JP2005083959A - Carrying substrate defect detection device and laser trimming machine equipped with carrying substrate defect detection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize cost and space reduction as well as productivity improvement by shortening detection time for a two-ply defect and a crack, or a breakage. <P>SOLUTION: The laser trimming machine equipped with a carrying substrate defect detection device is composed of: a detection stage 2 in which while a substrate 11 is carried the substrate 11 is stopped by detecting a defect of the substrate 11; a lighting 23; a mirror 25 which projects the side surface image of the substrate 11 on the imaging surface of a camera 21; the camera 21 which takes a picture of the surface image of the substrate 11 and the side surface image of the substrate 11 projected on the mirror 25; an image processing unit 3 which performs image processing of this picture and detects whether a two-ply defect and a crack or a breakage of the substrate 11 has occurred, and outputs a detection signal; and a CPU 4 which performs defective substrate treatment when a defect detection signal is inputted from the image processing unit 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a conveyance substrate defect detection device and a laser trimming machine equipped with the conveyance substrate defect detection device, and in particular, detects a double stacking defect and a substrate crack / chip defect that occur in substrate conveyance by capturing them as the same image. The present invention relates to a transport substrate defect detection device capable of shortening the substrate processing time by shortening the detection processing time and the number of detection stages and improving the productivity, and a laser trimming machine equipped with the transport substrate failure detection device.

A substrate processing apparatus such as a laser trimming machine generally includes a conveyor (conveying means) on which opposite ends of a substrate are placed. For example, in a laser trimming machine, a substrate is supplied by a substrate loading unit that lifts ceramic substrates that are overlaid one by one and places them on a conveyor.
At this time, if the ceramic substrates are brought into close contact with each other by vacuum suction, the substrate loading means may place the two stacked substrates on the conveyor. Moreover, the board | substrate with which crack and chip | tip (crack and / or chip | tip) defect generate | occur | produced may be mounted on a conveyor.
When such a defective substrate is conveyed to the trimming device main body of the laser trimming machine, there is a risk of damaging the machine. Therefore, the following conveyance substrate defect detection device has been used.

FIG. 8 shows a schematic block diagram of a transport substrate defect detection device according to a conventional example.
In the figure, a transport substrate defect detection apparatus 100 includes a double stack detection stage 102, a crack / chip detection stage 103, a thickness detection sensor 105, an image processing unit 106, and a CPU 107, and includes a substrate input unit 101 and a laser trimming machine. 104.
The substrate loading means 101 lifts the stacked ceramic substrates one by one and conveys them to the double-stack detection stage 102 of the transport substrate defect detection device 100. Then, the conveyed substrate is supplied to the laser trimming machine 104 via the double-stack detection stage 102 and the crack / chip detection stage 103.

FIG. 9 is a schematic block diagram for explaining a thickness detection sensor of a transport substrate defect detection device according to a conventional example.
In the figure, the thickness detection sensor 105 has a configuration in which, for example, a small reflective sensor is superposed in two stages, although not shown. The lower reflective sensor detects the lower substrate 11 that is stacked, and the upper reflective sensor detects the upper substrate 10. Each reflective sensor is connected to the CPU 107 and outputs a detection signal to the CPU 107.
In general, the double overlap detection stage 102 includes a belt conveyor and a guide plate (not shown) for transporting the substrates 10 and 11.

The CPU 107 is information processing means, and generally a personal computer or the like is used. In addition, when using the thickness detection sensor 105 using a reflection type sensor, it is also possible to process the detection signal from a reflection type sensor using a sequencer or a relay circuit.
When the CPU 107 receives a detection signal for detecting the substrate 10 from the upper reflective sensor of the thickness detection sensor 105, the CPU 107 outputs a control signal to the double-stack detection stage 102 to stop the belt conveyor. Then, an alarm signal is output to an alarm means (not shown) to notify the operator that a double stack failure has occurred.

As described above, when the two substrates 10 and 11 are stacked, the two upper and lower reflective sensors detect the substrates 10 and 11 respectively, and the CPU 107 detects that the two substrates 10 and 11 are stacked.
In addition, when the CPU 107 detects the overlapping of the substrates 10 and 11, the CPU 107 stops the conveyance and outputs an alarm signal. The operator who notices the alarm in this way removes the substrates 10 and 11 from the line (conveyance path) and re-inserts them.

FIG. 10 is a schematic block diagram for explaining the configuration of the crack / chip detection means of the transport substrate defect detection device according to the conventional example.
In the figure, the crack / chip detection means 130 includes a camera 131 that images a single substrate 11 from below, a lens 132 attached to the camera 11, and a plurality of illuminations 133 that irradiate the substrate 11 with light from below. It has become.
Although not shown in the figure, the crack / chip detection stage 103 includes a biaxial robot type transport unit that transports the substrate 11 by pinching or adsorbing it.

The substrate 11 that has been confirmed to be a single substrate via the double-stack detection stage 102 is conveyed to the front of the lens 132 and is imaged by the camera 131 while being irradiated with light from the illumination 133.
The captured image data is output to the image processing unit 106, and the image processing unit 106 converts the input image data into a digital signal. Then, the image processing unit 106 compares the digitized image with a normal image stored in advance, determines whether or not the substrate 11 is cracked or chipped, and uses the determination result as a detection signal for the CPU 107. Output to.

  As shown in FIG. 11, the normal image 150 includes a gray background image 151 of the camera shooting range 134 and a white surface image 152 of the substrate 11. As shown in FIG. 12, the image 150b of the substrate 11 includes a gray background image 151 of the camera photographing range 134 and a white surface image 152b of the substrate 11 on which a black crack / chip 154 is projected. .

  The CPU 107 inputs a detection signal from the image processing unit 106, and when the detection result is normal and there is no crack / chip defect in the substrate 11, the CPU 11 transports the substrate 11 to the laser trimming machine 104. On the other hand, when the detection result shows that the substrate 13 is cracked or chipped, the conveyance of the substrate 11 is stopped and an alarm signal is output.

  As described above, the transport substrate defect detection apparatus 100 detects a two-sheet stacking defect or a crack / chip defect by using the two-stack detection stage 102 and the crack / chip detection stage 103, and the laser trimming machine 104 detects only the normal substrate 11. Transport to.

  In Patent Document 1, in a visual inspection apparatus for a semiconductor device that optically reads a plurality of leads extending from a side surface of a substantially rectangular package, a reflecting means disposed on at least one side surface of the semiconductor device; The technology of a semiconductor device appearance inspection device comprising an optical reading mechanism for collectively obtaining an image on a side surface of a semiconductor device reflected by a reflecting means and an image on a plane side of the semiconductor device is disclosed. Yes.

  In Patent Document 2, a plurality of mirrors arranged around the sample and reflecting the image of the side surface of the sample, and an image of the upper surface of the sample and reflected by the plurality of mirrors are arranged above the sample. There is disclosed a technique of an appearance inspection apparatus that includes an image pickup unit that picks up an image of the side surface, and an inspection unit that performs grayscale image processing on a video signal supplied from the image pickup unit and inspects the appearance of a sample.

  Further, in Patent Document 3, in a visual inspection apparatus for a semiconductor device that optically reads an image of a semiconductor device provided with a substantially rectangular package, four polarized light sources arranged to face the four side surfaces of the package; It is arranged between the four polarized light sources and the corresponding side surfaces of the package, and reflects the projected images on the side surfaces formed by the polarized light emitted toward the package from the polarized light sources facing each other with the package in between. Disclosed is a technique of an appearance inspection apparatus for a semiconductor device, which includes four reflecting means to be performed, and image reading means for collectively fetching a projected image on each side surface reflected by the four reflecting means and an image on the plane side of the package. Has been.

  Further, Patent Document 4 includes an illumination for illuminating the inspection object and a camera above the inspection stage on which the inspection object is placed, and observes the side surface of the inspection object around the inspection object. There is disclosed a technique of an appearance inspection apparatus that includes a side observation unit, and in which a camera captures, as an inspection image, an upper surface of an inspection target and a side image of the inspection target captured by the side observation unit.

  Further, Patent Document 5 discloses an imaging unit disposed on a plane side or a bottom side of a semiconductor device, an illumination unit provided on each of the plane side and the bottom side of the semiconductor device, and both left and right side surfaces of the semiconductor device. The semiconductor device appearance inspection technique is configured by a pair of mirrors for taking both left and right side portions of the semiconductor device into the imaging means as part of the subject, and inspecting the appearance of the semiconductor device by the imaging means. It is disclosed.

Japanese Patent Laid-Open No. 7-98216 (2nd page, FIGS. 1 and 2) Japanese Patent Laid-Open No. 10-141925 (second page, FIGS. 1 and 2) Japanese Patent Laid-Open No. 11-44513 (Page 2, FIGS. 1 and 2) Japanese Unexamined Patent Publication No. 2000-18927 (page 2, FIGS. 1 and 2) Japanese Unexamined Patent Publication No. 2003-35681 (2nd page, FIG. 1)

However, since the double substrate detection stage 102 and the crack / chip detection stage 103 are separately provided and the defect detection process is performed separately, the transport substrate defect detection apparatus 100 takes a long time for detection and transport and is therefore productive. There was a problem that it was not possible to improve.
In addition, since the two stages 102 and 103 and separate defect detection means, that is, the thickness detection sensor 105 and the crack / chip detection means 130 are required, there is a problem that the manufacturing cost cannot be reduced. It was.
Further, since the two stages 102 and 103 are provided, there is a problem that space saving cannot be achieved.

Further, although Patent Documents 1 to 5 disclose the technique of an appearance inspection apparatus that captures and processes the upper surface and external terminals of a semiconductor device or the like as the same image, generally, a semiconductor device or the like is an inspection stage. In contrast, the transport substrate needs to be inspected on the transport line from the viewpoint of improving productivity. In addition, it is necessary to quickly process a substrate in which a defect is detected, and to shorten the production stop time.
That is, the techniques described in Patent Documents 1 to 5 have a problem that the substrate to be transported cannot be efficiently inspected.

  In order to solve the above problems, the present invention detects a double stacking defect and a crack / chip defect simultaneously and on the same stage, thereby reducing the detection time and improving the productivity, reducing the manufacturing cost and saving the space. It is an object of the present invention to provide a conveyance substrate defect detection device that can be made simple.

  In order to achieve this object, the transport substrate defect detection device of the present invention transports a substrate which is an object to be inspected, and stops the substrate or decelerates the transport speed of the substrate when detecting the defect of the substrate. A detection stage, illumination that illuminates one of the front and back surfaces of the substrate conveyed on the detection stage, and a side image of the substrate conveyed on the detection stage. A mirror that is projected on the camera, a camera that captures an image of either the front surface or the back surface of the substrate illuminated by the illumination, a side image of the substrate that is projected on the mirror, and an image captured by the camera. An image processing unit for performing image processing to detect whether or not a double stacking defect of the substrate has occurred and whether or not a crack or chipping defect has occurred in the substrate, and to output a detection signal; If you enter a defect detection signal from the unit, there is a configuration provided with the information processing unit for performing predetermined defective substrate process.

  In addition, the transport substrate defect detection device according to the present invention includes a substrate moving unit that removes one substrate from the two stacked substrates, and the information processing unit inputs the defect detection signal of the two-stack error from the image processing unit. The substrate moving means is configured to remove one substrate from the two stacked substrates, and to detect whether at least the crack / chip defect has occurred in the remaining substrate.

  In the conveyance substrate defect detection device according to the present invention, when the information processing unit inputs a defect detection signal from the image processing unit, the alarm signal is output to the alarm unit.

  Moreover, the conveyance board defect detection apparatus concerning this invention is set as the structure which used the said detection stage as the conveyance conveyor.

  In the transport substrate defect detection device according to the present invention, the transport conveyor includes a guide plate that guides the substrate, and the mirror attached to the outside of the guide plate passes through the guide plate to The side image is displayed on the imaging surface of the camera.

  In addition, the conveyance substrate defect detection device according to the present invention is configured such that a transparent material is used as the material of the guide plate, or a notch for projecting the side surface of the substrate is provided on the guide plate.

  Moreover, the conveyance substrate defect detection apparatus according to the present invention is configured such that the detection stage is a conveyance robot.

  Moreover, the laser trimming machine provided with the conveyance board defect detection apparatus concerning this invention is set as the structure provided with the conveyance board defect detection apparatus in any one of the said Claims 1-7.

The transport substrate defect detection device according to the present invention can simultaneously detect a double stacking defect and a crack / chip defect of a substrate being transported from the same image with a single detection stage. Therefore, from the transport time and the detection processing time associated with the detection. Detection time can be shortened, and productivity can be improved. In addition, since there is one detection stage, the stop time and the transport time can be saved by the amount corresponding to the two-layer detection stage, so that the transport time can be shortened.
In addition, since two detection stages are combined into one and it is not necessary to provide a thickness detection sensor, the manufacturing cost can be reduced. Furthermore, since the two detection stages are combined into one, space saving can be achieved.

In addition, when a double substrate failure is detected, a single substrate is automatically removed from the transport path, and the remaining substrate is inspected so that it can be processed more quickly by the operator, reducing production stop time. Production efficiency can be improved.
Furthermore, since the detection stage can be configured to include a transfer conveyor and a transfer robot, the transfer means can be freely selected according to the specifications of the substrate processing apparatus.

Further, by installing a mirror outside the guide plate of the transport conveyor, it is not necessary to raise and lower the mirror in synchronization with the transport of the substrate, so that the equipment cost can be reduced. Specifically, it can be easily realized by using a transparent material as the material of the guide plate or by providing a notch (view window) for projecting the side surface of the substrate on the guide plate.
Furthermore, by providing the transport substrate defect detection device according to the present invention in the laser trimming machine, particularly a substrate with a short processing time can be efficiently manufactured, and the operating rate of the laser trimming machine can be greatly improved. .

[Transfer substrate defect detection device]
FIG. 1 is a schematic block diagram for explaining the configuration of a transport substrate defect detection apparatus according to the present invention.
In FIG. 1, a conveyance substrate defect detection apparatus 1 includes a detection stage 2, an image processing unit 3, and a CPU 4, and is installed between a substrate loading unit 101 and a laser trimming machine 104.

The detection stage 2 is connected to the substrate loading unit 101 and the laser trimming machine 104. When a substrate (not shown) is supplied from the substrate loading unit 101, the detection stage 2 is transported and stopped in the camera photographing range 25. Alternatively, the substrate transport speed is reduced to detect a defect, and only a normal substrate is transported again, and is loaded into the laser trimming machine 104.
The detection stage 2 is a two-axis robot or a three-axis robot equipped with, for example, a conveyor such as a belt conveyor, a roller conveyor or a chain conveyor, a vacuum suction means for holding a substrate on a movable part, an air hand, etc. Such a transfer robot can be used, and can cope with various substrates and substrate processing apparatuses.

FIG. 2 is a schematic block diagram illustrating the configuration of the defect detection means of the conveyance substrate defect detection device according to the present invention.
In the figure, a defect detection means 20 is a camera 21 that images a single substrate 11 from above, a lens 22 that is attached to the camera 21 and expands the imaging range 25 of the camera 21, and images the surface and side surfaces of the substrate 11. The detection stage 2 is provided with a plurality of illuminations 23 for irradiating light and a mirror 24 for projecting a side image of the substrate 11 to the camera 21.

Since the camera 21 has a configuration in which the substrate 11 and the mirror 24 are within the camera photographing range 25, the surface image and the side image of the substrate 11 can be imaged by imaging one screen (see FIG. 3). .
In this way, by stopping the substrate 11 being transported once or capturing an image while decelerating the transport speed, the front surface image and the side image can be acquired simultaneously, and the transport time and imaging time associated with the transport / stop are set. It can be shortened.
In addition, in this embodiment, although it is set as the structure which images the surface image and side image of the board | substrate 11, it is not limited to this structure, For example, as a structure which images the back surface image and side image of the board | substrate 11 Also good.

  The image processing unit 3 performs image processing on an image captured by the camera 21 and compares it with a normal image stored in advance, thereby detecting whether a crack or chipping defect has occurred in the substrate 11. Further, the thickness of the normal image and the side image of the substrate 11 are compared, and it is detected whether or not a substrate double stacking defect has occurred. The detection result is output to the CPU 4 as a detection signal.

The CPU 4 as the information processing means inputs a defect detection signal from the image processing unit 3 and, when a double sheet defect or crack / chip defect is detected, as a predetermined defective substrate process, for example, to an alarm means (not shown). An alarm signal is output to inform the operator that a failure has occurred and the vehicle has stopped.
As a result, the operator can remove the defective substrate from the transport path and resume production.

Next, the operation of the transport substrate defect detection apparatus 1 having the above configuration will be described with reference to the drawings.
First, the transport substrate defect detection device 1 transports the substrate 11 to a predetermined position within the camera shooting range 25, the camera 21 captures the substrate 11, and the image processing unit 3 performs image processing on the captured image.

FIG. 3 is a schematic view of an image of a normal substrate having no double stacking defect and no crack / chip defect in the conveyance substrate defect detection device according to the present invention.
In the figure, a normal image 50 image-processed by the image processing unit 3 includes a gray background image 51 of the camera shooting range 25, a white surface image 52 of the substrate 11, and a white side image 53 of the substrate 11. It is made up of.
The image processing unit 3 compares a normal image stored in advance with the captured and image-processed image 50 to determine whether or not they are the same, and when they are the same, a detection signal indicating that the substrate 11 is normal is output. Output to CPU4.

FIG. 4 is a schematic view of an image of a substrate on which a double stacking defect has occurred in the transport substrate defect detection device according to the present invention.
In the figure, an image 50a having a double overlay image processed by the image processing unit 3 includes a gray background image 51 in the camera shooting range 25, a white surface image 52 of the upper substrate 11, and an upper substrate on which two images are superimposed. 10 and a white side image 53a on which the lower substrate 11 is projected.
The image processing unit 3 compares the normal image stored in advance with the captured and image-processed image 50a, and determines that the double stacking defect has occurred because the side image 53a is twice as thick as the side image 53. Then, a defect detection signal to that effect is output to the CPU 4. Then, the CPU 4 outputs an alarm signal, and the operator can perform defective substrate processing.

FIG. 5 shows a schematic diagram of an image of a substrate in which a crack / chip defect has occurred in the transport substrate defect detection device according to the present invention.
In the figure, a crack / chip defect image 50b image-processed by the image processing unit 3 is a white background of the substrate 11 on which a gray background image 51 of the camera photographing range 25 and a black crack / chip portion 54 are projected. It consists of a surface image 52 b and a white side image 53 of the substrate 11.
The image processing unit 3 compares a normal image stored in advance with the captured and image-processed image 50b, and a crack / chip defect 54 is displayed on the surface image 52b. The failure detection signal indicating that is output to the CPU 4. Then, the CPU 4 outputs an alarm signal, and the operator can perform defective substrate processing.

  As described above, according to the transport substrate defect detection device 1 of the present embodiment, a single detection stage 2 can simultaneously detect a double stacking defect and a crack / chip defect of a substrate being transported. Detection time consisting of time and detection processing time can be shortened, and productivity can be improved.

In the above embodiment, when a defect occurs, the CPU 4 that has input the defect detection signal outputs an alarm signal and the operator performs the defective substrate processing. However, the present invention is not limited to this configuration.
Next, an application example in which the transport substrate defect detection apparatus 1 efficiently processes a defective substrate will be described with reference to the drawings.

6A and 6B are schematic views of an application example of the conveyance substrate defect detection device according to the present invention, in which FIG. 6A is a front view, and FIG. 6B is a side view of AA.
In FIG. 2A, the camera 21, illumination 23, etc. are omitted for easy understanding.
In the figure, the conveyance substrate defect detection device 1a is configured such that the detection stage 2a includes a belt conveyor 26, a transparent guide plate 27, and a substrate moving means 7.

The detection stage 2 a includes a belt conveyor 26 that conveys the substrate 11 and a guide plate 27 that guides the substrate 11 onto the belt conveyor 26. Further, a mirror 24 is disposed so as to be adjacent to the guide plate 27 and to be within the camera photographing range 25.
In this way, the side surface of the substrate 11 can be reflected on the mirror 24 through the transparent guide plate 27 made of a material such as transparent acrylic or tempered glass. Instead of using a transparent material as the material of the guide plate 27, the guide plate 27 may be provided with a notch (not shown) for projecting the side surface of the substrate 11.

The substrate moving means 7 is attached to a rotary air cylinder 71, an air cylinder 72 rotated by the rotary air cylinder 71, and a rod tip of the air cylinder 72, and is attached to a vacuum generator (not shown). Only the substrate 10 can be removed from the two stacked substrates 10 and 11 (see FIG. 2).
The substrate moving means 7 is connected to the CPU 4 and is controlled by the CPU 4 that has input a defect detection signal.
Other configurations are substantially the same as those of the transport substrate defect detection apparatus 1.

Next, the operation of the transport substrate defect detection device 1a having the above configuration will be described.
The transport substrate defect detection device 1 a is supplied with the substrate 11 from the substrate loading means 101. At this time, the substrate 11 is placed on the belt conveyor 26, and the placed substrate 11 is conveyed into the camera photographing range 25 by the belt conveyor 26, and the surface and side surfaces of the substrate 11 are imaged by the camera 21. . And when the board | substrate 11 is normal, it is conveyed in the laser trimming machine 104 direction.
In addition, when the conveyance speed of the board | substrate 11 is the conveyance speed which can be imaged within the camera imaging | photography range 25, it is not necessary to stop once especially and to decelerate a conveyance speed.

On the other hand, when the double substrate failure occurs on the substrate 11, the transport substrate defect detection device 1 a first stops the belt conveyor 26, and the substrate moving unit 7 removes only the upper substrate 10 from the belt conveyor 26. Subsequently, the defect detection is performed again on the substrate 11 which is the lower one, and when the substrate 11 is normal, the substrate 11 is transported. Then, the removed substrate 10 is returned to the belt conveyor 26, and the substrate 10 is detected for defects.
In this way, the transport substrate defect detection device 1 automatically and efficiently performs the defective substrate processing for the double stacking defect, so that productivity can be improved.

  The substrate moving means 7 may be configured to remove the substrate 11 in which the crack / chip defect has occurred from the belt conveyor 26 and automatically perform the defective substrate processing of the crack / chip defect. In this case, generally, the stop time is shortened compared with the case where an operator performs defective substrate processing, and the operating rate can be improved.

As described above, according to the transport substrate defect detection device 1a according to this application example, the operator does not have to process the defective substrate every time a defect occurs, so that the operator's work efficiency can be improved. The problem that the operation rate of the production line is lowered due to the fact that the operator cannot process the defective substrate quickly can be improved.
Further, since the fixed mirror 24 can project the side surface of the substrate 11 conveyed on the belt conveyor 26, means such as raising and lowering the mirror 24 is not necessary, and the structure can be simplified.

[Laser trimming machine]
FIG. 7 is a schematic block diagram for explaining the configuration of the laser trimming machine according to the present invention.
In the figure, a laser trimming machine 60 comprises a substrate loading means 101, a transport substrate defect detection device 1, a laser trimming device main body 61, and a substrate carry-out means 62.

The laser trimming machine 60 can avoid an increase in size of the apparatus by incorporating the space-saving transport substrate defect detection apparatus 1.
In addition, since it is not necessary to separately install a transfer board defect detection device, usability can be improved.
Furthermore, since it is possible to detect a double stacking defect and a crack / chip defect of the substrate, it is possible to prevent a problem that the laser trimming apparatus main body 61 is damaged by the defective substrate.

The transport substrate defect detection device of the present invention and the laser trimming machine equipped with this transport substrate defect detection device have been described with reference to preferred embodiments, but the present invention is not limited to the above-described embodiments, It goes without saying that various modifications can be made within the scope of the present invention.
For example, the transport substrate defect detection device 1 may be configured to have the function of the substrate loading means 101. In this way, the transport substrate failure detection device and the transport substrate failure detection device that are highly functional and space-saving are provided. The present invention can also be applied to applications that provide a laser trimming machine.

The schematic block diagram explaining the structure of the conveyance board defect detection apparatus concerning this invention is shown. The schematic block diagram explaining the structure of the defect detection means of the conveyance board defect detection apparatus concerning this invention is shown. The schematic diagram of the image of the normal board | substrate without a double sheet | seat overlap defect and a crack and a chip defect in the conveyance board defect detection apparatus concerning this invention is shown. The schematic of the image of the board | substrate in which the double stacking defect generate | occur | produced in the conveyance board defect detection apparatus concerning this invention is shown. The schematic of the image of the board | substrate in which the crack and chipping defect generate | occur | produced in the conveyance board defect detection apparatus concerning this invention is shown. It is the schematic of the application example of the conveyance board defect detection apparatus concerning this invention, (a) is a front view, (b) has shown the AA side view. 1 is a schematic block diagram for explaining a configuration of a laser trimming machine according to the present invention. FIG. The schematic block diagram of the conveyance board defect detection apparatus concerning a prior art example is shown. The schematic block diagram explaining the thickness detection sensor of the conveyance board defect detection apparatus concerning a prior art example is shown. The schematic block diagram explaining the structure of the crack and chip | tip detection means of the conveyance board defect detection apparatus concerning a prior art example is shown. The schematic of the image of the non-defective board | substrate without a crack and a chip | tip part of the conveyance board defect detection apparatus concerning a prior art example is shown. The schematic of the image of the defect board | substrate with a crack and a chip | tip part of the conveyance board defect detection apparatus concerning a prior art example is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1a Conveyance board defect detection apparatus 2,2a Detection stage 3 Image processing unit 4 CPU
7 Substrate moving means 10, 11 Substrate 20 Defect detecting means 21 Camera 22 Lens 23 Illumination 24 Mirror 25 Camera photographing range 26 Belt conveyor 27 Guide plates 50, 50a, 50b, 150, 150b Images 51, 151 Background image
52, 152, 152b Surface image 53, 53a Side image 54 Crack / chip part 60 Laser trimming machine 61 Laser trimming device main body 62 Substrate unloading means 71 Rotating air cylinder 72 Air cylinder 73 Adsorption pad 100 Conveying substrate defect detection device 101 Substrate loading means 102 Double-stack detection stage 103 Crack / chip detection stage 104 Laser trimming machine 105 Thickness detection sensor 106 Image processing unit 107 CPU
130 Crack / Chip Detection Unit 131 Camera 132 Lens 133 Illumination 134 Camera Shooting Range 154 Crack / Chip

Claims (8)

A detection stage for conveying a substrate to be inspected and detecting a defect of the substrate to stop the substrate or reduce the conveyance speed of the substrate;
Illumination that illuminates either one of the front surface or the back surface of the substrate conveyed on the detection stage and the side surface;
A mirror that projects a side image of the substrate conveyed on the detection stage onto an imaging surface of a camera;
A camera that captures an image of one of the front and back surfaces of the substrate illuminated by the illumination and a side image of the substrate projected on the mirror;
An image processing unit that performs image processing on an image captured by the camera, detects whether a double stacking defect of the substrate has occurred and whether a crack or chipping defect has occurred in the substrate, and outputs a detection signal When,
An information processing means for performing predetermined defective substrate processing when a defect detection signal is input from the image processing unit.   Substrate moving means for removing one substrate from the two stacked substrates, and when the information processing means inputs the defect detection signal of the double stacking failure from the image processing unit, the substrate moving means from the two stacked substrates to the substrate moving means. 2. The transport substrate defect detection apparatus according to claim 1, wherein the substrate is removed, and further, it is detected whether at least the crack / chip defect has occurred in the remaining one substrate.   3. The conveyance substrate defect detection device according to claim 1, wherein when the information processing unit inputs a defect detection signal from the image processing unit, the information processing unit outputs an alarm signal to the alarm unit.   The conveyance substrate defect detection device according to claim 1, wherein the detection stage is a conveyance conveyor.   The transport conveyor includes a guide plate for guiding the substrate, and the mirror attached to the outside of the guide plate projects a side image of the substrate on the imaging surface of the camera via the guide plate. The conveyance substrate defect detection device according to claim 4.   The transport substrate defect detection device according to claim 5, wherein a transparent material is used as a material of the guide plate, or a notch for projecting a side surface of the substrate is provided in the guide plate.   The conveyance substrate defect detection device according to claim 1, wherein the detection stage is a conveyance robot.   A laser trimming machine comprising the conveyance substrate defect detection device according to any one of claims 1 to 7.

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