JPH07135400A - Inspection method for mounted component - Google Patents
Inspection method for mounted componentInfo
- Publication number
- JPH07135400A JPH07135400A JP5304636A JP30463693A JPH07135400A JP H07135400 A JPH07135400 A JP H07135400A JP 5304636 A JP5304636 A JP 5304636A JP 30463693 A JP30463693 A JP 30463693A JP H07135400 A JPH07135400 A JP H07135400A
- Authority
- JP
- Japan
- Prior art keywords
- component
- substrate
- image
- light sources
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Automatic Assembly (AREA)
- Image Processing (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Image Analysis (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、基板上に実装された電
気部品、電子部品の実装状態を光学的に検査する実装部
品の検査方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting component inspection method for optically inspecting the mounting states of electric components and electronic components mounted on a substrate.
【０００２】[0002]
【従来の技術】基板上に実装されたＬＥＤチップ等の電
気部品、電子部品は、ワイヤボンディング等の前に、そ
の実装状態を検査される。この検査は、通常は、基板上
の部品を上方からカメラにより撮影し、その画像を画像
処理装置で処理する光学的方法により行われる。2. Description of the Related Art Electrical components such as LED chips and electronic components mounted on a substrate are inspected for their mounting state before wire bonding or the like. This inspection is usually performed by an optical method in which a component on a substrate is photographed from above by a camera and the image is processed by an image processing device.
【０００３】[0003]
【発明が解決しようとする課題】このような光学的検査
方法は、装置の構成や取扱が簡単なため、各方面で使用
されているが、基板上に実装された部品の、基板板面に
垂直な方向の実装状態を検査することができない。すな
わち、図１（Ａ）に示す基板板面に平行な方向のズレ
Ｘ，Ｙや傾きＲは検査できるが、図１（Ｂ）に示す基板
板面に垂直な方向のずれＺ（浮き上がり）や傾きＲ′は
検査できない。Such an optical inspection method is used in various fields because the structure and handling of the device are simple, but it is used in the board surface of the board of the components mounted on the board. It is not possible to inspect the mounting state in the vertical direction. That is, the deviations X and Y in the direction parallel to the board surface shown in FIG. 1A and the inclination R can be inspected, but the deviation Z (lifting) in the direction perpendicular to the board surface shown in FIG. The slope R'cannot be inspected.
【０００４】そのため、ワイヤボンディング等が不正確
になり、不良品を生じるおそれがある。Therefore, wire bonding or the like becomes inaccurate, which may result in defective products.
【０００５】本発明はかかる事情に鑑みてなされたもの
であり、基板上に実装された部品の基板板面に垂直な方
向の実装状態を光学的に検査する実装部品の検査方法を
提供することを目的とする。The present invention has been made in view of the above circumstances, and provides a mounting component inspection method for optically inspecting a mounting state of a component mounted on a substrate in a direction perpendicular to a substrate plate surface. With the goal.
【０００６】[0006]
【課題を解決するための手段】本発明にかかる実装部品
の検査方法は、基板上に実装された部品を、複数の光源
を環状に配置した光源ユニットの中心部下方に位置合わ
せし、前記複数の光源を順次点灯したときに前記部品に
よって部品周囲の基板上に順番にできる複数の影および
／または反射像の形状に基づいて、前記部品の基板板面
に垂直な方向の実装状態を検査することを特徴としてい
る。According to the mounting component inspection method of the present invention, a component mounted on a substrate is positioned below a central portion of a light source unit in which a plurality of light sources are arranged in an annular shape. When the light sources are sequentially turned on, the mounting state of the component in the direction perpendicular to the board surface of the component is inspected based on the shapes of a plurality of shadows and / or reflected images formed on the substrate around the component by the component in order. It is characterized by that.
【０００７】[0007]
【作用】基板上に実装された部品を、複数の光源を環状
に配置した光源ユニットの中心部下方に位置合わせし、
複数の光源を順番に点灯すると、部品周囲の基板上に複
数の影および反射像が順番に形成される。基板上に実装
された部品が、基板板面に垂直な方向に傾いている場
合、その複数の影および反射像は長さが異なるものとな
る。従って、その複数の影および／または反射像の形状
から、前記部品の基板板面に垂直な方向の傾きが検査さ
れる。[Function] The components mounted on the substrate are aligned below the center of the light source unit in which a plurality of light sources are arranged in a ring,
When the plurality of light sources are sequentially turned on, a plurality of shadows and reflection images are sequentially formed on the substrate around the component. When the component mounted on the board is tilted in the direction perpendicular to the board surface of the board, the plurality of shadows and reflected images have different lengths. Therefore, the inclination of the component in the direction perpendicular to the board surface is inspected from the shapes of the plurality of shadows and / or reflection images.
【０００８】基板上に実装された部品が、基板板面に垂
直な方向にズレている場合、複数の光源を順番に点灯し
たときに部品周囲の基板上に順番に形成される複数の影
および反射像は、そのズレがない場合の複数の影および
反射像に比して長さが長くなる。従って、その複数の影
および／または反射像の形状から、前記部品の基板板面
に垂直な方向のズレが検査される。また、同様の原理に
より、前記部品の高さが検査される。When the components mounted on the substrate are displaced in the direction perpendicular to the substrate plate surface, when a plurality of light sources are sequentially turned on, a plurality of shadows formed in order on the substrate around the component and The reflected image has a longer length than the plurality of shadows and reflected images when there is no deviation. Therefore, from the shapes of the plurality of shadows and / or reflection images, the deviation of the component in the direction perpendicular to the board surface is inspected. Further, the height of the component is inspected by the same principle.
【０００９】[0009]
【実施例】以下、図面を参照して本発明の実施例を説明
する。図２は本発明法の実施に適した検査装置の側面
図、図３は図２のＳ−Ｓ線矢視図、図４は図２のＴ−Ｔ
線矢視図である。Embodiments of the present invention will be described below with reference to the drawings. 2 is a side view of an inspection apparatus suitable for carrying out the method of the present invention, FIG. 3 is a view taken along the line SS in FIG. 2, and FIG. 4 is TT in FIG.
FIG.
【００１０】本検査装置は、検査すべき部品１０が実装
された基板１１を水平方向に移動されるＸ−Ｙステー
ジ、その部品１０を上方から照明する光源ユニット２
０、照明された部品１０およびその近傍を上方から撮影
する画像認識カメラ３０、画像認識カメラ３０が得た画
像を処理する画像処理装置等からなる。This inspection apparatus comprises an XY stage in which a substrate 11 on which a component 10 to be inspected is mounted is horizontally moved, and a light source unit 2 for illuminating the component 10 from above.
0, an image recognition camera 30 for photographing the illuminated component 10 and its vicinity from above, an image processing device for processing an image obtained by the image recognition camera 30, and the like.
【００１１】光源ユニット２０は、鉛直線の周囲にリン
グ状に配設された多数の点光源２１（ＬＥＤ）を有す
る。各点光源２１は、中心部に円形の開口部を有する水
平な基板２２の下面内縁部に、中心点下方の検査位置を
照明するように取り付けられている。画像認識カメラ３
０は、光源ユニット２０の上方に真下を向けて同心状に
配置され、基板２２の開口部を通して前記検査位置を撮
影するようになっている。The light source unit 20 has a large number of point light sources 21 (LEDs) arranged in a ring shape around a vertical line. Each point light source 21 is attached to the inner edge of the lower surface of a horizontal substrate 22 having a circular opening in the center so as to illuminate the inspection position below the center point. Image recognition camera 3
0 is arranged concentrically with the light source unit 20 facing downward, and the inspection position is imaged through the opening of the substrate 22.
【００１２】本検査装置を用いて本発明法を実施するに
は、まず、基板１１上の部品１０を前記検査位置へ誘導
するべく、Ｘ−Ｙステージを駆動する。前記検査位置に
部品１０が誘導されると、多数の点光源２１を順番に点
灯する。各点光源２１は、部品１０を斜め上方から照明
するので、その点灯により、部品１０の出光側の基板１
１上には部品１０の影Ａが形成され、部品１０の入光側
の基板１１上には、部品１０からの反射光を受けて明る
い反射像Ｂが形成される。多数の点光源２１を例えば配
列方向に順番に点灯すれば、部品１０の周囲を回転する
ように、この影Ａと反射像Ｂが順番に形成される。To carry out the method of the present invention using the present inspection apparatus, first, the XY stage is driven in order to guide the component 10 on the substrate 11 to the inspection position. When the component 10 is guided to the inspection position, a large number of point light sources 21 are sequentially turned on. Since each point light source 21 illuminates the component 10 obliquely from above, the lighting of the point light source 21 causes the substrate 1 on the light outgoing side of the component 10 to be illuminated.
A shadow A of the component 10 is formed on the substrate 1, and a bright reflected image B is formed on the light-incident side substrate 11 of the component 10 by receiving the reflected light from the component 10. If a large number of point light sources 21 are sequentially turned on, for example, in the arrangement direction, the shadow A and the reflected image B are sequentially formed so as to rotate around the component 10.
【００１３】そして、多数の点光源２１を順番に点灯し
たときに、部品１０の近傍を画像認識カメラ３０で撮影
し、このときに部品１０の周囲に順番に形成される影Ａ
または反射像Ｂの画像を処理することにより、部品１０
の基板板面に垂直な方向の傾きおよびズレが検査され、
更に、部品１０の高さも検査することができる。各検査
の原理を以下に説明する。Then, when a large number of point light sources 21 are turned on in sequence, the vicinity of the component 10 is photographed by the image recognition camera 30, and at this time the shadow A formed around the component 10 in order.
Alternatively, by processing the image of the reflection image B, the component 10
The tilt and deviation in the direction perpendicular to the board surface of the
Furthermore, the height of the component 10 can also be inspected. The principle of each inspection will be described below.
【００１４】高さの検査 影Ａによる高さの検査原理を図５（ａ）に示し、反射像
Ｂによる高さの検査原理を図５（ｂ）に示す。[0014] The height height inspection principles by the inspection shadow A in shown in FIG. 5 (a), the test principle of height by reflection image B shown in Figure 5 (b).
【００１５】特定の点光源２１により部品１０が斜め上
方から照明されると、反照明側の基板１１上には部品１
０の影Ａができる。また、照明側の基板１１上には、部
品１０の側面からの反射光を受けて明るい反射像Ｂがで
きる。When the specific point light source 21 illuminates the component 10 from diagonally above, the component 1 is placed on the substrate 11 on the non-illuminating side.
A shadow A of 0 is created. Further, a bright reflected image B is formed on the substrate 11 on the illumination side by receiving the reflected light from the side surface of the component 10.
【００１６】影Ａの長さをｘW 、点光源２１直下から影
Ａの先までの水平距離をｘL 、基板１１の表面から点光
源２１までの高さをｈL 、部品１０の高さをｈW とする
と、下式が成立する。 ｈL ／ｘL ＝ｈW ／ｘW ｈL ／ｘL ＝ｔａｎθ ｈW ／ｘW ＝ｔａｎθThe length of the shadow A is x W , the horizontal distance from immediately below the point light source 21 to the tip of the shadow A is x L , the height from the surface of the substrate 11 to the point light source 21 is h L , and the height of the component 10 is Is h W , the following formula is established. h L / x L = h W / x W h L / x L = tan θ h W / x W = tan θ
【００１７】ここで、ｈL は既知、ｘL およびｘW は、
画像認識カメラ３０で得た影Ａの画像を処理することに
より得られる。従って、影Ａの画像処理により部品１０
の高さｈW が検査される。同様の原理により、反射像Ｂ
の画像処理によっても部品１０の高さｈW が検査され
る。Where h L is known and x L and x W are
It is obtained by processing the image of the shadow A obtained by the image recognition camera 30. Therefore, the image processing of the shadow A causes the component 10
The height h w of the is checked. Based on the same principle, the reflected image B
The height h W of the component 10 is also inspected by the image processing described above.
【００１８】傾きの検査 影Ａによる傾きの検査原理を図６（ａ）に示し、反射像
Ｂによる傾きの検査原理を図６（ｂ）に示す。 Inclination inspection The inclination inspection principle by the shadow A is shown in FIG. 6A, and the inclination inspection principle by the reflected image B is shown in FIG. 6B.
【００１９】特定の点光源２１1 により部品１０を照明
したときにできる影Ａの長さをｘ1、その反対側の点光
源２１2 により部品１０を照明したときにできる影Ａの
長さをｘ2 とする。部品１０が傾いていない場合は、ｘ
1 ＝ｘ2 となる。部品１０が傾いている場合は、その傾
きによってｘ1 ，ｘ2 がｘ1 ′（＜ｘ1 ）, ｘ2 ′（＞
ｘ2 ）にそれぞれ変化し、ｘ1 ′≠ｘ2 ′となる。
ｘ1 ′, ｘ2 ′は画像認識カメラ３０で得た影Ａの画像
を処理することにより得られる。従って、影Ａの画像処
理により部品１０の傾きが検査される。The length of the shadow A formed when the component 10 is illuminated by the specific point light source 21 1 is x 1 , and the length of the shadow A formed when the component 10 is illuminated by the point light source 21 2 on the opposite side is x 1 . x 2 . X if part 10 is not tilted
1 = x 2 . When the component 10 is tilted, x 1 and x 2 become x 1 ′ (<x 1 ) , x 2 ′ (>
x 2 ), and x 1 ′ ≠ x 2 ′.
x 1 ′ and x 2 ′ are obtained by processing the image of the shadow A obtained by the image recognition camera 30. Therefore, the inclination of the component 10 is inspected by the image processing of the shadow A.
【００２０】反射像Ｂによる場合も、部品１０の傾きに
より、２つの反射像Ｂの長さｘ3 ，ｘ4 が変化して
ｘ3 ′≠ｘ4 ′となり、一方の反射像Ｂについては部品
１０との間に距離ｘ5 ′も生じる。従って、反射像Ｂの
画像処理によっても、部品１０の傾きが検査される。Also in the case of the reflected image B, the lengths x 3 and x 4 of the two reflected images B change due to the inclination of the component 10 to become x 3 ′ ≠ x 4 ′, and one of the reflected images B has the component A distance x 5 ′ with 10 also occurs. Therefore, the inclination of the component 10 is also inspected by the image processing of the reflected image B.
【００２１】ズレ（浮き上がり）の検査 影Ａによるズレの検査原理を図７（ａ）に示し、反射像
Ｂによるズレの検査原理を図７（ｂ）に示す。 Deviation (lifting) inspection The principle of the deviation inspection by the shadow A is shown in FIG. 7A, and the principle of the deviation inspection by the reflected image B is shown in FIG. 7B.
【００２２】部品１０が基板１１の板面に垂直な方向に
ズレていない場合に、その部品１０を特定の点光源２１
1 により照明したときにできる影Ａの長さをｘ1 、その
反対側の点光源２１2 により照明したときにできる影Ａ
の長さをｘ2 とする。これらは既知である。部品１０が
基板１１の板面に垂直な方向にズレると、そのズレ量に
応じてｘ1 ，ｘ2 がｘ1 ″（＞ｘ1 ）, ｘ2 ″（＞
ｘ2 ）にそれぞれ変化する。ｘ1 ″, ｘ2 ″は影Ａの画
像を処理することにより得られる。従って、影Ａの画像
処理により部品１０の板面に垂直な方向のズレ（浮き上
がり）が検査される。When the component 10 is not displaced in the direction perpendicular to the plate surface of the substrate 11, the component 10 is moved to the specific point light source 21.
Shadow A possible the length of the shadow A capable when illuminated by 1 when x 1, was illuminated by the light source 21 2 points on the opposite side
Let the length of x be x 2 . These are known. When the component 10 is displaced in the direction perpendicular to the plate surface of the substrate 11, x 1 and x 2 are x 1 ″ (> x 1 ) , x 2 ″ (>
x 2 ) respectively. x 1 ″ and x 2 ″ are obtained by processing the image of the shadow A. Therefore, the image processing of the shadow A inspects the deviation (lifting) of the component 10 in the direction perpendicular to the plate surface.
【００２３】反射像Ｂによる場合も、部品１０の傾きに
より、２つの反射像Ｂの長さｘ3 ，ｘ4 がｘ3 ″（＞ｘ
3 ）, ｘ4 ″（＞ｘ4 ）にそれぞれ変化する。また、部
品１０から２つの反射像Ｂまでの間に距離ｘ5 ″，
ｘ6 ″も生じる。従って、反射像Ｂの画像処理によって
も、部品１０の板面に垂直な方向のズレ（浮き上がり）
が検査される。Also in the case of the reflected image B, the lengths x 3 and x 4 of the two reflected images B are x 3 ″ (> x) due to the inclination of the component 10.
3 ) , x 4 ″ (> x 4 ), and the distance x 5 ″, between the component 10 and the two reflection images B.
x 6 ″ also occurs. Therefore, even when the reflected image B is image-processed, the component 10 is displaced (lifted) in the direction perpendicular to the plate surface.
Is inspected.
【００２４】かくして、多数の点光源２１を順番に点灯
したときに基板１１上の部品１０の近傍を画像認識カメ
ラ３０で撮影し、部品１０の周囲に順番に形成される影
Ａまたは反射像Ｂの画像を処理することにより、部品１
０の基板板面に垂直な方向の傾きおよびズレを光学的に
検査することができる。更に、部品１０の高さも検査す
ることができる。Thus, when a large number of point light sources 21 are turned on in sequence, the vicinity of the component 10 on the substrate 11 is photographed by the image recognition camera 30, and the shadow A or the reflected image B formed around the component 10 in sequence. By processing the image of part 1
It is possible to optically inspect an inclination and a deviation of 0 in a direction perpendicular to the substrate plate surface. Furthermore, the height of the component 10 can also be inspected.
【００２５】なお、上記実施例では、多数の点光源２１
を使用したが、その点光源２１は最低４個あればよい。
また、点灯順は、必ずしも周方向に順番ということを意
味せず、左右の後に前後を点灯するようなことも可能で
あり、予め決めた順番であればよいということである。
更に、影Ａの画像と反射像Ｂの画像を同時に使用して、
検査を行うこともできる。In the above embodiment, many point light sources 21 are used.
However, at least four point light sources 21 may be used.
Further, the order of lighting does not necessarily mean the order in the circumferential direction, and it is also possible to illuminate the front and the rear after the left and right, and the order may be predetermined.
Furthermore, by using the image of the shadow A and the image of the reflection image B at the same time,
An inspection can also be performed.
【００２６】[0026]
【発明の効果】以上に説明した通り、本発明にかかる実
装部品の検査方法は、環状に配置された複数の光源を順
次点灯したときに部品周囲の基板上に順番にできる複数
の影および／または反射像の形状を認識することによ
り、基板上に実装された部品の基板板面に垂直な方向の
実装状態を光学的に検査できる。従って、安価で操作の
簡単な光学的検査装置を使用して、ワイヤボンディング
等の精度を飛躍的に高めることができる。As described above, according to the mounting component inspection method of the present invention, when a plurality of light sources arranged in a ring are sequentially turned on, a plurality of shadows and / or shadows that can be sequentially formed on the substrate around the component are formed. Alternatively, by recognizing the shape of the reflected image, it is possible to optically inspect the mounting state of the component mounted on the substrate in the direction perpendicular to the substrate plate surface. Therefore, the accuracy of wire bonding and the like can be dramatically improved by using an optical inspection device which is inexpensive and easy to operate.
【図１】基板上に実装された部品の実装状態を示す模式
図である。FIG. 1 is a schematic diagram showing a mounting state of components mounted on a board.
【図２】本発明法の実施に適した検査装置の側面図であ
る。FIG. 2 is a side view of an inspection apparatus suitable for carrying out the method of the present invention.
【図３】図２のＳ−Ｓ線矢視図である。FIG. 3 is a view taken along the line S-S in FIG.
【図４】図２のＴ−Ｔ線矢視図である。FIG. 4 is a view taken along the line TT of FIG.
【図５】本発明法における高さの検査原理図である。FIG. 5 is a diagram showing the principle of height inspection in the method of the present invention.
【図６】本発明法における基板板面に垂直な方向の傾き
の検査原理図である。FIG. 6 is a diagram showing the principle of inspection of the inclination in the direction perpendicular to the substrate plate surface in the method of the present invention.
【図７】本発明法における基板板面に垂直な方向のズレ
の検査原理図である。FIG. 7 is a diagram showing the principle of inspection for deviation in the direction perpendicular to the substrate plate surface in the method of the present invention.
１０ 部品 １１ 基板 ２０ 光源ユニット ２１ 点光源 ３０ 画像認識カメラ Ａ 影 Ｂ 反射像 10 parts 11 substrate 20 light source unit 21 point light source 30 image recognition camera A shadow B reflection image
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｇ０１Ｂ 11/26 Ｈ Ｇ０６Ｔ 7/00 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location G01B 11/26 H G06T 7/00
Claims (3)
を環状に配置した光源ユニットの中心部下方に位置合わ
せし、前記複数の光源を順番に点灯したときに前記部品
によって部品周囲の基板上に順番にできる複数の影およ
び／または反射像の形状に基づいて、前記部品の基板板
面に垂直な方向の実装状態を検査することを特徴とする
実装部品の検査方法。1. A component mounted on a substrate is aligned below a central portion of a light source unit in which a plurality of light sources are arranged in an annular shape, and when the plurality of light sources are sequentially turned on, a component surrounding the component is provided. An inspection method for a mounted component, which comprises inspecting a mounting state of the component in a direction perpendicular to a board surface of the substrate based on a plurality of shapes of shadows and / or reflection images sequentially formed on the substrate.
前記部品の近傍を上方から画像認識カメラにより撮影
し、このときに部品周囲の基板上に順番にできる複数の
影および／または反射像の画像を画像処理装置によって
処理することを特徴とする請求項１に記載の実装部品の
検査方法。2. A plurality of shadows and / or reflection images which are photographed in the vicinity of the component from above by an image recognition camera when the plurality of light sources are sequentially turned on, and which are sequentially formed on a substrate around the component at this time. 2. The mounting component inspection method according to claim 1, wherein the image is processed by an image processing device.
状態が、前記部品の傾きおよび／または基板板面からの
浮き上がりである請求項１に記載の実装部品の検査方
法。3. The mounting component inspection method according to claim 1, wherein the mounting state of the component in a direction perpendicular to the substrate plate surface is an inclination of the component and / or a lift from the substrate plate surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5304636A JPH07135400A (en) | 1993-11-09 | 1993-11-09 | Inspection method for mounted component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5304636A JPH07135400A (en) | 1993-11-09 | 1993-11-09 | Inspection method for mounted component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07135400A true JPH07135400A (en) | 1995-05-23 |
Family
ID=17935430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5304636A Pending JPH07135400A (en) | 1993-11-09 | 1993-11-09 | Inspection method for mounted component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07135400A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100834113B1 (en) * | 2006-11-10 | 2008-06-02 | 아주하이텍(주) | Method for automated optical inspection |
| CN100402974C (en) * | 2003-07-29 | 2008-07-16 | Tdk株式会社 | Inspection apparatus and inspection method |
| JP2010210646A (en) * | 2010-06-30 | 2010-09-24 | Sony Corp | System, method, and program for determining object |
| JP2010221380A (en) * | 2009-03-25 | 2010-10-07 | Fuji Xerox Co Ltd | Method for inspecting part assembling and device for inspecting part assembling |
| KR101144749B1 (en) * | 2010-01-29 | 2012-05-24 | 주식회사 고영테크놀러지 | Method for inspecting joint error of an element formed on a printed circuit board |
| JP2015122420A (en) * | 2013-12-24 | 2015-07-02 | 株式会社レクザム | Inclination inspection device for component |
| WO2018037604A1 (en) * | 2016-08-26 | 2018-03-01 | パナソニックＩｐマネジメント株式会社 | Image processing system and image processing method |
| JP2018054296A (en) * | 2016-09-26 | 2018-04-05 | 株式会社村田製作所 | Road surface inspecting apparatus, road surface inspecting method and program |
-
1993
- 1993-11-09 JP JP5304636A patent/JPH07135400A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100402974C (en) * | 2003-07-29 | 2008-07-16 | Tdk株式会社 | Inspection apparatus and inspection method |
| KR100834113B1 (en) * | 2006-11-10 | 2008-06-02 | 아주하이텍(주) | Method for automated optical inspection |
| JP2010221380A (en) * | 2009-03-25 | 2010-10-07 | Fuji Xerox Co Ltd | Method for inspecting part assembling and device for inspecting part assembling |
| KR101144749B1 (en) * | 2010-01-29 | 2012-05-24 | 주식회사 고영테크놀러지 | Method for inspecting joint error of an element formed on a printed circuit board |
| JP2010210646A (en) * | 2010-06-30 | 2010-09-24 | Sony Corp | System, method, and program for determining object |
| JP2015122420A (en) * | 2013-12-24 | 2015-07-02 | 株式会社レクザム | Inclination inspection device for component |
| WO2018037604A1 (en) * | 2016-08-26 | 2018-03-01 | パナソニックＩｐマネジメント株式会社 | Image processing system and image processing method |
| JP2018054296A (en) * | 2016-09-26 | 2018-04-05 | 株式会社村田製作所 | Road surface inspecting apparatus, road surface inspecting method and program |
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