせている。
そのため、複数のワークWに連続して欠損検出処理を施
せるようになっている。すなわち、ワーク載置板11の
各ワーク載置領域AにワークWを収納しておく。そし
て、ワークWを収納したワーク載置板11を図示しない
搬送機構により、VTRカメラ13の下方まで搬送す
る。搬送が終了すると、XY移動ロボット14により、
VTRカメラ13、上方照明部15、および側方照明体
16をワーク載置板11に沿って移動させつつ、各ワー
クWの欠損を連続して検出する。このとき、図3に示す
ように、照明箱16aから下方に向かって照射された照
明光は反射鏡部12によってワークW側面側に反射され
るので、実施例1の側方照明部3と同様、ワークW側面
が照明されることになる。このようにして照明されたワ
ークWの画像がVTRカメラ13で撮像され、その画像
データが画像演算処理部20で画像処理され、各ワーク
Wの欠損の有無が検出される。この画像演算処理は実施
例1のものと同様であるので、その説明は省略する。
In the work defect detecting device 10 thus constructed, the side illumination body 16 is separated from the work placing plate 11 and arranged above the work placing plate 11 as described above, and further, the side illumination unit 19 is provided. Is combined with the work placing plate 11 and the XY mobile robot 14 capable of accommodating a plurality of works W.
Therefore, a plurality of works W can be continuously subjected to the defect detection processing. That is, the work W is stored in each work placement area A of the work placement plate 11. Then, the work mounting plate 11 accommodating the work W is transported to a position below the VTR camera 13 by a transport mechanism (not shown). When the transportation is completed, the XY mobile robot 14
While the VTR camera 13, the upper illuminating unit 15, and the side illuminating body 16 are moved along the work placing plate 11, the defects of the respective works W are continuously detected. At this time, as shown in FIG. 3, the illumination light emitted downward from the illumination box 16a is reflected by the reflecting mirror portion 12 toward the side surface of the work W, and thus the same as the side illumination portion 3 of the first embodiment. , The side surface of the work W is illuminated. An image of the work W illuminated in this way is picked up by the VTR camera 13, and the image data thereof is subjected to image processing by the image calculation processing section 20 to detect whether or not each work W is missing. This image calculation process is the same as that of the first embodiment, and therefore its explanation is omitted.

【0018】欠損検出が終了すると、再び図示しない搬
送機構を駆動して、ワーク載置板11を次工程施工位置
に搬送するとともに、新たな欠損検出ワークWを収納し
たワーク載置板11をワーク欠損検出装置10下に搬入
し、再び上記した欠損検出作業を行う。
When the loss detection is completed, the transport mechanism (not shown) is driven again to transport the work placement plate 11 to the next step construction position, and the work placement plate 11 containing the new loss detection work W is placed on the work placement plate 11. It is carried in under the defect detection device 10, and the above-described defect detection work is performed again.

【0019】[0019]

【発明の効果】以上のように、本発明の請求項1の構成
によれば、ワークをその側方から照明するので、ワーク
側面に生じた欠損が明瞭に照らし出されることになり、
ワークの貫通欠損だけでなく、ワーク側面の表面部位に
形成された表面部欠損をも確実に検出できるようにな
り、ワークW欠損検出精度が向上した。
As described above, according to the structure of claim 1 of the present invention, since the work is illuminated from the side, the defect caused on the side surface of the work is clearly illuminated.
Not only the penetrating defect of the workpiece but also the surface defect formed on the surface portion of the side surface of the workpiece can be reliably detected, and the accuracy of detecting the workpiece W defect is improved.

【0020】また、請求項2の構成によれば、ワーク側
方照明をワークW上方から行うことができるので、平面
上に複数並列配置したワークにも側方照明を行うことが
できるようになった。そのため、請求項1の構成と合わ
せて複数のワークの欠損を精度よくしかも迅速に検出す
ることができるようになった。
Further, according to the second aspect of the invention, since the side illumination of the work can be performed from above the work W, the side illumination can be performed even for the plurality of works arranged in parallel on the plane. It was Therefore, combined with the structure of claim 1, it has become possible to detect defects of a plurality of works accurately and quickly.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例1のワーク欠損検出装置の構成
を示す斜視図である。
FIG. 1 is a perspective view showing a configuration of a work defect detecting device according to a first embodiment of the present invention.

【図2】実施例2のワーク欠損検出装置の構成を示す斜
視図である。
FIG. 2 is a perspective view showing a configuration of a work defect detecting device according to a second embodiment.

【図3】実施例2の側方照明部によるワーク側方照明の
状態を示す説明図である。
FIG. 3 is an explanatory diagram showing a state of work side illumination by a side illumination unit of the second embodiment.

【図4】ワークの貫通欠損の形状を示す斜視図である。FIG. 4 is a perspective view showing a shape of a penetrating defect of a work.

【図5】ワークの表面部欠損の形状を示す斜視図であ
る。
FIG. 5 is a perspective view showing a shape of a surface defect of a work.

【符号の説明】[Explanation of symbols]

3,19 側方照明体照明 4,13 VTRカメラ 30,31 欠損 W ワーク 3,19 Side illumination 4,13 VTR camera 30,31 Defect W work

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】ワーク(W)の上方に配置されて該ワーク
(W)の画像を撮像する撮像手段(4,13)と、ワー
ク(W)をその側方から照明する側方照明手段(3,1
9)とを備えたことを特徴とするワーク欠損検出装置。
1. An image pickup means (4, 13) arranged above a work (W) for picking up an image of the work (W), and a side illumination means (for illuminating the work (W) from its side. 3,1
9) A work defect detecting device comprising:
【請求項2】前記側方照明手段(19)が、ワーク
(W)の上方からワーク(W)に向けて照明光を照射す
る照明体(16)と、ワーク(W)側面の外側に配置さ
れて前記照明体(16)の照明光をワーク(W)の側面
に向けて反射する反射鏡部(12)とを備えていること
を特徴とする請求項1記載のワーク欠損検出装置。
2. The side illuminating means (19) is arranged outside a side surface of the work (W) and an illuminating body (16) for irradiating the work (W) with illumination light from above. The work defect detecting device according to claim 1, further comprising: a reflecting mirror section (12) that reflects the illumination light of the illumination body (16) toward a side surface of the work (W).
JP4190698A 1992-07-17 1992-07-17 Work chip detector Pending JPH0634567A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4190698A JPH0634567A (en) 1992-07-17 1992-07-17 Work chip detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4190698A JPH0634567A (en) 1992-07-17 1992-07-17 Work chip detector

Publications (1)

Publication Number Publication Date
JPH0634567A true JPH0634567A (en) 1994-02-08

Family

ID=16262369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4190698A Pending JPH0634567A (en) 1992-07-17 1992-07-17 Work chip detector

Country Status (1)

Country Link
JP (1) JPH0634567A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7169958B2 (en) 2002-06-11 2007-01-30 Basf Aktiengesellschaft Method for the production of 1,4- butane-diol by combined gas-phase and liquid-phase hydrogenation
US7271299B2 (en) 2002-06-11 2007-09-18 Basf Aktiengesellschaft Two-stage method for producing butanediol with intermediated separation of succinic anhydride
WO2012073730A1 (en) * 2010-12-01 2012-06-07 シーシーエス株式会社 Profile line detecting method and profile line detecting apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7169958B2 (en) 2002-06-11 2007-01-30 Basf Aktiengesellschaft Method for the production of 1,4- butane-diol by combined gas-phase and liquid-phase hydrogenation
US7271299B2 (en) 2002-06-11 2007-09-18 Basf Aktiengesellschaft Two-stage method for producing butanediol with intermediated separation of succinic anhydride
WO2012073730A1 (en) * 2010-12-01 2012-06-07 シーシーエス株式会社 Profile line detecting method and profile line detecting apparatus
JP2012117943A (en) * 2010-12-01 2012-06-21 Ccs Inc Contour line detection method and contour line detection device

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